JP2000159956A - Thermoplastic resin composition for sheet or card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain the subject composition having an excellent embossing property and useful for sheets and/or cards, such as magnetic cards, by adding a specific inorganic plate-like filler to a styrenic resin. SOLUTION: This thermoplastic resin composition for sheets or cards comprises (A) 100 pts.wt. of a styrenic resin and (B) 0.5-25 pts.wt. of an inorganic plate-like filler (preferably talc) having an average particle diameter of 0.2-5 μm. The component A is, for example, a styrenic (co)polymer such as polystyrene or a rubber-modified polystyrene, and the component B is, for example, the filler having a three-dimensionally anisotropic, biaxially oriented particle shape. The composition may further contain (C) a reinforcing material such as glass fibers, (E) an antioxidant, (E) a UV absorber, etc.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sheet used for cards such as magnetic cards and IC cards having excellent embossability and / or a thermoplastic resin composition for cards.

[0002]

2. Description of the Related Art In recent years, cards such as magnetic stripe cards and IC cards in which symbols and characters are three-dimensionally engraved by embossing have been widely used. As these card materials, it is necessary that the card is not warped or cracked by embossing, and a multilayer sheet made of a hard polyvinyl chloride resin is generally used. However, since the danger of generating harmful substances to the human body by burning polyvinyl chloride resin is a problem,
There has been a demand for a card material having excellent embossability other than polyvinyl chloride resin.

As a card material other than the polyvinyl chloride resin, Japanese Patent Application Laid-Open No. 9-124888 discloses a card-forming plastic composition obtained by adding diatomaceous earth to an ABS resin. Warpage has not been sufficiently reduced.

[0004]

SUMMARY OF THE INVENTION An object of the present invention is to provide a sheet and / or a thermoplastic resin composition for a card which is used for cards such as a magnetic card and an IC card and which has excellent embossability. And

[0005]

DISCLOSURE OF THE INVENTION The present inventors have been keen to provide a sheet used for cards such as magnetic cards and IC cards and / or a thermoplastic resin composition for cards which are excellent in embossability. As a result of the study, it has been found that the embossability can be remarkably improved by adding an inorganic plate-like filler having a specific particle size, particularly talc, to the styrene resin, and the present invention has been completed.

That is, the present invention relates to (1) (A) 100 parts by weight of a styrene resin, (B) an average particle size of 0.5 to
A thermoplastic resin composition for a sheet or card, comprising 0.5 to 25 parts by weight of a 5 μm inorganic plate-like filler, (2)
(B) The thermoplastic resin composition for a sheet or card, wherein the component is talc; (3) an embossed sheet or card comprising the thermoplastic resin composition for a sheet or card; (4) A) a sheet or card in which the above-mentioned thermoplastic resin composition for a sheet or card is used for a part of a sheet or a card; and (5) a thermoplastic resin composition for the sheet or card used in the surface of a sheet or a card. It is a sheet or card.

[0007]

DETAILED DESCRIPTION OF THE INVENTION In the present invention, the styrene resin as the component (A) is a resin obtained by (co) polymerizing styrene, for example, styrene, polystyrene, rubber-modified polystyrene (HIPS), and styrene / acrylonitrile copolymer. And styrene / rubber polymer / acrylonitrile copolymer (ABS resin, AES resin, AAS resin) and the like. These can be used in two or more types. Further, a part of the styrene and / or acrylonitrile is converted to α-methylstyrene, p-methylstyrene, pt-butylstyrene, (meth) acrylic acid or esters thereof such as methyl, ethyl, propyl and n-butyl. Compound, unsaturated dicarboxylic acid, unsaturated dicarboxylic anhydride, maleimide, N-methylmaleimide,
Also included are those substituted by vinyl monomers copolymerizable with styrene such as N-phenylmaleimide. It is also possible to replace a part of the styrene-based resin with a thermoplastic resin other than the styrene-based resin such as a polybutylene terephthalate resin, a polyamide resin, and a polycarbonate resin by a conventionally known method. In this case, the amount of the styrene resin is preferably at least 30% by weight, more preferably at least 40% by weight, based on the total amount of the thermoplastic resin. Here, particularly as the styrene resin, ABS resin, AES
Resins, AAS resins, MBS resins and the like are preferably used.

In the present invention, the inorganic plate-like filler of the component (B) is a so-called plate-like inorganic filler, which has a three-dimensionally anisotropic particle shape and biaxial orientation. Agents are preferred. Specific examples include talc, kaolin, mica, sericite, basic magnesium carbonate, aluminum hydroxide, glass flake, and the like. Two or more of these fillers may be used in combination. Of these, talc and kaolin are preferred, and talc is most preferred.

The amount of the inorganic plate-like filler to be added is as follows:
0.5 to 25 parts by weight is preferable with respect to 00 parts by weight,
Especially, 1-20 weight part is more preferable, and 2-15 weight part is more preferable. Within this range, the moldability is good, good sheets and cards are obtained, the effect of improving the embossability is high, and the transparency is also excellent.

The average particle size of the inorganic plate-like filler is preferably from 0.2 to 5 μm at the stage after compounding, and more preferably from 0.5 to 4 μm.
m is more preferably 0.5 to 3 μm.
Within this range, sheet and card formability is good,
High effect of improving embossability.

The average particle size of the inorganic plate-like filler is determined by treating the thermoplastic resin composition of the present invention with an organic solvent or burning it in an electric furnace or the like to separate only the inorganic plate-like filler component.
It can be determined by measuring with a centrifugal sedimentation type particle size distribution analyzer.

The thermoplastic resin composition of the present invention may further contain various other additives as long as the object of the present invention is not impaired. Examples of these other additives include reinforcing agents such as glass fiber, carbon fiber, asbestos fiber, rock wool, calcium carbonate, silica sand, bentonite, barium sulfate, and glass beads, or antioxidants (phosphorus, sulfur ), UV absorbers, heat stabilizers (hindered phenols, etc.), lubricants, release agents,
Antistatic agents, slip improvers, antiblocking agents, coloring agents including dyes and pigments, flame retardants, flame retardant aids, zirconium oxide, molybdenum oxide, etc.), foaming agents, cross-linking agents (for example, polyvalent epoxy compounds, Isocyanate compounds, acid anhydrides, etc.). In addition, other synthetic resins (for example, polyamide resin, polystyrene resin, acrylic resin, polyethylene resin, ethylene / vinyl acetate copolymer, phenoxy resin, epoxy resin, silicone resin,
Etc.) can be included.

The card according to the present invention has a long side of 10 m.
It is a plate-shaped molded product having a size of m to 300 mm, a short side of 10 to 200 mm, and a thickness of 50 to 5000 μm (the long side and the short side may have the same length, that is, a square), and exceeds this A molded article having a spread is referred to as a sheet, and in the present invention, refers to a material at a stage prior to card production.

The method for producing the thermoplastic resin composition of the present invention can be carried out by a known method. Specific examples of the production method include a method of uniformly kneading the components (A) and (B) and various additives as necessary using a single-screw or twin-screw extruder. In addition, at the time of melt-kneading, a masterbatch method in which only specific components are preliminarily kneaded and then kneaded with the remaining components may be used.

As a method for producing a sheet comprising the thermoplastic resin composition of the present invention, a method of melt-kneading and pelletizing the thermoplastic resin composition and processing it into a sheet by a commonly known injection molding, or a method of producing a thermoplastic resin composition After melt-kneading, a sheet is formed by a known method such as a T-die method or an inflation method.

The sheet made of the thermoplastic resin composition of the present invention may be either a single layer or a laminate of two or more sheets. There are no particular limitations on the lamination method when two or more sheets are used, and any known method such as a coextrusion method or a heat lamination method is used. In that case, at least one of the layers only needs to be formed of the thermoplastic resin composition of the present invention, and in particular, it is preferable that the thermoplastic resin composition of the present invention be formed on the surface layer. Is preferred.

The thickness of the sheet is 50 in the case of a single layer.
Thicknesses of up to 5000 μm, preferably 100 to 1000 μm are preferably used. When two or more sheets are stacked, the thickness is appropriately determined depending on the number of sheets to be stacked, the total thickness, decoration reasons, and the like.
m to 5000 μm, preferably 300 μm to 10 in total
A thickness of 00 μm is preferably used. In particular, a sheet having a surface layer (oversheet) of about 50 μm to 100 μm and a layer other than the surface layer (core sheet) of about 100 μm to 700 μm is preferably used.

As a method for producing a card comprising the thermoplastic resin composition of the present invention, the thermoplastic resin composition is melt-kneaded, then pelletized, and processed into a card by generally known injection molding, or the thermoplastic resin of the present invention. There is a method of cutting a sheet made of the resin composition into a specific size and processing it into a card. Alternatively, a plurality of sheets made of the thermoplastic resin composition of the present invention may be laminated to form a multilayer sheet, and then cut into a specific size and processed into a card. At this time, an adhesive layer or a layer for an antenna circuit or the like may be provided between each layer of the multilayer sheet as needed. Further, each layer may be printed or a magnetic material may be applied. Such a magnetic layer,
The entire sheet or a part of the sheet such as a stripe shape may be used. Further, the sheet may be subjected to secondary processing such as press molding to be processed into a card shape.

As for the size of the card, the long side is 10 mm
It is preferably a rectangular shape having a width of 50 mm to 300 mm and a short side extending from 10 mm to 200 mm, and a thickness of 50 to 5000 μm, particularly a long side of 50 mm to 100 mm and a short side of 2 mm.
A rectangular shape having an extension of 5 mm to 80 mm and a thickness of 400 to 2000 μm is preferable. Above all, a rectangular shape having a long side of about 85 mm and a short side of about 54 mm and a thickness of 600 to 900 μm is more preferable.

The card according to the present invention is generally a card capable of recording information, in particular, a function capable of reading electrically, optically or magnetically, a function capable of writing, a function capable of recording information, and It is suitable for a card having at least one function of recording information by embossing. Specifically, a contact type IC card (smart card), a non-contact type IC card having an IC chip and an antenna circuit embedded in the card, a magnetic card such as a magnetic stripe card, an optical card, and the like are preferable. Applications include prepaid cards, credit cards, banking cards, various certification cards, and the like.

When the thermoplastic resin composition of the present invention is used for a card such as a magnetic card or an IC card which conforms to JIS X6301, usually the thermoplastic resin composition 100 of the present invention is used.
It is used opaque by adding 2 to 25 parts by weight of titanium oxide to parts by weight.

The thermoplastic resin composition of the present invention is excellent in embossability such as engraving characters and patterns, and is therefore suitable for card applications such as magnetic cards and IC cards.

[0023]

EXAMPLES The effects of the present invention will be further described below with reference to examples. The tensile test was measured according to ASTM D638, and the tensile impact test was measured according to ASTM D1822. The amount of card warpage after embossed character engraving as embossing property is determined by embossing three lines of embossed characters on a card conforming to JIS X6301 using a manual embosser (NE-1600 manufactured by Nipponjiken Co., Ltd.).
01 and the card warpage was measured.

The following thermoplastic resin was used as the component (A).

A-1: ABS resin "Toyolac" type 920 manufactured by Toray Industries, Inc. A-2: ABS resin "Toyolac" type 100 manufactured by Toray Industries, Inc. A-3: Alloy "Toyolac" VX10 made of ABS resin and PBT resin. Toray Industries, Inc.

The following inorganic plate-like filler was used as the component (B).

B-1: Talc having an average particle size of 1.4 μm (LMS-300 manufactured by Fuji Talc Industries Co., Ltd.) B-2: Talc having an average particle size of 12.0 μm (NK48 manufactured by Fuji Talc Industry Co., Ltd.) In any case, there was no change in the average particle size of talc before and after blending.

Examples 1 to 6 and Comparative Example 1 After the components A and B were dry-blended in a V blender at the composition ratios shown in Table 1, the mixture was fed to a single screw extruder, discharged from a T-die, and discharged. 100 μm and 300 μ
m were obtained. The sheeting temperature was 230 ° C. when A-1 and A-2 were used, and 260 ° C. when A-3 was used.

The above 100 μm and 300 μm sheets are stacked in the order of 100/300/300/100 μm (“/” indicates lamination), and are subjected to a hot press molding machine,
Thermal fusion under the conditions of MPa and holding time of 10 minutes, 120 × 1
Create a sheet of 20 x 0.72-0.78mm thick,
Various test pieces and a card conforming to JIS X6301 were punched out by a punching press. The heat fusing temperatures are A-1 and A-
150 when using 2; 22 when using A-3
A card was made at 0 ° C.

Incidentally, there was no change in the average particle size before and after the blending of talc as the inorganic plate-like filler.

[0031]

[Table 1]

Examples 7 and 8, Comparative Example 2 As Reference Example 1, the thicknesses of 100 μm and 300 μm of Example 5 were used.
m and the thickness of 100 μm of Comparative Example 1 as Reference Example 2.
Using sheets of m and 300 μm, 100 μm is used as a surface layer (oversheet) and 300 μm is used as a core layer (core sheet).
/ 300/300/100 μm (“/” indicates lamination)
And heat-fused under the conditions of a temperature of 150 ° C., a pressure of 1 MPa, and a holding time of 10 minutes to obtain a card conforming to JIS X6301 as in Examples 1 to 6.

[0033]

[Table 2]

[0034]

When the composition of the present invention is used for cards such as a magnetic card and an IC card, there is little warping even when embossing is performed.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C08L 51/04 C08L 51/04 55/02 55/02 // B29K 25:00 B29L 7:00 F term ( Reference) 4F071 AA22 AA77 AB18 AB21 AB26 AB28 AF53 BA01 BB05 BB06 BC08 4F209 AA13 AB13 AB16 AF01 AG01 AG05 AH37 AH38 PA01 PB01 PC05 4J002 BC031 BN071 BN121 BN141 BN151 DE146 DE266 DJ036 DJ046 DJ000 DL006 FA016

Claims (5)

[Claims] 1. A heat for sheet or card containing (B) 0.5 to 25 parts by weight of an inorganic plate-like filler having an average particle diameter of 0.2 to 5 μm per 100 parts by weight of a styrene resin. Plastic resin composition. 2. The thermoplastic resin composition for a sheet or card according to claim 1, wherein the component (B) is talc. 3. An embossed sheet or card comprising the thermoplastic resin composition for a sheet or card according to claim 1. 4. A sheet or card wherein the thermoplastic resin composition for a sheet or card according to claim 1 or 2 is used as a part of the sheet or card. 5. A sheet or card wherein the thermoplastic resin composition for a sheet or card according to claim 1 or 2 is used on the surface of the sheet or card.