JP2000141497A - Three-dimensionally wiring apparatus and method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily three-dimensionally wire an optical device such as a semiconductor diode, an optical waveguide device or the like by forming the waveguiding by a stereo lithography. SOLUTION: The three-dimensionally wiring method comprises the steps of fixedly disposing a printed board placing optical devices at predetermined positions of an elevation table 3, forming an optical waveguide 15 for connecting the devices of photosetting resin 2 for wirings by a stereo lithography, and molding to embrace the waveguide 15 and the devices with a molding resin 18 having a lower refractive index than that of the resin 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a three-dimensional wiring device utilizing a stereolithography technique and a method therefor.

[0002]

2. Description of the Related Art A conventional apparatus of this kind is disclosed in
No. 305672.

[0003] As shown in FIG.
An elevation table 22 driven by an elevation control device 21 is horizontally arranged in a photo-curable resin 20 in 9, and
A projector 23 to irradiate a light beam toward the liquid surface of the photocurable resin 20 is provided.
The movement control device 24 controls the movement in the XY direction in the horizontal plane.

The projector 23 has an optical filter 25
UV laser light is supplied from the UV laser device 26 via the. The optical filter 25 adjusts the output of the UV laser device 26. The elevation control device 2
1. The operations of the movement control device 24 and the optical filter 25 are controlled by a control computer 27.

In the above apparatus, contour data is created by slicing the shape data of a three-dimensional object designed by the CAD system, and the contour data is supplied to the control computer 27. (Approximately 0.05 to 0.3 mm) in the resin tank 19 and the ultraviolet laser beam from the projector 23 is irradiated with the photocurable resin 28 on the elevating table 22.
Is scanned in the X-Y direction according to the contour data.

As a result, the lowered resin tanks are sequentially deposited on the elevating table 22 in a shape corresponding to the contour data, and finally a three-dimensional structure having a predetermined shape is formed.

[0007]

Generally, an optical device such as a semiconductor diode or an optical waveguide device is generally coupled using an optical element such as a connection by an optical fiber or a lens. Therefore, in order to perform three-dimensional wiring, a complicated connection arrangement is required, and the connection work is very troublesome.

Further, the connecting portion has a low mechanical strength and requires a structure in which no force is applied to the connecting portion even if the connecting portion is pulled by a strong force. Further, depending on the surrounding environment, the surrounding humidity is high, and the connecting portion has a high moisture absorption. There is a possibility that the light transmission is changed and the information transmission efficiency is deteriorated.

The present invention has been made to solve such a problem.

[0010]

According to the present invention, there is provided a table for arranging and fixing devices at predetermined positions, and a resin tank in which the table is provided to store a light-transmitting wiring photocurable resin. And, a table up and down moving unit that vertically moves the table in the resin tank, and a light irradiation unit that irradiates a specific position on the upper surface of the resin tank with light to cure the resin in the resin tank, A light irradiation unit moving unit for moving the light irradiation unit in the horizontal direction, and controlling the driving of the table vertical moving unit and the light irradiation unit moving unit to move the light irradiation unit to a specific position on the surface of the resin tank from the light irradiation unit. A molding control unit for irradiating light to form a wiring path coupled to the device; and a molding resin having a lower refractive index than the wiring path formed by the molding control unit and the light-curing resin for wiring in the resin tank. Mold and cure And Rudo section, that it consists characterized.

A first step of arranging and fixing the device at a predetermined position on the table; and a second step of moving the table in a vertical direction and a horizontal direction to optically mold a wiring path between the devices with a photocurable resin for wiring. And a third step of molding and curing the wiring path and the device formed in the second step with a mold resin having a lower refractive index than the wiring photocurable resin in the resin tank. .

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below. In this embodiment, an optical device such as a semiconductor laser, a semiconductor diode, or an optoelectronic device is connected by an optical waveguide formed by stereolithography instead of being connected by an optical fiber or the like.

In FIG. 1, reference numeral 1 denotes a resin storage tank for storing a photocurable resin 2 having a high light transmission property; 3, an elevating table on which a circuit section 4 is mounted; and 5, an elevating control device for vertically moving the elevating table. , 6 are projectors that irradiate a light beam toward the liquid surface of the photo-curable resin 2 to form the optical waveguide 15, and 7 is that the projector 6 is moved in the resin storage tank 1 through XY.
A movement control device 8 for moving in a direction (within a horizontal plane) is a UV laser device for supplying an ultraviolet laser beam to the projector 6 via an optical filter 9.

A control computer 10 controls the operations of the elevation control device 5, the movement control device 7, and the optical filter 9.

As shown in FIG. 2, the circuit section 4 includes a printed board 11 mounted and fixed on the elevating table 3, an optical device 12 and an input / output terminal 13 bonded or soldered to the printed board 11. It is composed of

Reference numeral 14 denotes a cleaning tank in which a cleaning liquid 16 for cleaning the circuit portion 4 to wash and remove excess resin on the printed circuit board 11 after forming the optical waveguide 15 in the resin storage tank 1 and 17 for cleaning. This is a shield tank for storing the printed circuit board 11 washed in the tank 14 and pouring and enclosing a resin 18 having a lower refractive index than the optical waveguide 15 so as to cover the optical device 12 and the optical waveguide 15 on the printed circuit board 11.

The elevation control device 5 includes the resin storage tank 1.
In addition to moving the elevating table 3 up and down, the circuit unit 4 is immersed in the cleaning liquid 16 by moving it to the cleaning tank 14, or is moved to the shield tank 17 to insert the printed circuit board 11 into the tank 17. Also performs actions.

The operation of the above configuration will be described with reference to FIG.

First, in step S1, the printed circuit board 11 is placed on the lifting table 3 and fixed as shown in FIG. In step S2, the elevating table 3 on which the printed circuit board 11 is placed is moved into the resin storage tank 1, and the elevating table 3 is moved.
Then, the circuit section 4 is submerged in the photocurable resin 2 and the process proceeds to the next step.

In step S3, a light beam is irradiated from the projector 6 to a desired position on the resin surface to cure the resin, and the optical waveguide 15 is placed on the optical device 12 and the input / output terminal 13.
Modeling. At this time, the elevation control device 5 lowers the circuit section 4 stepwise downward for each formed layer. At this time, the optical waveguide 15 to be formed is provided between the optical devices 12 and the input / output terminals 13 so as to couple the respective elements, as shown in FIG. 4, for example.

In step S4, when the optical shaping in step S3 is completed, the elevation controller 5 removes the elevation table 3 from the resin storage tank 1, moves it into the cleaning tank 14, and places the circuit section 4 in the cleaning liquid 16. Sink and move to the next step.

In step S5, the unnecessary photo-curable resin 2a on the printed circuit board 11 is removed in the cleaning tank 14 for cleaning. When the elevating table 3 is taken out of the resin storage tank 1 on the printed circuit board 11, as shown in FIG. 5, an unnecessary and unhardened photocurable resin 2a is often loaded. In this step, unnecessary resin is removed from the printed circuit board 11 by a method such as being immersed in the cleaning liquid 16 for a certain period of time. Note that the cleaning liquid 16 may be stirred to enhance the cleaning effect.

In step S6, when the cleaning in step S5 is completed, the lifting control device 5 raises the lifting table 3, takes out the circuit section 4 from the cleaning liquid 16, and removes the shield tank 1.
Move to 7. At this time, the printed circuit board 11 is removed from the elevating table 3 automatically or by an operator and stored in the shield tank 17.

In step S7, the molding resin 18 is poured from above the printed circuit board 11 housed in the shield tank 17, and the optical device 12 and the optical waveguide 15 on the printed circuit board 11 are wrapped and shielded.

This shield can increase the mechanical strength of the optical waveguide 15 and protect the joint between the optical waveguide 15 and the optical device 12 from the influence of the surrounding environment such as moisture absorption.

In step S8, the molding resin 18 shielded in step S7 is cured as shown in FIG. In step S9, the printed circuit board 11 that has been shielded from the shield tank 17 is automatically or automatically taken out by the operator from the shield tank 17, and the three-dimensional wiring operation is completed. As described above, complicated three-dimensional wiring such as an optical device can be easily performed by using the optical molding technology. In the above-described embodiment, the moving from the resin storage tank 1 to the cleaning tank 14 and the shield tank 17 is performed by the lifting / lowering control device 5, but may be performed by a worker.

[0027]

According to the present invention, by forming an optical waveguide by stereolithography, three-dimensional wiring of an optical device such as a semiconductor diode or an optical waveguide device can be easily performed.
In addition, by using a resin mold, the mechanical strength of the joint between the optical waveguide and the optical device can be improved, and the influence from the surrounding environment can be suppressed.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing an embodiment of the present invention.

FIG. 2 is an enlarged perspective view of a model before the optical waveguide in FIG. 1 is formed by optical shaping.

FIG. 3 is a diagram showing an operation flowchart of FIG. 1;

FIG. 4 is a view showing a printed circuit board immediately after optical molding of an optical waveguide.

FIG. 5 is a diagram showing that unnecessary photocurable resin is present on a printed circuit board.

FIG. 6 is a view showing a molded article shielded by molding resin.

FIG. 7 is a schematic view of a conventional stereolithography apparatus.

[Description of Signs] 1 Resin storage tank 3 Elevating table 4 Circuit section 5 Elevation control device 6 Projector 7 Movement control device 14 Cleaning tank 17 Shield tank 18 Mold resin

Claims (2)

[Claims] 1. A table for arranging and fixing a device at a predetermined position, a resin tank in which the table is provided, and a light-curable resin for wiring having a light transmitting property, and a table in the resin tank. A table up / down moving unit for vertically moving the table, a light irradiation unit for irradiating a specific position on the resin tank upper surface with light to cure the resin in the resin tank, and moving the light irradiation unit horizontally. A light irradiation unit moving unit, coupled to the device by controlling the driving of the table vertical moving unit and the light irradiation unit moving unit to irradiate light from the light irradiation unit to a specific position on the surface of the resin tank. A molding control unit that forms a wiring path, and a molding unit that molds and cures the wiring path and the device formed by the molding control unit with a mold resin having a lower refractive index than the photocurable resin for wiring in the resin tank. It is characterized by becoming Three-dimensional wiring device. 2. A first step of arranging and fixing a device at a predetermined position on a table, and a second step of moving the table in a vertical direction and a horizontal direction to stereolithically form a wiring path between the devices with a photocurable resin for wiring. And a third step of molding and curing the wiring path and the device formed in the second step with a mold resin having a lower refractive index than the wiring photocurable resin in the resin tank. Three-dimensional wiring method.