JP2000138176A - Vertical heat treatment equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vertical heat treatment equipment high in repeatability of measurement without being affected by the atmosphere at the time of measuring actual temperatures within a furnace and causing problems on particles for a treated body. SOLUTION: When temperatures are measured in an oxidizing and diffusing device, a support plate 19 is lifted up and down by a temperature measuring elevator 20. At this time, after the temperature is stabilized, results are recorded by a temperature profiler 22. As described above, as the temperature can be measured in a state that a back door 17 is closed, it is not affected by the atmosphere surrounding the device and the temperature with a furnace can be monitored almost in an atmosphere under production. In this case, if a temperature detection member 18 is moved, a positioning guide monitors to cause no positional shift to the detection member 18, thereby improving measuring precision with respect to a process.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a vertical heat treatment apparatus such as an oxidation / diffusion apparatus having a vertical structure and an LP-CVD (low pressure CVD) apparatus.

[0002]

2. Description of the Related Art As the diameter of an object to be processed such as a semiconductor wafer is increased, semiconductor processing equipment is shifting to a branch and leaf processing method. On the other hand, a tube (furnace) type such as an oxidation / diffusion apparatus and an LP-CVD apparatus employs a batch type mass processing method. This batch type mass processing system has processing capacity,
This is a process that will have an advantage in the future in terms of quality stability and cost.

On the other hand, the batch-type mass processing method has a disadvantage that the characteristics of the semiconductor device are differently affected within the same processing batch due to the variation in the temperature distribution inside the furnace. Hereinafter, the problem will be described.

FIG. 6 is a front view showing the basic structure of a conventional vertical heat treatment apparatus. In the figure, reference numeral 61 denotes a device main body having a substantially rectangular parallelepiped shape. The apparatus main body 61 is divided into two regions, and a processing chamber 62 for processing an object to be processed such as a semiconductor wafer (hereinafter abbreviated as a wafer) is provided in an upper region.
Is provided. The processing chamber 62 has a cylindrical shape whose lower part is open. In the processing chamber 62, a wafer boat 63, which is a support means for supporting the main surfaces of a plurality of wafers substantially horizontally at predetermined intervals, and a heat retaining cylinder 64 for holding the temperature of the wafer boat 63, are accommodated. It has become.

The heat retaining cylinder 64 is mounted on a heat retaining cylinder base 65, and the heat retaining cylinder base 65 closes an opening of the processing chamber 62, so that the wafer boat 63 and the heat retaining cylinder are placed in the processing chamber 62. 64 is sealed.
The heat-retaining cylinder base 65 can be moved up and down by an elevator 66 which is an elevating means provided in a lower region of the apparatus main body 61. Reference numeral 67 in the figure denotes a back door for opening and closing a lower region of the apparatus main body 61.

In the vertical heat treatment apparatus having the above structure, when measuring the actual temperature in the processing chamber (measuring the soaking length of the wafer area on the boat), the back door 67 is opened, and the temperature is detected by the arm 69a of the measuring jig 69. One draw T / C68 as a means
, And the single draw T / C 68 is raised to the uppermost portion of the wafer boat 63 through the heat retaining cylinder 65. Then, after the temperature is stabilized, the single draw T / C 68 is lowered and recording is performed by the temperature profiler 70.

[0007]

In the conventional vertical heat treatment apparatus, the measurement is performed by opening the back door 67 at the time of actual furnace temperature measurement, so that accurate temperature measurement is difficult due to the influence of the atmosphere. Further, the air is easily entangled with the air, and the temperature is lowered particularly in the lower part of the processing chamber. Furthermore, dust may adhere to an object to be processed or a structural member when entrained in the atmosphere,
There is a problem that the object becomes particles due to contamination. Further, since the single T / C 68 is attached to the measuring jig 69 at the time of measuring the actual furnace temperature, the reproducibility of the result is low depending on the setting method.

The present invention has been made in view of the above points, and is not affected by the atmosphere at the time of actual temperature measurement in a furnace, has no problem with particles to be processed, and has high reproducibility of measurement. It is an object to provide a mold heat treatment apparatus.

[0009]

Means for Solving the Problems In order to solve the above problems, the present invention has taken the following means. The vertical heat treatment apparatus of the present invention is a vertical heat treatment apparatus that performs a batch-type heat treatment on a plurality of processing objects, a process that accommodates a plurality of processing objects and performs a heat treatment on the processing objects. An apparatus body having a chamber, and support means for supporting the plurality of objects in the processing chamber in a state where the main surface is substantially horizontal at a predetermined interval,
Temperature detection means for detecting a temperature in the processing chamber,
A movable unit that is installed in the apparatus main body and moves the temperature detection unit in a vertical direction at least over a region where the plurality of objects to be processed are present in the processing chamber. It is characterized in that the temperature in the processing chamber can be measured without being inserted.

According to this structure, since the movable means for moving the temperature detecting means in the vertical direction at least over the region where the plurality of objects to be processed are present in the processing chamber is provided in the apparatus main body, the outside air is introduced into the apparatus main body. It is possible to measure the temperature inside the processing chamber without inserting. Thereby, accurate temperature measurement can be performed without being affected by the atmosphere at the time of actual furnace temperature measurement.

In the vertical heat treatment apparatus according to the present invention, it is preferable that the temperature detecting means includes a temperature detecting member for detecting a temperature, and a long support rod for supporting the temperature detecting portion.

In the vertical heat treatment apparatus of the present invention, it is preferable that the vertical heat treatment apparatus is provided with guide means for specifying a position in the apparatus main body at which the support rod is vertically movable. Thereby, the temperature detecting means can be moved up and down at a fixed position, so that the reproducibility of the temperature measurement is improved.

In the vertical heat treatment apparatus of the present invention, it is preferable that the temperature detecting member is a striated body, and that the temperature detecting member is provided in the apparatus main body and includes a storage member for winding / sending the striated body. .

According to this configuration, the striated body can be allowed to be bent, and the striated body can be prevented from spreading to the apparatus body. In addition, since the striated body is wound up and stored, damage to the striated body can be prevented.

[0015]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. (Embodiment 1) FIG. 1 is a perspective view showing a schematic configuration of a vertical heat treatment apparatus of the present invention. Here, a case where the vertical heat treatment apparatus is an oxidation / diffusion apparatus will be described.

The oxidation / diffusion apparatus includes a cassette storage section 1 (cassette station) containing wafers, a cassette transport section 2 for unloading a cassette from the storage section 1 and loading the cassette into the storage section 1, The apparatus includes a wafer transfer machine 3 for transferring wafers, a furnace unit 4 as a processing chamber, a boat unit 5 for mounting wafers, and a cap unit 6 for closing the furnace unit 4.

In the oxidation / diffusion apparatus having the above-described structure, the wafer in the cassette is transferred to the boat unit 5. The boat on which the wafers are mounted rises for each lower cap portion 6 and is inserted into the furnace body portion 4. The cap 6 serves as a shutter at the lower part of the furnace and forms a reaction chamber. Thereafter, a reaction gas is introduced from the upper part of the furnace, and after performing desired processing on the wafer, the processing gas is discharged out of the reaction chamber from the exhaust unit.

FIG. 2 is a front view showing the basic structure of the oxidation / diffusion device. In the figure, reference numeral 11 denotes an apparatus main body having a substantially rectangular parallelepiped shape. The apparatus main body 11 is divided into two regions, and an upper region includes a processing chamber 1 for processing a wafer.
2 are provided. The processing chamber 12 has a cylindrical shape whose lower part is open. The processing chamber 12 accommodates a wafer boat 13 which is a support means for supporting the main surfaces of a plurality of wafers substantially horizontally at predetermined intervals and a heat retaining cylinder 14 for holding the temperature of the wafer boat 13. It has become.

The heat-insulating cylinder 14 is mounted on a heat-insulating cylinder base 15. The heat-insulating cylinder base 15 closes the opening of the processing chamber 12, so that the wafer boat 13 and the heat-insulating cylinder are placed in the processing chamber 12. 14 is sealed.
The heat retaining cylinder base 15 can be raised and lowered by an elevator 16 which is a lifting means provided in a lower region of the apparatus main body 11. Reference numeral 17 in the figure denotes a back door for opening and closing a lower region of the apparatus main body 11.

A temperature measuring elevator 20 is mounted in a lower region of the apparatus main body 11. The temperature measuring elevator 20 has a support plate 19 extending substantially horizontally so as to support the temperature detecting member 18. Up and down. The temperature detecting member 18 includes a support rod and a thermocouple 21 inserted in the support rod. One end of the thermocouple 21 is exposed in the measurement region, and the other end is connected to a temperature profiler 22 outside the apparatus main body 11.

The support rod of the temperature detecting member 18 extends from the apparatus main body 11 and is guided by a positioning guide 23 having a hole. That is, the support rod is guided by inserting the support rod into the hole of the positioning guide. Thereby, since the temperature detecting member can be moved up and down at a fixed position, adjustment at the time of setting the temperature detecting member becomes unnecessary, and the insertion angle of the temperature detecting member into the furnace can be kept constant, Temperature monitoring with high reproducibility becomes possible.

As shown in FIG. 3, the positioning guide 23 is provided with a coating layer 23a made of a material such as quartz, Teflon or the like at a contact portion with the support rod. Thus, generation of particles from between the support rod and the positioning guide can be prevented, and contamination of the wafer can be prevented.

When the temperature is measured in the oxidation / diffusion apparatus having the above configuration, the temperature measuring elevator 20 is used.
Is performed by raising and lowering the support plate 19. At this time, after the temperature is stabilized, the result is recorded by the temperature profiler 22. As described above, since the temperature can be measured with the back door 17 closed, the furnace temperature can be monitored in a state close to the time of production without being affected by the atmosphere around the apparatus. In this case, since the position of the movable temperature detecting member 18 does not fluctuate due to the guide, it is possible to improve the measurement accuracy for the process.

(Embodiment 2) FIG. 4 is a front view showing a configuration of an oxidation / diffusion apparatus according to Embodiment 2 of the present invention. 4, the same parts as those in FIG. 2 are denoted by the same reference numerals, and detailed description thereof will be omitted.

The oxidation / diffusion device in the present embodiment is
A thermocouple housing 31 is provided in a lower region of the apparatus main body 11. As shown in FIG. 5, the storage section 31 has a structure in which the winding member 33 is rotated by a motor (not shown). 21 has a function of sending and winding. In addition, 32 in FIG. 5 indicates a terminal portion.

When temperature measurement is performed in the oxidation / diffusion apparatus having the above-described configuration, the temperature measurement elevator 20 is used.
Is performed by raising and lowering the support plate 19. At this time, after the temperature is stabilized, the result is recorded by the temperature profiler 22. As described above, since the temperature can be measured with the back door 17 closed, the furnace temperature can be monitored in a state close to the time of production without being affected by the atmosphere around the apparatus. In this case, it is possible to improve the measurement accuracy for the process including the movement of the temperature detecting member 18.

Further, since the thermocouple housing portion having the rotatable winding member is provided, it is possible to allow the thermocouple, which is a striated body, to be bent, and to prevent the thermocouple from spreading to the apparatus main body. it can. Further, since the thermocouple is wound up and stored, damage to the thermocouple can be prevented.

The present invention is not limited to the first and second embodiments, but can be implemented with various modifications. For example,
The present invention can be implemented by appropriately combining the contents of Embodiments 1 and 2. Further, in the above embodiment, the case where the vertical heat treatment apparatus is an oxidation / diffusion apparatus has been described.
The present invention can be applied to other vertical heat treatment apparatuses such as a VD apparatus.

[0029]

As described above, in the vertical heat treatment apparatus of the present invention, the movable means for vertically moving the temperature detecting means at least over the region where a plurality of objects to be processed are present in the processing chamber is installed in the apparatus body. So, when measuring the actual temperature inside the furnace,
It is not affected by the atmosphere, has no particle problem with the object to be processed, and has high measurement reproducibility.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a schematic configuration of an oxidation / diffusion device of the present invention.

FIG. 2 is a front view showing a configuration of the oxidation / diffusion device according to Embodiment 1 of the present invention.

FIG. 3 is a plan view showing a guide portion of the oxidation / diffusion device shown in FIG. 2;

FIG. 4 is a front view showing a configuration of an oxidation / diffusion device according to Embodiment 2 of the present invention.

FIG. 5 is a view showing a storage section of the oxidation / diffusion device shown in FIG. 4;

FIG. 6 is a front view showing a basic structure of a conventional vertical heat treatment apparatus.

[Explanation of symbols]

11: apparatus main body, 12: processing chamber, 13: wafer boat,
Reference numeral 14: heat retaining cylinder, 15: heat retaining cylinder base, 16: elevator, 17: back door, 18: temperature detecting member, 19: support plate, 20: temperature measuring elevator, 21: thermocouple, 2
2: Temperature profiler, 23: Positioning guide, 23
a contact part, 31 thermocouple storage part, 32 terminal part, 33
... winding member.

Claims (4)

[Claims] 1. A vertical heat treatment apparatus for performing a batch-type heat treatment on a plurality of workpieces, comprising a processing chamber for accommodating the plurality of workpieces and performing a heat treatment on the workpieces. An apparatus body, support means for supporting the plurality of objects in the processing chamber in a state where the main surface is substantially horizontal at a predetermined interval, temperature detecting means for detecting a temperature in the processing chamber, Moving means for vertically moving the temperature detecting means over at least an area where the plurality of objects to be processed are present in the processing chamber; and introducing outside air into the apparatus main body. A vertical heat treatment apparatus characterized in that the temperature inside the processing chamber can be measured without the need. 2. The vertical type according to claim 1, wherein said temperature detecting means comprises a temperature detecting member for detecting a temperature, and a long supporting rod for supporting said temperature detecting portion. Heat treatment equipment. 3. The vertical heat treatment apparatus according to claim 2, further comprising guide means for specifying a position in the apparatus main body at which the support rod is vertically movable. 4. The apparatus according to claim 1, wherein the temperature detecting member is a striated body, and further includes a storage member provided in the apparatus main body and configured to take up / send the striated body. The vertical heat treatment apparatus according to claim 1.