JP2000149777A - Inner-wall screening component for aluminum vapor deposition device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide inner-wall screening components for an aluminum vapor deposition device, making aluminum deposited thereon resistant to peeling off. SOLUTION: In inner-wall screening components, such as a pan 2 and screening frame 3, disposed within a deposition kettle 11 of an aluminum vapor deposition device, surface portions, such as a receiving surface 2b and inner circumferential surfaces 3b, exposed to aluminum vapor are roughened by sand-blasting. This ensures adhesiveness of aluminum to the surface portions such as the receiving surface 2b and the inner circumferential surfaces 3b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inner wall shielding component which is used when depositing aluminum on a phosphor screen of a panel glass constituting a cathode ray tube and which is disposed inside a deposition vessel of an aluminum deposition apparatus.

[0002]

2. Description of the Related Art In a process of manufacturing a cathode ray tube, a so-called metal back process of depositing aluminum on a phosphor screen of a panel glass constituting the cathode ray tube is performed. In the metal backing step, an aluminum vapor deposition apparatus having a vapor deposition vessel is used. Inside the vapor deposition vessel, an inner wall shielding component for preventing deposition of aluminum on the inner wall of the vapor deposition vessel is arranged. These inner wall shielding parts are formed by, for example, forming a stainless plate into a receiving tray or a shielding frame shape.

[0003] In the metal backing process using the aluminum vapor deposition apparatus, the above-mentioned internal shielding component is arranged inside the vapor deposition vessel, the upper portion of the internal shielding component is closed with panel glass, and the internal shielding component and the panel glass are placed inside the vapor deposition vessel. To form a deposition chamber surrounded by the phosphor screen. Then, aluminum vapor is generated in the vapor deposition chamber to expose the phosphor screen to the aluminum vapor. Thus, aluminum is vapor-deposited on the phosphor screen without exposing the inner wall of the vapor deposition vessel to aluminum vapor.

[0004]

However, in the above metal backing process, aluminum is deposited on the surface of the inner wall shielding parts such as the tray and the shielding frame. Then, as shown in FIG. 5, the aluminum 102 deposited on the surface of the inner wall shielding component 101 increases in thickness by repeatedly performing the metal back process, and may eventually peel off from the surface of the inner wall shielding component as an aluminum piece 103. is there. When the peeled aluminum pieces 103 adhere to the fluorescent screen of the panel glass, the panel glass becomes defective. This is a factor that lowers the yield of a cathode ray tube using this panel glass.

Further, in order to prevent the occurrence of the above-mentioned defective products, it is necessary to frequently perform maintenance for cleaning the inner wall shielding parts and removing aluminum deposited on the surface thereof, which is troublesome.

Accordingly, the present invention provides an inner wall shielding component of an aluminum deposition device in which aluminum deposited on the surface is difficult to peel off as aluminum pieces, thereby reducing the frequency of maintenance of the inner shielding component and using the aluminum deposition device. An object of the present invention is to improve the yield of manufactured cathode ray tubes.

[0007]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention relates to an inner wall shielding part disposed inside a vapor deposition vessel of an aluminum vapor deposition apparatus, wherein the surface is exposed to aluminum vapor. It is characterized by having been given. The unevenness is formed by sandblasting.

According to the inner wall shielding part of the above aluminum vapor deposition device, the surface of the inner shielding part having the unevenness formed thereon is exposed to aluminum, and the aluminum is deposited on the surface part having the unevenness formed. become. For this reason, the adhesion between the deposited aluminum and the surface portion is ensured, and the aluminum pieces are less likely to peel from the surface portion.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an inner wall shielding part of an aluminum vapor deposition apparatus to which the present invention is applied will be described below with reference to FIGS. FIG. 1 is a diagram showing a configuration of an aluminum vapor deposition device and an inner wall shielding component arranged inside the vapor deposition pot. FIG. 2 is a cross-sectional view for explaining a state in which an inner wall blocking component is arranged inside the evaporation pot.

As shown in these figures, an aluminum vapor deposition apparatus 1 comprises a box-shaped vapor deposition chamber 11 having an open upper surface,
An evacuation pipe 12 is connected to the bottom of the evaporator 11, and a main body 13 is disposed below the evaporator 11 and houses an evacuation pump (not shown) connected to the evacuation pipe 12. Evaporator 1 in this aluminum evaporator 1
A tray 2 and a shielding frame 3 are inserted into the inside 1 as an inner wall shielding component as described in the claims, and an inner lid frame 4 is placed on the upper part of the vapor deposition pot 11. Although not shown in FIG. 1, three pairs of tubes 11 a for fixing the heater 5 are provided upright on the bottom surface of the evaporation chamber 11.

The receiving tray 2 is inserted and mounted on the bottom of the vapor deposition vessel 11, and has three pairs of holes 2a for projecting a tube 11a provided on the bottom of the vapor deposition vessel 11. I have. The receiving tray 2 is made of stainless steel, and its receiving surface (that is, a surface that is directed upward while being placed on the bottom of the evaporation chamber 11) 2b is formed with unevenness by sandblasting. This receiving surface 2b is a surface corresponding to the surface portion described in the claims.

The shielding frame 3 is inserted into the evaporation chamber 11 in a state where it is placed on the receiving tray 2. For example, a partition wall is provided in a frame composed of four surfaces to form three shielding walls. It is partitioned into a vapor deposition chamber 3a. This shielding frame 3
Is made of stainless steel, and of its surface,
The inner peripheral surface (that is, the surface other than the outer peripheral surface) 3b toward the inside of each vapor deposition chamber 3a is formed with unevenness by sandblasting. The inner peripheral surface 3b is a surface corresponding to the surface portion described in the claims. In addition, the shielding frame 3 is placed on the tray 2.
Is placed in each vapor deposition chamber 3a, the hole 2a of the tray 2 and the pipe 11a
The shielding frame 3 is disposed one by one and the upper
It is assumed that they are arranged at substantially the same height as the periphery of the first.

The inner lid frame 4 is formed by forming, for example, three openings 4a in a stainless steel plate having a size enough to sufficiently close the upper opening of the evaporation chamber 11. The inner lid frame 4 has an upper portion of the evaporation chamber 11 and the shielding frame 3 such that each opening 4a is disposed on each of the evaporation chambers 3a and an upper portion of a gap between the shielding frame 3 and the evaporation chamber 11 is closed. Placed on
The lower surface of the inner lid frame 4 (the surface that faces downward while being placed on the evaporation pot 11) is subjected to sand blasting to form irregularities as necessary.

The metal backing process using the above-structured aluminum vapor deposition apparatus 1, tray 2, shielding frame 3, and inner lid frame 4 is performed as follows. First, the tray 2 is placed in the evaporation pot 11.
Is inserted, and the heater 5 is bridged over a plurality of pairs of tubes 11a protruding from the holes 2a of the tray 2. Next, the aluminum pellets 7 are placed on the heater 5 and the
The shielding frame 3 is placed thereon. Thus, the pellets 7 are placed in the respective vapor deposition chambers 3 a partitioned by the shielding frame 3 while being placed on the heater 5. Thereafter, the inner lid frame 4 is placed on the shielding frame 3 and the evaporation pot 11, and the panel glass 8 is placed on each of the evaporation chambers 3a. On this occasion,
The fluorescent screen 8a of each panel glass 8 is directed into the vapor deposition chamber 3a, and the vapor deposition chamber 11 is closed with each panel glass 8 and the inner lid frame 4.

Thereafter, as shown in FIG. 3, the gas inside the evaporation chamber 11 including the inside of the evaporation chamber 3a is exhausted from the exhaust pipe 12. Then, after the inside of the evaporation chamber 11 including the inside of the evaporation chamber 3a is decompressed to a predetermined vacuum state, each heater 5 is operated to heat the aluminum pellets 7. As a result, the aluminum vapor A is supplied into the vapor deposition chamber 3a in which the pellets 7 are arranged, and the phosphor screen 8a of the panel glass 8 is supplied.
Is exposed to aluminum vapor A, and aluminum is deposited on the fluorescent screen 8a.

At this time, the receiving surface 2b of the receiving tray 2 and the inner peripheral surface 3b of the shielding frame 3 are also exposed to the aluminum vapor A, so that aluminum is also deposited on these surfaces. Moreover, aluminum 9 deposited on these surfaces
The film thickness gradually increases due to the repeated metal back process. Here, as shown in FIG. 4 which is an enlarged view of the portion B, since these surfaces (in the drawing, the inner peripheral surface 3b of the shielding frame 3) are formed with irregularities,
Adhesion with the deposited aluminum 9 is ensured.

The aluminum 9 deposited on the receiving surface 2b of the receiving tray 2 and the inner peripheral surface 3b of the shielding frame 3 can be prevented from peeling off as aluminum pieces. Therefore, contamination of the vapor deposition chamber 3a by the aluminum pieces is prevented, and the cleanliness of the panel surface 8a of the panel glass 8 can be ensured. As a result, the yield of a cathode ray tube using the panel glass can be improved.

Further, an experiment was conducted in which an inner wall shielding component (ie, a tray and a shielding frame) having aluminum deposited on the surface portion was immersed in a caustic soda (sodium hydroxide) solution to dissolve and remove aluminum from the surface. As a result, it was confirmed that aluminum can be dissolved and removed from the surface portion of the inner wall shielding component described in the above-described embodiment to the same extent as the conventional inner wall shielding component. Therefore, there is no need to change the maintenance method of the inner wall shielding component, and the frequency of the maintenance can be reduced.

In order to confirm the improvement of the adhesion of the inner wall shielding component to the surface of the inner wall shielding component, the conventional inner wall shielding component and the inner wall shielding component of the present invention (that is, the tray and the shielding frame) described in the embodiment are used. Was subjected to an adhesion test. This adhesion test was carried out by scribing the aluminum-deposited surface portion with a needle, applying a mending tape to lightly suppress the mending tape, and then peeling the mending tape. The number of times of vapor deposition was 23 times. As a result, it was confirmed that, in the inner wall shielding component described in the embodiment, aluminum was less likely to peel off from the surface portion than in the conventional inner wall shielding component, and the adhesion was improved.

[0020]

As described above, according to the inner wall shielding component of the aluminum vapor deposition pot of the present invention, the surface portion exposed to aluminum is formed with irregularities, thereby ensuring the adhesion between the surface portion and aluminum. However, it is possible to prevent the aluminum piece from peeling off from the inner wall shielding component. As a result, it is possible to reduce the frequency of maintenance of the internal shielding components. Further, it is possible to prevent the aluminum piece from contaminating the panel glass and to improve the yield of the cathode ray tube using the panel glass.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of an aluminum vapor deposition apparatus and an inner wall shielding component arranged inside a vapor deposition pot in an embodiment.

FIG. 2 is a cross-sectional view showing a state in which an inner wall blocking component is arranged inside a deposition pot.

FIG. 3 is a cross-sectional view for explaining a metal back process.

FIG. 4 is an enlarged sectional view of a portion B in FIG. 3;

FIG. 5 is a cross-sectional view illustrating a state in which an aluminum piece peels off from a surface portion of the inner wall blocking component.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Aluminum vapor deposition apparatus, 2 ... Receiving pan (inner wall shielding part), 2a ... Receiving surface (surface part), 3 ... Shielding frame (inner wall shielding part), 3a ... Inner peripheral surface (surface part), 11 ... Evaporation pot,
A: Aluminum vapor

Claims (2)

[Claims] 1. An inner wall shielding component disposed inside a vapor deposition vessel of an aluminum vapor deposition apparatus, wherein a surface portion exposed to aluminum vapor is formed with irregularities. parts. 2. The inner wall shielding component of the aluminum vapor deposition device according to claim 1, wherein the unevenness is formed by sandblasting.