JP2000164616A - Resin-sealing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To set the vertical moving distance of a lower metal mold to be small. SOLUTION: A plurality of ejection rods 72 are installed on a movable casing 71. A rod drive part is driven, the movable casing 71 is lifted by eccentric rods 79, and a sealed lead frame of a lower metal mold is pushed up with the ejection rods 72. A cylinder is arranged between a pair of clamping pawls of a loader mechanism and an unloader mechanism, and the thickness of these mechanisms is reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a resin sealing device for sealing (packaging) an electronic element such as an IC package mounted on a lead frame with a resin.

[0002]

2. Description of the Related Art FIG. 2 is a schematic illustration of the operation of a conventional resin sealing device. In FIG. 2, reference numeral 1 denotes a fixed block, and an upper mold 2 is attached to a lower surface thereof. Upper mold 2
The lower die 3 is mounted on the movable block 4. In such a resin sealing device,
As shown in FIG. 2A, when the movable block 4 moves down and the lower mold 3 separates from the upper mold 2, these molds 2, 3
During this time, the loader mechanism 5 moves. The loader mechanism 5 arranges an unsealed lead frame (not shown) held by the holding portion on the lower mold 3 and supplies the held thermosetting resin to the lower mold 3.

Next, as shown in FIG. 1B, when the movable block 4 moves upward and the lower mold 3 is pressed against the upper mold 2, a cavity formed by the two molds 2 and 3 is formed. Is filled with the resin. Thereby, the electronic element of the lead frame is sealed with resin.

Next, as shown in FIG. 1C, when the movable block 4 moves down and the lower mold 3 separates from the upper mold 2, the unloader mechanism 6 moves between them. The unloader mechanism 6 holds the sealed lead frame at the holding section and transports the lead frame to a predetermined position.

[0005]

By the way, in the conventional resin sealing device, an eject rod for releasing the sealed lead frame from the lower mold 3 is fixedly positioned at a fixed position. For this reason, the lower die must be moved down via the movable block 4 to a position where the tip of the eject rod 7 can relatively press the sealed lead frame.

A loader mechanism 5 and an unloader mechanism 6
Conventionally, since the opening / closing structure for opening / closing a pair of holding claws is provided above the holding claws, the thickness of the loader mechanism 5 and the unloader mechanism 6 in the vertical direction is large. Become. For this reason, when supplying and transporting the lead frame, the vertical movement distance of the lower mold through the movable block 4 must be increased by an amount corresponding to the large thickness dimension.

As described above, when the vertical movement distance in each step of the lower mold is increased, it takes time for the lower mold to move up and down, so that the production (sealing) efficiency is reduced.

[0008]

The present invention has the following arrangement to solve such a problem. <Structure> The present invention
An unsealed lead frame on which the electronic element is mounted is sandwiched from above and below, and the upper mold and lower mold for sealing the electronic element with the filled resin, and the sealed lead frame is separated from the lower mold. A reject rod for molding, an unloader mechanism for nipping and transporting the sealed lead frame at the holding part, and a loader for nipping the unsealed lead frame at the holding part and disposing it at a predetermined position of the lower mold In a resin sealing device including a mechanism, a rod drive mechanism that moves the eject rod up and down to push up the sealed lead frame to release the mold, the holding portion of the loader mechanism and the unloader mechanism has at least one pair of It is characterized by having a cylinder arranged between the holding claws to open and close these holding claws.

<Description> Since the holding claws of the holding portion are opened and closed by the air cylinder or the hydraulic cylinder disposed therebetween, the vertical thickness of the loader mechanism and the unloader mechanism can be reduced. Further, at the time of ejecting, the eject rod can be moved upward by the rod drive mechanism simultaneously with the downward movement of the lower mold. Therefore, the vertical movement distance in each step of the lower mold can be set small, so that the sealing time for each lead frame can be shortened and the productivity can be improved.

[0010]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 6 is a diagram showing the overall configuration of the resin sealing device according to the present invention. In FIG. 6, a fixed block 10 is fixedly positioned above. An upper mold 11 is attached to the lower surface of the fixed block 10. The lower mold 1 is located at a lower position facing the upper mold 11.
2 are arranged. The lower mold 12 is mounted on the upper surface of the movable block 13. The movable block 13 is moved up and down by a vertically moving mechanism 14.

The vertical movement mechanism 14 includes a pair of link portions 15 connected to the lower surface of the movable block 13, and a link portion 15.
A screw rod 16 disposed therebetween and extending in the vertical direction; a screw cylinder 17 screwed to the screw rod 16 and pivotally supported by each link portion 15; a driving unit 18 for rotating and driving the screw rod 16; And a drive motor 19. In the vertically moving mechanism 14 having such a configuration, when the drive motor 19 is operated to rotate the screw rod 16 via the drive unit 18, the screwing cylinder 17 moves down, so that the pair of link parts 15, 15 Bend greatly to approach each other. Therefore, the movable block 13
Moves downward, so that the lower mold 12 is separated from the upper mold 11. On the other hand, when the screw rod 16 is rotated in the opposite direction, the screwing cylinder 17 moves upward, so that the pair of link portions 15, 15 are separated from each other and linearly extended. Therefore, the movable block 1
3 moves upward, and the lower mold 12 approaches the upper mold 11. A loader mechanism 2 to be described later is provided between the upper mold 11 and the lower mold 12.
0 and the unloader mechanism 40 move.

FIG. 7 is a sectional view showing a transfer section of the apparatus of the present invention. The transfer unit 50 includes a drive motor 51 supported on the side surface of the movable block 13, a small-diameter pulley 52 attached to a shaft extending below the drive motor 51, and a belt 53 by the pulley 52.
A large-diameter pulley 54 that is driven to rotate via a rotary cylinder 55, a rotary cylinder 55 fixed on the pulley 54, a screw body 56 fitted into the rotary cylinder 55 by a key, and the screw body 56 And a combined ball screw 57. The rotary cylinder 55 is rotatably supported via a bearing 59 in a support cylinder 58 provided on the lower surface of the movable block 13. The screw body 56 has a push-up rod 60 extending upward.
The push-up rod 60 is connected to the ball screw 57, penetrates through the movable block 13, and extends into the frame 61 on the movable block 13. The pressing plate 6 is provided inside the frame 61.
2 is arranged to be vertically movable, and a push-up rod 60 is connected to the lower surface of the press plate 62. A plurality of plungers 63 (only one is shown in the drawing) are implanted on the pressing plate 62.

In the transfer section 50 having such a structure, when the drive motor 51 is operated to rotate the pulley 54, the rotary cylinder 55 on the pulley 54 also rotates. Accordingly, the screwed body 56 fitted with the key moves the ball screw 57 upward while rotating.
Press. As a result, the plunger 63 on the pressing plate 62 protrudes in a liquid-tight manner from the runner 12 a of the lower mold 12. The runner 12a houses the thermosetting resin chip 64 supplied by the loader mechanism 20.

The lower mold 12 has a cavity 12b communicating with the runner 12a. Also, upper mold 1
1 has a cavity 11b at a position facing the same.

Incidentally, a rod driving unit 70 is disposed in the movable block 13. The rod driving section 70 has a movable casing 71. Movable casing 71
As shown in FIGS. 1 and 7, four eject rods 72 are provided upright on the upper surface. A pair of long holes 73 are formed in the front panel 71a and the rear panel 71b of the movable casing 71, respectively. Inside the movable casing 71, a pair of rotating rods 74 are arranged along the longitudinal direction. Each rotating rod 74 is rotatably supported via a bearing 75. As shown in FIG. 1, an ejection motor 76 is disposed on the front panel 71a side, and a drive gear 77 is mounted on a shaft 76a of the motor 76 as shown in FIG. The driven gear 7 is coaxially fixed to the peripheral surface of each rotating rod 74.
8 are engaged. Accordingly, when the motor 76 is operated, the driven gears 78, 78 rotate in the opposite directions via the drive gear 77, so that the rotating rods 74, 74 also rotate in the opposite direction. On the other hand, small-diameter eccentric rods 79 are eccentrically attached to both end surfaces of the rotating rods 74, 74. Each eccentric rod 79 is provided in each of the long holes 7 in the front panel 71a and the rear panel 71b.
3 Therefore, when each rotary rod 74 rotates, the eccentric rod 79 moves up to the position indicated by the arrow while being displaced in the elongated hole 73 as shown in FIG. Will move. When the movable casing 71 moves upward, the eject rod 72 on the movable casing 71 projects upward, so that the eject rod 72 projects into the cavity 12b of the lower mold 12. Therefore, the sealed lead frame can be released from the lower mold 12.

FIG. 4 shows a loader mechanism 20 of the apparatus of the present invention.
FIG. The loader mechanism 20 includes a moving base 21 and a holding portion 22 mounted below the moving base 21. The holding portion 22 includes a pair of holding claws 2 for holding the lead frame, which are pivotally supported by the mounting block 23 in a swingable manner.
And a coil spring 2 that biases (shrinks) the ends of the holding claws 24, 24 so as to approach each other.
5 and a pair of air cylinders 2 embedded in the mounting block 23 so as to be located between the holding claws 24, 24.
6, 26. These air cylinders 26, 2
When air is supplied through the air supply pipe 27, the rod 6 protrudes the rod 26a to separate the holding claws 24, 24 from each other. Note that a plurality of pairs of holding claws are mounted on the mounting block 23, and air cylinders are embedded therein.

On the lower surface of the movable base 21, four pins 28 for holding the resin chip 64 are further implanted. A long stopper 29 extends between the pins 28 in the horizontal direction, and the tip of the stopper 29 supports the resin chip 64 to prevent the resin chip 64 from dropping. The support block 30 that supports the base of the stopper 29 protrudes and retracts in the horizontal direction by the air cylinder 31. Further, between the pins 28, the tip of the drop arm 32 enters a position above the resin chip 64. The vicinity of the base of the drop arm 32 is rotatably supported by a pivot piece 33, and the base is swingably connected to an air cylinder 34. Therefore, when the rod of the air cylinder 34 is retracted, the drop arm 32 rotates counterclockwise, so that the tip of the arm 32 pushes down the resin chip 64 to drop it from between the pins 28.

FIG. 5 is a partial sectional view of the unloader mechanism 40. The unloader mechanism 40 has a holding portion 22 attached to the lower surface of a movable base 41. This holding portion 22
Since it has exactly the same configuration as that shown in FIG. 4, the same portions are denoted by the same reference numerals and description thereof will be omitted.

Next, the transfer portion 50 (see FIG. 7) is operated to press the resin chip 64, and the upper and lower dies 11, 1
The molten resin is filled in the second cavities 11b and 12b. When the resin cures, the vertical movement mechanism 14 is operated to move the movable block 13 downward. As a result, the unloader mechanism 40 moves between the upper mold 11 and the lower mold 12 via an arm (not shown). As shown in FIG. 5, since the air cylinders 26 are disposed between the holding claws 24, the thickness of the unloader mechanism 40 in the vertical direction is small. On the other hand, at the time of the unloader,
When the movable casing 71 is moved upward, the eject rod 72 projects into the cavity 12 b of the lower mold 12. Therefore, the downward movement distance of the movable block 13 can be set to be small at least by the projection size of the eject rod 72. Therefore, at the time of unloading, the lower movement distance of the movable block 13 can be set to be at least as small as the thickness of the unloader mechanism 40 and as much as the protrusion of the eject rod 72. That is, the movable block 1 at the time of the unloader
3 can be set to, for example, 80 mm (about ２ of the conventional).

The unloader mechanism 40 moves to a predetermined position when the sealed lead frame is clamped between the clamping claws 24, 24.

Next, the operation of the device of the present invention will be described. First, as shown in FIG. 6, the vertical movement mechanism 14 is operated to move the movable block 13 downward. Thereafter, the loader mechanism 20 moves between the upper mold 11 and the lower mold 12 via an arm (not shown). As shown in FIG. 4, the loader mechanism 20 has the air cylinders 26, 26 disposed between the holding claws 24, 24, and the stopper 29 and the drop arm 32 extend substantially in the horizontal direction to hold and hold the resin chip 64. Since it is dropped, its vertical thickness is small. Therefore, first,
The lower movement distance of the movable block 13 can be set small at the time of loading.

When the loader mechanism 20 moves to the above position, the stopper 29 retreats and the dropping arm 32 pushes down the resin chip 64, so that the resin chip 64 is stored in the runner 12a of the lower mold 12 (FIG. 7). reference). Also,
The unsealed lead frame held between the holding claws 24, 24 is moved by the operation of the air cylinders 26, 26.
24 are separated from each other, so that the lower mold 12 is disposed at a predetermined position.

When the loader mechanism 20 returns to the original position, the vertical movement mechanism 14 is actuated to move the movable block 13 upward.
The lower mold 12 is pressed against the upper mold 11 with the lead frame therebetween. In this case, since the downward movement distance of the movable block 13 is small, the upward movement distance is also small.

As described above, when the vertical movement distance of the movable block 13 at the time of the loader and the unloader is set to be small, the sealing operation time required for each lead frame is reduced, so that the production rate of the apparatus is greatly improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of a movable casing according to the present invention.

FIG. 2 is a schematic diagram illustrating the operation of a conventional device.

FIG. 3 is a front view of a rod driving unit according to the present invention.

FIG. 4 is a partial sectional view of a loader mechanism according to the present invention.

FIG. 5 is a partial sectional view of the unloader mechanism according to the present invention.

FIG. 6 is an overall configuration diagram of an apparatus according to the present invention.

FIG. 7 is a sectional view of a transfer section according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Upper mold 12 Lower mold 13 Movable block 14 Vertical movement mechanism 20 Loader mechanism 24 Nipping claw 26 Air cylinder 40 Unloader mechanism 50 Transfer part 70 Rod drive part 71 Movable casing 72 Eject rod 73 Slot hole 79 Eccentric rod

Claims (1)

[Claims] 1. An upper mold and a lower mold for sandwiching an unsealed lead frame on which an electronic element is mounted from above and below, and sealing the electronic element with a filled resin. An eject rod for releasing the sealed lead frame from the lower mold separated from the lower mold, and the sealed lead frame moved and released between the upper mold and the lower mold. And an unloader mechanism for nipping and transporting the unmolded lead frame between the upper mold and the lower mold while nipping the unsealed lead frame with the clamp. A loader mechanism for arranging the unsealed lead frame at a position, comprising a rod drive mechanism for vertically moving the eject rod to push up the sealed lead frame to release the mold. The holding portion is At least a pair of holding claws opened and closed in order to clamp the serial lead frame, a resin sealing apparatus characterized by having disposed between the pair of holding claws and a cylinder for opening and closing the pair of holding claws.