JP2000156268A - Ic socket and contact pin for ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC socket and a contact pin for the same, superior in the high frequency characteristic, and capable of using under a high temperature area, providing the elasticity to a contact pin (hereinafter 'pin') itself, not affected by the difference in pin insertion amounts, and not giving large damage to a substrate side electrode. SOLUTION: A pin 103 comprises an upper end contact part 104 for loading a lead 126 of IC on its upper end to be contacted therewith, a lower contact part 106 obliquely downwardly extended from the upper contact part 104 and contacting with an electrode of a wiring board on its lower end part, an elastic curved part 108 extended from the upper end contact part 104 at its one end, and a reference part 109 formed on the other end of the curved part 108, a socket body 101 comprises a slit part 110 formed around the IC installation place for guiding the lower end contact part of the pin to a central lower part of the socket body, and accommodating the reference part 109, an upper plate presses and fixes the reference part 109 accommodated in the slit part 110 to keep the standby attitude. The contact pressure is obtained on the upper end contact part 104 and the IC lead 126 by the elasticity of the curved part 108, on a connection part of the reference part 109 of the pin 103 and the curved part 108 when the IC lead is pressed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket serving as a contact medium between an IC and a wiring board and a contact pin used for the same, and more particularly to an IC socket and a contact pin requiring high frequency characteristics.

[0002]

2. Description of the Related Art In recent years, the operating frequency of ICs has become higher and higher, and accordingly, the demand for high-frequency characteristics has also been required for IC sockets. Therefore, in order to improve the high frequency characteristics of the IC socket, it is necessary to shorten the signal line length of the contact pins of the IC socket. On the other hand, the contact pins must have a structure for making elastic contact with the IC leads under pressure. For example, in the case of a contact pin in which a signal line itself is provided with a spring portion when punching from a contact pin metal material, there is a limit to the shortening of the spring length, that is, the shortening of the signal line length in terms of the pressure contact characteristics. It has been difficult to achieve low inductance with this type of contact pin.

On the other hand, Japanese Patent Application Laid-Open No. 5-174880 (Japanese Patent Application No. 4-38865) (hereinafter sometimes referred to as "Reference Document 1") has hook portions provided at both ends of a contact arm for forming a contact pin. Each of the hooks captures a columnar rubber that is laterally in contact with the socket main body and holds it at a fixed position on the socket main body, thereby holding a standby state (normal state).

Japanese Unexamined Patent Application Publication No. 10-50440 (Japanese Patent Application No. 8-204994) (hereinafter sometimes referred to as “Reference Document 2”) discloses a method in which a contact pin is provided with no elastic portion, and the center of a Y-shaped contact pin is provided. Elastic body (rubber, air tube, liquid tube, etc.) between one or both of one contact arm forming the Y-shape of the Y-shaped contact and the other pressing piece with the hanging projection as a fulcrum The elasticity of the elastic body against the rotation of the contact pin is formed by the restoring force of the elastic body.

[0005]

As described above, it is difficult to reduce the inductance of the contact pin of the type in which the signal line itself is provided with a spring portion as described above.

[0006] Further, the common feature of the two inventions described in Reference Documents 1 and 2 shown as examples of the above-mentioned conventional technology is that a columnar rubber or rubber, an air tube, or a liquid tube is used as a substance generating elasticity. There is a possibility that disconnection or hardening may occur when used at a high temperature, the durability is poor, and there are many problems as a socket. Among the rubber types, even a silicon rubber that is strong in a high-temperature environment causes disconnection and hardening at high temperatures. It is expected that the temperature that can be guaranteed for use will be up to 90 ° C.

Further, in Reference 2, since a large number of contact pins are provided with a rectangular columnar rubber,
When an IC having a variation in height is set on an IC lead, a strong contact pressure is applied to an IC lead having a variation below, but a normal (or upward) variation occurs adjacent to the IC lead. There is a possibility that the contact pressure on the IC lead may be weak, or in an extreme case, the IC lead may not be contacted.

In the invention described in Reference 1, an IC
At the time of contact with the lead, the contact portion that contacts the wiring board has I
The reaction force of the contact pressure with the C lead is applied, and according to the invention described in Reference Document 2, at the time of contact with the IC lead, the contact portion formed by the protrusion contacting with the wiring board is caused by the contact pressure with the IC lead. Both the reaction force and the restoring force of the rubber are applied, and both of them apply a load to the electrode portion (land) of the wiring board. Furthermore, when the contact pressure from the IC lead comes into contact with the wiring substrate, the contact portion rotates (wipes), so that when the load is large, the electrode portion (land) of the wiring substrate is likely to be damaged.

The present invention effectively solves these problems, and allows the contact between the contact pin and the IC lead to be performed without variation, while at the same time properly reducing the inductance of the contact pin.

[0010]

In order to solve the above problems, an IC socket according to the present invention comprises a socket body having a number of contact pins for connecting an IC and a wiring board, and the contact pins being provided on the socket body. An upper plate for holding, wherein the contact pin has an upper end contact portion for placing an IC lead on the upper end and making contact therewith, and a lower end portion extending obliquely downward from the upper end contact portion to contact an electrode of the wiring board. A lower end contact portion, a curved portion having one end extending from the upper end contact portion and having elasticity, and a reference portion formed at the other end of the curved portion, wherein the socket body is provided around an IC placement location. A guide is provided for guiding the lower end contact portion of the contact pin downwardly in the center of the socket body, and has a slit portion for accommodating the reference portion, and the upper plate is provided with a reference portion accommodated in the slit portion. The hold-down is fixed to hold the standby state. When the IC lead is pressurized, the connection between the reference portion of the contact pin and the curved portion becomes a fulcrum, and a contact pressure is obtained between the upper end contact portion and the IC lead by the elasticity of the curved portion.

Further, in the above, when the lower contact portion is supported on the electrode of the wiring board, the lower contact portion is pushed up by the electrode, and when the upper contact portion is pressed down by the IC lead, the contact is The pin serves as a fulcrum at the lower end contact portion and the connection portion between the reference portion and the curved portion, the curved portion is displaced, and a pressure contact state is obtained between the lower end contact portion and the electrode, and a contact pressure is obtained between the upper end contact portion and the IC lead. Can be

Further, in the above, when the lower end contact portion is supported on the electrode of the wiring board, the lower end contact portion is pushed up by the electrode, and when the upper end contact portion is pressed down by the IC lead and is pushed down, the contact is formed. The pin serves as a fixed fulcrum where the reference portion and the bending portion are integrally connected, and the bending portion is displaced and the lower end contact portion rotates and contacts on the electrode to obtain a pressurized contact state between the lower end contact portion and the electrode. A contact pressure may be obtained between the upper contact portion and the IC lead.

At this time, an upper plate and a socket body provided with a coupling portion to be connected to each other are used.

In the contact pin used in the above, an electric path is formed between the upper end contact part and the lower end contact part, and the reference part and the curved part between the upper end contact part and the reference part do not form an electric path.

[0015] The socket body has a locking wall in the center near the lower end contacting part which is guided below the lower surface of the center of the socket main body by the slit part. When the lower end portion contacts the electrode of the wiring board and an upward force is applied, the upper end contact portion is restricted from moving upward, and the upper end contact portion is pressurized and pushed down so that the lower end portion of the lower end contact portion is wired. The lower end contact portion is made to be a contact portion when it contacts the electrode of the substrate and rotates.

Further, a projection is provided at a lower end contact portion of the contact pin, and a recess for accommodating the projection of the lower end contact portion is formed on a locking wall provided at a central portion of the socket body.
When the lower end portion of the lower end contact portion contacts the electrode of the wiring board and an upward force is applied, the protrusion of the lower end contact portion is housed to limit upward movement, and the upper end contact portion is pressed and pressed down. The lower end portion of the lower end contact portion may be in contact with an electrode of the wiring board, and the lower end contact portion may be a contact portion when the projection rotates in the concave portion when moving on the electrode.

Alternatively, a projection is provided at the lower end contact portion of the contact pin, and the projection at the lower end contact portion of the contact pin and the lower surface of the central portion of the socket body are guided below the lower surface of the center of the socket body by the slit portion. And a floating member supported by the protrusion of the lower end contact portion, and a lower end contact portion located between the lower portion of the center portion of the socket body and the floating member. And an elastic body for applying a force to the elastic member.

The contact pin used in the above-mentioned IC socket has an upper end contact portion for placing an IC lead on the upper end and making contact therewith, and extends obliquely downward from the upper end contact portion so that the lower end portion contacts the electrode of the wiring board. A lower end contact portion for, and a curved portion having one end extending from the upper end contact portion and having elasticity,
A reference portion formed at the other end of the curved portion, wherein an electric path is formed between the upper end contact portion and the lower end contact portion, and the reference portion and the curved portion between the upper end contact portion and the reference portion do not form an electric path. It is.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an IC socket according to the present invention will be described below with reference to the drawings.

FIG. 1A is a sectional view of a main part of an IC socket, and is a sectional view taken along the line AA of FIG. 2 described later. FIG. 1A shows a view in which an IC is mounted and a cover is closed. And contacts indicate what is located when the cover is opened. In FIG. 1, reference numeral 101 denotes a socket main body formed of an insulator, and 102 denotes an upper plate.
And a substantially rectangular hole (the four corners are rounded) at the center. Reference numeral 103 denotes a contact pin formed by punching a flat plate of a metal conductor, and its enlarged view is shown in FIG. 104 is an upper end contact portion of the contact pin 103; 105 is an electric circuit portion extending obliquely downward from the upper end contact portion 104 to form an electric circuit; 106 is a lower end contact portion located at the lower end of the electric circuit portion 105 and having a rounded end. , 107 extend from the upper end contact portion 104 and bend downward to provide elasticity, and a small bending portion constituting a part of the bending portion. 108 extends downward from the small bending portion 107 and further curves upward. A large curved portion 109 having elasticity and constituting a curved portion together with the small curved portion 107 is a rectangular reference portion integrally formed at an end of the large curved portion 108. Reference numeral 403 denotes an upper end and an inner end (the socket body 1) of the reference portion 109 provided on the lower inner surface of the upper plate 102.
01 (the side facing the center of No. 01).

Reference numeral 110 denotes a slit formed in the socket main body 101. The slit 110 guides the lower end contact portion 106 to the lower center of the socket main body 101, and the reference portion 1
09 is stored. Reference numeral 111 denotes a locking wall located below the center of the socket body 101, and forms a slope facing upward from the lowermost portion, which is a portion facing a wiring board (not shown). Reference numeral 112 denotes a place for arranging the IC, which is located above a surface where the upper surface of the member constituting the locking wall 111 is formed in a rectangular shape according to the shape of the IC. Reference numeral 113 denotes an IC guide projection formed integrally with the socket body 101.

Reference numeral 114 denotes a cover formed of an insulator and made of the same material as the socket body 101, for example, and 115 denotes a socket body 10
1 is a socket bearing portion formed on one side surface and rotatably connecting the cover 114. Reference numeral 116 denotes a cover bearing, which is provided on one side surface of the cover 114 and is connected to the bearing on the socket body 101 side. Reference numeral 117 denotes a cover shaft that penetrates the connection bearings 115 and 116 to connect the two, 118 denotes a stopper provided above the side facing the side surface on which the cover bearing 116 is formed, and 119 denotes the stopper 118 that can rotate. Is a stopper spring that acts on one end of the stopper 118 to apply a rotational force, and 121 is a hook formed on the other end of the stopper 118. Reference numeral 122 denotes a hook locking projection, which is provided on a side surface of the socket body 101 opposite to the side surface on which the socket bearing portion 115 is formed.
, The cover 114 is kept closed. 12
Reference numeral 3 denotes a projection pad for holding an IC lead formed on the inner surface of the cover 114, and reference numeral 124 denotes a storage portion, which is formed on the inner surface of the cover and is the IC guide projection 1 when the cover 114 is closed.
13 is stored in the recess. 125 is an IC, and 126 is an IC lead.

FIG. 2 is a plan view of the IC socket, in which the cover 114 is closed above the center line of the alternate long and short dash line, and the cover 114 is opened below the center line. In FIG. 2, 127 is a cover spring for applying a force in a direction to open the cover 114, and 128 is the upper plate 102 and the socket body 1.
01 (not shown), for example, using rivets. In FIG. 2, components denoted by the same reference numerals as those in FIG. 1 indicate the same components.

FIG. 3 is a right side view of the IC socket. FIG. 3 is a sectional view taken along the line BB of FIG. In FIG. 3, FIG.
Those denoted by the same reference numerals as those described above indicate the same components.

FIG. 4A is a front view of a partial cross section of the upper plate 102, FIG. 4B is a plan view thereof, and FIG. 4C is a rear view thereof. FIG. 4A is a cross-sectional view taken along line CC of FIG. FIG.
, 401, 402, 403, and 404 are used to hold the reference portion 109 of the contact pin 103 housed in the slit portion 110 of the socket body 101 (not shown) from the upper end and the inner end thereof and fix the contact pin 103 in the slit 110. Are the holding projections. 405,406,407,4
Reference numerals 08, 409, 410, 411, and 412 denote engagement projections, which constitute engagement parts that are connected to the socket main body 101 by being inserted into holes provided on the upper surface of the socket main body 101 (not shown). 413,414,415,416
Reference numeral 417 denotes an insertion hole of the fixing member 128 (not shown), and 417 denotes an opening through which the IC guide projection 113 and the IC 125 (not shown) can pass.

In FIG. 1, FIG. 2 and FIG.
10 is formed by providing a required number of grooves in parallel at equal intervals around the IC arranging portion 112. This slit portion 110 is formed at right angles to each side of the rectangle that regulates the placement location 112, and in the example of FIGS.
A book is provided. A contact pin 103 is inserted into each of the slits 110, and a lower end contact portion 106 is located near the locking wall 111, and a rectangular lower side of the reference portion 109 hits a step 110 a of the slit portion 110. The upper plate 102 covers the socket main body 101 from above while the predetermined number of contact pins 103 are housed in the slit portion 110.

At this time, the upper plate 102 described with reference to FIG.
Engagement projections 405, 406, 407, 40 provided on the back surface of
8, 409, 410, 411, and 412 are inserted into holes provided in the surface of the socket body 101 to determine the positioning uniquely, the upper plate 102 and the socket body 101 are connected to each other, and fixed using rivets. It is fixed by a member 128. Upper plate 1 connected to socket body 101 and predetermined position
02 holding projections 401, 402, 403, 404
The upper part of the reference part 109 housed in the slit part 110 is pressed down and fixed, and the standby state of the contact pin 103 is maintained. IC guide projections 113 are provided at the four corners of the hole of the upper plate 102.
Protrudes.

As shown in FIG. 1, FIG. 2, and FIG.
IC placement location 112 in the upper center of socket body 101
Can be arranged. IC125 is IC guide projection 1
13, the IC lead 126 is placed so that the IC lead 126 contacts the upper end contact portion 104 of the contact pin 103. When the cover 114 is closed in this state, the cover 1
The protruding pads 123 on the inner surface 14 press the IC leads 126 from above. The IC lead 126 further presses the upper end contact portion 104. Since the upper end contact portion 104, the electric path portion 105, and the lower end contact portion 106 are connected to the reference portion 109 via a small bending portion 107 having elasticity and a large bending portion 108 having elasticity, the reference portion 109 and the large bending portion are connected. The small bending portion 107 and the large bending portion 108 are bent with the connection point with the supporting point 108 as a fulcrum, and a contact pressure is obtained between the upper end contact portion 104 and the IC lead 126 by the restoring force. At this time, since each contact pin is pressed from the IC lead independently of the other contact pins, each contact pressure between each upper contact portion and each IC lead is influenced by the contact pressure of some contact pins. I do not receive.

When the socket is mounted on the wiring board without mounting the IC and the cover is opened as shown in FIG. 5, the tip of the lower end contact portion 106 is supported in contact with the electrode 502 of the wiring board 501. You. The lower end contact portion 106 is pushed up by the electrode 502. Above the lower end contact portion 106, there is a locking wall 111 of the socket body 101, and the lower end contact portion 10
6 restricts the upward movement and the movement toward the center of the socket body due to the pushing up by the electrode 502. The lower end contact portion 106 is pushed up by the electrode 502,
2 and the portion in contact with the locking wall 111 as a fulcrum, while rotating while sliding (in the contact pin 103 in FIG. 5, the rotation direction of the clock hand).
08, the small bending portion 107 and the large bending portion 108 are bent, and the restoring force causes the lower end contact portion 106 to be bent.
And a contact pressure is obtained between the electrode and the electrode 502. At this time, since each contact pin is pushed up from the electrode independently of the other contact pins, each contact pressure between each lower contact portion and each electrode is not affected by the level of contact pressure by some of the contact pins.

Further, as shown in FIG. 6, when the IC 125 is mounted on the socket mounted on the wiring board 501 and the cover 114 is closed, the contact pins 103 pushed up by the electrodes 502 are moved to the projection pads 123 (right projection pads 1).
Reference numeral 23 'denotes an imaginary object which can be seen when a dashed line at the center of FIG. ), The small bending portion 107 is pressed by the IC lead 126.
The lower contact portion 106 is lowered with the displacement of the large curved portion 108, and the lower contact portion 106 is
6 and does not move in the horizontal direction due to contact with the locking wall 111, but does not move in the horizontal direction. ). The electric circuit portion 1 by the rotation of the lower end contact portion 106
05 and the upper end contact portion 104 in the downward and horizontal directions, and after the displacement of the bending of the small bending portion 107 and the large bending portion 108, the restoring force of the small bending portion 107 and the large bending portion 108 causes the upper end contact portion 104 to move. And the IC lead 126, and the contact pressure between the lower end contact portion 106 and the electrode 502 is obtained.
When the lower end contact portion 106 rotates on the electrode 502 due to the pressurization of the upper end contact portion 104, the lower end contact portion 106
05 and the small bending portion 10 integrally connected to the upper end contact portion 104
7 and the large curved portion 108 are bent, so that the lower end contact portion 106 does not apply an excessive load to the electrode 502 and does not cause a large damage. Further, the signal line connecting between the IC 125 and the electrode 502 is only the electric circuit section 105, and low inductance can be achieved.

Next, another embodiment of the locking wall and the lower end contact portion which fits the locking wall will be described with reference to FIG. 7, reference numeral 701 denotes a contact pin; 702, an upper end contact portion of the contact pin 701; 703, an electric circuit portion extending obliquely downward from the upper end contact portion 702 to form an electric circuit; and 704, a lower end of the electric circuit portion 703. A lower-end contact portion with a rounded tip, a hook-like projection 705 provided on the lower-end contact portion 704, and a curved portion 706 extending downward from the upper-end contact portion 702 to have elasticity and constitute a part of the curved portion. The small bending portion 707 extends downward from the small bending portion 706 and bends further upward to have elasticity and form a large bending portion together with the small bending portion 706.
07 is a rectangular reference portion integrally formed with the end of the reference numeral 07. 7
Reference numeral 09 denotes a locking wall located below the center of the socket main body 101, and forms a slope facing upward from the lowermost portion, which is a portion facing a wiring board (not shown). Reference numeral 710 denotes a recess provided on the inclined surface of the locking wall 709 to receive the projection 705 of the lower end contact portion 704 when the contact pin 701 is stored in the slit portion 110. In FIG. 7, the components denoted by the same reference numerals as those in FIGS. 1 to 6 indicate the same components.

The recess 710 in FIG.
When the upward force is applied by the lower end portion of the protrusion 4 contacting the electrode 502 of the wiring board, the protrusion 705 of the lower end contact portion 704 is formed.
To limit upward movement. Further, the concave portion 710
When the upper contact portion 702 is pressed by the IC lead 126, the lower contact portion 704 is pushed down and the lower end portion of the lower contact portion 704 contacts the electrode 502 of the wiring board, and the lower contact portion 704 rotates and moves on the electrode 502 (FIG. 7). The contact pin 701 is a contact portion when the projection 705 is rotated when the contact pin 701 rotates in the clockwise direction.

Next, another embodiment of the mechanism for restricting the upward movement when the lower end contact portion is pushed up by contacting the electrode of the wiring board will be described with reference to FIG. In FIG.
701 is the same as the contact pin shown in FIG. Reference numeral 801 denotes a floating member, which is located on the lower surface at the center of the socket body 101, that is, below the IC locating portion 112, and has a substantially rectangular projection plane. Reference numeral 802 denotes a spring as an elastic body located between the lower part of the center of the socket body 101 and the floating member 801. In FIG. 8, components denoted by the same reference numerals as those in FIGS. 1 to 7 indicate the same components.

As shown in FIG. 8 (b), the peripheral side surface of the floating member 801 forms a step 803 with a recessed lower portion, and the step 803 has a projection 70 of the lower end contact portion 704.
5 prevents the floating member 801 from being separated from the socket body 101.

When the IC socket configured as shown in FIG. 8 is mounted on the wiring board 501, the tip of the lower end contact portion 704 contacts and is supported by the electrode 502 of the wiring board 501. At this time, the lower surface of the floating member 801 does not contact the wiring board. The lower end contact portion 704 is pushed up by the electrode 502. As the protrusion 705 of the lower end contact portion 704 rises with the floating member 801, the spring 8
Receives 02 repulsion. In this state, contact pin 7
The cover 114 is closed by bringing the IC lead 126 into contact with the upper-end contact portion 702 of the “01”. The contact pin 701 pushed up by the electrode 502 attempts to lower the lower end contact portion 704 due to the displacement of the small curved portion 706 and the large curved portion 707 by the pressure from the IC lead 126. The protrusion 70 formed on the lower end contact portion 704 does not move downward in contact with the electrode 502 and does not move in the horizontal direction while contacting the floating member 801.
The contact point 5 is a sliding point on the electrode 502 while sliding on the contact point (the contact pin 701 on the left side in FIG. 8A rotates in the reverse direction of the clock hand, and the contact pin 701 on the right side rotates in the clockwise direction). I do. After the downward and horizontal displacement of the electric path portion 703 and the upper end contact portion 702 due to the rotation of the lower contact portion 704 and the displacement of the bending of the small curved portion 706 and the large curved portion 707, the small curved portion 706 and the large curved portion Due to the restoring force of the portion 707 and the repulsive force of the spring 802, the upper end contact portion 7
02 and the IC lead 126, and the lower end contact portion 7
A contact pressure is obtained between the electrode 04 and the electrode 502. Spring 802
The contact pressure described above can be changed by changing the spring constant of the contact, and by using a spring having an appropriate spring constant, the contact which does not apply an excessive load to the electrode 502 from the lower end contact portion 704 and does not cause a large damage. Pressure can be obtained.

[0036]

As described above in detail, according to the present invention, it is possible to obtain a contact pin and an IC socket having excellent high frequency characteristics by reducing the inductance of the signal line of the contact pin. The contact pressure and the contact pressure with the electrode of the wiring board are obtained by the elasticity provided to the contact pins or, in addition to this, by the elastic body interposed between the socket body and the floating member when floating is provided, so it can be used even at high temperatures. Since each contact pin has elasticity independently, even if the contact pressure with the IC lead and the contact pressure with the electrode of the wiring board vary, the contact pressure is increased by other contact pins. And the contact pins have elasticity so that the bottom contact does not overload the electrodes. No damage is caused, and the contact pins are housed and fixed in the slits of the socket body, so that they can be uniformly aligned without any height and looseness, and the contact with the contact focus IC leads can be performed without variation. be able to.

[Brief description of the drawings]

FIG. 1 is a front sectional view of a main part of an IC socket according to an embodiment and a perspective view of a contact pin.

FIG. 2 is a plan view of an IC socket according to an embodiment in which a cover is partially omitted.

FIG. 3 is a right side view of the IC socket according to the embodiment.

FIG. 4 is a front view, a plan view, and a back view of the upper plate according to the embodiment.

FIG. 5 is a front sectional view of an essential part for explaining an IC socket according to an embodiment mounted on a wiring board;

FIG. 6 is a front sectional view of an essential part for explaining an IC socket according to an embodiment in which an IC is mounted on a wiring board.

FIG. 7 is a front sectional view of an essential part for explaining an IC socket according to another embodiment.

FIG. 8 is a front sectional view of an essential part for explaining an IC socket according to another embodiment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 101 ... Socket main body, 102 ... Upper plate, 103 ... Contact pin, 104 ... Upper end contact part, 105 ... Electric circuit part, 10
Reference numeral 6: Lower contact portion, 107: Small bending portion, 108: Large bending portion, 109: Reference portion, 110: Slit portion, 111: Locking wall, 112: IC placement portion, 113: IC guide protrusion, 114: Cover 115, socket bearing part, 1
16 ... cover bearing part, 117 ... cover shaft,
118: stopper, 119: shift for stopper, 1
Reference Signs List 20: stopper spring, 121: hook, 122: hook locking projection, 123: projection pad, 124: storage section, 125: IC, 126: IC lead, 127: cover spring, 128: fixing member, 401, 402, 40
3,404 ... pressing projection, 405,406,407,4
08, 409, 410, 411, 412: engagement projections (engagement portions), 413, 414, 415, 416: insertion holes, 4
17 ... opening, 501 ... wiring board, 502 ... electrode, 701
.., Contact pin, 702, upper contact portion, 703, electric circuit portion, 704, lower contact portion, 705, projection, 706, small curved portion, 707, large curved portion, 708, reference portion, 709, locking wall, 710 Recess, 801 ... floating member, 8
02 ... Spring (elastic body).

Claims (9)

[Claims] 1. A socket body comprising: a plurality of contact pins for connecting an IC and a wiring board to each other; and an upper plate for holding the contact pins on the socket body. An upper end contact portion, a lower end contact portion extending obliquely downward from the upper end contact portion and having a lower end portion in contact with an electrode of the wiring board, and a curved portion having one end extending from the upper end contact portion and having elasticity, A reference portion formed at the other end of the curved portion, wherein the socket main body is formed around a location for arranging an IC, and guides a lower end contact portion of the contact pin downwardly in the center of the socket main body. An IC having a slit portion for accommodating therein, wherein the upper plate presses and fixes a reference portion accommodated in the slit portion and maintains a standby posture.
socket. 2. When the lower contact portion is supported on the electrode of the wiring board, the lower contact portion is pushed up by the electrode, and when the upper contact portion is pressed down by the IC lead, the contact pin is moved to the lower end. The connecting portion between the contact portion and the reference portion and the bending portion serves as a fulcrum, the bending portion is displaced, a pressure contact state is obtained between the lower contact portion and the electrode, and a contact pressure is obtained between the upper contact portion and the IC lead. The IC socket according to claim 1, wherein 3. When the lower end contact portion is supported on the electrode of the wiring board, the lower end contact portion is pushed up by the electrode, and when the upper end contact portion is pressed down by the IC lead, the contact pin is set to the reference. The curved portion is displaced as a fixed fulcrum in which the portion and the curved portion are integrally connected, and the lower end contact portion pivotally contacts on the electrode to obtain a pressurized contact state between the lower end contact portion and the electrode. The IC socket according to claim 1, wherein a contact pressure is obtained between the IC socket and the IC lead. 4. The IC socket according to claim 1, wherein the upper plate and the socket main body are provided with engagement portions that are connected to each other. 5. An electric circuit is formed between an upper end contact part and a lower end contact part of a contact pin, and the reference part and the curved part between the upper end contact part and the reference part do not form an electric path. An IC socket according to any one of claims 1 to 4. 6. The socket body has, at its center, a locking wall located near a lower end contact portion guided by a slit below the center of the socket body, and the locking wall is provided at the lower end of the lower end contact portion. When the portion contacts the electrode of the wiring board and an upward force is applied, the upward movement of the lower end contact portion is limited, and the lower end portion of the lower end contact portion is pressed down by pressing the upper end contact portion. The IC socket according to any one of claims 1 to 5, wherein the lower end contact portion serves as a contact portion when the lower end contact portion rotates by contacting the electrode. 7. A projection is provided at a lower end contact portion of a contact pin, and a recess for accommodating the projection of the lower end contact portion is formed in a locking wall provided at a central portion of the socket body. When the lower end portion contacts the electrode of the wiring board and an upward force is applied, the protrusion of the lower end contact portion is housed to limit upward movement, and the upper end contact portion is pressed down to be pushed down to lower the lower contact portion. 7. The contact portion when the lower end portion contacts the electrode of the wiring board and the lower end contact portion moves on the electrode and the projection rotates in the concave portion.
The described IC socket. 8. A projection at the lower end contact portion of the contact pin, wherein the projection at the lower end contact portion of the contact pin and the lower surface of the central portion of the socket body are guided below the lower surface of the center of the socket body by the slit portion. And a floating member supported by the protrusion of the lower end contact portion, and a lower end contact portion located between the lower portion of the center portion of the socket body and the floating member. The IC socket according to any one of claims 1 to 5, further comprising an elastic body that applies a force to the IC socket. 9. An upper end contact portion for placing and contacting an IC lead on an upper end, a lower end contact portion extending obliquely downward from the upper end contact portion and having a lower end portion in contact with an electrode of a wiring board, and one end. A curved portion extending from the upper end contact portion and having elasticity, and a reference portion formed at the other end of the curved portion,
A contact pin for an IC socket, wherein an electric path is formed between an upper end contact section and a lower end contact section, and a reference section and a curved section between the upper end contact section and the reference section do not form an electric path.