JP2000149151A - Heat radiation structure for light emitting diode lamp - Google Patents

Heat radiation structure for light emitting diode lamp

Info

Publication number
JP2000149151A
JP2000149151A JP10320386A JP32038698A JP2000149151A JP 2000149151 A JP2000149151 A JP 2000149151A JP 10320386 A JP10320386 A JP 10320386A JP 32038698 A JP32038698 A JP 32038698A JP 2000149151 A JP2000149151 A JP 2000149151A
Authority
JP
Japan
Prior art keywords
substrate
emitting diode
light emitting
support body
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10320386A
Other languages
Japanese (ja)
Inventor
Koyo Nakamura
光瑤 中村
Shunji Toida
俊次 樋田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Koki Kogyo Co Ltd
Original Assignee
Nippon Koki Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Koki Kogyo Co Ltd filed Critical Nippon Koki Kogyo Co Ltd
Priority to JP10320386A priority Critical patent/JP2000149151A/en
Publication of JP2000149151A publication Critical patent/JP2000149151A/en
Pending legal-status Critical Current

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  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Audible And Visible Signals (AREA)

Abstract

PROBLEM TO BE SOLVED: To effectively radiate heat emitted by LED from a lamp body and a globe through a filling material and a supporting main body since a part of the supporting main body is made in close contact with the lamp body and the globe, to improve light emitting efficiency since the temperature rising in LED can be prevented and to improve the radiation luminous intensity of a lamp unit. SOLUTION: This heat radiation structure has an LED 1, a substrate 2, a supporting main body 3, a filling material 4 and a glove 5. The lead part of LED is soldered to the conduction pattern of the substrate 2. The supporting main body 3 is the good conductor of heat and it supports the substrate 2 between the lead part and solder through the thermally conductive and non- electrically conductive filling material 4 and radiates heat from a flange part 11. The globe covers LED 1 by leaving the heat radiation face of the supporting main body 3.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、標識灯、信号灯
などの、警報、信号もしくは情報等を発する灯器で、発
光ダイオード(以下「LED」という。)を光源とする
ものの放熱機構に関する。LEDは、電球に比較し寿命
が長いので、標識灯など長時間連続して点灯する用途に
適し、近年多く使用されている。しかし、点灯に伴いL
ED内部の温度が上昇すると、発光効率が低下して光度
が低減する性質がある。このため、LED内部で発生す
る熱を速やかに排出するための内部冷却が重要である。
この発明は、LEDを光源とする灯器の内部LED取り
付け部の冷却に有効な手段を提供するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radiating mechanism for emitting a warning, a signal, information, or the like, such as a marker light or a signal light, and using a light emitting diode (hereinafter, referred to as "LED") as a light source. Since LEDs have a longer life than light bulbs, they are suitable for long-term continuous use such as sign lights, and have been widely used in recent years. However, with lighting, L
When the temperature inside the ED increases, there is a property that the luminous efficiency decreases and the luminous intensity decreases. For this reason, it is important to internally cool the LED to quickly discharge the heat generated inside the LED.
The present invention provides an effective means for cooling an internal LED mounting portion of a lamp using an LED as a light source.

【0002】[0002]

【従来の技術】従来の、この種の灯器の内部冷却改善を
目的とする技術の例としては、特開平4−121901
号(以下「イ号」という。)記載の構成が知られてい
る。これは、灯器内部の放熱を促進するため、灯器の構
造は上部の基台(4)を中空とし、下部は高盃状とした
ステー(6)の側面に複数の通気孔を設け、ステー
(6)の中央部を隔離して電源(7)を収納している。
また、同様の目的のものに、特開平9−69304号
(以下「ロ号」という。)がある。これは、灯器の頂上
部に放熱体(56)を設け、放熱を改善するものであ
る。
2. Description of the Related Art An example of a conventional technique for improving the internal cooling of a lamp of this type is disclosed in JP-A-4-121901.
No. (hereinafter referred to as “A”) is known. This is because, in order to promote heat radiation inside the lamp, the lamp has a structure in which the upper base (4) is hollow and the lower is a cup-shaped stay (6), and a plurality of ventilation holes are provided on the side surface. A power source (7) is housed in a central part of the stay (6).
Japanese Patent Application Laid-Open No. 9-69304 (hereinafter referred to as "B") has a similar purpose. This is to improve the heat radiation by providing a radiator (56) at the top of the lamp.

【0003】[0003]

【発明が解決しようとする課題】しかし、上述のような
従来技術においては、LEDはプリント基板(イ号の
3、ロ号の33)に取り付けられている。この取り付け
状態は、図が小さく、詳細が明確には示されていない
が、プリント基板(イ号の3、ロ号の33)は支持本体
(イ号の4:基台、ロ号の32:ユニット本体)とは離
れて固定され、空気層で隔離されているので、LEDと
基台4やユニット本体32の熱伝達は空気に依存するこ
ととなり、冷却効果は限定されたものとなる。
However, in the prior art as described above, the LEDs are mounted on a printed circuit board (No. 3, No. 33). In this mounting state, although the figure is small and the details are not clearly shown, the printed circuit board (No. 3, No. 33) includes a supporting body (No. 4: Base, No. 32: (The unit body), and is separated by an air layer, so that the heat transfer between the LED and the base 4 or the unit body 32 depends on the air, and the cooling effect is limited.

【0004】一般に、LED素子はリード部をプリント
基板の穴に貫通させた状態で半田付をして取り付けられ
る。このとき、LED本体の反対側に通電用のパターン
を形成し、ここにリードを貫通させて半田付けするの
で、半田とリードが突出することになる。これらが金属
製の支持本体に接触すると電気的に短絡状態となり、正
常には動作しない。即ち、必ず空気層が介在することに
なり、熱伝導が制約を受けると考えられる。また、LE
Dのリード先端と金属製の支持本体が、直接接触してい
なくても、隙間が狭い場合には、雷の影響などで放電に
より短絡する可能性があり危険である。
Generally, an LED element is mounted by soldering with a lead portion penetrating through a hole in a printed circuit board. At this time, an energizing pattern is formed on the opposite side of the LED body, and the lead is penetrated here and soldered, so that the solder and the lead protrude. When they come into contact with the metal supporting body, they are electrically short-circuited and do not operate normally. That is, it is considered that an air layer is always interposed, and heat conduction is restricted. Also, LE
Even if the tip of the lead of D and the metal support body are not in direct contact with each other, if the gap is narrow, there is a danger that a short circuit may occur due to lightning or the like due to electric discharge.

【0005】[0005]

【課題を解決するための手段】本発明にかかる発光ダイ
オード灯器の放熱構造は、 発光ダイオード、基板、支
持本体、充填物及びグローブを有している。該発光ダイ
オードは、そのリード部が該基板の穴に挿通されかつ該
基板の裏面の通電用パターンに半田により固定されて、
該基板に取り付けられている。該支持本体は熱の良導体
で構成され、該リード部及び該半田との間に熱伝導性か
つ非電気伝導性の該充填物を介して該基板を支持し、そ
のフランジ部は灯体に取り付けられかつ該グローブを支
持して放熱面を形成している。そして、該グローブは該
発光ダイオードを覆っている。
According to the present invention, a heat radiating structure for a light emitting diode lamp includes a light emitting diode, a substrate, a support body, a filling, and a globe. The light-emitting diode has its lead portion inserted through a hole in the substrate and fixed to a conducting pattern on the back surface of the substrate by soldering,
It is attached to the substrate. The supporting body is composed of a good heat conductor, supports the substrate via the heat conductive and non-electrically conductive filler between the lead portion and the solder, and has a flange portion attached to the lamp body. The glove is supported and forms a heat radiating surface. And, the globe covers the light emitting diode.

【0006】LEDが取り付けられるプリント基板と、
この基板を支持する熱伝導性及び導電性の支持本体との
間に、熱伝導性で電気絶縁性の充填物を充填して固化さ
せることにより、LEDと金属部との間に介在する空気
層が無くなる。そして、LEDから生ずる熱は速やかに
充填物を介して支持本体に伝導し、この支持本体の放熱
面から外部へ放散される。このため、灯器の光度は高ま
り、従来技術の課題が解決されるに至った。
A printed circuit board on which the LED is mounted;
An air layer interposed between the LED and the metal part by filling and solidifying a thermally conductive and electrically insulating filler between the thermally conductive and electrically conductive support body supporting the substrate. Disappears. Then, the heat generated from the LED is quickly conducted to the supporting body via the filling material, and is radiated to the outside from the heat radiation surface of the supporting body. For this reason, the luminous intensity of the lamp is increased, and the problem of the related art has been solved.

【0007】該基板は可撓性を有し、該支持本体は一部
に円錐筒部を有し、該円錐筒部の外面に沿って該基板を
支持していてもよい。この場合、基板を円錐筒部の外周
に巻き付けやすく、航空障害灯に課せられた規制、即ち
水平方向は全周で、上下方向は下向き15゜から真上ま
での範囲に適合する配光を行え、規定光度の上向き7.
5゜にも容易に対応可能である。
[0007] The substrate may have flexibility, the support body may have a conical cylinder part, and the substrate may be supported along the outer surface of the conical cylinder part. In this case, it is easy to wind the substrate around the outer periphery of the conical cylindrical portion, and the regulation imposed on the aviation obstruction light, that is, the light distribution suitable for the whole circumference in the horizontal direction and the vertical direction from 15 ° downward to just above can be performed. 6. Upward of the specified luminous intensity
It can easily handle 5 mm.

【0008】該基板は可撓性を有し、該支持本体は一部
に円筒部を有し、該円筒部の外面に沿って該基板を支持
していてもよい。前記と同様に可撓性の基板は円筒部の
外周に巻き付けやすい。また、投光方向は水平方向の全
周となる。
[0008] The substrate may have flexibility, the support body may have a cylindrical portion in part, and may support the substrate along an outer surface of the cylindrical portion. As described above, the flexible substrate is easily wound around the outer periphery of the cylindrical portion. The light projection direction is the entire circumference in the horizontal direction.

【0009】該支持本体と該基板の間に互いに間隔を保
ってスペーサーが配設され、該スペーサーを除いた該支
持本体と該基板の間に該充填物が充填されていてもよ
い。剛性の基板の場合は最低二カ所にスペーサーがあれ
ば足りるが、可撓性の基板の場合、スペーサー相互の間
隔は、隣り合うスペーサーが基板を支持本体に接触させ
ないように支持する間隔に決められる。剛性の基板の場
合は勿論、可撓性の基板の場合でも、スペーサーを除い
た基板と支持本体との間に充填物を充填できる。
[0009] A spacer may be provided between the support body and the substrate at a distance from each other, and the filler may be filled between the support body and the substrate except for the spacer. In the case of a rigid substrate, it is sufficient to have spacers in at least two places, but in the case of a flexible substrate, the spacing between the spacers is determined by the interval at which adjacent spacers support the substrate so as not to contact the substrate. . In the case of a rigid substrate as well as a flexible substrate, a filler can be filled between the substrate and the support body excluding the spacer.

【0010】該支持本体は一面に開口を有する箱形で他
面に段面を残して凹部を有し、該基板は該裏面で該凹部
を覆って該段面に取り付けられ、該開口を該グローブが
覆っていてもよい。この場合の基板は可撓性のもので
も、剛性のものでもよい。光は一方向へ放射される。工
業製品の検査や識別等に使用する照明灯に適する。ま
た、同様の構造で多数のLEDを使用し、LEDを個別
に点滅できる制御回路を付加して文字や記号を表示さ
せ、通路案内その他の表示灯や標識灯とする場合にも適
用できる。
The supporting body is box-shaped having an opening on one surface and has a recess on the other surface, leaving a stepped surface. The substrate is attached to the stepped surface covering the recessed portion on the back surface, and the opening is formed on the substrate. The glove may be covered. In this case, the substrate may be flexible or rigid. Light is emitted in one direction. Suitable for lighting used for inspection and identification of industrial products. Further, the present invention can be applied to a case where a large number of LEDs are used in the same structure, a control circuit capable of individually blinking the LEDs is added to display characters and symbols, and the display is used as a guide light or other indicator light or sign light.

【0011】該充填物はシリコンゴムと硬化剤を混合し
たものから成っていてもよい。熱伝導性で電気絶縁性の
充填物の一例としては、近年、放熱用シリコーンゴムと
いうものが販売されている。この中には、液状の主剤に
硬化剤を混合して注入すれば狭い空間でも充満して、時
間の経過により硬化するものがある。LEDを取り付け
たプリント基板と支持本体の間の隙間にこの充填材を注
入して硬化させることにより、ほぼ完全に空気が排出さ
れ、この充填材によりプリント基板と支持本体の間の熱
伝達が格段に向上する。また、LEDのリード先端と金
属製の支持本体が空間を保って近接している場合に起こ
り得る放電も、この充填材があれば抑制される。
The filler may comprise a mixture of silicone rubber and a curing agent. As an example of a thermally conductive and electrically insulating filler, a heat-dissipating silicone rubber has recently been sold. Among these, there is a type in which a narrow space is filled by mixing and injecting a hardening agent into a liquid base material and hardening over time. By injecting this filler into the gap between the printed circuit board on which the LED is mounted and the support body and curing the air, the air is almost completely exhausted, and the heat transfer between the printed circuit board and the support body is remarkable by this filler. To improve. In addition, the discharge that can occur when the lead end of the LED and the metal supporting body are close to each other while maintaining a space is suppressed by the filler.

【0012】[0012]

【発明実施の形態】次に、この発明の実施の形態を、航
空障害灯に適用した例につき、図面に基づいて説明す
る。図1の右半分は外観図、左半分は断面図である。こ
の航空障害灯の配光は、赤色光にて水平方向は全周、上
下方向は下向き15゜から真上までの範囲で規定され、
規定光度の最高値は上向き7.5゜方向である。このた
め、LEDを全周に上向き7.5゜に装着する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment in which the present invention is applied to an aviation obstacle light will be described with reference to the drawings. The right half of FIG. 1 is an external view, and the left half is a cross-sectional view. The light distribution of this aviation obstruction light is specified by red light in a range from 15 ° downward to just above in the horizontal direction and up and down in the horizontal direction.
The maximum value of the specified luminous intensity is the upward 7.5 ° direction. For this reason, the LED is mounted at an angle of 7.5 ° all around.

【0013】1はLED、2はLED用の基板、3は支
持本体、4は充填物、5はグローブである。LED1は
図6で分かる通り、そのリード部6が基板2の穴7に挿
通されかつ基板2の裏面8にプリントされた通電用のパ
ターン9に半田10で固定されて、基板2に取り付けら
れている。
1 is an LED, 2 is an LED substrate, 3 is a support body, 4 is a filler, and 5 is a glove. As can be seen from FIG. 6, the LED 1 has its lead portion 6 inserted through the hole 7 of the substrate 2 and fixed to the energizing pattern 9 printed on the back surface 8 of the substrate 2 with solder 10 and attached to the substrate 2. I have.

【0014】支持本体3は熱の良導体で構成され、リー
ド部6及び半田10との間に熱伝導性かつ非電気伝導性
の充填物4を介して基板2を支持し、そのフランジ部1
1は灯体12に取り付けられかつグローブ5を支持して
放熱面13を形成している。
The support body 3 is made of a good heat conductor, supports the substrate 2 between the lead portion 6 and the solder 10 through a thermally and electrically non-conductive filler 4, and has a flange portion 1
1 is attached to the lamp body 12 and supports the globe 5 to form a heat radiation surface 13.

【0015】グローブ5は前記の通り支持本体3のフラ
ンジ部11に取り付けられ、LED1を覆っている。
The globe 5 is attached to the flange 11 of the support body 3 as described above, and covers the LED 1.

【0016】図示の例で、支持本体3のフランジ部11
は、灯体12のフランジ部14に取り付けられる。ま
た、支持本体3の中央空洞部15の下部には点灯回路1
6が収納されており、周囲には通線窓17があり、コネ
クタ18により点灯回路16と基板2のパターン9を接
続する。灯体13の下部の端子台収納部19に端子台2
0が収納されており、電源線21を接続する。
In the illustrated example, the flange portion 11 of the support body 3 is provided.
Is attached to the flange portion 14 of the lamp body 12. The lighting circuit 1 is located below the central cavity 15 of the support body 3.
The lighting circuit 16 and the pattern 9 of the board 2 are connected by a connector 18. The terminal block 2 is stored in the terminal block storage section 19 below the lamp body 13.
0 is stored, and the power supply line 21 is connected.

【0017】支持本体3のフランジ部12の上面は、グ
ローブ5の装着に供されている。基板2は上下の縁部で
支持本体3にねじ止めされ、支持本体3と密着している
が、中間部では支持本体3の外面が凹んでいて両者の間
に仮の隙間が設けられている。これは前述のように、L
ED1の半田10による固定部が支持本体3と接触しな
いようにするためである。
The upper surface of the flange portion 12 of the support body 3 is used for mounting the globe 5. The substrate 2 is screwed to the support body 3 at upper and lower edges and is in close contact with the support body 3, but at an intermediate portion, the outer surface of the support body 3 is depressed and a temporary gap is provided between the two. . This is, as mentioned above,
This is to prevent the fixing portion of the ED 1 by the solder 10 from coming into contact with the support body 3.

【0018】基板2は支持本体3の全周に取り付ける必
要があり、剛性のものでも可撓性のあるものでもよい。
本実施例では、この基板2を3分割して取り付けてい
る。基板2の合わせめは基板押さえ22で押さえ、基板
2が正しい円筒又は円錐形となるように規制している。
基板押さえ22の横断面形状は、必要な曲がり剛性を確
保するため逆T字断面とし、基板2に接触する部分に
は、LED1のリード部6との接触を避けるための切り
欠き(図示省略)が設けられている。
The substrate 2 needs to be attached to the entire periphery of the support body 3, and may be rigid or flexible.
In this embodiment, the substrate 2 is attached in three parts. The alignment of the substrate 2 is suppressed by a substrate holder 22, and the substrate 2 is regulated so as to have a correct cylindrical or conical shape.
The cross-sectional shape of the substrate holder 22 is an inverted T-shaped cross-section to ensure the required bending rigidity, and a notch (not shown) is provided at a portion in contact with the substrate 2 to avoid contact with the lead portion 6 of the LED 1. Is provided.

【0019】LED用の基板2と支持本体3との仮の隙
間は、放熱用の充填物4が充填されることにより、無く
なっている。この充填は、基板2を支持本体3に取り付
けた後、支持本体3の上面に設けた注入口23から流動
性のある充填材を注入して、なされる。注入口23は複
数個(本実施例では3個)設けられており、注入の際、
別の注入口23から空気が排出されて、充填物4が基板
2と支持本体3に密着する。なお、この仮の隙間の下端
部には、0リング24が装着されており、注入の際に充
填物4が漏れるのを防止している。なお、Fは灯体12
に設けられた放熱用のフィンである。
The temporary gap between the LED substrate 2 and the support main body 3 is eliminated by filling the heat radiation filler 4. This filling is performed by attaching the substrate 2 to the support main body 3 and then injecting a fluid filler through an inlet 23 provided on the upper surface of the support main body 3. A plurality of injection ports 23 (three in this embodiment) are provided.
The air is exhausted from another inlet 23, and the filler 4 comes into close contact with the substrate 2 and the support body 3. In addition, an O-ring 24 is attached to the lower end of the temporary gap to prevent the filler 4 from leaking during injection. Note that F is the lamp body 12
These are fins for heat radiation provided in the.

【0020】以上の構成により、図示の場合、LED1
の内部で発生した熱は、LED1のリード部6、基板2
の裏面8に形成された通電用のパターン9、基板2の裏
面8側に充填された伝熱性の充填物4を通って支持本体
3に伝わる。そして、この熱の一部はそのフランジ部1
1の放熱面13から灯体12に伝わってそのフィンFか
ら外部へ放出され、また一部は放熱面13からグローブ
5に伝わって外部へ放出される。また、LED1近傍の
空気は、LED1の熱を得て高温となって上昇し、グロ
ーブ5を介して放熱し、温度低下とともに支持本体3の
中央空間部15を降下して支持本体3に放熱しつつ循環
する。この場合の灯器の放射光度は、実測例で約20%
向上した。
With the above configuration, the LED 1
The heat generated inside the LED is led by the lead 6 of the LED 1 and the substrate 2.
The power transmission pattern 9 formed on the back surface 8 of the substrate 2 and the heat conductive filler 4 filled on the back surface 8 side of the substrate 2 are transmitted to the support body 3. And a part of this heat is
The heat is transmitted from the radiating surface 13 to the lamp body 12 to the outside through the fins F, and a part of the heat is transmitted from the heat radiating surface 13 to the globe 5 and is discharged to the outside. The air in the vicinity of the LED 1 is heated by the heat of the LED 1, rises to a high temperature, rises, dissipates heat through the globe 5, and descends along the central space 15 of the support body 3 as the temperature decreases, and radiates heat to the support body 3. Circulate while circulating. The radiance of the lamp in this case is about 20%
Improved.

【0021】図1で、基板2は可撓性を有し、支持本体
3は一部に円錐筒部25を有し、この円錐筒部25の外
面に沿って基板2を支持している。こうすると、基板2
を円錐筒部25の外周に巻き付けやすく、航空障害灯に
課せられた規制、即ち水平方向は全周で、上下方向は下
向き15゜から真上までの範囲に適合する配光を行え、
規定光度の上向き7.5゜にも容易に対応可能である。
この場合、基板2は円錐面形状に曲げて円錐筒部25に
取り付けられ、両者の間に充填物4が充填される。この
構造は、従来例に見られる幅の狭いLED基板が3ヶ所
でねじ止めされた構造に比して、剛性が高く、耐振性に
優れ、航空障害灯として要求される規定に適合した投光
角度を得られる。また、基板2の枚数が少なくなること
から、基板2の加工も容易となり、取り付けのボトルの
数が減る利点もある。
In FIG. 1, the substrate 2 has flexibility, and the supporting body 3 has a conical tube portion 25 in a part thereof, and supports the substrate 2 along the outer surface of the conical tube portion 25. In this case, the substrate 2
It is easy to wind around the outer periphery of the conical tube portion 25, and the regulation imposed on the aviation obstruction light, that is, the horizontal direction is the entire circumference, and the vertical direction can perform a light distribution suitable for the range from 15 ° downward to directly above,
It can easily cope with an upward direction of 7.5 ゜ of the specified luminous intensity.
In this case, the substrate 2 is bent into a conical surface shape and attached to the conical cylindrical portion 25, and the filler 4 is filled between the two. This structure is higher in rigidity and superior in vibration resistance than the structure in which a narrow LED board is screwed at three places as seen in the conventional example. You get the angle. Further, since the number of substrates 2 is reduced, the processing of the substrates 2 is facilitated, and there is an advantage that the number of bottles to be mounted is reduced.

【0022】図4で、基板2は可撓性を有し、支持本体
3は一部に円筒部26を有し、この円筒部26の外面に
沿って基板2を支持している。こうすると、前記と同様
に、可撓性の基板2は円筒部26の外周に巻き付けやす
い。この場合、基板2は円筒面形状に曲げて円筒部26
に取り付けられ、両者の間に充填物4が充填される。こ
の構造は、従来例に見られる幅の狭いLED基板が3ヶ
所でねじ止めされた構造に比して、剛性が高く、耐振性
に優れている。また、基板2の枚数が少なくなることか
ら、基板2の加工も容易となり、取り付けのボトルの数
が減る利点もある。
In FIG. 4, the substrate 2 has flexibility, the support body 3 has a cylindrical portion 26 in a part, and supports the substrate 2 along the outer surface of the cylindrical portion 26. In this case, the flexible substrate 2 can be easily wound around the outer periphery of the cylindrical portion 26 as described above. In this case, the substrate 2 is bent into a cylindrical surface shape and the cylindrical portion 26 is formed.
And the filler 4 is filled between the two. This structure is higher in rigidity and excellent in vibration resistance than a structure in which a narrow LED board is screwed at three places as in the conventional example. Further, since the number of substrates 2 is reduced, the processing of the substrates 2 is facilitated, and there is an advantage that the number of bottles to be mounted is reduced.

【0023】支持本体3と基板2の間に互いに間隔を保
ってスペーサー27が配設され、これらのスペーサー2
7を除いた支持本体3と基板2の間に充填物4が充填さ
れている。こうすると、可撓性の基板2の場合でも支持
本体3と基板2の間に充填物4で塞がれるべき隙間を確
保できる。図2では水平角で40゜間隔配置の場合を示
したが、この角度は適当に決められる。これれらのスペ
ーサー27はLED1の列の間に接着して取り付けられ
ており、これによってスペーサー27がLED1のリー
ド部6の半田10に接触して隙間が不斉になるのを避け
ている。
A spacer 27 is provided between the support body 3 and the substrate 2 at a distance from each other.
The filler 4 is filled between the support body 3 and the substrate 2 excluding 7. In this way, even in the case of the flexible substrate 2, a gap to be closed by the filler 4 can be secured between the support body 3 and the substrate 2. Although FIG. 2 shows the case where the horizontal angles are arranged at intervals of 40 °, this angle is appropriately determined. These spacers 27 are adhered and attached between the rows of the LEDs 1, thereby preventing the spacers 27 from contacting the solders 10 of the lead portions 6 of the LEDs 1 and making the gaps asymmetric.

【0024】図5及び6は扁平型の灯器に本発明を適用
した例を示してある。支持本体3は一面に開口28を有
する箱形で他面に段面29を残して凹部30を有し、基
板2は裏面8でこの凹部30を覆って段面29に取り付
けられ、開口28をグローブ5が覆っている。こうする
と、基板2は可撓性のものでも、剛性のものでも採用で
きる。光は一方向へ放射されることになり、工業製品の
検査や識別等に使用する照明灯に適する。また、同様の
構造で多数のLED1を使用し、LED1を個別に点滅
できる制御回路を付加して文字や記号を表示させること
により、通路案内その他の表示灯や標識灯とする場合に
も適用できる。
FIGS. 5 and 6 show examples in which the present invention is applied to a flat lamp. The support body 3 has a box shape having an opening 28 on one surface, and has a concave portion 30 on the other surface while leaving a step surface 29. Glove 5 is covering. In this case, the substrate 2 may be flexible or rigid. Light is emitted in one direction, which is suitable for an illumination lamp used for inspection and identification of industrial products. Further, by using a large number of LEDs 1 with the same structure and adding a control circuit capable of individually blinking the LEDs 1 to display characters and symbols, the present invention can also be applied to a case where the display is used as a passage guide or other indicator lamps or marker lamps. .

【0025】充填物4はシリコンゴムと硬化剤を混合し
たものから成っている。こうすると、LED1を取り付
けたプリント基板2と支持本体3の間の隙間11にこの
充填材4を注入して硬化させることにより、ほぼ完全に
空気が排出され、この充填材4によりプリント基板2と
支持本体3の間の熱伝達が格段に向上する。また、LE
Dのリード部先端と金属製の支持本体が空間を保って近
接している場合に起こり得る放電も、この充填材があれ
ば抑制される。
The filling 4 is made of a mixture of silicone rubber and a curing agent. In this way, the filler 4 is injected into the gap 11 between the printed board 2 on which the LED 1 is mounted and the support body 3 and hardened, whereby air is almost completely exhausted. The heat transfer between the support bodies 3 is significantly improved. Also, LE
The discharge, which can occur when the tip of the lead portion of D and the metal supporting body are close to each other while maintaining a space, is suppressed by the filler.

【0026】[0026]

【発明の効果】本発明によれば、LEDを取り付ける基
板が、支持本体との間に電気絶縁性でかつ伝熱性の充填
物を介してこの支持本体に支持されており、この支持本
体がその一部で灯体やグローブに密接しているので、L
EDの発する熱をこの充填物及び支持本体を介して灯体
やグローブから効果的に放熱でき、LED内部の温度上
昇を防げるので発光効率が向上し、灯器の放射光度を高
めることができる。
According to the present invention, the substrate on which the LED is mounted is supported by the supporting body via an electrically insulating and heat-conductive filler between the supporting body and the supporting body. Because it is close to the lighting fixtures and gloves in part,
The heat generated by the ED can be effectively radiated from the lamp body or the globe through the filler and the support body, and the temperature inside the LED can be prevented from rising, so that the luminous efficiency is improved and the luminous intensity of the lamp can be increased.

【0027】請求項2によれば、請求項2の場合と同様
に基板を円錐筒部の外周に巻き付けやすく、航空障害灯
に課せられた規制、即ち水平方向は全周で、上下方向は
下向き15゜から真上までの範囲に適合する配光を行
え、規定光度の上向き7.5゜にも容易に対応可能であ
る。
According to the second aspect, similarly to the second aspect, the substrate is easily wound around the outer periphery of the conical cylindrical portion, and the regulation imposed on the aviation obstruction light, that is, the horizontal direction is the entire circumference, and the vertical direction is downward. Light distribution suitable for a range from 15 ° to directly above can be performed, and it is possible to easily cope with an upward direction of 7.5 ° of the specified luminous intensity.

【0028】請求項3によれば、可撓性の基板は円筒部
の外周に巻き付けやすく、水平方向の全周に均等に投光
することができる。
According to the third aspect, the flexible substrate can be easily wound around the outer periphery of the cylindrical portion, and can uniformly project light over the entire circumference in the horizontal direction.

【0029】請求項4によれば、剛性の基板の場合は勿
論、可撓性の基板の場合でも、スペサーを除いた基盤と
支持本体との間に充填物を充填できる。
According to the fourth aspect, the filler can be filled between the base and the support body excluding the spacer, not only in the case of a rigid substrate but also in the case of a flexible substrate.

【0030】請求項5によれば、光は一方向へ放射され
るので、工業製品の検査や識別等に使用する照明灯に適
用でき、同様の構造で多数のLEDを使用し、LEDを
個別に点滅できる制御回路を付加して文字や記号を表示
させることにより、通路案内その他の表示灯や標識灯に
も適用できる。
According to the fifth aspect, since the light is emitted in one direction, it can be applied to an illuminating lamp used for inspection and identification of industrial products, etc. By adding a control circuit capable of blinking to display characters and symbols, the present invention can also be applied to guide lights and other indicator lights and sign lights.

【0031】請求項6によれば、基板と支持本体の間の
熱伝達が格段に向上するので、LEDの温度上昇を防い
で放射光度を高くでき、また、LEDのリード部先端と
金属製の支持本体が近接している場合に起こり得る放電
も抑制できる。
According to the sixth aspect, the heat transfer between the substrate and the supporting body is remarkably improved, so that the temperature of the LED can be prevented from rising and the radiant intensity can be increased. Discharge that can occur when the support main body is close can also be suppressed.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る発光ダイオード灯器の放熱構造の
具体例を適用した航空障害灯の左半部を断面で示す正面
図である。
FIG. 1 is a front view showing, in cross section, a left half portion of an aviation obstacle lamp to which a specific example of a heat radiation structure of a light emitting diode lamp according to the present invention is applied.

【図2】図1の平面図である。FIG. 2 is a plan view of FIG.

【図3】図1の底面図である。FIG. 3 is a bottom view of FIG. 1;

【図4】図1の変形で、支持本体3が円筒部26を有す
るものの場合の部分断面図である。
FIG. 4 is a partial cross-sectional view of a modification of FIG. 1, in which the support main body 3 has a cylindrical portion 26;

【図5】扁平型灯器の場合を示す正面図である。FIG. 5 is a front view showing a case of a flat lamp.

【図6】図5の6−6線断面図である。FIG. 6 is a sectional view taken along line 6-6 in FIG. 5;

【符号の説明】 1 LED(発光ダイオード) 2 基板 3 支持本体 4 充填物 5 グローブ 6 リード部 7 穴 8 裏面 9 パターン 10 半田 11 放熱面[Description of Signs] 1 LED (Light Emitting Diode) 2 Substrate 3 Supporting Body 4 Filler 5 Globe 6 Lead 7 Hole 8 Back 9 Pattern 10 Solder 11 Heat Dissipation Surface

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 3K014 AA01 LA01 LB04 5C083 BB10 BB28 DD02 DD06 DD10 JJ30 5F041 AA33 DB01 DC07 DC23 DC66 DC78 DC84 FF16  ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 3K014 AA01 LA01 LB04 5C083 BB10 BB28 DD02 DD06 DD10 JJ30 5F041 AA33 DB01 DC07 DC23 DC66 DC78 DC84 FF16

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 発光ダイオード(1)、基板(2)、支持本体
(3)、充填物(4)及びグローブ(5)を有しており、該発光
ダイオード(1)は、そのリード部(6)が該基板(2)の穴(7)
に挿通されかつ該基板(2)の裏面(8)の通電用のパターン
(9)に半田(10)で固定することにより、該基板(2)に取り
付けられており、該支持本体(3)は熱の良導体で構成さ
れ、該リード部(6)及び該半田(10)との間に熱伝導性か
つ非電気伝導性の該充填物(4)を介して該基板(2)を支持
し、そのフランジ部(11)は灯体(12)に取り付けられかつ
該グローブ(5)を支持して放熱面(13)を形成しており、 該グローブ(5)は該発光ダイオード(1)を覆っていること
を特徴とする発光ダイオード灯器の放熱構造。
1. Light emitting diode (1), substrate (2), support body
(3), a filler (4) and a globe (5), and the light emitting diode (1) has a lead (6) with a hole (7) in the substrate (2).
And a pattern for energizing the back surface (8) of the substrate (2)
(9) is fixed to the substrate (2) by fixing with solder (10), the support body (3) is made of a good heat conductor, and the lead portion (6) and the solder (10) are fixed. ), The substrate (2) is supported via the thermally and electrically non-conductive filler (4), and the flange (11) is attached to the lamp body (12) and the globe is supported. A heat dissipation structure for a light emitting diode lamp, wherein the heat dissipation surface (13) is formed by supporting the light emitting diode (1), and the globe (5) covers the light emitting diode (1).
【請求項2】 該基板(2)は可撓性を有し、該支持本体
(3)は一部に円錐筒部(25)を有し、該円錐筒部(25)の外
面に沿って該基板(2)を支持している請求項1に記載の
発光ダイオード灯器の放熱構造。
2. The substrate (2) is flexible, and the support body is
The light emitting diode lamp according to claim 1, wherein (3) partially has a conical tube portion (25) and supports the substrate (2) along an outer surface of the conical tube portion (25). Heat dissipation structure.
【請求項3】 該基板(2)は可撓性を有し、該支持本体
(3)は一部に円筒部(26)を有し、該円筒部(26)の外面に
沿って該基板(2)を支持している請求項1に記載の発光
ダイオード灯器の放熱構造。
3. The support body has flexibility, and the support body is flexible.
3. The heat dissipation structure of a light emitting diode lamp according to claim 1, wherein (3) has a cylindrical portion (26) in part and supports the substrate (2) along an outer surface of the cylindrical portion (26). .
【請求項4】 該支持本体(3)と該基板(2)の間に互いに
間隔を保ってスペーサー(27)が配設され、該スペーサー
(27)を除いた該支持本体(3)と該基板(2)の間に該充填物
(4)が充填されている請求項1,2又は3に記載の発光
ダイオード灯器の放熱構造。
4. A spacer (27) is provided between the support body (3) and the substrate (2) at a distance from each other.
The filler between the support body (3) and the substrate (2) except for (27)
The heat dissipation structure of a light emitting diode lamp according to claim 1, wherein (4) is filled.
【請求項5】 該支持本体(3)は一面に開口(28)を有す
る箱形で他面に段面(29)を残して凹部(30)を有し、該基
板(2)は該裏面(8)で該凹部(30)を覆って該段面(29)に取
り付けられ、該開口(28)を該グローブ(5)が覆っている
請求項1に記載の発光ダイオード灯器の放熱構造。
5. The support body (3) is box-shaped with an opening (28) on one surface and has a recess (30) on the other surface leaving a step surface (29), and the substrate (2) is provided on the back surface. The heat dissipation structure of a light-emitting diode lamp according to claim 1, wherein the recess (30) is covered with the step (29) and the step (29) is attached to the step surface (29), and the opening (28) is covered by the globe (5). .
【請求項6】 該充填物(4)はシリコンゴムと硬化剤を
混合したものから成っている請求項1に記載の発光ダイ
オード灯器の放熱構造。
6. The heat radiating structure for a light emitting diode lamp according to claim 1, wherein said filler (4) is made of a mixture of silicone rubber and a curing agent.
JP10320386A 1998-11-11 1998-11-11 Heat radiation structure for light emitting diode lamp Pending JP2000149151A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10320386A JP2000149151A (en) 1998-11-11 1998-11-11 Heat radiation structure for light emitting diode lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10320386A JP2000149151A (en) 1998-11-11 1998-11-11 Heat radiation structure for light emitting diode lamp

Publications (1)

Publication Number Publication Date
JP2000149151A true JP2000149151A (en) 2000-05-30

Family

ID=18120899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10320386A Pending JP2000149151A (en) 1998-11-11 1998-11-11 Heat radiation structure for light emitting diode lamp

Country Status (1)

Country Link
JP (1) JP2000149151A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004039594A (en) * 2002-07-08 2004-02-05 Seiwa Electric Mfg Co Ltd Luminaire using light emitting diode element
JP2005197006A (en) * 2003-12-26 2005-07-21 Toki Corporation Kk Case for light emission unit and manufacturing method of light emission unit
JP2010129915A (en) * 2008-11-28 2010-06-10 Panasonic Electric Works Co Ltd Shell type led mounted substrate
JP2012104860A (en) * 2012-02-13 2012-05-31 Panasonic Corp Led lighting device
US8272762B2 (en) 2010-09-28 2012-09-25 Lighting Science Group Corporation LED luminaire

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004039594A (en) * 2002-07-08 2004-02-05 Seiwa Electric Mfg Co Ltd Luminaire using light emitting diode element
JP2005197006A (en) * 2003-12-26 2005-07-21 Toki Corporation Kk Case for light emission unit and manufacturing method of light emission unit
JP2010129915A (en) * 2008-11-28 2010-06-10 Panasonic Electric Works Co Ltd Shell type led mounted substrate
US8272762B2 (en) 2010-09-28 2012-09-25 Lighting Science Group Corporation LED luminaire
JP2012104860A (en) * 2012-02-13 2012-05-31 Panasonic Corp Led lighting device

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