JP2000164540A - Mechanism for horizontal holding cassette for end face polishing equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable cassettes to be surely kept in a horizontal position when they are placed on a feeding section by a method wherein detecting members are each arranged on a placing pad at positions corresponding to the opposed projections out of projections which are opposed to each other on a diagonal line, and it is judged that the cassette is placed right in position when the cassette is detected by the detecting member. SOLUTION: Four corner projections 113 L-shaped in a plan are provided on the upside of a placing pad 110 to receive the four corners under the cassette 11, and detecting members 114 are each provided inside the corner projections 113 which are opposed to each other on the diagonal line. The detecting member 114 are so set as to transmit signals if the base of the cassette 11 is fitted in the four corner projections 113 when the cassette 11 is placed. Moreover, the detecting member 114 is possessed of an operating part which is actuated by a cassette or composed of a light emitting part and a photodetective part, where light from the light emitting part is reflected from the cassette.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cassette horizontal holding mechanism in an end face polishing apparatus, and more particularly, to accurately positioning a cassette containing a wafer to be mounted on a wafer supply portion and having an end face polished therein. The present invention relates to a cassette horizontal holding mechanism in a possible end surface polishing apparatus.

[0002]

2. Description of the Related Art Generally, a semiconductor wafer such as a silicon wafer is subjected to chamfering at a peripheral portion thereof in order to prevent edge chipping and crown during epitaxial growth. This chamfering is performed by grinding with a diamond grindstone, but a work-strained layer tends to remain after the grinding, and if such a work-strained layer remains, crystal defects occur when heat treatment is repeated in the device process. Sometimes. For this reason, the work-strained layer is usually removed by etching. However, the etched surface becomes wavy or scale-like irregularities, and dirt is apt to remain. Is a major cause of deterioration.

Therefore, in recent years, a technique for smoothing a chamfered edge of a wafer by mirror polishing has been established as a technique completely different from polishing of the wafer surface, and an apparatus for mirror polishing the edge of the wafer has been established. Various end face polishing apparatuses have been proposed.

[0004] In the end face polishing apparatus, wafers stored in a stacked state in a cassette are mounted on a mounting table of a supply unit, and thereafter, the wafers are automatically taken out one by one and polished. However, in such a configuration, if the horizontal state is not ensured when the cassette is mounted on the mounting table of the supply unit, it is necessary to perform the subsequent steps. There is a problem that the polishing of the end face of the wafer is not performed smoothly.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a cassette horizontal holding mechanism in an end face polishing apparatus which can ensure a horizontal state when a cassette in which a plurality of wafers are stacked and stored in the end face polishing apparatus is placed on a supply section. To provide. Another object of the present invention is to ensure a horizontal state when a cassette in which a plurality of wafers are stacked and stored in an end surface polishing apparatus is placed on a supply unit, and the subsequent steps can be performed. It is another object of the present invention to provide a cassette horizontal holding mechanism in the end face polishing apparatus.

[0006]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, according to the present invention, a cassette accommodating a plurality of wafers in a stacked state is mounted on a mounting table of a supply unit, and the wafers in the cassette are loaded. In a notch polishing section, and after polishing the peripheral end surface of the wafer in the end polishing section, the wafer is housed in a cassette of a discharge section by a conveying member. A plurality of protrusions for receiving the corners of the bottom surface of the cassette are provided on the mounting table of the cassette, and at least a portion of the mounting table corresponding to the diagonally opposed protrusion of the plurality of protrusions is provided on the bottom surface of the cassette. Detecting members for detecting the presence / absence of the cassette are provided so that when all the detecting members have detected, it is known that the cassette has been properly placed in the supply section. The cassette has four corners,
The protrusions are also provided at four places on the mounting table. Further, the detecting member has an operating portion operated on the bottom surface of the cassette, and detects by pressing the operating portion, or includes a light emitting portion and a light receiving portion, and light from the light emitting portion is provided. The light is detected by being reflected on the bottom surface of the cassette and reaching the light receiving section.

[0007]

According to the present invention, the above means are adopted.
When a cassette in which a plurality of wafers are stored in a stacked state is placed on the mounting table of the supply unit while ensuring a horizontal state, at least two diagonal lines on the lower surface of the cassette are detected by the detection member, and a signal from the detection member is output. The signal is issued, and it is determined whether or not the cassette is kept horizontal based on the presence or absence of this signal.

[0008]

Embodiments of the present invention shown in the drawings will be described below. The drawing shows an entire wafer end surface polishing apparatus (edge polisher) employing the cassette horizontal holding mechanism according to the present invention.

This end face polishing apparatus includes a supply unit 10 for taking out wafers from a cassette in which wafers are stacked and housed therein, aligning the wafers in a predetermined direction, further turning the wafers back and forth, and transporting them to the next step. Notch polishing unit 2 for receiving a wafer from unit 10 and polishing a notch provided on the wafer
0, the wafer whose notch is polished by the notch polishing unit 20 is received, and the edge of the wafer is first polished with the front side up, and the wafer is similarly turned upside down. End surface polishing section 50 for polishing the end surface of
And a discharge unit 100 having a cassette for accommodating a wafer whose polishing of the notch and the end surface has been completed.

As shown in FIG. 12, the supply unit 10 has two cassettes 11, 11 for stacking and storing wafers W therein, and sequentially takes out the wafers W from the cassette 11 to form a peripheral surface. An aligner 12 for aligning the notches formed in the cassette 1 so as to be at a predetermined position;
1 to transfer the wafer from the aligner 12 to the aligner 12, and rotate the aligned wafer taken out of the aligner 12 by 180 ° in a horizontal state to invert the front and rear, and transport the wafer to the next notch polishing step with the front and back inverted And a transfer member 14 having the multi-joint arm 13.

The two cassettes 11 and 11 and the aligner 12 are mounted on a mounting table 110, while the transport member 14 is mounted on the side of the mounting table 110 so as to move along the mounting table 110. It is attached to the attached robot 111. The transfer member 14 is reciprocally movable between a position indicated by a solid line and a position indicated by a two-dot chain line, and the multi-joint arm 1 having a bifurcated portion 15 provided at a distal end thereof.
The wafer W is placed on the upper surface of the two forked portions 15 of the transfer member 14 so that the wafer W can be transferred according to the expansion and contraction of the articulated arm 13. I have.

A circle indicated by a two-dot chain line outside the conveying member 14 indicates a rotation range of the forked portion 15. further,
The aligner 12 is disclosed in, for example, Japanese Patent No. 2729297, and includes an articulated arm 13 of a transfer member 14.
The notch provided on the peripheral portion of the wafer W is aligned with the forked portion 15 of the multi-joint arm 13 at a predetermined position.

Accordingly, the transfer member 14 takes out the wafer W from the cassette 11 and transfers it to the aligner 12, receives the wafer W aligned by the aligner 12, and reverses the front-back position of the wafer, ie, the notch. Is transmitted to the wafer transfer portions 21 as the aligner 12 side. In this case, the wafer transfer unit 2
Reference numerals 1 and 21 are formed at two locations as indicated by a two-dot chain line so as to correspond to a notch polishing device 22 provided in a notch polishing section 20 described later (see FIG. 1).

FIG. 13 schematically shows a cassette horizontal holding mechanism for mounting the cassette 11 on the mounting table 110 in the supply section 10 configured as described above while holding the cassette 11 in a horizontal state. It is configured as shown. That is, the lower surface of the cassette 11 is
In order to receive the corners, four corner projections 113 having an L-shape when viewed from a plane are provided, and a detection member 114 is provided inside each of the corner projections 113 on a diagonal line.

The detection member 114 is connected to the cassette 1
1 is placed, that is, the bottom of the cassette 11 is
When fitted between the two corner projections 113, a signal is emitted. As the detection member 114, for example, a member having an operating portion operated by a cassette, a member having a light emitting portion and a light receiving portion, and light from the light emitting portion being reflected by the cassette, etc. The formula is not limited, and the corner projection 113 is not limited to the L-shape.

The cassette 11 is open at the front side in the wafer insertion direction and closed at the back side. this is,
This is for storing each wafer W in a state of being in contact with the back side, and for positioning each wafer W so as to match each other when viewed from a plane. When the cassette 11 is fitted between the four corner projections 113, First, the rear side of the cassette 11 is
13 and then the front side is lowered as shown by the arrow to fit between the two corner projections 113, so that the stored wafer W can be prevented from jumping out. .

The two detecting members 114 constitute a part of a cassette detecting circuit (not shown), and when the signals of the two detecting members 114 are input, that is, first, the fitting of the back side is performed. At this time, a signal from one of the detection members 114 is input, and thereafter, when the front side is fitted, a signal from the other detection member 114 is input, thereby outputting a cassette detection circuit. It can be known that the device is mounted on the mounting table 110.

Therefore, the output of the cassette detecting circuit is used as a signal for lighting the lamp, a driving start signal for the conveying member 14,
It can be adopted for various things. That is, in the cassette horizontal holding mechanism according to the present invention, only when the cassette 11 is surely mounted on the mounting table 110, the end face polishing apparatus starts the next process or notifies the operator. Can be used for

In the end face polishing apparatus provided with the cassette horizontal holding mechanism according to the present invention, a notch polishing section 20 is provided continuously to the supply section 10.
The notch polishing section 20 includes a pair of notch polishing apparatuses 22 and 22 facing each other across the two wafer transfer sections 21 and 21 as shown in FIG. 1 and the two notch polishing apparatuses 22 and 22 as shown in FIG. 22 and can move up and down, and can move between the wafer transfer section 21 and the notch polishing device 22 along a rail 29 arranged in the X direction. In the section 21, the wafer W is received and raised, further moved in the X direction to be located above the notch polishing device 22, and then lowered and delivered to the suction plate 36 of the notch polishing device 22. A three-claw member 23 is provided.

That is, FIG. 3 shows a state viewed along the line CC of FIG. 1, and the three-claw member 23 has a claw portion 24 that hangs downward. The claw portion 24 has three claws. When the wafer W is gripped, one claw enters the notch of the wafer, and the other two claws press the peripheral end surface of the wafer. Each of the claws can be grasped and opened by a driving source, and the rotation of the wafer is prevented by positioning one of the claws at the notch at the time of grasping.

The claw portion 24 can be moved up and down by a driving source, can move in the X direction, and can rotate while keeping the horizontal position. Notch polishing device 22, 2 as shown in
The two suction plates 36 are respectively located above.

As shown in FIGS. 4 and 5, the notch polishing device 22 is located at the lower position of the claw portion 24 of the three-claw member 23, adsorbs the wafer on the upper surface, and moves up and down with respect to the horizontal state. And a cover 31 capable of coming in contact with and separating from the wafer sucked by the suction portion 30 and opening a portion facing the notch.
A notch polishing pad 32 positioned inside the cover 31 so as to abut against the notch, and a polishing unit 34 including a drive source 33 for rotating the notch polishing pad 32. Have been.

The suction portion 30 has a circular suction hole 35 formed on the upper surface of the disk, and further has an end on the polishing portion 34 side, that is, a notch side, as shown by a two-dot broken line in FIG. It has a suction plate 36 that can be tilted as the center, and a vacuum source is connected to this suction plate 36.

The polishing section 34 is provided with a base 39 on a machine base 37 of the notch polishing apparatus 22 with a main shaft 38 disposed facing the suction section 30 penetrating therethrough. A cover 31 in which a notch polishing pad 32 is located is provided on the substrate 40 in an upright state.
A drive source 33 is provided below, and a belt 41 is stretched between the drive source 33 and the rotation axis of the notch polishing pad 32.

On the other hand, a connecting member 42 is provided on the base 39, and a wire 43 is connected to the connecting member 42. The weight 43 is connected to the wire 43 via a pulley 44 provided on the machine base.
5 are suspended. Therefore, the base 45 is moved along the main shaft 38 by the weight 45, and the notch polishing pad 32 provided on the substrate 40 provided on the base 39 is moved to the suction plate 3.
6 is pressed by the notch of the wafer W attracted to the wafer 6. It is to be noted that reference numeral 46 denotes an operation part 46a
The movable portion can be located at a position apart from the notch by the cylinder 46.

Then, the notch polishing device 22 configured as described above is attached to the notch polishing unit 20 by the wafer transfer unit 2.
Two are provided with 1 therebetween.

Further, an end face polishing section 50 is provided continuously to the notch polishing section 20. This end face polishing section 50
Are provided at the center in a continuous manner in the Y direction, are provided in series, and are provided with two articulated arms that can reciprocate in the Y direction.
A peripheral surface polishing device 53 is arranged in series with each other in the Y direction while being opposed to each other with the two transfer members 51 and 52 therebetween, and further includes a wafer reversing member 80.

The wafer reversing member 80 is provided with
It is provided with a pair of wafer reversing mechanisms 81 that are movable in the Y direction along rails 82 provided along the upper portion of 0 and are capable of reversing the wafer.

The wafer reversing mechanism 81 receives the wafer placed on the upper surface of each articulated arm 13 of the one transfer member 51, and transfers the wafer placed on the one articulated arm 13 to one peripheral portion. The wafer on which the other articulated arm 13 is mounted is transferred to the suction pad 54 on one side of the surface polishing apparatus 53 and the suction pad 54 on the other side of the peripheral polishing apparatus 53, respectively. Further, after polishing the end face by the peripheral surface polishing apparatus 53 on the supply unit 10 side, the two wafers on the suction plate 54 are received and raised, and the reversal is performed.
It is delivered to both suction disks 54 of the other peripheral surface polishing device 53, and after being polished by the other peripheral surface polishing device 53 to the two articulated arms of the other transport member 52.

The two transfer members 51 and 52 arranged continuously in the Y direction at the center have the same configuration as the transfer member 14 used in the supply unit 10.

On the other hand, the peripheral surface polishing device 53 has a pair of polishing drums 55 each having a drum pad 55a wound at a central portion thereof. A pressing mechanism 60 is provided. In this case, each wafer pressing mechanism 60 is in a direction inclined by a predetermined angle with respect to the Y direction when viewed from a plane (A direction).
(See FIG. 10), and a suction plate 5 which can swing vertically between a horizontal state and an inclined state in the upper part.
4 are provided.

As shown in FIGS. 7, 8 and 9, the wafer pressing mechanism 60 includes a first body 61 for holding a suction disk 54 for vacuum suction of a wafer, and a support shaft 62 for the first body 61. And a second body 63 that is swingably held about the center of the rotary table 64. Are supported so as to be movable in a direction perpendicular to the radial direction, that is, in a direction parallel to a line connecting the centers of two adjacent polishing drums 55.

The support mechanism 65 includes a first rail 67 provided on a base plate 66 fixed to the lower surface of the turntable 64 in a direction (A direction) that comes into contact with and separates from the polishing drum 55. First slide member 68 movable along
And the first rail 67 above the first slide member 68.
Second rail 69 provided in a direction (direction B) orthogonal to
And a second slide member 70 movable along a second rail 69, and the second body 63 is attached to the upper portion of the second slide member 70 by a leg 71.

A pulley 72 is provided on the lower surface of the base plate 66.
A wire 72a is stretched over the pulley 72, a rear end of the wire 72a is fixed to an arm 73 extending downward from the first slide member 68, and a weight 74 is provided at a tip of the wire 72a. Hanged. The weight 74 constantly urges the first slide member 68 on the first rail 67 toward the polishing drum 55.

A wire 9 having a weight 91 attached to the end thereof via a pulley 90 is connected to the second slide member 70.
The weight 91 urges the suction plate 54 to adsorb the wafer, and the two wafers are attached to the two polishing drums 55, 55.
Are configured to abut substantially uniformly.

This is to make the non-uniform contact force on the two polishing drums 55, 55 caused by the rotation of the wafer itself when the wafer comes into contact with the rotating polishing drums 55, 55 substantially uniform. It is.

An air cylinder 75 is provided on the lower surface of the base plate 66.
The tip of the rod 75a of the air cylinder 75 contacts the arm 73, and the air cylinder 75 causes the first slide member 68 to oppose the weight 74 and the polishing drum 55
It is configured to be urged in a direction away from.

It should be noted that, as shown in FIG.
Has a plurality of suction holes formed in the surface thereof, and the suction holes are connected to a vacuum source (not shown) through ports and pipes 77 provided in the first body 61 and the second body 63 and the like. ing. The suction disk 54 is rotated at a very slow speed during polishing by a driving source provided on the first body 61.

Also, as described above, the first body 61
Can rotate about the support shaft 62 between a state in which the suction plate 54 is horizontally oriented and a state in which the suction board 54 is inclined by the rotary actuator 78. Deliver or receive.
When the suction plate 54 is inclined, the polishing force is applied to the two polishing drums 55, that is, the drum pads 55 a wound around the two polishing drums 55 by the action force of the weight 74. Places are polished at the same time.

When the first body 61 is in the horizontal position at the non-polishing position, the first body 61 is retracted by the cylinder 75 in a direction away from the polishing drum 55 against the weight 74. Further, the polishing drum 55 is configured to be rotatable by a driving source 76 provided on a base of the polishing apparatus. Further, at the time of polishing the wafer W attached to the suction plate 54, an abrasive (slurry) is jetted out, and this abrasive is collected and reused.

The wafer reversing member 80 is shown in FIGS. 2 and 6 and, as described above, the two peripheral surface polishing devices 53 on one side.
Is provided so as to be movable above. That is, the wafer reversing member 80 includes a rail 82 provided in the Y direction above the two peripheral surface polishing apparatuses 53 on one side, and a pair of the rails 82 attached to the rail 82 and opposed to each other across the polishing drum 55. And a pair of wafer reversing mechanisms 81 having an interval corresponding to the suction disk 54 of FIG.

The wafer reversing mechanism 81 of the wafer reversing member 80 is located above a position corresponding to the suction plate 54 in a horizontal state facing the polishing drum 55 of the peripheral surface polishing device 53. Then, the wafer reversing mechanism 81
Can be gripped by the drive source, and can rotate in the vertical direction, from a pair of bay-shaped arms that can turn the front and back of the wafer by rotating while holding the wafer A bay-shaped claw portion 83, an elevating arm 84 capable of moving the bay-shaped claw portion 83 up and down by a member such as a cylinder,
And a mobile stand 85 to which the lifting arm 84 is fixed.

The mobile unit base 85 can be moved in the Y direction along the rails 82 by a driving source provided therein.

Therefore, as shown in FIG. 2, the wafer reversing mechanism 81 (81a, 81a,
81b) a horizontal suction plate 54 facing the polishing drum 55 of the peripheral surface polishing device 53 on the supply unit 10 side;
From above, the polishing drum 5 of another peripheral surface polishing device 53
The rails 82 disposed above are located between the suction plates 54 in a horizontal state facing each other with the position 5 therebetween and up to the position located above the suction plates 54.
Can be moved in the Y direction.

In this case, the suction disk 5 of the both peripheral surface polishing device 53
4, the same wafer reversing mechanism 81 (81a) faces the upper side of the suction plate 54a on the supply unit 10 side. The same wafer reversing mechanism 81 (81b) also faces above the suction plate 54b on the opposite side. As a result, the suction disk 5 on the supply unit 10 side of the both-surface polishing device 53
The same wafer W is supplied to 4a and the suction plate 54b on the side opposite to the supply unit 10 side. The rail 82 and the wafer reversing member 80 are
It is also provided above the other two peripheral surface polishing devices 53 that are provided facing each other with the two transport members 51 and 52 as boundaries.

As a result, the end face polishing section 50 is formed with two sets of the end face polishing sections 50 including two peripheral polishing apparatuses 53 and a wafer reversing member 80 that are continuous in the Y direction while sharing the transport members 51 and 52. Will be.

A discharge unit 100 is provided adjacent to the end face polishing unit 50 for storing the polished wafers in a cassette. In the discharge unit 100, two cassettes 11 similar to the cassette 11 provided in the supply unit 10 are provided. The front end of the cassette 11 in the insertion direction is closed, and further insertion is prevented. Have been.

The position where each of the cassettes 11 is disposed is a position where the polished wafer W can be stored by the two articulated arms of the transfer member 52 disposed in the end face polishing section 50. Further, both cassettes 11 are mounted on a base 101, and the base 101 is
02 is fixed to the upper surface of the substrate 103 which can swing up and down between a horizontal position and a vertical position.
When the substrate 103 is in the vertical position, a water storage section 104 is formed in the discharge section 100 so that the cassette 11 provided on the upper surface is submerged (see FIG. 2).

Since the front ends of the cassettes 11 in the wafer insertion direction are closed so as to prevent further insertion of wafers, the drive sources 102 are inserted so that the front ends of the cassettes 11 in the insertion direction are downward. Even when the substrate 103 is rotated and submerged in water, there is no possibility that the wafers in the cassette 11 will jump out.

When the cassette 11 is submerged, the polished wafers housed therein are submerged from its end face, and can be submerged smoothly without the action of water resistance. It has the effect of washing the surface.

Next, the operation of the end face polishing apparatus configured as described above will be described. The wafer W is transported from the cassette 11 reliably mounted on the mounting table 110 by the cassette horizontal holding mechanism according to the present invention.
Is carried out and transmitted to the aligner 12, and the aligner 1
In step 2, the wafer W is positioned so that the notch is at a fixed position.

Thereafter, the articulated arm 1 of the transport member 14
3 transports the wafer W and reverses the front and rear of the wafer W. On the other hand, the claw portion 24 of the three-claw member 23 grasps the wafer and transfers it to the suction plate 36 of the notch polishing device 22, and the notch polishing device 22
Polish the notch with. The wafer whose notch has been polished is transferred by the transfer member 51 to the suction plate 54 facing the peripheral surface polishing device 53, and the peripheral surface polishing device 53 polishes the end face with two polishing drums 55.

Further, since this polishing is performed in a state of being inclined by a predetermined angle in the vertical direction with respect to the horizontal, first, the polishing is performed by the first peripheral polishing device 53, and then the wafer is polished by the next peripheral polishing device 53 Transported to Since the wafer reversing member 80 is provided between the first peripheral surface polishing device 53 and the next peripheral surface polishing device 53, the wafer polished by the first peripheral surface polishing device 53 is turned over. It is turned over by the member 80 and is conveyed to the next peripheral surface polishing device 53 to be polished again. That is, the end face of the wafer W is pressed twice by the polishing drum 55 in an inclined state and polished.

Since the end face of the wafer is chamfered at the time of this polishing, the center part of the end face and the chamfered end face at the front side are polished at the front side polishing, and the center part of the end face and the chamfered end face at the back side are polished at the back side polishing. Will be polished.

The wafer W polished on the front and back sides is transferred to the discharge unit 100 by the arm of the transfer member 52 and stored in the cassette 11 located there. Therefore, the cassette 1 of the discharge unit 100
1 has a notch and a peripheral end face polished wafer W
Are stored in a stacked state, and the polishing operation in the end face polishing apparatus is completed.

[0056]

According to the present invention, when a cassette in which wafers before polishing are stored in a stacked state is arranged in the supply portion of the end face polishing apparatus, the cassette is not properly mounted. Is detected by the detecting member, the wafer stored in the cassette can be reliably taken out and transported. Therefore, as a transfer member for taking out a wafer into the cassette, a member that controls only the horizontal and vertical directions and performs position control can reliably take out the wafer without colliding with another wafer or cassette. Has an effect.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing an entire end face polishing apparatus provided with a cassette horizontal holding mechanism according to the present invention.

FIG. 2 is a schematic front view showing the entire end face polishing apparatus.

FIG. 3 is a schematic view taken along line CC of FIG. 1;

FIG. 4 is a schematic plan view of a notch polishing apparatus.

FIG. 5 is a schematic front view of a notch polishing apparatus.

FIG. 6 is a schematic view taken along line DD of FIG. 1;

FIG. 7 is a schematic front view of a peripheral surface polishing device arranged in the end surface polishing device.

FIG. 8 is a schematic side view of a peripheral surface polishing device arranged in the end surface polishing device.

FIG. 9 is a schematic front view showing the vicinity of a suction unit of the peripheral surface polishing device arranged in the end surface polishing device.

FIG. 10 is a schematic plan view showing one side of an end face polishing section arranged in the end face polishing apparatus.

FIG. 11 is a schematic front view showing one side of an end face polishing section arranged in the end face polishing apparatus.

FIG. 12 is a schematic plan view showing a supply unit.

FIG. 13 is a schematic diagram illustrating a relationship between a mounting table, a protrusion, and a cassette of a supply unit.

[Explanation of symbols]

 Reference Signs List 10 supply section 11 cassette 12 aligner 13 articulated arm 14, 51, 52 transfer member 15 bifurcated section 20 notch polishing section 21 wafer transfer section 22 notch polishing Apparatus 23 Three-claw member 24 Claw part 29, 82 Rail 30 Suction part 31 Cover 32 Notch polishing pad 33, 76, 102 Driving source 34 Polishing part 35 ... Suction holes 36, 54 (54a, 54b) ... Suction plate 37 ... Machine 38 ... Spindle 39 ... Base 40, 103 ... Substrate 41 ... Belt 42 ... Connection members 43, 72a, 92 Wires 44, 72, 90 Pulleys 45, 74, 91 Weights 46, 75 Cylinder 46a Working part 50 End polishing part 53 Peripheral polishing device 55 Drum 55a Drum Pad 60 Wafer pressing mechanism 61 First body 62 Support shaft 63 Second body 64 Rotary table 65 Support mechanism 66 Base plate 67 First rail 68 First slide Member 69 Second rail 70 Second slide member 71 Leg 73 Arm 75a Rod 77 Pipe 78 Rotary actuator 80 Wafer reversing member 81 (81a, 81b) Wafer Reversing mechanism 83... Bay-shaped claw 84... Elevating arm 85... Mobile unit table 100... Discharge unit 101... Base 104... Storage unit 110. 114 ... Detection member W ... Wafer

Claims (4)

[Claims] 1. A cassette in which a plurality of wafers are stored in a stacked state is mounted on a mounting table of a supply unit, and the wafers in the cassette are sequentially transported so that a notch of the wafer is polished by a notch polishing unit, and edge polishing is performed. After polishing the peripheral end surface of the wafer by the unit, the end surface polishing apparatus is configured to be accommodated in the cassette of the discharge unit by the transfer member, and the mounting table of the supply unit includes a plurality of bases for receiving the corners of the bottom surface of the cassette. Protrusions are provided, and a detection member for detecting the presence or absence of the bottom surface of the cassette is disposed at a position of the mounting table corresponding to at least a diagonally opposed protrusion of the plurality of protrusions, and all the detection members are provided. A cassette horizontal holding mechanism in the end face polishing apparatus, wherein when the detection is detected, it is known that the cassette is properly placed on the supply unit. 2. A cassette horizontal holding mechanism in an end surface polishing apparatus according to claim 1, wherein said cassette has four corners, and said projections are also provided at four places on said mounting table. 3. The cassette horizontal holding apparatus according to claim 1, wherein the detecting member has an operating portion that is operated on the bottom surface of the cassette, and detects by pressing the operating portion. mechanism. 4. The detecting member includes a light emitting unit and a light receiving unit, and detects light from the light emitting unit when the light is reflected by the bottom surface of the cassette and reaches the light receiving unit.
A cassette horizontal holding mechanism in the edge polishing apparatus according to any one of the preceding claims.