JP2000156271A - Ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC socket capable of executing the accurate electrical test for a long period under a temperature of 150 deg.C. SOLUTION: In an IC socket 1, a positioning film 4, an insulating resin film 3 and a pressure jig 5 are sequentially stacked, positioned and fixed on a supporting board 2. The insulating resin film 3 comprises a circuit pattern on which a plurality of conductive contact pads are formed corresponding to a plurality of bumps 21 of an IC 10, and which electrically connects the contact pads with an external electrical test circuit, and is made of a material capable of elastically deforming at a temperature of 150 deg.C for a long period. The supporting board 2 comprises the openings 22 for receiving the bumps 21 on the places corresponding to the bumps 21 (contact pads). When the IC 10 is pressed to the pressure jig 5, the insulating resin film 3 is elastically deformed in the openings 22 by the bumps 21, so that the contact pressure is generated on the contact parts of the bumps 21 and the contact pads.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC used for performing a burn-in test or the like of an IC having bumps.
Regarding sockets.

[0002]

2. Description of the Related Art The present applicant has already devised and applied for an IC socket 100 as shown in FIGS. 25 and 26 (see Japanese Patent Application No. 10-62228). The IC socket 100 includes an insulating resin film 103 on which a circuit pattern (not shown) corresponding to the bump (solder ball) 102 of the IC 101 is formed, and the insulating resin film 103.
And a terminal pin unit 105 having an upper end connected to the circuit pattern and a lower end connected to an electric test circuit (not shown). A silicon rubber plate 1 is provided on the back surface of the insulating resin film 103 on which the IC 101 is mounted.
06 is arranged. A pressing member 107 is mounted on the upper surface of the support board 104 so as to be opened and closed via a socket body 108.

[0003] The IC socket 100 as described above is an IC socket.
When the pressing member 101 is pressed downward by the pressing member 107, I
The bump 102 of C101 is a silicon rubber plate 106
In order to elastically deform (depress) the bumps 102, the bumps 102 of the IC 101 and the circuit pattern can be brought into contact with a desired contact pressure by the elastic restoring force of the silicon rubber plate 106. And this IC socket 100
Is configured to electrically connect the IC 101 to an external electrical test circuit (not shown) via the terminal pin unit 105 and the circuit pattern, and to perform an accurate burn-in test or the like.

[0004]

However, the above I
When the burn-in test or the like is repeatedly performed under a temperature environment of about 150 ° C., the elastic restoring force of the silicon rubber plate 106 of the C socket 100 is reduced, and the contact stability between the bump 102 and the circuit pattern may be reduced. . Therefore, it has been desired to provide an IC socket 100 having even more excellent durability.

The present invention has been devised in order to meet such a demand in the market, and maintains good contact stability between the bump and the circuit pattern even when it is repeatedly used more than the conventional IC socket. Durable IC that can
The purpose is to provide a socket.

[0006]

According to a first aspect of the present invention, an integrated circuit (IC) is provided.
A plurality of conductive contact pads are formed to correspond to the plurality of bumps, and an elastically deformable insulating resin formed with a circuit pattern for electrically connecting the contact pads and an external electrical test circuit. A film, a support board for supporting a surface of the insulating resin film opposite to the surface on which the contact pads are formed, and positioning means attached to the support board for positioning the IC with respect to the insulating resin film. And IC pressing means attached to the support board and pressing an IC bump against a contact pad of the insulating resin film. Then, at a portion of the support board corresponding to the contact pad, the IC
A hole for receiving the bump is formed.

According to the present invention having such a structure, when the IC is positioned at a predetermined position by the positioning means, the I / O is controlled.
The bump C is securely mounted on the contact pad of the insulating resin film. In this state, when the IC is pressed by the IC pressing means, the bumps of the IC cause the insulating resin film to elastically deform so as to be recessed in the hole of the support board. At this time, the elastic force of the insulating resin film acts on the contact portion between the bump and the contact pad, and the bump and the contact pad come into contact with a desired contact pressure. When the pressing force of the IC pressing means acting on the IC is released, the insulating resin film is elastically restored and returns to the original state. Even if this series of operations are repeated, the insulating resin film has superior durability compared to the conventional silicon rubber plate, so that it is possible to perform an accurate IC electrical test for a long time. I do. Here, the circuit pattern may be formed on the upper surface side or the lower surface side of the insulating resin film, or on both sides of the upper surface side and the lower surface side.

According to a second aspect of the present invention, in the first aspect of the present invention, a part of the plurality of holes formed corresponding to the plurality of contact pads is formed to have a size different from other portions. Features.

According to the present invention having such a configuration, when the size of some of the plurality of holes formed in the support board is made different from the size of the other holes, the insulating resin The elastic deformation force of the film is different between some holes and other holes. Therefore, according to the present invention, it is possible to appropriately adjust the contact pressure between the bump and the contact pad.

According to a third aspect of the present invention, in the first aspect of the present invention, the support protrusion for supporting the insulating resin film is formed in an annular shape along the edge of the hole of the support board. .

According to the present invention having such a configuration, since the insulating resin film is supported by the annular support projections,
Is pressed by the IC pressing means, the insulating resin film is elastically deformed and recessed inside the support protrusion, and the bump is received inside the support protrusion and the hole of the support board. Then, a pressure is generated at the contact portion between the bump and the contact pad due to the elastic deformation of the insulating resin film. Here, the elastic deformation force (spring force) of the insulating resin film can be appropriately adjusted by appropriately changing the size (diameter) of the annular support protrusion.

According to a fourth aspect of the present invention, in the third aspect of the present invention, the support projection is partially cut away.

According to the present invention having such a configuration, the elastic deformation force of the insulating resin film can be changed by appropriately changing the notch amount of the support projection. That is, the contact pressure between the bump and the contact pad can be adjusted by changing the notch amount of the support protrusion.

According to a fifth aspect of the present invention, in the first aspect of the present invention, the edge of the hole of the support board is chamfered.

According to the present invention having such a configuration, when the insulating resin film is pressed by the bumps of the IC, the amount of temporal deformation of the insulating resin film changes depending on the chamfered shape. That is, it is possible to appropriately adjust the rate of increase in the contact pressure between the bump and the contact pad. Further, according to the present invention, it is possible to appropriately adjust the elastic deformation force of the insulating resin film by changing the magnitude of the chamfer amount.

According to a sixth aspect of the present invention, in the first aspect of the present invention, the hole is formed so as to be eccentric with respect to the bump of the IC.

According to the present invention having such a configuration, when the IC is pressed by the IC pressing means, the insulating resin film is depressed into the hole eccentric with the bump, and the IC is pressed into the center of the hole eccentric with the bump. Displaced to move toward. This is because the elastic deformation force of the insulating resin film is minimized at the center position of the hole. As a result, according to the present invention, the IC can be positioned by pressing the IC against one surface of the positioning means, and the positioning accuracy of the IC is improved.

According to a seventh aspect of the present invention, in the first aspect of the present invention, a tension adjusting hole is formed around the contact pad of the insulating resin film.

According to the present invention having such a configuration, the elastic deformation force of the insulating resin film can be adjusted by appropriately changing the size and shape of the tension adjusting hole, and the contact pressure between the bump and the contact pad can be adjusted. Can be appropriately adjusted.

According to an eighth aspect of the present invention, in the first aspect of the present invention, the contact pad of the insulating resin film has a bump receiving hole having a diameter smaller than that of the bump engaging with the bump of the IC. It is characterized by:

According to the present invention having such a configuration, when the IC is pressed by the IC pressing means, the insulating resin film is bent and deformed in the hole while the bump is engaged with the bump receiving hole of the contact pad. Therefore, a contact pressure is generated at the contact portion between the bump and the contact pad due to the elastic deformation force of the insulating resin film. Also, the IC is positioned by the bumps engaging the bump receiving holes in the contact portions. Further, the elastic deformation force of the insulating resin film can be adjusted by appropriately changing the size of the bump receiving hole.

According to a ninth aspect of the present invention, in the first aspect of the present invention, the contact pad of the insulating resin film is formed with a slit for engaging with the bump of the IC.

According to the present invention having such a configuration, it is possible to adjust the elastic deformation force of the insulating resin film by changing the shape of the slit. In such an invention, the bump makes line contact with the edge of the slit.

According to a tenth aspect of the present invention, in the first aspect of the present invention, a part of the insulating resin film in a region where the plurality of contact pads are formed is thicker than another part. It is characterized by being formed.

According to the present invention having such a configuration, the insulating resin film has a larger elastic deformation force in a thick portion than in other portions. That is, by changing the thickness of the insulating resin film, the contact pressure between the bump and the contact pad can be adjusted.

According to an eleventh aspect of the present invention, in the first aspect of the present invention, the first support board supports the insulating resin film and has the positioning means and the IC pressing means attached thereto. A second support board elastically supported by a first support board via a spring and having a hole for receiving the bump of the IC.

According to the present invention having such a configuration, the pressing force of the IC pressing means is opposed by the elastic deformation force of the spring and the elastic deformation force of the insulating resin film. Therefore, the present invention
It is possible to reduce the stress acting on the insulating resin film.

[0028]

Embodiments of the present invention will be described below in detail with reference to the drawings.

[First Embodiment] As shown in FIGS. 1 and 2, an IC socket 1 according to the present embodiment has a plate-like support made of an insulating resin material (for example, polyetherimide). A board 2, an insulating resin film 3 to be superimposed on the support board 2, and an insulating resin film 3
The positioning film 4 includes a positioning film 4 to be superimposed thereon and a pressing jig 5 to be superimposed on the positioning film 4. The support board 2, the insulating resin film 3, the positioning film 4 and the pressing jig 5 are integrally fastened and fixed by a fastening means 8 including a screw 6 and a nut 7.

As shown in FIGS. 1 and 6 to 8, the insulating resin film 3 has a plurality of contact pads 11 formed on the upper surface 3a corresponding to the bumps of the IC 10 of FIG. A circuit pattern 13 extending from the pad 11 toward the outer edge of the upper surface is formed. A terminal pin 1 made of conductive metal extends downward through the insulating resin film 3 and fits into a terminal socket 14 of the support board 2 described later at an end of the circuit pattern 13.
5 is fixed (see FIG. 2). The insulating resin material film 3 is formed of a resin material having heat resistance, durability and elasticity, for example, polyetherimide, polyethersulfone, polyphenylene sulfide, or the like.

Here, the contact pad 11 and the circuit pattern 13 are formed in a predetermined shape with copper on the upper surface 3a of the insulating resin film 3 and then nickel-plated on the copper.
Further, it is formed by plating gold, rhodium, solder or the like on nickel plating. As shown in FIG. 6, four positioning holes 18 are formed outside the contact pads 11 of the insulating resin film 3 so as to engage with the positioning projections 17 on the lower surface of the socket body 16. Further, four holes 20 for receiving the shaft of the screw 6 are formed outside the positioning holes 18. In FIG. 6, all the contact pads 11 have the circuit pattern 1 as shown in FIG.
3 is connected to each terminal pin 15 via the circuit pattern 13.

As shown in FIGS. 1 to 5, the support board 2 is provided with contact pads 11 (ICs) of the insulating resin film 3.
Through holes (holes) 22 for receiving the bumps 21 of the IC 10 are formed at positions corresponding to the ten bumps 21).
A terminal socket 14 for receiving the terminal pin 15 is attached to the support board 2 at a position corresponding to the terminal pin 15 of the insulating resin film 3. Here, the terminal socket 14 is formed of a conductive metal, a terminal pin 15 is fitted into the upper socket portion 14a, and a pin portion 14b protruding downward from the support board 2 has an external electrical test circuit (not shown). Are fitted in the mounting holes.

The support board 2 is, as shown in FIG.
The upper surface 2a is formed in a planar shape so as to support the back surface 3b side of the insulating resin film 3 (see FIG. 7),
The positioning protrusion 1 on the lower surface of the socket body 16 is provided on the upper surface 2a.
Four positioning holes 23 are formed to be engaged with the positioning member 7.
Outside the positioning hole 23, four holes 24 and 25 for receiving the screw 6 and the nut 7 are formed.

The positioning film 4 is formed of an insulating resin film as shown in FIGS. 1 to 3 and FIG. 9 and has a rectangular hole surrounding the outermost bump 21 of the bump 21 of the IC 10. 26 are formed, and this rectangular hole 2 is formed.
At 6, the IC 10 is positioned on the insulating resin film 3.

The positioning film 4 is also provided with four positioning holes 27 for engaging with the positioning projections 17 on the lower surface of the socket body 16, and a hole 28 for receiving the screw 6 is provided outside the positioning hole 27. It is formed at four places (see FIGS. 9 and 10).

As shown in FIGS. 1 to 3 and FIGS. 10 to 13, the pressing jig 5 includes a socket body 16 fixed on the support board 2 via the insulating resin film 3 and the positioning film 4. And a cover 31 rotatably attached to the socket body 16 and opening and closing the rectangular IC inlet 30 of the socket body 16.

Among them, the socket body 16 has the positioning projection 17 formed on the lower surface thereof as described above.
By engaging the positioning projections 17 with the positioning holes 27 of the positioning film 4, the positioning holes 18 of the insulating resin film 3, and the positioning holes 23 of the support board 2, the socket body 16 itself and the positioning film 4 and the insulating resin film are formed. 3 is positioned with respect to the support board 2. The socket body 16 is a rectangular IC.
Guide walls 32 for guiding the IC 10 to predetermined positions on the positioning film 4 and the insulating resin film 3 are formed at four corners of the inlet 30. The guide wall 32 is inclined so as to enlarge the IC inlet 30 as going upward, so that the IC 10 can be guided smoothly. Here, the guide wall 32 and the positioning film 4 function as positioning means for positioning the IC.

A cover mounting portion 33 for rotatably mounting the cover 31 is formed on one side surface of the socket body 16. The arm portion 34 of the cover 31 is attached to the cover attachment portion 33 so as to be rotatable via a rotation shaft 35. Further, on the other side surface of the socket body 16, a hook 37 that engages with the step portion 36 of the cover 31 is attached so as to be rotatable via a rotation shaft 38. The cover 31 is constantly urged by a spring 40 in the clockwise direction (opening direction) in FIGS. The hook 37 is constantly biased by a spring 41 in the clockwise direction in FIGS. 10 and 11 (the direction in which the cover 31 is closed).

An IC pressing block 42 is attached to the cover 31. As shown in FIGS. 10, 11, and 13, the IC pressing block 42 is slidably housed in a block housing recess 43 formed on the lower surface side of the cover 31, and a pair of tongues formed on both upper sides. Piece 4
The shaft 46 is fitted into the mounting hole 45 of the block 4, and both ends of the shaft 46 are elongated holes 4 of the side wall 47 of the block accommodating recess 43.
8 so as to be slidable. A spring receiving hole 50 is formed above the block receiving recess 43 of the cover 31.
A compression coil spring 51 is accommodated in the inside of the cylinder.
The compression coil spring 51 is connected to an IC via a shaft 46.
The pressing block 42 is always urged downward in FIGS. 10 and 13, and the bump 21 of the IC 10 is pressed against the contact pad 11 of the insulating resin film 3 via the IC pressing block 42 to The contact pad 11 is brought into contact with a desired contact pressure (see FIG. 3).

Here, in the IC pressing block 42, the shaft 46 is pressed by the compression coil spring 51 when the cover 31 is opened, and abuts on the lower end of the elongated hole 48. or,
When the cover 31 is closed, the IC pressing block 42
The compression coil spring 51 is compressed and contracted by the thickness of the IC 10 so that the shaft 46 slides in the elongated hole 48 and
The side wall 42a of the C pressing block 42 is
The slide is guided by the third side wall 43a.

The lower surface of the IC pressing block 42 is formed in a rectangular shape in conformity with the shape of the IC 10, and a rectangular concave portion 52 is formed on the lower surface thereof. A pressing surface 53 is formed. Then, the IC pressing surface 53 presses the upper surface of a portion corresponding to the bump 21 of the IC 10 (see FIG. 3). Therefore, IC 10
C is pressed by the pressing surface 53 and the bump 21 of the IC 10 is pressed.
Surely contacts the contact pad 11 of the insulating resin film 3. Here, the cover 31, the IC pressing block 42
And a compression coil spring 51 for pressing the IC
Is configured.

An inclined wall 55 is formed above the step 36 of the cover 31. Therefore, a sufficient space for operating the hook 37 is secured near the operation portion 37a at the tip of the hook 37, and the hook 37 can be easily operated by a machine or manually.

When the engagement between the hook 37 and the stepped portion 36 of the cover 31 is released, the cover 31 rotates clockwise in FIG. The IC inlet 30 of the socket body 16 opens (see FIG. 11). Next, the IC 10 is inserted into the IC inlet 30 of the socket body 16 with the bump 21 facing down (see FIGS. 1 and 3). At this time, the IC 10 is guided by the guide wall 32 of the socket body 16 and placed at a predetermined position on the positioning film 4 and the insulating resin film 3. Then, the outermost portion of the bump 21 of the IC 10 is positioned at the edge of the rectangular hole 26 of the positioning film 4 (see FIG. 3). As a result, the bumps 21 of the IC 10
Is securely in contact with the contact pad 11 of the insulating resin film 3.

After the IC 10 is housed in the socket body 16, the cover 31 is closed and the hook 37 is
The cover 31 is locked on the upper portion of the socket main body 16 when it is engaged with the step portion 36 of FIG. At this time, the compression coil spring 51 is compressed by the thickness of the IC 10, and the spring force of the compression coil spring 51 acts on the IC 10 via the IC pressing block 42. As a result, bump 2 of IC 10
In 1, the insulating resin film 3 is recessed toward the hole 22 of the support board 2 and is received in the hole 22 of the support board 2. Here, the insulating resin film 3 is elastically deformed by being pressed by the bumps 21 to bring the bumps 21 and the contact pads 11 into contact with a desired contact pressure. In addition, it has been confirmed that the durability of the insulating resin film 3 when a load is repeatedly applied in a temperature environment of about 150 ° C. is much better than that of the conventional silicone rubber plate.

As described above, in this embodiment, when the IC 10 is pressed by the IC pressing means 54, the bumps 21 of the IC 10
2 so that the contact pressure between the bump 21 and the contact pad 11 is obtained by the elastic force of the insulating resin film 3, the burn-in test and the like are repeated under a temperature environment of about 150 ° C. However, the insulating resin film 3 having excellent durability can be repeatedly elastically deformed to bring the bumps 21 and the contact pads 11 into contact with a desired contact pressure, and the electrical test of the IC 10 can be accurately performed for a long time. become.

In this embodiment, the holes 2 of the support board 2 are used.
2 is a circular through hole, but is not limited thereto.
1 and any shape such as an elliptical shape or a substantially cross shape, and may be a bottomed hole 22a as shown in FIG. 14 (a) or a hole as shown in FIG. 14 (b). (Dent) 22b
It may be.

Although the present embodiment has shown the mode in which all the holes 22 are formed in the same size, the present invention is not limited to this.
By forming a part of the plurality of holes 22 to have a size different from that of the other part, the elastic deformation force of the insulating resin film 3 can be made different between the part and the other part. That is, the magnitude of the contact pressure between the bump 21 and the contact pad 11 can be adjusted. For example, if a part of the plurality of holes 22 is made larger than the size of the hole 22 in the other part, a part of the
The elastic deformation force of the portion of the insulating resin film 3 corresponding to the portion 2 becomes smaller than the other portions.

[Second Embodiment] FIG. 15 shows a second embodiment of the present invention. As shown in FIG. 15, in the present embodiment, a support projection 56 for supporting the insulating resin film 3 is formed in an annular shape at the edge of the hole 22 for receiving the bump 21 of the support board 2.

According to the present embodiment having such a configuration,
When the IC 10 is pressed by the IC pressing means 54, the IC 10
Of the IC 10 is recessed (elastically deformed) inside the annular support protrusion 56, and the bump 21 of the IC 10 is received inside the support protrusion 56 (in the hole 22). As a result, a desired contact pressure is generated at the contact portion between the bump 21 and the contact pad 11 due to the elastic deformation force of the insulating resin film 3, and the same effect as in the first embodiment can be obtained. .

In this embodiment, if the diameter of a part of the plurality of support protrusions 56 is made different from the diameter of the other support protrusions 56, the elastic deformation force of the insulating resin film 3 is reduced. Partial adjustment becomes possible.

Also, as shown in FIG. 16, the annular support protrusion 56 is partially cut out to form a notch 57 so that the tension of the insulating resin film 3 is adjusted and the bump 21 and the contact pad are formed. You may make it adjust the contact pressure with 11.

[Third Embodiment] FIG. 17 shows a third embodiment of the present invention. As shown in FIG. 17, in the present embodiment, a chamfer 58 is formed on the edge of the hole 22 for receiving the bump 21 of the support board 2.

According to the present embodiment having such a configuration,
When the IC 10 is pressed by the IC pressing means 54, the IC 10
The bump 21 is received in the hole 22 while deforming the insulating resin film 3 along the chamfer 58 of the hole 22. At this time, the increase in the elastic deformation force of the insulating resin film 3 becomes slower than in the first and second embodiments, and the increase in the contact pressure between the bump 21 and the contact pad 11 also becomes slower. become.

As described above, in the present embodiment, the bump 21
And the contact pad 11 can be smoothly contacted, and the bump 21 and the contact pad 11 can be brought into contact with a desired contact pressure, so that the same effect as in the first embodiment can be obtained.

In this embodiment, the holes 2 of the support board 2 are used.
Although the mode in which the C chamfer 58 is applied to the edge of No. 2 has been described, the invention is not limited to this, and a curved chamfer (R chamfer) may be applied. In this way, the increase in the elastic deformation force of the insulating resin film 3 can be further smoothed.

In this embodiment, by changing the amount of chamfering, the elastic deformation force of the insulating resin film 3 can be adjusted, and the contact pressure between the bump 21 and the contact pad 11 can be adjusted. it can.

[Fourth Embodiment] FIG. 18 shows a fourth embodiment of the present invention. As shown in FIG. 18, in the present embodiment, the holes 22 of the support board 2 are formed so as to be eccentric by a predetermined amount e with respect to the positions of the bumps 21. Here, the position of the bump 21 refers to the position of the bump 21 in a state where the IC 10 is set in the socket body 16 and the outermost bump 21 of the IC 10 is engaged with the rectangular hole 26 of the positioning film 4 ( (See FIG. 3).

According to the present embodiment having such a configuration,
When the IC 10 is pressed by the IC pressing means 54, the bump 21 slides toward the center S <b> 1 of the hole 22 while bending the insulating resin film 3 into the hole 22. This is because if the contact position between the bump 21 and the contact pad 11 is closer to the edge of the hole 22, a component force acts on the bump 21 toward the center S <b> 1 of the hole 22. Therefore, when the IC 10 is pressed by the IC pressing means 54 in the socket body 16, the IC 10 slides slightly by the action of the eccentric hole 22,
The outermost bump 21 can be brought into contact with the edge of the rectangular hole 26 of the positioning film 4. Thereby, the positioning accuracy of the IC 10 is further improved. That is, in the present embodiment, regardless of the variation in the gap between the rectangular hole 26 of the positioning film 4 and the outermost bump 21 of the bumps 21 of the IC 10, the rectangular hole 26 of the positioning film 4 IC 10 can be reliably positioned with reference to the edge of the IC 10.

According to the present embodiment, the bump 21 of the IC 10 can be accurately positioned at a predetermined position on the contact pad 11, and is pressed by the bump 21 so as to be elastically deformed into the hole 22 and recessed. Since a desired contact pressure can be generated at the contact portion between the bump 21 and the contact pad 11 due to the elastic deformation force of the resin film 3, the same effect as in the first embodiment can be obtained. Of course, it allows for more accurate electrical testing of IC10.

[Fifth Embodiment] FIG. 19 shows a fifth embodiment of the present invention. As shown in FIG. 19, in the present embodiment, a tension adjusting hole 60 is formed around the contact pad 11 of the insulating resin film 3.
As described above, by appropriately forming the tension adjusting hole 60 in the insulating resin film 3, the contact pressure between the contact pad 11 and the bump (not shown) near the tension adjusting hole 60 can be adjusted.

Therefore, according to the present embodiment having such a configuration, the contact pressure between each bump and the contact pad 11 can be adjusted to the most preferable value, and the electrical test of the IC can be performed more accurately.

In the present embodiment, the tension adjusting holes 6
By changing the value of 0, the contact pressure between each bump and the contact pad 11 can be adjusted more precisely.

[Sixth Embodiment] FIG. 20 shows a sixth embodiment of the present invention. As shown in FIG. 20, in the present embodiment, a bump receiving hole 61 having a smaller diameter than bump 21 is formed in contact pad 11 of insulating resin film 3.
Are formed.

According to the present embodiment having such a configuration,
A bump receiving hole 61 is provided in a part of the plurality of contact pads 11.
The contact pressure between the contact pad 11 and the bump 21 at the portion where the bump receiving hole 61 is formed can be reduced. That is, in the present embodiment, it is possible to change the contact pressure between some of the contact portions between the plurality of bumps 21 and the contact pads 11 and the other portions.

In this embodiment, the bump receiving holes 61 may be formed in all the contact pads 11. Further, the size of the bump receiving hole 61 may be appropriately changed, and the contact pressure between the bump 21 and the contact pad 11 may be precisely adjusted. In this manner, a better contact state between the bump 21 of the IC 10 and the contact pad 11 can be obtained, and a more accurate electrical test of the IC 10 can be performed.

In this embodiment, the contact pad 1
1 has a bump receiving hole 61 formed therein, and the bump 21 engages with the bump receiving hole 61 to accurately position the IC 10.
6 can be roughened, or the positioning film 4 can be omitted. Therefore, in the present embodiment, it is possible to reduce the number of parts as compared with the above embodiments.

[Seventh Embodiment] FIG. 21 shows a seventh embodiment of the present invention. As shown in FIG. 21, in the present embodiment, a slit 62 that engages with the bump 21 is formed in the contact pad 11 of the insulating resin film 3.

According to the present embodiment, the IC 1
0 is pressed by the IC pressing means 54, the bump 2
1 fits into the slit 62 while bending the insulating resin film 3 into the hole 22 of the support board 2, and the bump 21 and the contact pad 11 contact with a desired contact pressure.

As described above, if the slit 62 is formed in a part of the plurality of contact pads 11, the contact pressure between the contact pad 11 and the bump 21 in the portion where the slit 62 is formed can be reduced. That is, in the present embodiment, it is possible to change the contact pressure between some of the contact portions between the plurality of bumps 21 and the contact pads 11 and the other portions.

In the present embodiment, the slit 62
May be formed on all the contact pads 11.
Furthermore, the size (for example, the length) of the slit 62 may be changed as appropriate, and the contact pressure between the bump 21 and the contact pad 11 may be precisely adjusted. In this manner, a better contact state between the bump 21 of the IC 10 and the contact pad 11 can be obtained, and a more accurate electrical test of the IC 10 can be performed.

In the present embodiment, the contact pad 1
Since the slit 62 is formed in the IC chip 1, the positioning of the IC 10 is accurately performed by engaging the bump 21 with the slit 62. Therefore, the positioning film 4
The accuracy of the rectangular hole 26 can be roughened, or the positioning film 4 can be omitted. Therefore, in the present embodiment, it is possible to reduce the number of parts as in the sixth embodiment.

[Eighth Embodiment] FIG. 22 shows an eighth embodiment of the present invention. As shown in FIG. 22, in the present embodiment, in the insulating resin film 3, the thickness of the insulating resin film 3 in a range where the plurality of holes 22 are formed in the support board 2 is partially increased. (3A <3
B) to be formed.

According to the present embodiment having such a configuration,
The thicker portion 3B of the insulating resin film 3 has a larger elastic deformation force than the thinner portion 3A. Therefore, in the present embodiment, the contact pressure between the contact pad (not shown) and the bump (not shown) formed on the thick portion 3B of the insulating resin film 3 can be increased. That is, in the present embodiment, the elastic deformation force of the insulating resin film 3 can be adjusted by appropriately changing the thickness of the insulating resin film 3, and the contact pressure between the bump and the contact pad can be adjusted. Can be. As a result, in this embodiment, a better contact state between the bumps of the IC and the contact pads can be obtained, and a more accurate electrical test of the IC can be performed.

[Ninth Embodiment] FIGS. 23 and 24 show a ninth embodiment.
It shows a ninth embodiment of the present invention. As shown in these figures, the support board 2 of the present embodiment
Is divided into a support board 63 and a second support board 64. Among them, the second support board 64 is formed to have substantially the same size as the rectangular hole 26 of the positioning film 4 in FIG. 9, and corresponds to the contact pad 11 of the insulating resin film 3 in FIG. A hole 22 for receiving the bump 21 is formed at the position. Then, the second support board 64
The four corners inside the region where the hole 22 is formed
The first support board 63 is resiliently supported by the first support board 63 and moves up and down in a rectangular recess 66.

In the present embodiment having such a configuration, the elastic force of the insulating resin film and the spring force of the four springs 65 (not shown) apply to the pressing force of the IC pressing means 54 shown in FIG. Since they are opposed to each other, the burden on the insulating resin film is reduced. As a result, in the present embodiment, the durability of the insulating resin film is improved compared to the first embodiment, and the IC resin is provided for a longer period of time than in the first embodiment.
Electrical test can be performed accurately.

[0076]

As described above, according to the present invention, the holes for receiving the bumps of the IC are formed in the support board, and
When pressed by the C pressing means, the bumps of the IC cause the contact pads of the insulating resin film having excellent high-temperature durability to be elastically deformed into the holes, and the elastic deformation of the insulating resin film to the contact portions between the bumps and the contact pads. Since the contact pressure caused by the force is generated, the electrical test of the IC can be accurately performed for a long period of time as compared with the conventional example in which the contact pressure between the bump and the contact pad is obtained by the silicon rubber plate. .

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of an IC socket according to a first embodiment of the present invention.

FIG. 2 is a front sectional view of the IC socket.

FIG. 3 is a partially enlarged view of FIG. 2;

FIG. 4 is a plan view of the support board according to the first embodiment of the present invention.

FIG. 5 is a sectional view of the support board.

FIG. 6 is a plan view of the insulating resin film according to the first embodiment of the present invention.

FIG. 7 is a sectional view of the insulating resin film.

FIG. 8 is a partially enlarged view of FIG. 6;

FIG. 9 is a plan view of a positioning film showing the first embodiment of the present invention.

FIG. 10 is a cross-sectional view (a cross-sectional view cut along line AA of FIG. 12) of the pressing jig according to the first embodiment of the present invention.

FIG. 11 is a view showing a state where a cover of the pressing jig is opened.

FIG. 12 is a plan view showing a part of the pressing jig cut away.

13 is a cross-sectional view taken along the line BB of FIG.

FIG. 14 is a sectional view of a hole showing an application example of the first embodiment of the present invention. FIG. 14A is a diagram illustrating a first application example, and FIG. 14B is a diagram illustrating a second application example.

FIG. 15 is an enlarged view of a main part of an IC socket showing a second embodiment of the present invention. FIG. 15A is an enlarged sectional view of a main part of the IC socket, and FIG. 15B is a plan view of a main part of the support board.

FIG. 16 is a main part plan view of a support board showing an application example of the second embodiment.

FIG. 17 is an enlarged view of a main part of an IC socket showing a third embodiment of the present invention. FIG. 17A is an enlarged sectional view of a main part of the IC socket, and FIG. 17B is a plan view of a main part of the support board.

FIG. 18 is an enlarged view of a main part of an IC socket showing a fourth embodiment of the present invention. FIG. 18A is an enlarged sectional view of a main part of the IC socket, and FIG. 18B is a plan view of a main part of the support board.

FIG. 19 is a plan view of a principal part of an insulating resin film according to a fifth embodiment of the present invention.

FIG. 20 is an enlarged view of a main part of an IC socket showing a sixth embodiment of the present invention. FIG. 20A is an enlarged sectional view of a main part of the IC socket, and FIG. 20B is a plan view of a main part of the insulating resin film.

FIG. 21 is an enlarged view of a main part of an IC socket showing a seventh embodiment of the present invention. FIG. 21A is an enlarged sectional view of a main part of the IC socket, and FIG. 21B is a plan view of a main part of the insulating resin film.

FIG. 22 is a sectional view of a main part of an IC socket according to an eighth embodiment of the present invention.

FIG. 23 is a plan view of a support board showing a ninth embodiment of the present invention.

FIG. 24 is a sectional view of the support board.

FIG. 25 is a sectional view of a conventional IC socket.

FIG. 26 is a partially enlarged view of FIG. 25.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... IC socket, 2 ... Support board, 3 ... Insulating resin film, 4 ... Positioning film (positioning means), 10 ... IC, 11 ... Contact pad, 13 ... Circuit pattern, 21 ... Bumps, 22 holes, 32 guide walls (positioning means), 54 IC pressing means, 56
... Support protrusion, 58, chamfer, 60, tension adjustment hole,
61 bump receiving hole, 62 slit, 63 first support board, 64 second support board, 65
Spring

Claims (11)

[Claims] A plurality of conductive contact pads are formed to correspond to a plurality of bumps of an IC, and a circuit pattern for electrically connecting the contact pads to an external electrical test circuit is formed. A deformable insulating resin film, a support board for supporting a surface of the insulating resin film opposite to the surface on which the contact pads are formed, and an IC attached to the support board and attaching the IC to the insulating resin film. An IC pressing means attached to the support board and pressing an IC bump against the contact pad of the insulating resin film, wherein the contact pad of the support board is In the corresponding part,
An IC socket, wherein a hole for receiving the bump of the IC is formed. 2. The IC socket according to claim 1, wherein a part of the plurality of holes formed corresponding to the plurality of contact pads is formed to have a size different from that of another part. 3. The IC socket according to claim 1, wherein the support protrusion for supporting the insulating resin film is formed in an annular shape along an edge of the hole of the support board. 4. The IC socket according to claim 3, wherein said support projection is partially cut out. 5. The IC socket according to claim 1, wherein an edge of the hole of the support board is chamfered. 6. The IC socket according to claim 1, wherein the hole is formed so as to be eccentric with respect to the bump of the IC. 7. The IC socket according to claim 1, wherein a tension adjusting hole is formed around the contact pad of the insulating resin film. 8. The IC socket according to claim 1, wherein the contact pad of the insulating resin film is formed with a bump receiving hole having a smaller diameter than the bump that engages with the bump of the IC. . 9. The IC socket according to claim 1, wherein a slit for engaging with a bump of the IC is formed in the contact pad of the insulating resin film. 10. A film thickness of a part of the insulating resin film in a range where the plurality of contact pads are formed is formed to be thicker than another part.
The described IC socket. 11. The support board supports the insulating resin film and the positioning means and the IC.
A first support board to which a pressing means is attached;
Is elastically supported by a support board via a spring.
2. The IC socket according to claim 1, further comprising a second support board having a hole for receiving the C bump.