JP2000155241A - Optical semiconductor device and method for connecting the optical semiconductor device and optical connector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simplify the structure of a receptacle and an optical connector, to reduce a cost and to assure the reliability at the time of optical connector attachment and detachment by disposing fitting grooves and fixing a sleeve to a main body. SOLUTION: A ferrule 13 of the optical connector of an external pigtail cord is inserted into the sleeve 11 and is connected thereto. The ferrule 13 of the optical connector is inserted into the alignment sleeve 11 and is butted against the ferrule 7 on the optical semiconductor device side. The collar of a chip 14 is fitted in this state into the fitting groove 17 of a block 10. Since the ferrule 13 is pressed from backward by the spring 15 of the optical connector, the state that the front ends of both ferrules 7 and 13 are butted against each other is maintained at all times. Then, the insertion force at the time of the attachment and detachment of the optical connector does not act on the ferrules 7 and 13. As a result, the highly reliable structure which does not affect the internal optical system of the optical semiconductor device may be obtained at a low cost even in the case where the attachment and detachment of the optical connector are repeated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor device, and more particularly to an optical semiconductor device having high reliability in connection of an external optical fiber cord (hereinafter referred to as "pigtail cord") to an optical connector, and an optical semiconductor device. The present invention relates to a method for connecting to an optical connector.

[0002]

2. Description of the Related Art In recent years, optical devices for communication have been miniaturized,
Along with demands for cost reduction and high functionality, demands for reduction in mounting cost on a printed circuit board, ease of handling, and the like are increasing. In order to meet these demands, optical modules have been developed in which an optical connector is detachable and can be mounted on a printed circuit board by reflow.

First, the configuration of a conventional optical semiconductor device and its problems will be described with reference to the manufacturing procedure of the main body of the optical semiconductor device.

FIG. 5 is a diagram showing an example of the configuration of a conventional optical semiconductor device. A laser diode (hereinafter, referred to as “LD”) 1 as an optical semiconductor element is mounted on a silicon substrate (Si substrate) 2 in which a V-groove is formed, and the silicon substrate 2 is mounted on a package 3. A monitor photodiode (hereinafter referred to as “PD”) 4 is mounted on a PD carrier 5, and is also mounted on a package 3.

An optical fiber 6 is fixed to a ferrule 7,
This optical fiber is arranged in the V-groove of the silicon substrate and is held down and fixed by the optical fiber retainer 8. The package 3 is hermetically sealed by a lid 9. The block 10 'is fixed to the package 3 together with the ferrule 7, and the main body of the optical semiconductor device is completed.

Next, a procedure for connecting a pigtail cord to the main body of the optical semiconductor device will be described.

FIG. 6 is a diagram showing a structure of a connecting portion of a pigtail cord in a conventional optical semiconductor device. A ferrule 13 to which an optical fiber is fixed, an alignment sleeve 11 for aligning the ferrule on the optical semiconductor device side, and a clip 14 are fixed to the optical connector of the pigtail cord. The optical semiconductor device and the ferrule of the pigtail cord are aligned via the precision sleeve 11, and the optical fibers are optically connected to each other.

[0008]

Here, since the ferrule is fixed to the package with a material such as an adhesive together with the block with respect to the package, the cutting force at the time of attaching and detaching the connector is reduced by the optical semiconductor via the alignment sleeve. If the ferrule on the device side is added, there is a risk that the adhesive portion may be broken. In addition, when the attachment and detachment are repeatedly performed, a problem may occur in the connector connection characteristics.

The optical semiconductor device of the present invention is a receptacle-type optical semiconductor device in which an external pigtail cord can be attached to and detached from an optical connector. In particular, the structure of the optical semiconductor device receptacle and the optical connector are simplified to reduce the cost. It is another object of the present invention to realize a simple connector structure that ensures reliability when attaching and detaching an optical connector.

[0010]

In order to solve the above-mentioned problems, an optical semiconductor device of the present invention accommodates an optical semiconductor element, a short optical fiber optically coupled to the optical semiconductor element, and an optical fiber. A first ferrule, having a main body that houses the optical semiconductor element, the optical fiber, and the short optical fiber,
A first fitting groove into which a fastening claw of an external optical connector, which is provided with a second ferrule and a fastening claw, is connected to the first ferrule by abutting the sleeve in the sleeve; And a sleeve fixing portion for fixing the sleeve to the main body.

Here, the sleeve fixing portion fixes the sleeve in a state where the sleeve is detachable. As a specific configuration, the main body has a block for fixing the first ferrule, and the first fitting groove is formed in the block. Further, the sleeve fixing portion includes a pressing plate for pressing the sleeve mounted on the first ferrule from above to fix the sleeve, or the pressing plate further has a tab, and the block is fitted with the tab. It is characterized by having a second fitting groove to be fitted.

Further, the optical semiconductor device of the present invention is characterized in that the sleeve fixing portion includes a tubular body fitted to the sleeve mounted on the first ferrule and fixing the sleeve from the front. .

[0013] The method for connecting an optical semiconductor device and an optical connector according to the present invention, in the above-described configuration of the optical semiconductor device and the optical connector, comprises a sleeve fitting step of fitting a sleeve to a first ferrule, and a sleeve fixing component. A sleeve fixing step of fixing the sleeve to the optical semiconductor device, a second ferrule insertion step of delivering the second ferrule to the sleeve and abutting against the first ferrule, and fastening the fastening claw into the first fitting groove And a claw fitting step.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an optical semiconductor device according to the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view showing the structure of one embodiment of the optical semiconductor device of the present invention. Except for the block 10 and a configuration in which a sleeve (not shown) can be mounted by this, the configuration is the same as that of the conventional optical semiconductor device shown in FIG. That is, the laser diode 1 as an optical semiconductor element is mounted on the silicon substrate 2 on which the V groove is formed,
Further, the silicon substrate 2 is mounted on the package 3. Monitor photodiode (hereinafter referred to as "PD")
4 is mounted on the PD carrier 5 and is also mounted on the package 3.

The optical fiber 6 is fixed to a ferrule 7,
This optical fiber is arranged in the V-groove of the silicon substrate and is held down and fixed by the optical fiber retainer 8. The package 3 is hermetically sealed by a lid 9. The block 10 is fixed to the package 3 together with the ferrule 7. Here, the optical semiconductor element 1 and the short optical fiber 6 are positioned and fixed so as to be optically coupled. The short optical fiber 6 is fixed inside the inner diameter of the ferrule 7, and the ferrule 7 is fixed to the package 3 by the block 10. The alignment sleeve 11 is fitted to the outer diameter of the ferrule 7, and the alignment sleeve fixing part 12 is fixed to the block 10.

In the optical semiconductor device of the present invention, the ferrule 7
Is characterized in that a structure for fixing a sleeve fixing component for mounting an alignment sleeve is employed in the block 10 for fixing the component to the package 3. For example, in the present embodiment, the block 10 is provided with a fitting groove 16.

Next, with reference to FIG. 2, a description will be given of a state in which the alignment sleeve is fixed and a configuration in which the optical connector of the pigtail cord is further connected.

FIGS. 2A and 2B are top views showing the configuration of an embodiment of the optical semiconductor device according to the present invention, wherein FIG. 2A shows a state before the sleeve is mounted, and FIG. (C) shows the state after the optical connector is connected. In the conventional optical semiconductor device, there is no means provided on the optical semiconductor device side for fixing an alignment sleeve for connecting to an optical connector of an external pigtail cord.
On the other hand, the optical semiconductor device of the present invention includes a means for fixing the alignment sleeve 11. Specifically, in the present embodiment, the block 10 is formed with a fitting groove 16, while the sleeve fixing component 12 has a collar, and the collar is fitted into the fitting groove 16. Configuration.

As shown in FIG. 2A, first, an alignment sleeve 11 is inserted and fitted into the ferrule 7 on the side of the optical semiconductor device, and a sleeve fixing part 12 is fitted with a flange fitting groove 16 from above. It is attached so that it fits in. Thereby, the alignment sleeve 11 is mounted on the optical semiconductor device.

As the sleeve fixing component 12, for example, a component having a structure as shown in FIG. 3 can be used. This has a configuration in which after the alignment sleeve 11 is inserted into the ferrule 7 (1 in the figure), the alignment sleeve 11 is fixed to the holding block 10 from above by the sleeve fixing part 12 (2 in the figure). Needless to say, the fixing of the sleeve fixing component to the optical semiconductor device may be performed by fixing the component to the block or directly to the package body. Further, in this embodiment, the sleeve fixing component 12 is formed by being fitted into the fitting groove 16 of the block 10 from above. However, the claw may be fitted under the bottom surface of the package. Can be taken.

Further, the shape of the sleeve fixing part is not particularly limited to these, and the material is not particularly limited as long as it is easily formed. For example, as a modified example of the configuration, a cylindrical component provided with a screw portion as shown in FIG. 4 can be used. In this case, instead of providing a fitting groove in the block 10, a screw is formed, and the alignment sleeve 11 is inserted and fitted into the ferrule, and the fixing component is further fitted from the front and fixed to the block 10 with the screw.

In this embodiment, instead of pressing the sleeve from above, it is intended to cover and fix the tubular body from the front. Therefore, the cylindrical body may have a cylindrical shape, but is not limited to this. If the inside is cylindrical, the outer diameter may be square. In addition, the fixing means is not limited to these structures, but a protrusion is formed on a fastening structure using elastic deformation by a spring or the like or a component for fixing a frule, and this is fitted into a hole provided in the block. Alternatively, various configurations can be adopted.

In this embodiment, the configuration in which the alignment sleeve 11 itself is easily attached to and detached from the optical semiconductor device is described for convenience. However, the alignment sleeve 11 may be permanently fixed.

FIG. 2B shows a state in which the alignment sleeve 11 is fixed as described above. FIG. 2 (c)
Shows a state in which a ferrule 13 of an optical connector of an external pigtail cord is further inserted into the sleeve 11 and connected. The ferrule 13 of the optical connector is inserted into the alignment sleeve 11 and abuts against the ferrule 7 on the side of the optical semiconductor device. In this state, the collar of the clip 14 is fitted into the fitting groove 17 of the block 10. In this state, the clip 14 of the optical connector is connected to the block 10 of the optical semiconductor device, and the optical connector connection is completed. Since the ferrule 13 is pressed from the rear by the spring 17 of the optical connector, the state where the tips of the ferrules 7 and 13 abut against each other is always maintained.

Normally, optical connectors are required to maintain stable characteristics (connection loss, return loss, etc.) even when they are repeatedly attached and detached. When there is no part for fixing the alignment sleeve, when the optical connector is detached, the aligning sleeve fitted to the optical connector also generates a release force at the same time, and at the same time, the release force is applied to the ferrule on the optical semiconductor device side. Finally, there is a possibility that the optical fiber will come off. That is, when the optical connector is detached, a pulling force is applied to the alignment sleeve.

In the optical semiconductor device of the present invention, since the alignment sleeve 11 is prevented from coming off from the optical semiconductor device side by the alignment sleeve fixing part 12, the pulling force is applied to the ferrule 7 and the optical fiber on the optical semiconductor device side. , The reliability at the time of attaching and detaching the optical connector is secured. And, because of the presence of the alignment sleeve fixing component, when the optical connector is detached, the force can be prevented from affecting the optical fiber,
Reliability at the time of attaching and detaching the optical connector is ensured. The configuration of the optical semiconductor device of the present invention can exert its effect especially when applied to a receptacle having a simple structure adopted in a surface-mounted optical semiconductor device by so-called chip mounting.

[0028]

As described above, the optical semiconductor device of the present invention employs a structure in which the alignment sleeve for connecting to the optical connector is fixed to the device main body, so that the cutting force at the time of attaching / detaching the optical connector is reduced. Does not add to the ferrule and optical fiber of the optical semiconductor device. As a result, a highly reliable structure that does not affect the optical system inside the optical semiconductor device can be provided at low cost even when the optical connector is repeatedly attached and detached.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration of an embodiment of an optical semiconductor device of the present invention.

FIG. 2 is a top view illustrating a configuration of an optical semiconductor device according to an embodiment of the present invention, wherein FIG.
(B) shows the state after attaching the sleeve and before connecting the optical connector,
(C) shows the state after the connection of the optical connector.

FIG. 3 is a perspective view showing an example of a part for fixing a ferrule used in an embodiment of the optical semiconductor device of the present invention.

FIG. 4 is a perspective view showing another example of a part for fixing a ferrule used in one embodiment of the optical semiconductor device of the present invention.

FIG. 5 is a perspective view showing a configuration of a conventional optical semiconductor device.

FIG. 6 is a top view showing a state before connection between a conventional optical semiconductor device and an optical connector.

[Explanation of symbols]

 Reference Signs List 1 optical semiconductor element (laser diode) 2 silicon substrate 3 package 4 monitor photodiode (monitor PD) 5 PD carrier 6 short optical fiber 7 ferrule 8 optical fiber pressing plate 9 lid 10 block 11 alignment sleeve 12 alignment sleeve fixing part 13 Optical connector ferrule 14 Clip 15 Spring 16 Fixing part fitting groove 17 Clip fitting groove 18 Fixing part fitting groove

Claims (8)

[Claims] 1. An optical semiconductor device, a short optical fiber optically coupled to the optical semiconductor device, a first ferrule for housing the optical fiber, the optical semiconductor device, the optical fiber, and the short optical fiber An optical semiconductor device comprising:
A first ferrule including a second ferrule and a fastening claw, wherein the second ferrule is connected to the first ferrule by abutting the sleeve in a sleeve; An optical semiconductor device comprising: a fitting groove; and sleeve fixing means for fixing the sleeve to the main body. 2. The optical semiconductor device according to claim 1, wherein said sleeve fixing means fixes said sleeve in a state where said sleeve is detachable. 3. The device according to claim 1, wherein the main body has a block for fixing the first ferrule, and the first fitting groove is formed in the block. The optical semiconductor device according to the above. 4. The optical semiconductor according to claim 2, wherein said sleeve fixing means includes a pressing plate for pressing said sleeve mounted on said first ferrule from above to fix said sleeve. apparatus. 5. The sleeve fixing means includes: a pressing plate that presses the sleeve mounted on the first ferrule from above to fix the sleeve; and the claw; 4. The optical semiconductor device according to claim 3, further comprising a second fitting groove into which the groove is fitted. 6. The sleeve fixing means according to claim 2, wherein the sleeve fixing means includes a tubular body fitted to the sleeve mounted on the first ferrule and fixing the sleeve from the front. Optical semiconductor device. 7. The optical semiconductor device, further comprising: a substrate on which the optical semiconductor element and a part of the short optical fiber are disposed; and an optical fiber pressing plate for pressing a portion of the short optical fiber disposed on the substrate. The optical semiconductor device according to claim 1, further comprising: 8. The method for connecting an optical semiconductor device to an optical connector according to claim 1, wherein the optical connector includes a second ferrule and a fastening claw, and the sleeve is connected to the first connector. A sleeve fitting step of fitting to the ferrule, a sleeve fixing step of fixing the sleeve to the optical semiconductor device by the sleeve fixing component, and delivering the second ferrule to the sleeve and forming the first ferrule. A method for connecting an optical semiconductor device and an optical connector, comprising: a second ferrule inserting step of abutting; and a fastening claw fitting step of fitting the fastening claw into the first fitting groove.