JP2000138014A - Coaxial cable - Google Patents
Coaxial cableInfo
- Publication number
- JP2000138014A JP2000138014A JP10325973A JP32597398A JP2000138014A JP 2000138014 A JP2000138014 A JP 2000138014A JP 10325973 A JP10325973 A JP 10325973A JP 32597398 A JP32597398 A JP 32597398A JP 2000138014 A JP2000138014 A JP 2000138014A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- coaxial cable
- abs resin
- thickness
- insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Communication Cables (AREA)
- Insulated Conductors (AREA)
- Organic Insulating Materials (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、特に優れた高周波
特性が要求される計測機器、情報通信機器、情報処理機
器等の高周波部品の信号伝達線路として用いられる同軸
ケーブルに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coaxial cable used as a signal transmission line for high-frequency components such as measuring equipment, information communication equipment, and information processing equipment requiring particularly excellent high-frequency characteristics.
【0002】[0002]
【従来の技術】近年、計測機器、情報通信機器は増々小
型化され、それに伴い使用される同軸ケーブルも細径化
が要求されている。そこで、従来の金属編組層の代わり
に、金属メッキが付着しやすいよう絶縁体表面を化学処
理等の表面改質を施した上で、絶縁体表面に金属メッキ
層または金属蒸着層を設け、細径化を実現した同軸ケー
ブルが知られている(例えば、実開昭62−3311
7)。ところが、上記の例の様に、同軸ケーブルの絶縁
体として高周波特性に優れた低誘電損失のフッ素樹脂を
使った場合には、金属層が付着しにくく、金属層の膜厚
が不均等になったり、絶縁体と金属層の密着力が弱く耐
久性に劣るという品質上の問題があった。さらに、絶縁
体への密着性(付着性)を改善するとともに、端末むき
を容易にするため、絶縁体とメッキ層の間に絶縁体より
も無電解メッキが容易な樹脂を押出被覆あるいはテープ
巻した同軸ケーブルも知られている(例えば、特開平7
−272553)。しかし、この方法においても絶縁層
が厚くなるため細径化が困難であり、しかも、絶縁体と
は電気的特性の異なる無電解メッキが容易な樹脂を被覆
しているので、高周波特性に影響が出るという問題があ
る。2. Description of the Related Art In recent years, measuring equipment and information communication equipment have been increasingly miniaturized, and consequently, coaxial cables used have also been required to be reduced in diameter. Therefore, instead of the conventional metal braided layer, the surface of the insulator is subjected to surface modification such as chemical treatment so that metal plating is easily attached, and then a metal plating layer or a metal deposition layer is provided on the surface of the insulator. A coaxial cable having a reduced diameter is known (for example, Japanese Utility Model Application Laid-Open No. 62-3311).
7). However, when a low dielectric loss fluororesin having excellent high frequency characteristics is used as the insulator of the coaxial cable as in the above example, the metal layer is hard to adhere and the thickness of the metal layer becomes uneven. In addition, there is a quality problem that the adhesion between the insulator and the metal layer is weak and the durability is poor. Furthermore, in order to improve the adhesion (adhesion) to the insulator and to facilitate the peeling of the end, a resin, which is more easily electrolessly plated than the insulator, is extruded or taped between the insulator and the plating layer. A coaxial cable is also known (for example, see
-272553). However, even in this method, it is difficult to reduce the diameter because the thickness of the insulating layer is thick, and the high-frequency characteristics are not affected because the resin is coated with a resin that has different electrical characteristics from the insulator and is easily electrolessly plated. There is a problem of getting out.
【0003】[0003]
【発明が解決しようとする課題】本発明は、上記従来技
術の問題点を解消し、メッキの密着性に優れるととも
に、コンパクトで高周波特性に優れた同軸ケーブルを提
供することを課題とするものである。SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art and to provide a coaxial cable which is excellent in plating adhesion and compact and has excellent high frequency characteristics. is there.
【0004】[0004]
【課題を解決するための手段】本発明者等は、上記課題
を解決するために鋭意検討を重ねた結果、絶縁体の改質
面とメッキ層のいずれにも密着が良く、高周波特性に影
響を与えない薄い厚さのABS樹脂被膜層を絶縁体と無
電解メッキ層との間に設けることを着想し、本発明を完
成するに至った。The present inventors have conducted intensive studies to solve the above-mentioned problems, and as a result, they have good adhesion to both the modified surface of the insulator and the plating layer, and have an effect on high frequency characteristics. The present invention was completed with the idea of providing an ABS resin coating layer having a small thickness, which does not give the layer, between the insulator and the electroless plating layer.
【0005】即ち、本発明は、外径0.03mm以上の
単線または撚り線導体上に押出し被覆した肉厚0.03
5mm以上のフッ素樹脂からなる絶縁体、該絶縁体上に
塗布した膜厚0.05μm〜3μmのABS樹脂被膜
層、該ABS樹脂被膜層上に厚さ0.5μm〜5μmの
無電解金属メッキ層、該無電解金属メッキ層上に厚さ5
μm以上の電解金属メッキ層が設けられ、さらに、最外
層が保護被覆層で構成されていることを特徴とする同軸
ケーブルである。That is, the present invention relates to a method for extruding and coating a solid or stranded conductor having an outer diameter of 0.03 mm or more with a thickness of 0.03 mm.
An insulator made of a fluororesin having a thickness of 5 mm or more, an ABS resin coating layer having a thickness of 0.05 μm to 3 μm applied on the insulator, and an electroless metal plating layer having a thickness of 0.5 μm to 5 μm on the ABS resin coating layer A thickness of 5 mm on the electroless metal plating layer.
A coaxial cable characterized in that an electrolytic metal plating layer of at least μm is provided and the outermost layer is formed of a protective coating layer.
【0006】[0006]
【発明の実施の形態】以下、本発明を図面に基づいて詳
細に説明する。図1において、1は導体、2は絶縁体、
3はABS樹脂被膜層、4は無電解メッキ層、5は電解
メッキ層、6は保護被覆層である。導体1は、外径が
0.03mm以上の銀メッキスズ入り銅合金線、銅被鋼
線等の単線または撚り線の導体を用いる。絶縁体2とし
ては、四弗化エチレン樹脂(PTFE)、四弗化エチレ
ン−パーフロオロアルキルビニルエーテル共重合体樹脂
(PFA)、四弗化エチレン−六弗化プロピレン共重合
体樹脂(FEP)、四弗化エチレン−エチレン共重合体
樹脂(ETFE)等のフッ素樹脂から構成するが、フッ
素樹脂の中でも誘電損失が特に少ない四弗化エチレン−
六弗化プロピレン共重合体樹脂(FEP)が特に好まし
い。絶縁体2の肉厚は、0.035mm以上とする。次
に、絶縁体2の外周を金属ナトリウム−ナフタレン系、
あるいは金属ナトリウム−アンモニア系の化学的処理、
あるいはエキシマレーザ等による表面改質処理を施す。
さらに次に、上記の表面改質処理が施された絶縁体2の
外周に膜厚1μm〜3μmのABS樹脂被膜層3を施
す。被膜層3は、溶剤に溶解させたABS樹脂槽にディ
ッピングするか、あるいは塗布する等の方法により形成
させる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the drawings. In FIG. 1, 1 is a conductor, 2 is an insulator,
3 is an ABS resin coating layer, 4 is an electroless plating layer, 5 is an electrolytic plating layer, and 6 is a protective coating layer. As the conductor 1, a single or stranded conductor such as a silver-plated tin-containing copper alloy wire or a copper-coated steel wire having an outer diameter of 0.03 mm or more is used. Examples of the insulator 2 include: tetrafluoroethylene resin (PTFE), ethylene tetrafluoride-perfluoroalkyl vinyl ether copolymer resin (PFA), ethylene tetrafluoride-propylene hexafluoropropylene copolymer resin (FEP), It is made of fluororesin such as fluorinated ethylene-ethylene copolymer resin (ETFE).
Hexafluoropropylene copolymer resin (FEP) is particularly preferred. The thickness of the insulator 2 is 0.035 mm or more. Next, the outer periphery of the insulator 2 is made of metal sodium-naphthalene,
Or a chemical treatment of metal sodium-ammonia system,
Alternatively, the surface is modified by an excimer laser or the like.
Next, an ABS resin coating layer 3 having a film thickness of 1 μm to 3 μm is applied to the outer periphery of the insulator 2 that has been subjected to the above-mentioned surface modification treatment. The coating layer 3 is formed by a method such as dipping or coating in an ABS resin tank dissolved in a solvent.
【0007】ここで、ABS樹脂被覆層3は、膜厚が
0.05μm〜3μmと極く薄い被膜であり、表面改質
され、凹凸が形成された絶縁体表面に食い込み、このア
ンカー効果により絶縁体表面との強い密着が得られる。
さらに、ABS樹脂は次工程のメッキとも密着性が良い
ので、表面改質した絶縁体とメッキ層との間にこのAB
S樹脂被膜層を設けることにより、従来方法と比較し、
メッキの耐久性が格段に向上する。ここで、ABS樹脂
の被覆層3の膜厚が3μm以下と極く薄いので、高周波
特性には何ら影響を与えなく、優れた高周波特性が期待
できる。次に、ABS樹脂被膜層3の表面に無電解メッ
キを施す。無電解メッキ層4としては、厚さ0.5μm
〜5μmの銅メッキ層を設ける。さらに、無電解メッキ
層4の外周に電解メッキ層5を設ける。電解メッキ層5
としては、厚さ5μm〜30μmの銅メッキ層を設け
る。銅メッキの種類としては、シアン化銅メッキ、硫酸
銅メッキ等が有るが、本願発明では、延展性が良く曲げ
にも強い硫酸銅を選択した。最後に、電解メッキ層5の
外周に、厚さ0.02mm以上の保護被覆層6を設け
る。保護被覆層6としては、PVC、ポリエチレン、ポ
リウレタン等各種の被覆材が選択できる。Here, the ABS resin coating layer 3 is an extremely thin film having a thickness of 0.05 μm to 3 μm, and cuts into the surface of the insulator on which the surface has been modified to form irregularities, and the insulating effect is exerted by the anchor effect. Strong adhesion to the body surface is obtained.
Further, since the ABS resin has good adhesion to the plating in the next step, this AB resin is placed between the surface-modified insulator and the plating layer.
By providing the S resin coating layer, compared to the conventional method,
The plating durability is remarkably improved. Here, since the thickness of the coating layer 3 of the ABS resin is extremely thin, 3 μm or less, excellent high-frequency characteristics can be expected without affecting the high-frequency characteristics at all. Next, the surface of the ABS resin coating layer 3 is subjected to electroless plating. The thickness of the electroless plating layer 4 is 0.5 μm.
A copper plating layer of about 5 μm is provided. Further, an electrolytic plating layer 5 is provided on the outer periphery of the electroless plating layer 4. Electrolytic plating layer 5
Is provided with a copper plating layer having a thickness of 5 μm to 30 μm. As the type of copper plating, there are copper cyanide plating, copper sulfate plating, and the like. In the present invention, copper sulfate having good spreadability and high bending resistance was selected. Finally, a protective coating layer 6 having a thickness of 0.02 mm or more is provided on the outer periphery of the electrolytic plating layer 5. As the protective coating layer 6, various coating materials such as PVC, polyethylene, and polyurethane can be selected.
【0008】[0008]
【実施例】導体1として、外径0.05mmの0.3%
スズ入り銅合金の銀メッキ単線を使用した。絶縁体2と
しては、四弗化エチレン−六弗化プロピレン共重合体樹
脂(FEP)を押出被覆し、厚さ0.05mmとした。
次に、メッキ工程に入る前に、絶縁体2の表面、外周を
波長248nm、KrFエキシマレーザにて表面改質し
た。次に、表面改質を施した絶縁体2の外周に、ABS
樹脂を厚さ1μmで塗布した。さらに、このABS樹脂
被覆上への無電解メッキの厚さは3μmとし、電解メッ
キは厚さ27μmとした。最後に、保護被覆層としては
ポリエチレンを被覆及びコーティング被覆し、厚さは
0.035mmとした。以上により、金属編組では難し
い外径0.28mmの細径同軸ケーブルが容易に作成で
きた。また、高周波特性も従来の同軸ケーブルと同等で
あった。EXAMPLE As the conductor 1, 0.3% of an outer diameter of 0.05 mm was used.
A silver-plated single wire of a tin-containing copper alloy was used. The insulator 2 was formed by extrusion coating a tetrafluoroethylene-hexafluoropropylene copolymer resin (FEP) to a thickness of 0.05 mm.
Next, before entering the plating step, the surface and outer periphery of the insulator 2 were surface-modified with a KrF excimer laser having a wavelength of 248 nm. Next, ABS is applied to the outer periphery of the insulator 2 subjected to the surface modification.
The resin was applied at a thickness of 1 μm. Further, the thickness of the electroless plating on the ABS resin coating was 3 μm, and the thickness of the electrolytic plating was 27 μm. Finally, polyethylene was coated and coated as a protective coating layer to a thickness of 0.035 mm. As described above, a small-diameter coaxial cable having an outer diameter of 0.28 mm, which is difficult with a metal braid, can be easily formed. Also, the high frequency characteristics were equivalent to those of the conventional coaxial cable.
【0009】[0009]
【発明の効果】本願発明の同軸ケーブルは、表面改質し
た絶縁体とメッキ層との間にABS樹脂被膜層を介在さ
せることによりメッキの密着力を高め、メッキの耐久性
が向上できる。また、ABS樹脂被覆層は極く薄い層で
あり、高周波特性に影響を及ぼすことがなく、優れた高
周波特性が得られる。さらに、金属編組を使用せず、金
属メッキ層から構成されているため、同軸ケーブルの細
径化ができる。According to the coaxial cable of the present invention, the ABS resin coating layer is interposed between the surface-modified insulator and the plating layer so that the adhesion of the plating can be increased and the durability of the plating can be improved. Further, the ABS resin coating layer is an extremely thin layer, and does not affect the high-frequency characteristics, so that excellent high-frequency characteristics can be obtained. Furthermore, since the metal braid is not used and is constituted by the metal plating layer, the diameter of the coaxial cable can be reduced.
【図1】本発明の同軸ケーブルの横断面図である。FIG. 1 is a cross-sectional view of a coaxial cable of the present invention.
1 導体 2 絶縁体(フッ素樹脂) 3 ABS樹脂被膜層 4 無電解メッキ層 5 電解メッキ層 6 保護被覆層 DESCRIPTION OF SYMBOLS 1 Conductor 2 Insulator (fluorine resin) 3 ABS resin coating layer 4 Electroless plating layer 5 Electrolytic plating layer 6 Protective coating layer
Claims (2)
線導体上に押出被覆した肉厚0.035mm以上のフッ
素樹脂からなる絶縁体、該絶縁体上に塗布した膜厚0.
05μm〜3μmのABS樹脂被膜層、該ABS樹脂被
膜層上に厚さ0.5μm〜5μmの無電解金属メッキ
層、該無電解金属メッキ層上に厚さ5μm以上の電解金
属メッキ層が設けられ、さらに、最外層が保護被覆層で
構成されていることを特徴とする同軸ケーブル。1. An insulator made of a fluororesin having a thickness of 0.035 mm or more, which is extrusion-coated on a single wire or a stranded wire conductor having an outer diameter of 0.03 mm or more, and a film thickness of 0.03 mm applied on the insulator.
An ABS resin coating layer having a thickness of 05 μm to 3 μm, an electroless metal plating layer having a thickness of 0.5 μm to 5 μm on the ABS resin coating layer, and an electrolytic metal plating layer having a thickness of 5 μm or more are provided on the electroless metal plating layer. A coaxial cable, wherein the outermost layer is formed of a protective coating layer.
るいはケミカル処理にて表面処理することを特徴とする
請求項1記載の同軸ケーブル。2. The coaxial cable according to claim 1, wherein the surface of the insulator is surface-treated by excimer laser treatment or chemical treatment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32597398A JP4137255B2 (en) | 1998-10-30 | 1998-10-30 | coaxial cable |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32597398A JP4137255B2 (en) | 1998-10-30 | 1998-10-30 | coaxial cable |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2000138014A true JP2000138014A (en) | 2000-05-16 |
JP4137255B2 JP4137255B2 (en) | 2008-08-20 |
Family
ID=18182669
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32597398A Expired - Fee Related JP4137255B2 (en) | 1998-10-30 | 1998-10-30 | coaxial cable |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4137255B2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6953888B2 (en) | 2003-02-25 | 2005-10-11 | Daniel Livshitz | Thin coaxial cable and method for its manufacture |
JP2008060062A (en) * | 2006-08-02 | 2008-03-13 | Nissei Electric Co Ltd | Coaxial cable |
JP2008084810A (en) * | 2006-08-30 | 2008-04-10 | Nissei Electric Co Ltd | Coaxial cable |
WO2010064579A1 (en) * | 2008-12-02 | 2010-06-10 | 株式会社フジクラ | Transmitting cable and signal transmitting cable using same |
CN110060814A (en) * | 2018-01-19 | 2019-07-26 | 日立金属株式会社 | Cable is used in signal transmission |
JP2019160414A (en) * | 2018-03-07 | 2019-09-19 | 日立金属株式会社 | Cable for differential signal transmission, multicore cable, and production method of cable for differential signal transmission |
-
1998
- 1998-10-30 JP JP32597398A patent/JP4137255B2/en not_active Expired - Fee Related
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6953888B2 (en) | 2003-02-25 | 2005-10-11 | Daniel Livshitz | Thin coaxial cable and method for its manufacture |
JP2008060062A (en) * | 2006-08-02 | 2008-03-13 | Nissei Electric Co Ltd | Coaxial cable |
JP2008084810A (en) * | 2006-08-30 | 2008-04-10 | Nissei Electric Co Ltd | Coaxial cable |
WO2010064579A1 (en) * | 2008-12-02 | 2010-06-10 | 株式会社フジクラ | Transmitting cable and signal transmitting cable using same |
US20110226507A1 (en) * | 2008-12-02 | 2011-09-22 | Fujikura Ltd. | Transmission cable and signal transmission cable using the same |
JPWO2010064579A1 (en) * | 2008-12-02 | 2012-05-10 | 株式会社フジクラ | Transmission cable and signal transmission cable using the same |
CN110060814A (en) * | 2018-01-19 | 2019-07-26 | 日立金属株式会社 | Cable is used in signal transmission |
CN110060814B (en) * | 2018-01-19 | 2022-10-18 | 日立金属株式会社 | Cable for signal transmission |
JP2019160414A (en) * | 2018-03-07 | 2019-09-19 | 日立金属株式会社 | Cable for differential signal transmission, multicore cable, and production method of cable for differential signal transmission |
JP7114945B2 (en) | 2018-03-07 | 2022-08-09 | 日立金属株式会社 | Differential signal transmission cable, multicore cable, and method for manufacturing differential signal transmission cable |
Also Published As
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---|---|
JP4137255B2 (en) | 2008-08-20 |
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