JP2000150734A - Electronic parts loading substrate having socket-like structure part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate for mounting electronic parts, which has a socket-like structure part whose manufacture is simple and which is superior in reliability although it has structure without a gap in an interlayer connection part. SOLUTION: A substrate for loading electronic parts 1 has a first substrate 3, and a second substrate 4 having socket-like structure parts 24 and 24A in plural parts. The substrates 3 and 4 are integrally stuck by a sticking layer 51. The socket-like structure parts 24 and 24A and a conductor layer C1 are stuck through an interlayer connection layer 54. The interlayer connection layer 54 is formed of the surface of the conductor layer C1, the inner wall faces of holding holes 23 installed in the second substrate 4 and a plating layer 53 formed on the inner wall face of a recessed part 52 provided in accordance with the conductor layer C1 in the sticking layer 51.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting board having a socket-like structure.

[0002]

2. Description of the Related Art Heretofore, as an example of an electronic component mounting board having a socket-like structure, a conversion module for signal conversion used when a personal computer user upgrades a CPU is known.

[0003] A conversion board constituting this type of conversion module is provided with a plurality of plated through holes and various conductor patterns. The base end of an external connection pin is fixed to the opening on the lower surface side of each plating through hole. Each external connection pin is inserted into and extracted from each pin insertion hole of the PGA socket on the motherboard. The socket board has a structure in which socket pins are held in a plurality of pin holding holes provided in an insulating base material. The tip of each socket pin protrudes from the lower surface of the socket substrate, and is inserted into the upper opening of each plated through hole and soldered. An insertion hole is formed in the upper end surface of each socket pin, and PGA which is a CPU is formed therein.
I / O pins can be fitted and removed.

[0004] Therefore, it is considered that if a high-performance PGA is mounted using such a conversion module, the PGA can be adapted to the motherboard, and the original performance is easily exhibited.

[0005]

By the way, in the conventional conversion module, the interlayer connection between the conductor on the conversion board side and the conductor on the socket board side is made by a through-hole insertion mounting method using socket pins. Had been. However, for example, when a special module structure in which a build-up layer is provided on the upper surface side of the conversion substrate is adopted, the upper surface side opening of the plated through hole is below the build-up layer and is closed. Therefore, it becomes impossible to insert each socket pin into each plating through hole and perform soldering. Therefore, it is necessary to change to another mounting method other than the through-hole insertion mounting method.

In the above structure, if the socket substrate and the build-up layer were to be bonded and integrated by an adhesive layer, it would be expected that interlayer connection between the two conductors would become more difficult, and the conversion module itself would be difficult. Can be difficult to manufacture. Further, in order to improve the reliability of the conversion module, it is necessary that high connection reliability is secured at the interlayer connection portion.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a socket which is easy to manufacture and excellent in reliability, despite having a structure having no gaps between interlayer connections. It is an object of the present invention to provide an electronic component mounting board having a similar structure.

[0008]

According to a first aspect of the present invention, there is provided a first substrate having a conductor layer on an upper surface and a plurality of terminals protruding from a lower surface of the device. Having a detachable socket-like structure at a plurality of locations, and a second substrate integrally bonded to an upper surface of the first substrate via an adhesive layer, wherein an interlayer between the two substrates is provided. In the electronic component mounting board to which connection is achieved, the surface of the conductor layer, the inner wall surface of the holding hole penetrated through the second substrate, and the adhesive layer are provided corresponding to the conductor layer. An electronic component mounting device having a socket-like structure, wherein the socket-like structure and the conductor layer are connected to each other via an interlayer connection layer made of a plating layer formed on the inner wall surface of the recess. The substrate is the gist.

According to a second aspect of the present invention, there are provided a first substrate having a conductor layer on an upper surface side and a plurality of socket-like structure portions to which a plurality of terminals protruding from a lower surface of the device are detachable. An electronic component mounting substrate, comprising: a second substrate integrally bonded to an upper surface of the first substrate via an adhesive layer, wherein interlayer connection between the two substrates is achieved.
The socket-like structure portion and the conductor layer are connected via an interlayer connection layer formed by melting and solidifying conductive metal particles inserted into the holding holes provided in the second substrate. The gist is an electronic component mounting substrate having a socket-like structure portion.

According to a third aspect of the present invention, there are provided a first substrate having a conductor layer on an upper surface side, and a plurality of socket-like structure portions to which a plurality of terminals projecting from a lower surface of the device are detachably attachable. An electronic component mounting substrate, comprising: a second substrate integrally bonded to an upper surface of the first substrate via an adhesive layer, wherein interlayer connection between the two substrates is achieved.
The socket-like structure portion and the conductor layer are connected to each other via an interlayer connection layer formed by melting and solidifying a conductive metal paste printed in a recess provided in the adhesive layer corresponding to the conductor layer. The gist of the invention is an electronic component mounting board having a socket-like structure.

According to a fourth aspect of the present invention, there are provided a first substrate having a conductor layer on an upper surface side and a plurality of socket-like structure portions to which a plurality of terminals protrudingly provided on a lower surface of the device are detachable. An electronic component mounting substrate, comprising: a second substrate integrally bonded to an upper surface of the first substrate via an adhesive layer, wherein interlayer connection between the two substrates is achieved.
An anisotropic conductor disposed in a recess provided in the adhesive layer corresponding to the conductor layer is compressed at a lower end surface of the socket-like structure in a substrate thickness direction through an interlayer connection layer. An electronic component mounting board having a socket-like structure, characterized in that the socket-like structure and the conductor layer are connected to each other.

Hereinafter, the "action" of the present invention will be described. According to the first aspect of the present invention, the socket-like structure and the conductor layer are connected via the interlayer connection layer made of a conductive plating layer, so that the two are reliably connected to each other. Becomes

[0013] Such an interlayer connection layer can be obtained relatively easily through, for example, a process of bonding the substrates to each other, plating the predetermined portion in advance, and holding the socket-like structure in the holding hole. Can be. Therefore, it is possible to provide an electronic component mounting substrate which is easy to manufacture and has excellent reliability, despite the structure having no gap at the interlayer connection portion.

According to the second aspect of the present invention, the socket-like structure and the conductor layer are connected via the interlayer connection layer formed by melting and solidifying the conductive metal particles. The conduction state is ensured.

In such an interlayer connection layer, for example, after bonding substrates, the conductive metal particles before melting and the socket-like structure are inserted into the holding holes. It can be obtained relatively easily through the steps of heating, melting and solidifying. Therefore, it is possible to provide an electronic component mounting substrate which is easy to manufacture and has excellent reliability, despite the structure having no gap at the interlayer connection portion.

According to the third aspect of the present invention, the socket-like structure and the conductor layer are connected via the interlayer connection layer formed by melting and solidifying the conductive metal paste. The conduction state is ensured.

[0017] Such an interlayer connection layer is formed by, for example, printing a conductive metal paste in a concave portion and then bonding the substrates together.
In this state, the conductive metal paste can be obtained relatively easily through a step of heating and melting and solidifying the paste. Therefore, it is possible to provide an electronic component mounting substrate which is easy to manufacture and has excellent reliability, despite the structure having no gap at the interlayer connection portion. According to the invention as set forth in claim 4, the socket-like structure and the conductor layer are connected via the interlayer connection layer formed by compressing the anisotropic conductor in the thickness direction of the substrate. Is in a state of being electrically conducted.

Such an interlayer connection layer is formed, for example, by arranging an anisotropic conductor in a concave portion and then bonding the substrates together, and compressing the anisotropic conductor by the lower end surface of the socket-like structure. Can be obtained relatively easily. Therefore, it is possible to provide an electronic component mounting substrate which is easy to manufacture and has excellent reliability, despite the structure having no gap at the interlayer connection portion.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] Hereinafter, the P of the first embodiment embodying the electronic component mounting board of the present invention will be described.
FIGS. 1 to 3 show a GA conversion module 1 and a method of manufacturing the same.
This will be described in detail based on FIG.

As shown in FIGS. 1 and 2, the conversion module 1 of this embodiment is a device for mounting a PGA 2 which is a kind of chip module on a motherboard MB after performing a predetermined signal conversion. is there. On the lower surface of the device PGA2, I / O pins 26 as a plurality of terminals are regularly projected.

The conversion board 3 as a first board constituting the conversion module 1 is composed of a rigid core board 17 having a rectangular shape. The core substrate 17 is a so-called double-sided plate having conductors on both front and back surfaces. The core substrate 17 includes a group of plated through holes in which a large number (several hundreds in the present embodiment) of plated through holes 5 are arranged in a substantially rectangular shape.
The plating through holes 5 are arranged in a grid pattern or a staggered pattern at a constant pitch.

One of the plurality of plated through holes 5 (indicated by 5A) is formed at a position corresponding to one of a plurality of socket pins 24, which will be described later, which requires replacement connection (indicated by 24A). Have been.

The base ends of the external connection pins 6 are press-fitted (press-fitted) without soldering into the openings on the lower surfaces of the plated through holes 5 and 5A.
As a result, conduction between each external connection pin 6 and each plating through hole 5, 5A is achieved.

On the lower surface side of the core substrate 17, sub-substrates 32 are arranged at predetermined intervals. Each of the external connection pins 6 is inserted through the pin insertion hole 36 of the sub-board 32 so as not to be able to come out, and its tip protrudes from the lower surface of the sub-board 32 by a predetermined length. Since the external connection pins 6 are fixed to each other, the bending of the pins is prevented, so that it is hard to hinder the insertion and removal of the pins 6.

As shown in FIGS. 1 and 2, the core substrate 1
7, a build-up layer B1 is formed on the entire upper surface. The build-up layer B1 is manufactured through a build-up process, and refers to a layer obtained by alternately laminating insulating layers and conductor layers. More specifically, in the conversion module 1 of the present embodiment, the two insulating layers I1, I2
A build-up layer B1 comprising two and two conductor layers C1 and C2 is formed. It can be understood that the conversion substrate 3 as the first substrate has the conductor layers C1 and C2 on the upper surface side.

On the upper surface of the insulating layer I1 on the inner layer side, an inner conductor layer C1 (specifically, the conductor pattern 15) is formed. The inner conductor layer C1 and the land 5a on the upper surface of the core substrate 17 are connected to the via hole 1 formed in the insulating layer I1.
8 are electrically connected to each other. On the upper surface of the insulating layer I2 on the outer layer side, an outer conductor layer C2 (specifically, various pads 7, 8, 8a, 8b, 14 and the conductor pattern 1) are formed.
6) is formed. Outer conductor layer C2 and inner conductor layer C
1 are electrically connected to each other through via holes 19 formed in the insulating layer I2.

The upper surface of the build-up layer B1 (ie, the insulating layer I)
2 upper surface), one die pad 7 is provided in a substantially square region surrounded by the plated through hole group.
A plurality of bonding pads 8 surrounding it are formed. On the die pad 7, a QFP (quad flat package) 9 for signal conversion as an element for performing signal conversion is surface-mounted. Each lead of the QFP 9 is joined to each pad 8 using solder S1 which is a conductive material. One of the plurality of pads 8 is assigned as an input pad 8a for replacement connection, and another one is assigned as an output pad 8b for replacement connection.

The input side pad 8a is connected to the secondary side end of the conductor pattern 16 formed on the upper surface of the insulating layer I2. The output-side pad 8b is connected to the conductor pattern 15 on the inner layer.
Are connected to each other through a via hole 19 with respect to the primary side end. Further, the secondary side end of the conductor pattern 15 is connected via a via hole 18 to the upper surface side land 5Aa of the specific plated through hole 5A that requires replacement connection.

In the plated through hole 5 which does not require the replacement connection, the via holes 18 and 19 are arranged so as to be arranged substantially in series along the axial direction of the plated through hole 5. As a result, conduction between the upper surface side land 5a and the connection pad 14 located immediately above the land 5a is achieved.

As shown in FIG. 1, pads 10 for connecting electronic components are formed in a region of the upper surface of the core substrate 17 which is not surrounded by the through-hole group.
A DIP (dual in-line package) 11 is surface-mounted on the pad 10. An electronic component connection pad 12 is also formed on the lower surface side of the conversion board 3, and a chip resistor 13 is surface-mounted thereon. These electronic components 11 and 13 are also joined to the pads 10 and 12 using solder S1.

However, some other conductive patterns (not shown) are formed on the lower surface side of the conversion board 3. The conductor pattern electrically connects the land 5b of the plated through hole 5 and the pad 12 for the electronic component 13 to each other. A conductor pattern (not shown) for electrically connecting the pads 8 and 10 is also formed on the upper surface of the insulating layer I2 on the outer layer side.

As shown in FIGS. 1 and 2, the insulating substrate 21 constituting the socket substrate 4 as the second substrate has a square shape and a frame shape, and the size of the outer shape is Is approximately equal to the size of PGA2. The insulating base 21 has a square central hole 22. Around the central hole 22, a number of pin holding holes 23 having a circular cross section and a diameter much smaller than the central hole 22 are formed. In each pin holding hole 23, each socket pin 24, 24A as a socket-like structure is inserted and held so as not to come out. The socket pins 24 and 24A of the present embodiment are P
For GA, the number is about several hundred. Each socket pin 24, 24A is formed with an insertion hole 25 extending along the axial direction. The insertion hole 25 is opened at the center of the upper end surface of the socket pins 24 and 24A, and the I / O pin 26 of the PGA 2 can be inserted and removed therefrom. That is, the socket substrate 4 has a structure on the upper surface side where the PGA 2 can be attached and detached. An engagement protrusion (not shown) for securely holding the I / O pin 26 may be provided on the inner wall surface of the insertion hole 25 so as to face the same. In the present embodiment, the lower end surfaces of the socket pins 24 and 24A slightly protrude from the lower surface side of the insulating base material 21.

The surface of the build-up layer B1 and the lower surface of the socket substrate 4 are entirely bonded by an adhesive layer 51 made of an insulating resin material. That is, the conversion module 1 of the present embodiment has a structure (three-layer integrated structure) in which the conversion board 3, the build-up layer B1, and the socket board 4 are integrated. Further, there is no gap at the bonding interface between the build-up layer B1 and the socket substrate 4. In the present embodiment, such an adhesive layer 51 is formed using an epoxy resin-based adhesive sheet. The thickness of the adhesive layer 51 is set to several hundred μm to several mm.

As shown in FIG. 2, a concave portion 52 is provided in the adhesive layer 51 at a position corresponding to the primary end 16a of the conductor pattern 16 and the pad 14. Recess 52
Has a circular cross section, and is formed one size larger than the pin holding hole 23.

A plating layer 53 is formed on the surface of the conductor layer C 2 (that is, the primary end 16 a and the pad 14), the inner wall surface of the pin holding hole 23, and the inner wall surface of the recess 52.
The plating layer 53 is also in contact with the lower end surface and the entire outer peripheral surface of each socket pin 24, 24A. Therefore, each socket pin 24 and each pad 14 are connected via the conductive plating layer 53, and as a result, both
24 are in a state of being electrically connected. Similarly,
Socket pin 24A and primary end 1 via plating layer 53
As a result, the connection between the two 16a and 24A is reliably conducted. That is, in the conversion module 1, the build-up layer B1 and the socket substrate 4
An interlayer connection layer 5 made of a plating layer 53
4 can be grasped. In the present embodiment, the plating layer 53 also has a role of holding the socket pins 24 and 24A in the pin holding holes 23 so as not to come out.

The socket pins 24 that do not require replacement connection are:
It is electrically connected to the plated through hole 5 via a simple connection path composed of two via holes 18 and 19. On the other hand, the specific socket pin 24A is electrically connected to the plated through hole 5A via a connection path that is slightly more complicated than the socket pin 24 described above.

The latter connection path is, so to speak, a specific socket pin 24A and a corresponding plated through hole 5A.
Can be grasped as a connection path for conducting through the QFP 9. The conductor layers C1 and C2 in the build-up layer B1 are used as a part of the connection path.

Next, the structure of the PGA socket 41 will be described. The PGA socket 41 includes a socket body 42 including a fixed member and a movable member. A plurality of pins 43 are protrudingly provided on the lower surface side of the fixing member constituting the socket body 42. These pins 43 are soldered to plated through holes on the motherboard MB side.

On the upper surface side of the fixed member, a movable member is disposed so as to cover. The movable member has a plurality of pin insertion / extraction holes 44 through which the socket pins 24 and 24A can be inserted / extracted. These pin insertion / extraction holes 44 have a positional relationship corresponding to the socket pins 24 and 24A.

A step 46 having a predetermined height exists on the upper surface side of the movable member. An operation lever 45 as an operation means is provided in a through hole passing through the step portion 46 in the horizontal direction by about 90 degrees.
It is inserted so that it can rotate about °. This operation lever 45
Moves between a locked position and an unlocked position. When the operation lever 45 is rotated, the movable member slides slightly along the horizontal direction. Socket pins 24, 24
A is inserted into each pin insertion / extraction hole 44 with the operation lever 45 rotated to the unlock position. Operation lever 45
Is rotated to the lock position, the pin insertion / extraction holes 44 are narrowed, and the socket pins 24 and 24A are
1 is fixed so that it cannot escape. At this time, the contacts in each pin insertion hole 44 are connected to each socket pin 24, 24.
As a result, electrical continuity with the motherboard MB is achieved.

In this embodiment, the socket 41 for PGA is "Socket" manufactured by Thomas & Bets Company.
5 "or" Socket 7 "(both ZIF series).

Next, an example of a method for manufacturing the conversion module 1 of the present embodiment having a three-layer integrated structure will be described with reference to FIG. First, the conversion substrate 3 is prepared in advance. The conversion substrate 3 can be obtained by performing a conventionally known pattern formation such as a subtractive method using, as a starting material, a core substrate 17 in which a copper foil is adhered to both surfaces of an insulating substrate made of glass epoxy, for example. Thereby, the core substrate 1
The conversion substrate 3 in which the plated through holes 5 and 5A and the pads 10 and 12 are formed in 7 is manufactured.

In the subsequent build-up layer forming step, a build-up layer B1 is formed on the upper surface of the core substrate 17 constituting the conversion substrate 3 by a build-up process. here,
First, a photosensitive epoxy-based additive adhesive is applied to the upper surface of the core substrate 17. The photosensitive epoxy-based additive adhesive refers to a resin matrix in which a resin filler relatively soluble in an oxidizing agent is dispersed in a resin matrix relatively insoluble in an oxidizing agent. Next, by performing exposure and development, an insulating layer I1 having a via hole forming hole having an inner diameter of about several tens of micrometers is formed. Next, a roughening agent (oxidizing agent)
The insulating layer I1 is chemically roughened using chromic acid. Thereafter, a catalyst nucleus is provided, a permanent resist (not shown) is formed, plating pretreatment, and electroless copper pattern plating are performed. After the above-described plating process, a copper plating layer is deposited on a portion where a permanent resist is not formed or on an inner wall surface of a via hole forming hole. Therefore, the conductor pattern 1 is formed on the insulating layer I1.
5 and via holes 18 are formed. The via hole 18 thus formed is a so-called filled via in which the inside of the via hole forming hole is completely filled with the copper plating layer.

Further, the same procedure is applied to the upper surface of the insulating layer I1 in which the via hole 18 is formed, in accordance with the same procedure as described above, application of an adhesive layer, exposure / development, roughening treatment, catalyst nucleation, formation of permanent resist, Perform processing and electroless copper pattern plating. As a result, pads 7, 8, 8 are formed on insulating layer I2.
a, 8b, 14, conductor pattern 16, via hole 19
Is formed, and a desired build-up layer B shown in FIG.
1 is completed.

Next, an adhesive sheet serving as the adhesive layer 51 is positioned and arranged on the surface of the build-up layer B1. At a predetermined position of the adhesive sheet, a circular opening serving as the concave portion 52 is provided in advance. Further, a perforated insulating base material 21 which will later become the socket substrate 4 is positioned on the adhesive sheet and then superposed. At this time, the pin holding hole 23 is already formed at a predetermined position of the insulating base material 21. Then, by applying a pressing force in the thickness direction of the substrate while heating, the build-up layer B1 and the insulating base material 21 are integrally bonded via the bonding layer 51 (see FIG. 3B). In other words, the core substrate 17 and the insulating base material 21 are indirectly bonded via the adhesive layer 51 and the build-up layer B1.

Next, after a plating resist is formed on the upper surface of the insulating base material 21, a catalyst nucleus is applied and activated, followed by electroless plating. In this case, the lower surface side of the core substrate 17 that does not need to deposit copper plating is preferably entirely protected by, for example, coating a plating resist (not shown). Then, as shown in FIG. 3C, the primary end 16a and the surface of the pad 14,
A plating layer 53 is formed on the inner wall surface of the pin holding hole 23 and the inner wall surface of the recess 52. Specifically, in the present embodiment, an electroless copper plating layer is formed. In order to secure the plating thickness, the electroless copper plating layer may be used as a base to further perform the plating by electrolytic copper plating. The unnecessary plating resist is removed at this point.

Further, each socket pin 24, 24A is pressed into the pin holding hole 23 from the opening on the upper surface side of each pin holding hole 23, so that each socket pin 24, 24A is inserted into each pin holding hole 23.
(See FIG. 3 (d)). That is, the socket board 4 is completed at this point.

After the above-described substrate bonding step and socket pin mounting step, a pin press-in and fixing step is subsequently performed. Then, each plated through hole 5, 5
A, the base end of the external connection pin 6 is press-fitted from the lower surface side opening and fixed. Further, by printing solder cream on various pads 7, 8, 8a, 8b, 10, 12 and temporarily fixing and reflowing parts, QF
P9 and the electronic components 11 and 13 are soldered to predetermined locations. Instead of printing the solder cream, soldering may be performed individually for each component.

Next, the desired conversion module 1 is completed by inserting the external connection pins 6 into the pin insertion holes 36 of the sub-board 32 and fixing them so that they cannot be pulled out. The PGA 2 is added to the conversion module 1 thus configured.
Is mounted, and further mounted on the PGA socket 41 of the motherboard MB, the result is as follows.

PGA flowing through a specific socket pin 24A
The signal No. 2 is input to the QFP 9 via a route of the interlayer connection layer 54 → the conductor pattern 16 → the input side pad 8a. The converted signal is output from the QFP 9 and then reaches the upper surface land 5Aa of the plated through hole 5A via a route of the output pad 8b → the via hole 19 → the conductor pattern 15 → the via hole 18. The converted signal reaching the land 5Aa is a plated through hole 5
The copper is supplied to the motherboard MB through a route of the copper plating layer in A → the lower surface side land 5Ab → the external connection pin 6 → the pin 43 of the PGA socket 41. As a result of the exchange connection using the conductor layers C1 and C2 of the build-up layer B1, signal conversion is mainly performed by the QFP 9, and the original function of the PGA 2 is sufficiently exhibited.

Therefore, according to the present embodiment, the following effects can be obtained. (1) In the present embodiment, the socket pins 24, 24A and the conductor layer C2 are connected via an interlayer connection layer 54 made of a conductive plating layer 53. as a result,
There is a state in which conduction between the socket pins 24, 24A and the conductor layer C2 is ensured. Therefore, it is possible to obtain a highly reliable conversion module 1 in spite of a three-layer integrated structure and a structure in which there is no gap between interlayer connection portions.

(2) The interlayer connection layer 54 of the present embodiment composed of the plating layer 53 can be obtained relatively easily through the above-described steps. Therefore, despite having a three-layer integrated structure and a structure with no gaps between interlayer connections,
The conversion module 1 can be easily manufactured.

(3) The conversion module 1 of the present embodiment
After bonding the perforated insulating base material 21, a plating layer 53 is formed in advance on a predetermined portion, and then the socket pins 24 and 24A are press-fitted into the pin holding holes 23. That is, purchase a commercially available socket board,
There is no manufacturing method that uses it as it is. Therefore, the material cost can be reduced as compared with the case where expensive commercial products are purchased, and the cost of the entire conversion module 1 can be prevented. [Second Embodiment] Next, a method of manufacturing a PGA conversion module 1 according to a second embodiment of the present invention will be described with reference to FIG. Here, the differences from the first embodiment will be mainly described, and the common points will be denoted by the same reference numerals, and description thereof will be omitted.

In the present embodiment, first, a build-up layer forming step is performed according to the above-described procedure to form a build-up layer B1 on the upper surface of the core substrate 17 (see FIG. 4A). Next, the adhesive layer 51 and the socket substrate 4 are arranged on the surface of the build-up layer B1 so as to be superposed in that order. In the present embodiment, an insulating base material 21A in which the pin holding holes 23 are already formed and the copper plating layer 61 is formed on the inner peripheral surface and the opening thereof is used. That is, the insulating base material 21A has a structure similar to the plated through hole at a plurality of locations. The surface layer of the copper plating layer 61 may be subjected to solder plating. Then, by applying a pressing force in the thickness direction of the substrate while heating, the build-up layer B1 and the insulating base material 21 are integrally bonded via the bonding layer 51 (see FIG. 4B).

Subsequently, a substantially spherical solder particle 62, which is a conductive metal particle, is inserted into each of the pin holding holes 23 by using a special particle inserting device, and then each of the socket pins 24, 24A is inserted.
Is inserted into each pin holding hole 23 (see FIG. 4C). The average particle size of the solder particles 62 is preferably slightly smaller than the inner diameter of the pin holding hole 23. The solder particles 62 may be inserted one by one for each hole, or a plurality of solder particles may be inserted as needed.

Further, the solder particles 62 are formed using a reflow furnace.
Is heated and melted and solidified to form an interlayer connection layer 63.
Is formed, and at this point, the socket substrate 4 is completed (see FIG. 4D). Then, through this interlayer connection layer 63,
The lower end surface of each socket pin 24 is connected to each pad 14, and the lower end surface of socket pin 24A is connected to conductor pattern 1.
6 is connected to the primary end 16a.

After the above-described substrate bonding step and socket pin mounting step, a pin press-in and fixing step is subsequently performed. Then, each plated through hole 5, 5
A, the base end of the external connection pin 6 is press-fitted from the lower surface side opening and fixed. Further, by printing solder cream on various pads 7, 8, 8a, 8b, 10, 12 and temporarily fixing and reflowing parts, QF
P9 and the electronic components 11 and 13 are soldered to predetermined locations. Instead of printing the solder cream, soldering may be performed individually for each component. It should be noted that the component soldering step can be performed before the pin press-fitting step or the socket pin mounting step.

Therefore, according to the present embodiment, the following effects can be obtained. (1) In this embodiment, the socket pins 24, 24A and the conductor layer C2 are connected via the interlayer connection layer 63 formed by melting and solidifying the conductive solder particles 62. As a result, the socket pins 24, 24A and the conductor layer C2
Are reliably conducted. Therefore,
Conversion module 1 having excellent reliability despite having a three-layer integrated structure and a structure having no gaps between interlayer connections.
Can be obtained.

(2) Interlayer connection layer 63 in this embodiment
Can be obtained relatively easily through the above steps. Therefore, the conversion module 1 can be easily manufactured in spite of the three-layer integrated structure and the structure in which there is no gap between the interlayer connection portions.

(3) The conversion module 1 of the present embodiment
After bonding the plated perforated insulating base material 21A, the solder particles 62 and the socket pins 24, 24A are inserted into the pin holding holes 23, and the solder particles are heated, melted and solidified in this state. I am taking it. That is, there is no manufacturing method in which a commercially available socket substrate is purchased and used as it is. Therefore, the material cost can be reduced as compared with the case where expensive commercial products are purchased, and the cost of the entire conversion module 1 can be prevented. Third Embodiment Next, a method of manufacturing a PGA conversion module 1 according to a third embodiment of the present invention will be described with reference to FIG. Here, the differences from the first embodiment will be mainly described, and the common points will be denoted by the same reference numerals, and description thereof will be omitted.

In the present embodiment, first, a build-up layer forming step is performed according to the above-described procedure to form a build-up layer B 1 on the upper surface of the core substrate 17 (see FIG. 5A). Next, an adhesive sheet to be the adhesive layer 51 is positioned and pressed on the surface of the build-up layer B1. At a predetermined position of the adhesive sheet, a circular opening serving as the concave portion 52 is provided in advance (see FIG. 5B).

Further, a solder paste 7 as a conductive metal paste is
1 is printed with a predetermined thickness (see FIG. 5C). As the solder paste 71, for example, eutectic solder (Pb: Sn = 3)
7:63, melting point 183 ° C.) dispersed in a vehicle. The surface of the solder paste 71 is coated with a flux according to a conventionally known method.

After the paste printing step, the socket substrate 4 is positioned on the adhesive sheet and then superposed. In the present embodiment, a commercially available socket substrate 4 in which the socket pins 24 and 24A are already molded in the respective pin holding holes 23 of the insulating base 21B is used as it is. And
By applying a pressing force in the thickness direction of the substrate while heating, the build-up layer B1 and the insulating base material 21B are integrally bonded via the bonding layer 51. Further, the solder paste 71 is heated and melted using a reflow furnace and solidified, thereby forming the interlayer connection layer 72 (see FIG. 5D). The lower end surface of each socket pin 24 and each pad 14 are connected via the interlayer connection layer 72, and the lower end surface of the socket pin 24 A and the primary end 16 a of the conductor pattern 16 are connected. Thereafter, if a pin press-in fixing step and a component soldering step are performed, a desired conversion module 1 is completed.

Therefore, according to the present embodiment, the following effects can be obtained. (1) In this embodiment, the socket pins 24, 24A and the conductor layer C2 are connected via an interlayer connection layer 72 formed by melting and solidifying a printed conductive solder paste 71. As a result, the electrical connection between the socket pins 24, 24A and the conductor layer C2 is ensured.
Therefore, it is possible to obtain a highly reliable conversion module 1 in spite of a three-layer integrated structure and a structure in which there is no gap between interlayer connection portions.

(2) Interlayer connection layer 72 in this embodiment
Can be obtained relatively easily through the above steps. Therefore, the conversion module 1 can be easily manufactured in spite of the three-layer integrated structure and the structure in which there is no gap between the interlayer connection portions. [Fourth Embodiment] Next, a method of manufacturing a PGA conversion module 1 according to a fourth embodiment of the present invention will be described with reference to FIG. Here, the differences from the third embodiment will be mainly described, and the common points will be denoted by the same reference numerals, and description thereof will be omitted.

In this embodiment, after the build-up layer forming step is first performed, the adhesive sheet serving as the adhesive layer 51 is then pressure-bonded (see FIGS. 6A and 6B). Here, instead of printing the solder paste 71 in the concave portion 52, an anisotropic conductive elastic material 81 as an anisotropic conductive material is disposed there (FIG. 6).
(c)). Specifically, in the present embodiment, a somewhat flat spherical anisotropic conductive rubber is used. As the anisotropic conductive rubber, one having a size that can be arranged in the concave portion 52 is selected. In the rubber matrix constituting the anisotropic conductive rubber, conductive metal particles are uniformly dispersed. Accordingly, when the rubber is elastically deformed by applying a pressing force in a predetermined direction, the rubber is compressed and the conductive metal particles are short-circuited, so that a conductive state along the pressing force applying direction is obtained.

After the conductor arranging step, the commercially available socket substrate 4 is positioned on the adhesive sheet and then superposed. By applying a pressing force in the thickness direction of the substrate while heating, the build-up layer B1
And the insulating base material 21B are integrally bonded. At this time, the anisotropic conductive rubber 81 is compressed by the lower end surfaces of the socket pins 24 and 24A in the thickness direction of the substrate and is somewhat crushed (see FIG. 6D). As a result, the lower end face of each socket pin 24 is connected to each pad 14 via the interlayer connection layer 82, and the lower end face of the socket pin 24A is connected to the primary side end 16a of the conductor pattern 16. Thereafter, if a pin press-in fixing step and a component soldering step are performed, a desired conversion module 1 is completed.

Therefore, according to the present embodiment, the following effects can be obtained. (1) In the present embodiment, the socket pins 24, 24A and the conductor layer C2 are connected via an interlayer connection layer 82 made of a compressed anisotropic conductive elastic body 81. As a result, the electrical connection between the socket pins 24, 24A and the conductor layer C2 is ensured. Therefore, it is possible to obtain a highly reliable conversion module 1 in spite of a three-layer integrated structure and a structure in which there is no gap between interlayer connection portions.

(2) Interlayer connection layer 82 in this embodiment
Can be obtained relatively easily through the above steps. Therefore, the conversion module 1 can be easily manufactured in spite of the three-layer integrated structure and the structure in which there is no gap between the interlayer connection portions. This structure of the conversion module 1 is advantageous in that heating is not particularly required when the interlayer connection layer 82 is formed. Fifth Embodiment Next, a method of manufacturing a PGA conversion module 1 according to a fifth embodiment of the present invention will be described with reference to FIG. Here, the differences from the first embodiment will be mainly described, and the common points will be denoted by the same reference numerals, and description thereof will be omitted.

In this embodiment, first, a build-up layer forming step is performed in accordance with the above-described procedure to form a build-up layer B1 on the upper surface of the core substrate 17 (see FIG. 7A). Next, the adhesive layer 51 and the insulating base material 21C are arranged on the surface of the build-up layer B1 so as to be overlapped in that order. In the present embodiment, an insulating base 21C in which the pin holding holes 23 are not formed is used. By applying a pressing force in the thickness direction of the substrate while heating, the adhesive layer 51 is formed.
Then, the build-up layer B1 and the insulating base material 21C are integrally adhered to each other (see FIG. 7B).

Next, a laser beam is radiated vertically from the upper surface side of the insulating base material 21C using a laser irradiator, thereby drilling a laser processing hole H1 in a predetermined area (see FIG. 7 (c)). At that time, it is necessary to irradiate the primary side end 16a or the area where the pad 14 is located, that is, the area where the metal is located. The upper portion of the laser-processed hole H1 thus processed becomes the pin holding hole 23 in the insulating base material 21C, and the lower portion becomes the concave portion 52 in the adhesive layer 51. Because of laser processing, pin holding hole 2
3 and the recess 52 have substantially the same size and the same cross-sectional shape.

Thereafter, if the socket pin mounting step, the pin press-in fixing step, and the component soldering step are performed according to the method of Embodiment 1, the desired conversion module 1 is completed. Therefore, even with the conversion module 1 as in the present embodiment, the effects of the first embodiment can be obtained. [Sixth Embodiment] Next, a conversion module 91 according to a fifth embodiment of the present invention will be described with reference to FIGS. Here, the differences from the first embodiment will be mainly described, and the common points will be denoted by the same reference numerals, and description thereof will be omitted.

Another conversion module 91 shown in FIG.
Are configured to mount a BGA (bump grid array) 92 which is a kind of chip module. A large number of substantially hemispherical bumps 93 as terminals protrude from the lower surface of the BGA 92. Instead of such bumps 93, a structure in which a sphere-shaped ball or the like is protruded may be used.

As shown in FIG. 9, the socket substrate 4 of the present embodiment has a three-dimensional uneven structure on its upper surface. More specifically, on each of the corners on the upper surface side of the insulating base material 21D constituting the socket substrate 4, a projecting piece 98 for preventing displacement is vertically provided in the thickness direction of the substrate. Have been. Each of these four protruding pieces 98 is integrally formed with the insulating base material 21D. Each protruding piece 9
The movement of the BGA 92 disposed between the eight pieces in the horizontal direction of the substrate is restricted by the protruding pieces 98, so that the displacement is less likely to occur.

A cover 99 is placed over the insulating base 21D. Locking claws 102 as locking portions are formed at a plurality of locations on the lower edge of the lid 99. These locking claws 102 can be engaged with and disengaged from the outer peripheral lower edge of the insulating base 21D. That is, each locking claw 102 functions as a stopper when the lid 99 is attached. A coin screw 100 as a device pressing member is screwed into a female screw hole 101 penetrating through the center of the lid 99. Then, by rotating the coin screw 100 and moving it downward, the BGA 92 is pressed and fixed to the insulating base material 21D side.

As shown in FIG. 9, the socket board 4 of the present embodiment has a large number of BGA socket pins 94. The BGA socket pin 94 has a structure in which a lower half 95 and an upper half 96 are connected by a spring 97. The lower half 95, the upper half 96, and the spring 97 are all made of a conductive metal material. The lower half 95 is held in the opening on the lower surface side of the pin holding hole 23 so as not to come out.
The upper half 96 is accommodated in the pin holding hole 23 so as to be slidable in the vertical direction. A hemispherical concave portion is formed on the upper end surface of the upper half portion 96, and the bottom surface of the bump 93 is pressed against the concave portion. It should be noted that a specific BGA socket pin requiring replacement connection is provided with 94A for convenience of explanation. In the present embodiment, each socket pin 9 is also interposed via the interlayer connection layer 54.
4 is connected to the primary end 16a and the socket pin 9
4A and the pad 14 are connected.

Note that such a conversion module 91
Basically, it can be manufactured by the procedure described in the first embodiment. Therefore, even with the conversion module 91 as in the present embodiment, each effect in the first embodiment can be obtained. In particular, since this conversion module 91 has an uneven structure on the upper surface of the socket substrate 4, B
A structure advantageous for mounting the GA 92 is provided. That is, as a result of the four protruding pieces 98 being less likely to be displaced, the mountability of the device is improved, and the added value of the conversion module 91 itself is increased.

The embodiment of the present invention may be modified as follows. Instead of forming the adhesive layer 51 using the adhesive sheet in the above embodiments, for example, a liquid adhesive is applied to the build-up layer B1 or the insulating bases 21, 21A, 21B or the like to thereby form the adhesive layer 51. May be adopted.

As an alternative to the build-up layer B1, for example, a flexible board is joined to the upper surface of the conversion board 3, and the socket pins 2 are connected to the connection conductors of the flexible board.
The replacement connection may be performed by connecting 4, 24A. It is also acceptable to omit the build-up layer B1 and the flexible board, and to bond the conversion board 3 and the socket board 4 via the bonding layer 51.

A substrate other than the conversion substrate 3 may be used as the first substrate. That is, the present invention can also be embodied in electronic component mounting boards other than the conversion modules 1 and 91 as in the above embodiments.

The sub-board 32 for preventing pin bending and tilting on the lower surface side of the conversion board 3 may be omitted if unnecessary. The device mounted on the upper surface side of the second substrate 4 is PG
It is not limited to a grid array type package such as A2 or BGA92, but may be a package other than a package (for example, an IC bare chip having a plurality of terminals on the lower surface).

The first substrate 3 is not limited to a rigid substrate, but may be a flexible substrate. Similarly, the second substrate 4 is not limited to a rigid substrate, but may be a flexible substrate.

Next, in addition to the technical ideas described in the claims, the technical ideas grasped by the above-described embodiments are listed below together with their effects. (1) In claim 1, the plating layer is an electroless copper plating layer. Therefore, according to the invention described in the technical idea 1, a low-resistance interlayer connection layer can be formed relatively inexpensively and easily.

(2) In the first aspect, the holding hole and the concave portion are laser-processed holes formed simultaneously by laser processing. Therefore,
According to the invention described in the technical idea 2, the electronic component mounting substrate can be manufactured using the insulating base material in which the holding holes are not drilled.

[0085]

As described in detail above, according to the first to fourth aspects of the present invention, the manufacturing is simple and excellent in reliability despite the fact that there is no gap in the interlayer connection portion. An electronic component mounting substrate having a socket-like structure can be provided.

[Brief description of the drawings]

FIG. 1 is a schematic side view showing a use state of a conversion module according to a first embodiment of the invention.

FIG. 2 is a partially enlarged cross-sectional view illustrating a use state of the conversion module according to the first embodiment.

FIGS. 3A to 3D are enlarged cross-sectional views of a main part for describing a manufacturing procedure of the conversion module according to the first embodiment.

FIGS. 4A to 4D are enlarged cross-sectional views of a main part for describing a manufacturing procedure of a conversion module according to a second embodiment.

FIGS. 5A to 5D are enlarged cross-sectional views of a main part for describing a manufacturing procedure of a conversion module according to a third embodiment.

FIGS. 6A to 6D are main-part enlarged cross-sectional views illustrating a manufacturing procedure of a conversion module according to a fourth embodiment.

FIGS. 7A to 7D are enlarged cross-sectional views of a main part for describing a manufacturing procedure of a conversion module according to a fifth embodiment.

FIG. 8 is a schematic side view showing a usage state of a conversion module according to a sixth embodiment.

FIG. 9 is a partially enlarged cross-sectional view illustrating a usage state of a conversion module according to a sixth embodiment.

[Explanation of symbols]

1, 91: a conversion module as an electronic component mounting board; 2, a PGA as a device; 3, a conversion board as a first board; 4, a socket board as a second board;
14 ... Pad forming a part of the conductor layer, 16a ... Primary end of the conductor pattern forming a part of the conductor layer, 23 ... (pin) holding hole, 24, 24A ... (PGA as a socket-like structure)
Socket pins, 26 pins as terminals, 51 adhesive layers, 52 recesses, 53 plating layers, 54, 63, 7
2, 82 ... interlayer connection layer, 62 ... solder particles as conductive metal particles, 71 ... solder paste as conductive metal paste, 81 ... anisotropic conductive elastic material as anisotropic conductive material,
92: BGA as a device; 93, bumps as terminals; 94, 94A: (BG as a socket-like structure)
A) Socket pin.

Continued on the front page F-term (reference) 5E336 AA01 AA05 AA08 AA09 BB02 BB03 BB16 BC04 BC15 BC26 BC31 BC34 CC02 CC31 DD12 EE01 EE07 EE08 EE15 GG11 5E346 AA02 AA04 AA06 AA12 AA15 AA26 AA29 CC32A04 CC32 DDCC EE31

Claims (4)

[Claims] A first substrate having a conductor layer on an upper surface side; and a socket-like structure at a plurality of locations where a plurality of terminals protruding from a lower surface of the device are detachable. A second substrate integrally adhered to the substrate via an adhesive layer, wherein an interlayer connection between the two substrates is provided. The surface of the conductor layer, the second Via the interlayer connection layer consisting of a plating layer formed on the inner wall surface of the holding hole provided through the substrate and the inner wall surface of the recess provided in the adhesive layer corresponding to the conductor layer. An electronic component mounting board having a socket-like structure, wherein a structure is connected to the conductor layer. 2. A first substrate having a conductor layer on an upper surface side, and a plurality of socket-like structure portions to which a plurality of terminals protruding from a lower surface of the device are detachably attachable. A second substrate that is integrally bonded to the second substrate via an adhesive layer, wherein an interlayer connection between the two substrates is achieved. Wherein the socket-like structure and the conductor layer are connected via an interlayer connection layer formed by melting and solidifying the conductive metal particles inserted into the holding hole. Electronic component mounting substrate. 3. A first substrate having a conductor layer on an upper surface side, and a plurality of socket-like structure portions to which a plurality of terminals projecting from a lower surface of the device are detachably attachable. A second substrate integrally bonded to the substrate via an adhesive layer, wherein an interlayer connection between the two substrates is achieved, wherein the adhesive layer corresponds to the conductor layer. Characterized in that the socket-like structure portion and the conductor layer are connected via an interlayer connection layer formed by melting and solidifying a conductive metal paste printed in the recess provided as described above. An electronic component mounting board with a socket-like structure. 4. A first substrate having a conductor layer on an upper surface side, and a plurality of socket-like structure portions to which a plurality of terminals protruding from a lower surface of the device are detachably attachable. A second substrate integrally bonded to the substrate via an adhesive layer, wherein an interlayer connection between the two substrates is achieved, wherein the adhesive layer corresponds to the conductor layer. The socket-like structure and the anisotropic conductor arranged in the recess provided by compressing the lower end surface of the socket-like structure in the thickness direction of the substrate through the interlayer connection layer. An electronic component mounting board having a socket-like structure, wherein the board is connected to a conductor layer.