JP2000136368A - Conductive adhesive and method for mounting electronic part using same - Google Patents
Conductive adhesive and method for mounting electronic part using sameInfo
- Publication number
- JP2000136368A JP2000136368A JP31255398A JP31255398A JP2000136368A JP 2000136368 A JP2000136368 A JP 2000136368A JP 31255398 A JP31255398 A JP 31255398A JP 31255398 A JP31255398 A JP 31255398A JP 2000136368 A JP2000136368 A JP 2000136368A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- epoxy resin
- resin precursor
- conductive adhesive
- silver powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品を回路基
板に装着するための導電性接着剤、および同接着剤を用
いた電子部品の実装方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive adhesive for mounting an electronic component on a circuit board, and a method for mounting an electronic component using the adhesive.
【０００２】[0002]
【従来の技術】近年、電子部品実装用接合剤として、
銀、パラジウム等の金属粉を樹脂に充填した導電性接着
剤や、クリーム半田等が知られている。導電性接着剤
は、その流動性を向上させるため、粘度が１〜５０ｃｐ
ｓ程度の溶剤や希釈剤を、接着剤総重量に対し２重量部
以上含有させている。例えば、大きさが２５μｍ程度の
不定形で、タップ密度が３〜４．５ｇ／ｃｍ3程度の銀
粉を分散させたエポキシ樹脂前駆体に、ブチルカルビト
ール系の溶剤やグリシジルエーテル型希釈剤を添加して
いる。2. Description of the Related Art In recent years, as a bonding agent for mounting electronic parts,
A conductive adhesive in which metal powder such as silver or palladium is filled in a resin, cream solder, and the like are known. The conductive adhesive has a viscosity of 1 to 50 cp to improve its fluidity.
About 2 parts by weight of a solvent or a diluent of about s with respect to the total weight of the adhesive is contained. For example, a butyl carbitol-based solvent or a glycidyl ether-type diluent is added to an epoxy resin precursor in which silver powder having an irregular size of about 25 μm and a tap density of about 3 to 4.5 g / cm 3 is dispersed. are doing.
【０００３】このような溶剤型導電性接着剤は、溶剤や
希釈剤によって粘度を調製することができるため、ある
程度の量の金属粉を含ませることができる。また、溶剤
や希釈剤は、樹脂前駆体を硬化させて電子部品を固定す
る加熱工程で揮発するため、加熱硬化後の接着剤は、金
属粉の充填率が高く、その体積抵抗は、１×１０-5〜１
０-4Ωｃｍ程度と低い。したがって、溶剤型導電性接着
剤は、電子部品実装用接着剤として用いるには適してい
る。しかし、チクソ比（高せん断時の粘度に対する低せ
ん断時の粘度の比；以下、Ｅ型粘度計を用いた場合のロ
ータ回転数５ｒｐｍでの粘度に対するロータ回転数０．
５ｒｐｍでの粘度の比をいう。）が３程度と小さく、チ
クソトロピー性が低い。そのため、印刷または塗布方式
にこの接着剤を使用すると、基板上で接着剤がダレて拡
がり、隣接する電極間が電気的に短絡したり、接着剤層
の厚みが薄くなって、電子部品の電極と接着剤とが接触
しなかったりする。特に、ポリイミドフィルム基板等の
薄くてうねりやすい基板では、この問題が顕著である。
一方、エポキシ樹脂前駆体に溶剤や希釈剤を添加しない
無溶剤型導電性接着剤を電子部品実装用に用いることが
検討されている。[0003] Since the viscosity of such a solvent-type conductive adhesive can be adjusted by a solvent or a diluent, a certain amount of metal powder can be contained. In addition, since the solvent and the diluent volatilize in the heating step of curing the resin precursor and fixing the electronic component, the adhesive after the heat curing has a high filling rate of the metal powder and has a volume resistance of 1 ×. 10 -5 to 1
It is as low as about 0 -4 Ωcm. Therefore, the solvent type conductive adhesive is suitable for use as an electronic component mounting adhesive. However, the thixo ratio (the ratio of the viscosity at low shear to the viscosity at high shear; hereinafter referred to as the rotor rotational speed of 0.5 with respect to the viscosity at a rotor rotational speed of 5 rpm using an E-type viscometer).
It refers to the ratio of viscosity at 5 rpm. ) Is as small as about 3 and has low thixotropy. Therefore, when this adhesive is used in a printing or coating method, the adhesive drips and spreads on the substrate, causing an electrical short circuit between adjacent electrodes, and a reduction in the thickness of the adhesive layer, thereby reducing an electrode of an electronic component. And the adhesive do not contact. In particular, this problem is remarkable in a thin and easily undulating substrate such as a polyimide film substrate.
On the other hand, use of a solventless conductive adhesive which does not add a solvent or a diluent to an epoxy resin precursor is being studied for mounting electronic components.
【０００４】[0004]
【発明が解決しようとする課題】しかし、無溶剤型導電
性接着剤は、体積抵抗が１×１０-3Ωｃｍ程度と高く、
電子部品の実装に用いるには問題があった。また、無溶
剤型導電性接着剤は、樹脂中に充填される金属粉の量が
多いため、非常に粘性が高く、チクソトロピー性に乏し
い。そのため、塗布や印刷形式に使用するには、適度な
チクソトロピー性を付与する必要があった。本発明は、
上記課題に鑑み、電子部品を回路基板に安定して実装で
き、優れた品質の電子回路基板を製造できる無溶剤型導
電性接着剤を提供することを目的とする。また、上記の
接着剤を用いて、電子部品を基板上に実装する方法を提
供することを目的とする。However, the solventless conductive adhesive has a high volume resistance of about 1 × 10 −3 Ωcm,
There was a problem in using it for mounting electronic components. Further, the solventless conductive adhesive has a very high viscosity and poor thixotropy due to a large amount of metal powder filled in the resin. Therefore, it has been necessary to impart appropriate thixotropic properties in order to use it for application or printing. The present invention
In view of the above problems, it is an object of the present invention to provide a solventless conductive adhesive capable of stably mounting an electronic component on a circuit board and producing an electronic circuit board of excellent quality. It is another object of the present invention to provide a method for mounting an electronic component on a substrate using the above adhesive.
【０００５】[0005]
【課題を解決するための手段】本発明の導電性接着剤
は、エポキシ樹脂前駆体１００重量部、潜在性硬化剤２
〜３０重量部、および銀粉２００〜５００重量部からな
り、前記銀粉が薄片状で、かつそのタップ密度が５ｇ／
ｃｍ3以上、５０％平均粒径が１０μｍ以下であること
を特徴とする。ここにおいて、前記エポキシ樹脂前駆体
が、少なくとも１種類の多官能型エポキシ樹脂前駆体を
含むと好適である。また、本発明による電子部品の実装
方法は、装着しようとする回路基板の電極に上記導電性
接着剤を印刷または塗布する工程、前記電極に電子部品
を装着する工程、および加熱して前記エポキシ樹脂前駆
体を硬化させ前記部品を基板上に固定する工程を含むこ
とを特徴とする。The conductive adhesive of the present invention comprises 100 parts by weight of an epoxy resin precursor and a latent curing agent 2
To 30 parts by weight, and 200 to 500 parts by weight of silver powder, wherein the silver powder is flaky and has a tap density of 5 g /
cm 3 and a 50% average particle size of 10 μm or less. Here, it is preferable that the epoxy resin precursor contains at least one kind of polyfunctional epoxy resin precursor. Also, the method for mounting an electronic component according to the present invention includes a step of printing or applying the conductive adhesive on an electrode of a circuit board to be mounted, a step of mounting the electronic component on the electrode, and a step of heating the epoxy resin. Curing the precursor and fixing the component on a substrate.
【０００６】[0006]
【発明の実施の形態】上記のように、本発明の導電性接
着剤は、エポキシ樹脂前駆体、潜在性硬化剤、および銀
粉からなる無溶剤型導電性接着剤であって、前記銀粉
は、薄片状であり、そのタップ密度が５ｇ／ｃｍ3以
上、５０％平均粒径が１０μｍ以下である。タップ密度
は、５〜７ｇ／ｃｍ3、５０％平均粒径は、１．０〜１
０μｍであるとより好適である。このような構成をとる
ことによって、本発明は、電子部品実装用に適した導電
性接着剤となる。以下に、その理由を順次説明する。DETAILED DESCRIPTION OF THE INVENTION As described above, the conductive adhesive of the present invention is a solventless conductive adhesive comprising an epoxy resin precursor, a latent curing agent, and silver powder. It is flaky, and has a tap density of 5 g / cm 3 or more and a 50% average particle size of 10 μm or less. Tap density: 5-7 g / cm 3 , 50% average particle size: 1.0-1
More preferably, it is 0 μm. With such a configuration, the present invention is a conductive adhesive suitable for mounting electronic components. Hereinafter, the reason will be sequentially described.
【０００７】薄片状の銀粉は、硝酸銀溶液のような銀塩
溶液から無電解法によって銀を析出させて得られたもの
で、この銀粉は、厚みが１〜２μｍ程度あるため、接着
剤中で細かく破砕されることはない。また、この銀粉の
タップ密度は、従来よりも大きいため、同じ体積中に含
まれる銀粉の充填率が高い。したがって、本発明の無溶
剤型導電性接着剤は、従来の溶剤型導電性接着剤と同程
度の低い体積抵抗を有する。[0007] The flaky silver powder is obtained by depositing silver from a silver salt solution such as a silver nitrate solution by an electroless method. Since the silver powder has a thickness of about 1 to 2 μm, it is used in an adhesive. It is not crushed finely. In addition, since the tap density of the silver powder is higher than that in the related art, the filling rate of the silver powder contained in the same volume is high. Therefore, the solvent-free conductive adhesive of the present invention has a volume resistance as low as that of the conventional solvent-based conductive adhesive.
【０００８】さらに、従来の無溶剤型導電性接着剤は、
チクソ比が１．０〜２．５程度と低いが、本発明の無溶
剤型導電性接着剤は、チクソ比４〜７程度のチクソトロ
ピー性を有する。通常、接着剤のチクソ比が４以上あれ
ば、印刷したり塗布したりした場合、接着剤がダレて拡
がることがない。したがって、本発明の導電性接着剤
は、その形状保持性が良好であり、接着剤層を厚膜に形
成することが可能である。そのため、基板の電極間が短
絡したり、電子部品の電極と接着剤とが接触しなかった
りすることがない。特に、回路基板の厚さが０．４ｍｍ
以下であっても、電子部品と基板との電気的接続を安定
しておこなうことができる。さらに、微細な間隔で塗布
または印刷することができ、特に、０．３ｍｍ以下のフ
ァインピッチ印刷が可能となる。なお、５０％平均粒径
とは、全銀粒子を粒径の大きさに並べたときの中央値
（メジアン値）を意味する。Further, the conventional solvent-free conductive adhesive is
Although the thixo ratio is as low as about 1.0 to 2.5, the solventless conductive adhesive of the present invention has a thixotropy of about 4 to 7. Usually, if the thixotropy of the adhesive is 4 or more, the adhesive does not sag and spread when printed or applied. Therefore, the conductive adhesive of the present invention has good shape retention, and can form an adhesive layer in a thick film. Therefore, there is no short circuit between the electrodes of the substrate and no contact between the electrodes of the electronic component and the adhesive. Especially, the thickness of the circuit board is 0.4mm
Even in the following case, the electrical connection between the electronic component and the substrate can be stably performed. Furthermore, it can be applied or printed at fine intervals, and in particular, fine pitch printing of 0.3 mm or less is possible. The 50% average particle size means a median value (median value) when all the silver particles are arranged in the size of the particle size.
【０００９】導電性接着剤に含まれる潜在性硬化剤は、
エポキシ樹脂前駆体１００重量部に対して、２重量部よ
り少ないと、十分に硬化せず、３０重量部より多いと、
室温で保存している間に硬化する場合があって、保存性
が低下する。エポキシ樹脂前駆体に対して、潜在性硬化
剤を２〜３０重量部とすると確実に硬化できると共に保
存性も良くて好適である。また、エポキシ樹脂前駆体
が、少なくとも１種の多官能型エポキシ樹脂前駆体を含
むと、得られる接着剤の接着強度を向上させることがで
きて好ましい。The latent curing agent contained in the conductive adhesive is
If the amount is less than 2 parts by weight with respect to 100 parts by weight of the epoxy resin precursor, the composition is not sufficiently cured, and if the amount is more than 30 parts by weight,
It may cure during storage at room temperature, resulting in poor storage stability. When the latent curing agent is used in an amount of 2 to 30 parts by weight with respect to the epoxy resin precursor, the curing can be surely performed and the storage stability is good, which is preferable. Further, it is preferable that the epoxy resin precursor contains at least one kind of polyfunctional epoxy resin precursor, because the adhesive strength of the obtained adhesive can be improved.
【００１０】[0010]
【実施例】以下に、具体的な実施例を挙げて、本発明を
より詳細に説明する。 《実施例１〜５》エポキシ樹脂として、表１に示す樹脂
を用いた。The present invention will be described below in more detail with reference to specific examples. << Examples 1-5 >> Resins shown in Table 1 were used as epoxy resins.
【００１１】[0011]
【表１】 [Table 1]
【００１２】硬化剤としては、２−メチルイミダゾール
アジン（油化シェルエポキシ（株）社製；商品名：エピ
キュアＭ１２ＡＺ）を用いた。また、銀粉Ａとして、硝
酸銀溶液から無電解法で析出させた銀粉を用いた。この
銀粉Ａのタップ密度は、５．３ｇ／ｃｍ3、５０％平均
粒径は、３．２μｍであった。そして、上記各配合成分
を表２に示す重量比で混合して、導電性接着剤（実施例
１〜５）を作製した。As a curing agent, 2-methylimidazole azine (trade name: Epicure M12AZ, manufactured by Yuka Shell Epoxy Co., Ltd.) was used. Further, as the silver powder A, a silver powder precipitated from a silver nitrate solution by an electroless method was used. The tap density of this silver powder A was 5.3 g / cm 3 , and the 50% average particle size was 3.2 μm. Then, the above respective components were mixed at a weight ratio shown in Table 2 to prepare a conductive adhesive (Examples 1 to 5).
【００１３】[0013]
【表２】 [Table 2]
【００１４】《比較例１〜５》銀粉として、実施例で用
いた銀粉Ａおよび表３に示す銀粉Ｂ〜Ｄを用いる他は、
実施例と同様の配合成分を用いた。<< Comparative Examples 1-5 >> Except for using silver powder A used in the examples and silver powders B to D shown in Table 3 as silver powder,
The same blending components as in the examples were used.
【００１５】[0015]
【表３】 [Table 3]
【００１６】そして、各配合成分を表４に示す重量比で
混合して、導電性接着剤（比較例１〜５）を作製した。Then, the respective components were mixed at the weight ratios shown in Table 4 to prepare conductive adhesives (Comparative Examples 1 to 5).
【００１７】[0017]
【表４】 [Table 4]
【００１８】上記のようにして得られた接着剤につい
て、各種特性を測定した。その測定方法は以下の通りで
ある。 １）チクソ比：コーン角度３°のＥ型粘度計を用い、３
０℃、０．５ｒｐｍでロータを回転させたときの、２回
転目のロータに作用する粘性抵抗トルクから粘度を測定
し、同様にして、５ｒｐｍでロータを回転させたときの
粘度を測定して、５ｒｐｍでの粘度に対する０．５ｒｐ
ｍでの粘度の比から算出した。 ２）ダレ拡がり率：開口径φ５ｍｍのメタルマスクを用
いて基板上に接着剤を印刷し、印刷直後の径φ0と、 ２
５℃、５０％ＲＨにて１時間放置した後の径φ1を測定
し、（φ1−φ0）／φ0×１００から算出した。 ３）膜厚：開口径φ１ｍｍ、厚み１００μｍのメタルマ
スクを用いて基板上に接着剤を印刷し、２５℃、５０％
ＲＨにて１時間放置した後の接着剤の厚みを測定した。 ４）接着強度：ＪＩＳ−Ｋ−６８５０に準じて測定し
た。 ５）硬化時間：基板上に接着剤を印刷し、リフロー炉に
て、温度１５０℃で４０秒、５０秒、６０秒、７０秒、
および８０秒の各時間加熱した後、触針法で硬化を確認
した。最も短い時間で硬化を確認できた時間を硬化時間
とした。 ６）保存安定日数：接着剤の製造直後の粘度（η0）を
Ｅ型粘度計で測定した後、この接着剤を２５±１℃で放
置した。そして、定期的に、Ｅ型粘度計で粘度（η1）
を測定した。η1≧２×η0となるまでに要した日数を保
存安定日数とした。 各接着剤の特性測定の結果を表５に示す。Various characteristics of the adhesive obtained as described above were measured. The measuring method is as follows. 1) Thixotropic ratio: Using an E-type viscometer with a cone angle of 3 °, 3
The viscosity was measured from the viscous resistance torque acting on the second rotation of the rotor when the rotor was rotated at 0 ° C. and 0.5 rpm, and the viscosity was similarly measured when the rotor was rotated at 5 rpm. 0.5 rpm for viscosity at 5 rpm
It was calculated from the ratio of viscosity in m. 2) Drip spreading rate: An adhesive is printed on a substrate using a metal mask having an opening diameter of 5 mm, and a diameter φ 0 immediately after printing is obtained.
5 ° C., the diameter phi 1 after leaving 1 hour at 50% RH were measured and calculated from (φ 1 -φ 0) / φ 0 × 100. 3) Film thickness: An adhesive is printed on the substrate using a metal mask having an opening diameter of φ1 mm and a thickness of 100 μm, and is heated at 25 ° C. and 50%
The thickness of the adhesive after being left at RH for 1 hour was measured. 4) Adhesive strength: Measured according to JIS-K-6850. 5) Curing time: An adhesive is printed on the substrate, and in a reflow oven, at a temperature of 150 ° C. for 40 seconds, 50 seconds, 60 seconds, 70 seconds,
After heating for 80 seconds and for 80 seconds, curing was confirmed by the stylus method. The time at which curing was confirmed in the shortest time was taken as the curing time. 6) Storage stability days: The viscosity (η 0 ) immediately after the production of the adhesive was measured with an E-type viscometer, and the adhesive was left at 25 ± 1 ° C. Periodically, the viscosity (η 1 ) is measured with an E-type viscometer.
Was measured. The number of days required until η 1 ≧ 2 × η 0 was taken as the storage stable days. Table 5 shows the results of measuring the properties of each adhesive.
【００１９】[0019]
【表５】 [Table 5]
【００２０】表５から明らかなように、本発明による導
電性接着剤は、チクソ比が高く、ダレて拡がることがほ
とんどなかった。したがって、形成された接着剤層の膜
厚も厚かった。さらに、接着強度に優れ、硬化時間およ
び保存安定日数も実用に適した範囲内であった。As is clear from Table 5, the conductive adhesive according to the present invention had a high thixotropy ratio and hardly spread out. Therefore, the thickness of the formed adhesive layer was also large. Furthermore, the adhesive strength was excellent, and the curing time and storage stability days were within the range suitable for practical use.
【００２１】次に、実施例１で作製した接着剤と、比較
例６として用意したｔ−ブチルカルビトールを含む導電
性接着剤（粒径４０μｍの不定形銀粉含有、チクソ比
２．５）とを用いて、以下のようにしてＩＣ部品の実装
の良否を評価した。まず、０．３ｍｍピッチにて、各接
着剤を基板上の電極に印刷した。この電極上にパッケー
ジＩＣ部品を装着した後、リフロー炉にて接着剤を加熱
硬化させた。そして、隣接する電極間の電気的短絡の発
生の有無を調べた。また、各接着剤を厚さ１００μｍの
基板上の電極にそれぞれ印刷し、バンプ高が６０μｍの
ベアＩＣを装着した後、リフロー炉にて接着剤を加熱硬
化させた。そして、回路基板の電極とベアＩＣのバンプ
電極との間の導通不良の発生の有無を調べた。その結
果、比較例６の接着剤は、ダレて拡がり、基板上の電極
間で電気的短絡が発生した。また、基板電極と部品電極
との間で導通不良の部分があった。実施例１で作製した
接着剤は、比較例６のような電気的短絡や導通不良の発
生はなく、良好に部品を基板上に実装することができ
た。Next, the adhesive prepared in Example 1 and the conductive adhesive containing t-butyl carbitol prepared as Comparative Example 6 (containing amorphous silver powder having a particle size of 40 μm and a thixotropic ratio of 2.5) were used. Was used to evaluate the quality of the mounting of the IC component as follows. First, each adhesive was printed on the electrodes on the substrate at a pitch of 0.3 mm. After mounting the package IC component on this electrode, the adhesive was heated and cured in a reflow furnace. Then, the presence or absence of the occurrence of an electric short circuit between the adjacent electrodes was examined. Further, each adhesive was printed on an electrode on a substrate having a thickness of 100 μm, and a bare IC having a bump height of 60 μm was mounted. Then, the adhesive was heated and cured in a reflow furnace. Then, the presence or absence of the occurrence of a conduction failure between the electrode of the circuit board and the bump electrode of the bare IC was examined. As a result, the adhesive of Comparative Example 6 was sagged and spread, causing an electrical short between the electrodes on the substrate. In addition, there was a portion with poor conduction between the substrate electrode and the component electrode. The adhesive prepared in Example 1 did not cause an electrical short circuit or poor conduction as in Comparative Example 6, and successfully mounted components on the board.
【００２２】[0022]
【発明の効果】本発明によれば、回路基板上に電子部品
を高精度に実装できる導電性接着剤を提供できる。According to the present invention, it is possible to provide a conductive adhesive capable of mounting electronic components on a circuit board with high accuracy.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 秋口 尚士 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 末次 憲一郎 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Ｆターム(参考） 4J040 EC001 EC061 EC161 HA066 KA03 KA16 LA03 LA04 LA09 NA19 5E319 AA03 AC01 BB11 CC36 CD29 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Takashi Akiguchi 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. Terms (reference) 4J040 EC001 EC061 EC161 HA066 KA03 KA16 LA03 LA04 LA09 NA19 5E319 AA03 AC01 BB11 CC36 CD29
Claims (4)
性硬化剤２〜３０重量部、および銀粉２００〜５００重
量部からなり、前記銀粉が薄片状で、かつそのタップ密
度が５ｇ／ｃｍ3以上、５０％平均粒径が１０μｍ以下
であることを特徴とする導電性接着剤。1. A composition comprising 100 parts by weight of an epoxy resin precursor, 2 to 30 parts by weight of a latent curing agent, and 200 to 500 parts by weight of silver powder, wherein said silver powder is flaky and has a tap density of 5 g / cm 3 or more. And a 50% average particle size of 10 μm or less.
１種類の多官能型エポキシ樹脂前駆体を含む請求項１記
載の導電性接着剤。2. The conductive adhesive according to claim 1, wherein the epoxy resin precursor contains at least one kind of polyfunctional epoxy resin precursor.
回路基板の電極に印刷または塗布する工程、前記電極に
電子部品を装着する工程、および加熱して前記エポキシ
樹脂前駆体を硬化させ前記部品を基板上に固定する工程
を含むことを特徴とする電子部品の実装方法。3. The step of printing or applying the conductive adhesive according to claim 1 on an electrode of a circuit board, the step of mounting an electronic component on the electrode, and the step of heating to cure the epoxy resin precursor. A method for mounting an electronic component, comprising a step of fixing the component on a substrate.
請求項３記載の電子部品の実装方法。4. The method according to claim 3, wherein a circuit board having a thickness of 0.4 mm or less is used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31255398A JP3681907B2 (en) | 1998-11-02 | 1998-11-02 | Conductive adhesive and electronic component mounting method using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31255398A JP3681907B2 (en) | 1998-11-02 | 1998-11-02 | Conductive adhesive and electronic component mounting method using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000136368A true JP2000136368A (en) | 2000-05-16 |
| JP3681907B2 JP3681907B2 (en) | 2005-08-10 |
Family
ID=18030604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31255398A Expired - Fee Related JP3681907B2 (en) | 1998-11-02 | 1998-11-02 | Conductive adhesive and electronic component mounting method using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3681907B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006210765A (en) * | 2005-01-31 | 2006-08-10 | Brother Ind Ltd | Substrate joint, ink jet head and their manufacturing method |
| JP2009138155A (en) * | 2007-12-10 | 2009-06-25 | Fukuda Metal Foil & Powder Co Ltd | Solventless conductive adhesive |
| WO2016121296A1 (en) * | 2015-01-29 | 2016-08-04 | バンドー化学株式会社 | Bonding composition |
-
1998
- 1998-11-02 JP JP31255398A patent/JP3681907B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006210765A (en) * | 2005-01-31 | 2006-08-10 | Brother Ind Ltd | Substrate joint, ink jet head and their manufacturing method |
| JP4552671B2 (en) * | 2005-01-31 | 2010-09-29 | ブラザー工業株式会社 | Substrate assembly, inkjet head, and manufacturing method thereof |
| JP2009138155A (en) * | 2007-12-10 | 2009-06-25 | Fukuda Metal Foil & Powder Co Ltd | Solventless conductive adhesive |
| WO2016121296A1 (en) * | 2015-01-29 | 2016-08-04 | バンドー化学株式会社 | Bonding composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3681907B2 (en) | 2005-08-10 |
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