JP2001085824A - Adhesive for mounting electronic parts and mounting method for electronic parts using the same - Google Patents
Adhesive for mounting electronic parts and mounting method for electronic parts using the sameInfo
- Publication number
- JP2001085824A JP2001085824A JP26002899A JP26002899A JP2001085824A JP 2001085824 A JP2001085824 A JP 2001085824A JP 26002899 A JP26002899 A JP 26002899A JP 26002899 A JP26002899 A JP 26002899A JP 2001085824 A JP2001085824 A JP 2001085824A
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- Prior art keywords
- bonding agent
- pts
- mounting
- parts
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、電子部品を回路基
板に実装するための接合剤およびその接合剤を用いた電
子部品の実装方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding agent for mounting an electronic component on a circuit board and a method for mounting an electronic component using the bonding agent.
【0002】[0002]
【従来の技術】近年、電子部品実装用接合剤として、
銀、ニッケルなどの金属粉を樹脂に充填した導電性接着
剤、クリーム半田などが知られている。従来の導電性接
着剤には、その印刷性を向上させるため、不飽和脂肪
酸、二酸化珪素などのチクソ性付与剤を含有させるのが
一般的である。しかし、従来の導電性接着剤は、絶縁体
であるチクソ性付与剤を含有するため、加熱硬化後の導
電性が低いという問題がある。また、クリーム半田は、
その成分中に鉛を含むため、安全衛生および地球環境保
護の点で問題がある。さらに、従来の導電性接着剤は、
加熱硬化時にチクソ性が低下するため、接着剤がダレ広
がり、実装後の電子部品端面に形成されるフィレット高
が低くなり、接着強度が低下したり、硬化後に部品が基
板から欠落したりするなどの問題を生じやすい。部品が
基板から欠落するのを防止するため、印刷工程で塗布さ
れる接着剤の膜厚を厚くする方法などが検討されてい
る。しかし、この場合、印刷用マスクも厚くする必要が
あり、接着剤の版抜け性が悪くなったり、接着剤の塗布
量が不安定になったりするなどの新たな問題が生じてい
る。2. Description of the Related Art In recent years, as a bonding agent for mounting electronic parts,
A conductive adhesive, a cream solder, or the like in which a resin is filled with a metal powder such as silver or nickel is known. Conventional conductive adhesives generally contain a thixotropic agent such as an unsaturated fatty acid or silicon dioxide in order to improve the printability. However, since the conventional conductive adhesive contains a thixotropy-imparting agent which is an insulator, there is a problem that the conductivity after heat curing is low. In addition, cream solder
Since lead is contained in the component, there is a problem in terms of safety and health and protection of the global environment. In addition, conventional conductive adhesives
Since the thixotropic property decreases during heat curing, the adhesive spreads, the height of the fillet formed on the end surface of the electronic component after mounting decreases, the adhesive strength decreases, or the component drops from the substrate after curing, etc. Problems are likely to occur. In order to prevent the parts from dropping off the substrate, a method of increasing the thickness of the adhesive applied in the printing process is being studied. However, in this case, it is necessary to increase the thickness of the printing mask, which causes new problems such as poor plate removal of the adhesive and unstable application of the adhesive.
【0003】[0003]
【発明が解決しようとする課題】本発明は、前記諸問題
に鑑み、電子部品と回路基板とを導通性よく接合でき、
かつ、接着強度に優れた高品質の電子部品実装製品を製
造できる電子部品実装用接合剤を提供することを目的と
する。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has enabled electronic components and a circuit board to be joined with good conductivity.
In addition, it is an object of the present invention to provide a bonding agent for electronic component mounting capable of producing a high quality electronic component mounting product having excellent adhesive strength.
【0004】[0004]
【課題を解決するための手段】本発明は、エポキシ樹脂
100重量部、潜在性硬化剤2〜30重量部および導電
性粒子300〜900重量部からなる電子部品実装用接
合剤に関する。前記導電性粒子のタップ密度は、4.5
g/cm3以上であり、かつ、平均粒子径が4〜5μm
であることが好ましい。また、本発明は、前記電子部品
実装用接合剤を回路基板の電極に印刷する工程、塗布さ
れた接合剤上に電子部品を装着する工程および前記接合
剤を硬化させる工程を含むことを特徴とする電子部品の
実装方法に関する。前記印刷工程で塗布される電子部品
実装用接合剤の膜厚は、40〜90μmであることが好
ましい。SUMMARY OF THE INVENTION The present invention relates to a bonding agent for mounting electronic parts, comprising 100 parts by weight of an epoxy resin, 2 to 30 parts by weight of a latent curing agent, and 300 to 900 parts by weight of conductive particles. The tap density of the conductive particles is 4.5.
g / cm 3 or more, and the average particle size is 4 to 5 μm.
It is preferable that Further, the present invention is characterized in that it includes a step of printing the electronic component mounting bonding agent on an electrode of a circuit board, a step of mounting an electronic component on the applied bonding agent, and a step of curing the bonding agent. The present invention relates to a method for mounting electronic components. The electronic component mounting adhesive applied in the printing step preferably has a thickness of 40 to 90 μm.
【0005】[0005]
【発明の実施の形態】本発明の電子部品実装用接合剤
は、エポキシ樹脂、潜在性硬化剤および導電性粒子を含
んでいる。前記エポキシ樹脂は、常温で液状のものが用
いられる。また、最終的に液状となる限り、固体のエポ
キシ樹脂を一部含んでいてもよい。エポキシ樹脂全体の
粘度は、例えばE型粘度計を用い、30℃、ロータ回転
数0.5rpmの条件で測定したときの測定値が、0.
2〜10Pa・s、さらには0.4〜3.5Pa・sで
あることが好ましい。BEST MODE FOR CARRYING OUT THE INVENTION The bonding agent for mounting electronic parts of the present invention contains an epoxy resin, a latent curing agent and conductive particles. The epoxy resin is liquid at room temperature. Moreover, as long as the liquid epoxy resin finally becomes liquid, it may contain a part of solid epoxy resin. The viscosity of the entire epoxy resin is, for example, a value measured at 30 ° C. and a rotor rotation speed of 0.5 rpm using an E-type viscometer.
The pressure is preferably 2 to 10 Pa · s, more preferably 0.4 to 3.5 Pa · s.
【0006】エポキシ樹脂としては、例えば、ビスフェ
ノールA型エポキシ樹脂、ビスフェノールF型エポキシ
樹脂、ビスフェノールAD型エポキシ樹脂、ビスフェノ
ールS型エポキシ樹脂などのビスフェノール型エポキシ
樹脂、テトラメチルジヒドロキシビフェニルジグリシジ
ルエーテルなどのビフェニル型エポキシ樹脂、ジヒドロ
キシナフタレンジグリシジルエーテルなどのナフタレン
型エポキシ樹脂、フェノールノボラック型エポキシ樹
脂、1,6−ヘキサンジオールジグリシジルエーテルな
どの脂環式エポキシ樹脂、トリグリシジルアミノフェノ
ール型エポキシ樹脂などのアミノフェノール型エポキシ
樹脂などを用いることができる。これらは単独で用いて
もよく、2種以上を組み合わせて用いてもよい。これら
のうちでは、安価で、低粘度で、安定性がよいなどの点
から、ビスフェノールA型エポキシ樹脂、ビスフェノー
ルF型エポキシ樹脂、脂環式エポキシ樹脂などが、特に
好ましく用いられる。また、エポキシ樹脂には、粘度調
整などのために用いられる分子中にエポキシ基を1〜2
個有する低分子量成分(希釈剤)が含まれていてもよ
い。Examples of the epoxy resin include bisphenol type epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin and bisphenol S type epoxy resin, and biphenyl such as tetramethyldihydroxybiphenyldiglycidyl ether. Epoxy resins, naphthalene type epoxy resins such as dihydroxynaphthalenediglycidyl ether, phenol novolak type epoxy resins, alicyclic epoxy resins such as 1,6-hexanediol diglycidyl ether, and aminophenols such as triglycidyl aminophenol type epoxy resins A type epoxy resin or the like can be used. These may be used alone or in combination of two or more. Among them, bisphenol A type epoxy resin, bisphenol F type epoxy resin, alicyclic epoxy resin and the like are particularly preferably used because they are inexpensive, have low viscosity and good stability. Further, the epoxy resin has an epoxy group in a molecule used for viscosity adjustment or the like.
Low molecular weight components (diluents) may be included.
【0007】前記潜在性硬化剤は、低温から常温、例え
ば0〜40℃ではほとんどエポキシ樹脂と硬化反応を起
こさないが、一定の温度に加熱すると、硬化反応を速や
かに進行させる硬化剤である。かかる性質を有する点か
ら、潜在性硬化剤は常温で固体(粉体)であることが多
いが、液状であってもよい。ここで、一定の温度とは、
潜在性硬化剤の種類によって異なるが、一般に80〜2
00℃であり、80〜150℃程度であることが、硬化
反応時の温度管理上好ましい。また、硬化反応が充分に
進行するまでに要する加熱時間は、40〜400μmの
膜状に塗布した接合剤を硬化させる場合、一般に0.5
〜30分間であり、0.5〜10分間程度であること
が、製造工程上好ましい。The latent curing agent hardly causes a curing reaction with an epoxy resin at a low temperature to a normal temperature, for example, 0 to 40 ° C., but when heated to a certain temperature, the curing reaction proceeds rapidly. From the viewpoint of having such properties, the latent curing agent is often solid (powder) at room temperature, but may be liquid. Here, the constant temperature is
Depending on the type of the latent curing agent, it is generally 80 to 2
It is preferably 00 ° C. and about 80 to 150 ° C. in terms of temperature control during the curing reaction. The heating time required for the curing reaction to proceed sufficiently is generally 0.5 to 0.5 when the bonding agent applied in the form of a film of 40 to 400 μm is cured.
30 minutes, and preferably about 0.5 to 10 minutes in the manufacturing process.
【0008】潜在性硬化剤としては、例えばイミダゾー
ル、1または2以上のアルキル基を有するアルキルイミ
ダゾールなどのイミダゾール系硬化剤、アミノ基含有化
合物をエポキシ樹脂などと適度に反応させて潜在性を付
与したアダクト系硬化剤、ポリアミノアミドなどのアミ
ド系硬化剤、フタル酸無水物、テトラヒドロフタル酸無
水物、メチルテトラヒドロフタル酸無水物、ピロメリッ
ト酸無水物、ナジック酸無水物などの酸無水物系硬化剤
を用いることができる。これらは単独で用いてもよく、
2種以上を組み合わせて用いてもよい。例えばアダクト
型硬化剤と酸無水物系硬化剤とを組み合わせることで低
粘度で硬化反応性に優れた接合剤を得ることが可能とな
る。前記硬化剤のうちでは、潜在性が優れている点か
ら、アダクト系硬化剤、イミダゾール系硬化剤が好まし
い。As the latent curing agent, for example, an imidazole-based curing agent such as imidazole, an alkylimidazole having one or more alkyl groups, or an amino group-containing compound is appropriately reacted with an epoxy resin or the like to impart a potential. Adduct-based curing agents, amide-based curing agents such as polyaminoamide, acid anhydride-based curing agents such as phthalic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, pyromellitic anhydride, and nadic acid anhydride Can be used. These may be used alone,
Two or more kinds may be used in combination. For example, by combining an adduct-type curing agent and an acid anhydride-based curing agent, a bonding agent having low viscosity and excellent curing reactivity can be obtained. Among the curing agents, adduct-based curing agents and imidazole-based curing agents are preferable because of their excellent potential.
【0009】前記導電性粒子としては、金属の微粒子、
例えば銀粉末、銅粉末、ニッケル粉末などが好ましく用
いられる。導電性粒子の平均粒子径は、最適なチクソ性
などを接合剤に付与し得る点から、4〜5μm、さらに
は4.0〜4.6μmであることが好ましい。平均粒径
が4μm未満になると、チクソ性が高くなり過ぎて塗布
工程中での供給量がばらつく、あるいは脱泡が困難にな
るなど、取り扱いが困難となり、5μmを超えると、チ
クソ性が低(劣)化する傾向がある。また、同様に最適
なチクソ性などを接合剤に付与し得る点から、導電性粒
子のタップ密度は、4.5g/cm3以上、さらには
4.5〜5.5g/cm3、とくには4.7〜5.3g
/cm3であることが好ましい。タップ密度が4.5g
/cm3未満になると、接合剤の粘度が高くなりすぎる
ため、エポキシ樹脂に対して3〜9倍もの導電性粒子を
配合することができない。その結果、最適なチクソ性を
付与するにはチクソ性付与剤の添加が必要となる。ま
た、タップ密度が5.5g/cm3以上になると、導電
性粒子の製造が非常に困難となる傾向が生じる。The conductive particles include metal fine particles,
For example, silver powder, copper powder, nickel powder and the like are preferably used. The average particle diameter of the conductive particles is preferably 4 to 5 μm, and more preferably 4.0 to 4.6 μm, from the viewpoint that optimum thixotropic properties and the like can be imparted to the bonding agent. When the average particle size is less than 4 μm, the thixotropy becomes too high, the supply amount during the coating step varies, or defoaming becomes difficult, and handling becomes difficult. When the average particle size exceeds 5 μm, the thixotropy becomes low ( Inferior). Similarly, from the viewpoint that optimal thixotropic properties and the like can be imparted to the bonding agent, the tap density of the conductive particles is 4.5 g / cm 3 or more, more preferably 4.5 to 5.5 g / cm 3 , particularly 4.7-5.3g
/ Cm 3 . 4.5g tap density
If it is less than / cm 3 , the viscosity of the bonding agent becomes too high, so that 3 to 9 times as much conductive particles as epoxy resin cannot be blended. As a result, it is necessary to add a thixotropy-imparting agent in order to impart optimum thixotropy. Further, when the tap density is 5.5 g / cm 3 or more, the production of conductive particles tends to be extremely difficult.
【0010】本発明の接合剤は、エポキシ樹脂100重
量部に対し、潜在性硬化剤2〜30重量部、好ましくは
10〜30重量部および導電性粒子300〜900重量
部を配合したものである。潜在性硬化剤の配合量が2重
量部未満になると、接合剤の硬化が遅くなったり、硬化
が不充分となるなどの傾向が生じ、30重量部を超える
と、接合剤の保存安定性が悪くなったり、硬化後の接合
剤の物性が低下するなどの傾向が生じる。また、導電性
粒子の配合量が、300重量部未満になると、充分な導
電性が得られず、チクソ性も不充分となり、900重量
部を超えると、接合剤の粘度が高くなり、取り扱い作業
性が悪くなる。すなわち、潜在性硬化剤が2〜30重量
部のとき、接合剤を充分に硬化させることができるとと
もに、保存安定性も良好となり、導電性粒子が300〜
900重量部のとき、作業性および基板と部品との導通
性が良好となる。The bonding agent of the present invention is obtained by mixing 2 to 30 parts by weight of a latent curing agent, preferably 10 to 30 parts by weight, and 300 to 900 parts by weight of conductive particles with respect to 100 parts by weight of an epoxy resin. . If the amount of the latent curing agent is less than 2 parts by weight, the curing of the bonding agent tends to be slow or the curing is insufficient. If the amount exceeds 30 parts by weight, the storage stability of the bonding agent is reduced. There is a tendency that the bonding agent becomes worse or the physical properties of the bonding agent after curing are reduced. When the amount of the conductive particles is less than 300 parts by weight, sufficient conductivity cannot be obtained and the thixotropy becomes insufficient. When the amount exceeds 900 parts by weight, the viscosity of the bonding agent increases, and Worse. That is, when the latent curing agent is 2 to 30 parts by weight, the bonding agent can be sufficiently cured, the storage stability is improved, and the conductive particles are 300 to 300 parts by weight.
When the amount is 900 parts by weight, the workability and the conductivity between the board and the parts are improved.
【0011】接合剤のチクソ性は、例えばE型粘度計を
用い、30℃でロータ回転数0.5rpmの条件で測定
したときの粘度を、ロータ回転数を5.0rpmにする
以外は同様に測定したときの粘度で割った値で示すこと
ができる。本発明の接合剤の場合、前記のようにして求
められるチクソ性は、チクソ性付与剤を添加しなくても
4.0〜8.0、さらには4.5〜7.0となり得る。
この範囲は、後述の電子部品実装方法に最適なチクソ性
の範囲であり、接合剤の導電性を低下させることなく最
適な電子部品の実装を行うことができる。The thixotropy of the bonding agent is measured in the same manner as described above, except that the viscosity measured at 30 ° C. under a condition of a rotor rotation speed of 0.5 rpm using an E-type viscometer, except that the rotor rotation speed is set to 5.0 rpm. It can be shown as a value divided by the viscosity at the time of measurement. In the case of the bonding agent of the present invention, the thixotropy determined as described above can be 4.0 to 8.0, and even 4.5 to 7.0 without adding a thixotropy-imparting agent.
This range is the optimum thixotropy range for the electronic component mounting method described below, and allows optimal mounting of the electronic component without lowering the conductivity of the bonding agent.
【0012】本発明の接合剤の粘度は、導電性粒子を粒
径とタップ密度で分級した結果、例えばE型粘度計を用
い、30℃でロータ回転数0.5rpmの条件で測定し
たとき、100〜500Pa・s、さらには150〜4
50Pa・sとすることができる。The viscosity of the bonding agent of the present invention is obtained by classifying conductive particles according to particle diameter and tap density. For example, when the viscosity is measured using an E-type viscometer at 30 ° C. and a rotor rotation speed of 0.5 rpm, 100 to 500 Pa · s, 150 to 4
It can be 50 Pa · s.
【0013】本発明の接合剤は、後述する実施例でいう
加熱ダレ率を0〜5.0%、さらには0〜1.0%とす
ることができる。図1に、本発明の電子部品実装用接合
剤を用いて、基板上に電子部品を接合する場合の加熱前
および加熱硬化後の接合剤の状態を模式的に示す。ま
た、図2に、従来の接合剤を用いて、基板上に電子部品
を接合する場合の加熱前および加熱硬化後の接合剤の状
態を模式的に示す。ここで、図1および2中、1は基
板、2は電子部品、3は加熱前の本発明の接合剤、4は
加熱硬化後の本発明の接合剤、5は加熱前の従来の接合
剤および6は加熱硬化後の従来の接合剤を示す。加熱ダ
レ率が小さいと、図1および2から明らかなように、加
熱後も電子部品を接合剤でしっかりと固定できるため、
接合強度が高くなる。The bonding agent of the present invention can have a heat sag rate of 0 to 5.0%, and more preferably 0 to 1.0%, in the examples described later. FIG. 1 schematically shows the state of the bonding agent before and after heating and curing when an electronic component is bonded onto a substrate using the bonding agent for mounting electronic components of the present invention. FIG. 2 schematically shows a state of the bonding agent before and after heating and curing when an electronic component is bonded on a substrate using a conventional bonding agent. 1 and 2, 1 is a substrate, 2 is an electronic component, 3 is a bonding agent of the present invention before heating, 4 is a bonding agent of the present invention after heat curing, and 5 is a conventional bonding agent before heating. And 6 show conventional bonding agents after heat curing. If the heat sag rate is small, as is clear from FIGS. 1 and 2, the electronic component can be firmly fixed with a bonding agent even after heating.
The joining strength increases.
【0014】最適なチクソ性および粘度を有し、保存安
定性および潜在性に優れ、接着強度にも優れた接合剤と
しては、例えば以下のようなものが挙げられる。 (態様1) ビスフェノールA型エポキシ樹脂 100重量部 アダクト系硬化剤 15〜30重量部 銀粉 300〜800重量部 (態様2) 脂環式エポキシ樹脂 100重量部 酸無水物系硬化剤 50〜100重量部 アダクト系硬化剤 5〜15重量部 銀粉 300〜900重量部 (態様3) ビスフェノールF型エポキシ樹脂 100重量部 イミダゾール系硬化剤 3〜10重量部 ニッケル粉 500〜900重量部Examples of the bonding agent having the optimum thixotropy and viscosity, excellent storage stability and potential, and excellent adhesive strength include the following. (Aspect 1) Bisphenol A type epoxy resin 100 parts by weight Adduct-based curing agent 15-30 parts by weight Silver powder 300-800 parts by weight (Aspect 2) Alicyclic epoxy resin 100 parts by weight Acid anhydride-based curing agent 50-100 parts by weight Adduct type curing agent 5 to 15 parts by weight Silver powder 300 to 900 parts by weight (Aspect 3) Bisphenol F type epoxy resin 100 parts by weight Imidazole type curing agent 3 to 10 parts by weight Nickel powder 500 to 900 parts by weight
【0015】次に、本発明の接合剤を用いた電子部品の
実装方法について説明する。まず、接合剤を回路基板の
電極に印刷する。このとき電極部以外の部分をマスクで
覆うが、マスクとしてメタルマスクを用いることが、塗
布された接合剤の厚さが均一になるなどの点から好まし
い。また、同様の理由から、スキージの材質としては、
フッ素樹脂が好ましい。電極上には膜状に接合剤が塗布
される。その膜厚は、接合剤を基板に安定して供給し易
いという点から、40〜90μm、さらには40〜60
μmであることが好ましい。Next, a method for mounting an electronic component using the bonding agent of the present invention will be described. First, a bonding agent is printed on the electrodes of the circuit board. At this time, a portion other than the electrode portion is covered with a mask, but it is preferable to use a metal mask as the mask from the viewpoint of uniforming the thickness of the applied bonding agent. In addition, for the same reason, as the material of the squeegee,
Fluororesins are preferred. A bonding agent is applied on the electrodes in a film form. The thickness is 40 to 90 μm, and more preferably 40 to 60 μm, from the viewpoint that the bonding agent can be stably supplied to the substrate.
μm is preferred.
【0016】次に、接合剤上に電子部品を装着する。部
品の装着の仕方は電子部品の種類によって異なる。一般
には、後の加熱工程で接合剤の粘度が低下し、電子部品
の接合面を接合剤で充分に覆うことができる(濡れ性が
よい)ので、接合剤上に部品を置くだけでもよい。もち
ろん加圧して接合剤と電子部品とを充分に密着させても
よい。部品を装着したら加熱して接合剤を硬化させる。
硬化させる条件は接合剤の種類によって異なるが、一般
に、潜在性硬化剤の作用する温度、すなわち80〜20
0℃、さらには80〜150℃程度で硬化させる。Next, an electronic component is mounted on the bonding agent. How to mount the components differs depending on the type of the electronic components. In general, the viscosity of the bonding agent is reduced in the subsequent heating step, and the bonding surface of the electronic component can be sufficiently covered with the bonding agent (has good wettability). Therefore, the component may be simply placed on the bonding agent. Of course, the bonding agent and the electronic component may be sufficiently adhered by applying pressure. After the parts are mounted, they are heated to cure the bonding agent.
The curing conditions vary depending on the type of the bonding agent, but generally, the temperature at which the latent curing agent acts, that is, 80 to 20.
The composition is cured at 0 ° C., and more preferably at about 80 to 150 ° C.
【0017】[0017]
【実施例】次に、本発明を実施例に基づいてさらに具体
的に説明する。 《実施例1〜3》エポキシ樹脂として表1に示す樹脂A
〜C、潜在性硬化剤としてアミン系化合物をエポキシ化
合物で変性したアダクト系硬化剤(味の素(株)製のア
ミキュアPN−23(商品名)、以下PN−23とい
う。)および導電性粒子として表2に示す粒子Xおよび
Yを、表3に示す割合(重量部)で混合し、接合剤とし
た。Next, the present invention will be described more specifically based on examples. << Examples 1-3 >> Resins A shown in Table 1 as epoxy resins
To C, an adduct-based curing agent obtained by modifying an amine-based compound with an epoxy compound as a latent curing agent (Amicure PN-23 (trade name) manufactured by Ajinomoto Co., Inc .; hereinafter, referred to as PN-23); The particles X and Y shown in Table 2 were mixed in the ratio (parts by weight) shown in Table 3 to obtain a bonding agent.
【0018】[0018]
【表1】 [Table 1]
【0019】[0019]
【表2】 [Table 2]
【0020】[0020]
【表3】 [Table 3]
【0021】得られた接合剤について、各種特性を評価
した。評価方法(測定方法)は以下の通りである。 (1)体積抵抗値:JIS−K 6911に準じて測定
した。 (2)粘度:E型粘度計(3°コーン)を用いて、30
℃で回転数0.5rpmで、2回転目の数値を読みとっ
た。 (3)硬化性:基板上に接合剤を厚さ50±10μmの
膜状に塗布し、120℃で5分間加熱した後、触針法で
硬化を確認した。充分に硬化しているものを「○」、硬
化が不充分のものを「×」とした。 (4)保存安定性:接合剤の製造直後の粘度(η0)を
測定し、その後、その接合剤を30±1℃の温度下で保
存し、定期的に粘度(η1)を測定した。η1≧2×η0
となるまでに要した日数を調べた。結果を表4に示す。Various properties of the obtained bonding agent were evaluated. The evaluation method (measurement method) is as follows. (1) Volume resistance value: Measured according to JIS-K6911. (2) Viscosity: 30 using an E-type viscometer (3 ° cone)
The value of the second rotation was read at a rotation speed of 0.5 rpm at a temperature of ° C. (3) Curability: A bonding agent was applied on the substrate in a film having a thickness of 50 ± 10 μm, heated at 120 ° C. for 5 minutes, and then cured by a stylus method. Those that were sufficiently cured were rated "O", and those that were insufficiently cured were rated "x". (4) Storage stability: The viscosity (η 0 ) immediately after the production of the bonding agent was measured, and then the bonding agent was stored at a temperature of 30 ± 1 ° C., and the viscosity (η 1 ) was measured periodically. . η 1 ≧ 2 × η 0
The number of days required to reach was determined. Table 4 shows the results.
【0022】[0022]
【表4】 [Table 4]
【0023】《比較例1〜5》実施例で用いた原料と同
じ原料を表5に示す割合(重量部)で混合し、接合剤と
した。得られた接合剤について、各種特性を、実施例と
同様にして評価した。結果を表4に実施例1〜3と合わ
せて示す。<< Comparative Examples 1-5 >> The same raw materials as those used in the examples were mixed at the ratio (parts by weight) shown in Table 5 to obtain a bonding agent. Various characteristics of the obtained bonding agent were evaluated in the same manner as in the examples. The results are shown in Table 4 together with Examples 1 to 3.
【0024】[0024]
【表5】 [Table 5]
【0025】表4から、本発明の電子部品実装用接合剤
は、体積抵抗値が小さく、適度な粘度を有し、硬化性お
よび保存安定性が実用に適した範囲内であることがわか
る。From Table 4, it can be seen that the bonding agent for mounting electronic parts of the present invention has a small volume resistance value, an appropriate viscosity, and curability and storage stability within a range suitable for practical use.
【0026】《実施例4〜5》実施例1で用いた接合剤
と、樹脂A 100重量部、PN−23 15重量部、
平均粒径7.0μmでタップ密度3.1g/cm3の銀
粒子400重量部およびチクソ性付与剤としてステアリ
ン酸アマイドワックスを3重量部添加した接合剤とを用
いて、以下のようにして、実装の実用性を評価した。こ
こで、前者を用いる場合を実施例4、後者を用いる場合
を実施例5とする。<< Examples 4-5 >> 100 parts by weight of resin A, 15 parts by weight of PN-23,
Using 400 parts by weight of silver particles having an average particle size of 7.0 μm and a tap density of 3.1 g / cm 3 and a bonding agent to which 3 parts by weight of stearic acid amide wax was added as a thixotropic agent, as follows: The practicality of the implementation was evaluated. Here, a case where the former is used is referred to as a fourth embodiment, and a case where the latter is used is referred to as a fifth embodiment.
【0027】(1)部品接着強度:底面寸法0.6mm
×0.3mmを有する電子部品用に設計された基板の電
極上に、接合剤を厚さ50±10μmの膜状に印刷し
た。このとき、電極以外の部分をメタルマスクで覆い、
スキージにはフッ素樹脂の材質のものを用いた。塗布さ
れた接合剤上に一般的な電子部品装着装置を用いて前記
寸法の部品を装着し、それをリフロー用の炉に設置して
接合剤を硬化させた。リフロー炉の温度は90〜150
℃であり、この炉の中で接合剤は1〜30分間加熱され
る。次に、部品と基板との間の引っ張りせん断接着強度
を測定した。 (2)加熱ダレ率:基板上に接合剤を厚さ50±10μ
mの真円膜状に印刷し、その直径(φ0)を測定した。
次に、その接合剤を加熱硬化させた後、硬化した真円膜
状の接合剤の直径(φ1)を測定した。このとき式:
{(φ1−φ0)/φ0}×100から導かれる値を加熱
ダレ率(%)とした。結果を表6に示す。(1) Component adhesive strength: bottom dimension 0.6 mm
The bonding agent was printed as a film having a thickness of 50 ± 10 μm on an electrode of a substrate designed for an electronic component having a size of × 0.3 mm. At this time, cover the parts other than the electrodes with a metal mask,
The squeegee used was a fluororesin material. The components having the above dimensions were mounted on the applied bonding agent using a general electronic component mounting apparatus, and the components were set in a reflow furnace to cure the bonding agent. Reflow furnace temperature is 90-150
C. and the bonding agent is heated in this furnace for 1 to 30 minutes. Next, the tensile shear bond strength between the component and the substrate was measured. (2) Heat sag rate: 50 ± 10μ thickness of bonding agent on substrate
m, and the diameter (φ 0 ) was measured.
Next, the bonding agent was heated and cured, and the diameter (φ 1 ) of the cured round film-shaped bonding agent was measured. Then the formula:
The value derived from {(φ 1 −φ 0 ) / φ 0 } × 100 was defined as the heat sag rate (%). Table 6 shows the results.
【0028】[0028]
【表6】 [Table 6]
【0029】表6から、本発明の接合剤を用いた場合、
従来のごとくチクソ性付与剤を添加して適当な作業性を
付与した接合剤に比べ、加熱ダレ率が小さく、電子部品
と基板との間の接合強度も良好となることがわかる。As shown in Table 6, when the bonding agent of the present invention was used,
It can be seen that the heat sag rate is smaller and the bonding strength between the electronic component and the substrate is better than that of a bonding agent having an appropriate workability by adding a thixotropic agent as in the related art.
【0030】[0030]
【発明の効果】本発明の接合剤を用いて電子部品を基板
に接合すると、粘度とチクソ性が電子部品の実装に用い
るのに最適であり、加熱ダレ率も小さいため、電子部品
と基板との間の接着強度が優れたものとなる。また、本
発明の接合剤には、チクソ性付与剤を含有させる必要が
ないため、その添加による体積抵抗値の増大を避けるこ
とができ、電子部品と基板との導通性も優れたものとな
る。When an electronic component is bonded to a substrate using the bonding agent of the present invention, the viscosity and thixotropy are optimal for use in mounting the electronic component, and the heat sag rate is small. The adhesive strength between them is excellent. In addition, since the bonding agent of the present invention does not need to contain a thixotropy-imparting agent, an increase in volume resistance value due to the addition can be avoided, and the conductivity between the electronic component and the substrate becomes excellent. .
【図1】本発明の電子部品実装用接合剤を用いて基板上
に電子部品を接合する場合の加熱前および加熱硬化後の
接合剤の状態を示す模式図である。FIG. 1 is a schematic view showing a state of a bonding agent before and after heating and curing when an electronic component is bonded onto a substrate using the bonding agent for mounting electronic components of the present invention.
【図2】従来の接合剤を用いて基板上に電子部品を接合
する場合の加熱前および加熱硬化後の接合剤の状態を示
す模式図である。FIG. 2 is a schematic diagram showing a state of a bonding agent before and after heat curing when an electronic component is bonded on a substrate using a conventional bonding agent.
1 基板 2 電子部品 3 加熱前の本発明の接合剤 4 加熱硬化後の本発明の接合剤 5 加熱前の従来の接合剤 6 加熱硬化後の従来の接合剤 REFERENCE SIGNS LIST 1 substrate 2 electronic component 3 bonding agent of the present invention before heating 4 bonding agent of the present invention after heating 5 conventional bonding agent before heating 6 conventional bonding agent after heating and curing
───────────────────────────────────────────────────── フロントページの続き (72)発明者 秋口 尚士 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 平野 正人 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 中田 幹也 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Fターム(参考) 5E319 BB11 CC61 5G301 DA03 DA57 DD03 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Naoshi Akiguchi 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. 72) Inventor Mikiya Nakata 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F-term (reference) 5E319 BB11 CC61 5G301 DA03 DA57 DD03
Claims (4)
剤2〜30重量部および導電性粒子300〜900重量
部からなる電子部品実装用接合剤。1. A bonding agent for mounting electronic parts, comprising 100 parts by weight of an epoxy resin, 2 to 30 parts by weight of a latent curing agent, and 300 to 900 parts by weight of conductive particles.
cm3以上であり、かつ、平均粒子径が4〜5μmであ
る請求項1記載の電子部品実装用接合剤。2. The conductive particles having a tap density of 4.5 g /
The bonding agent for electronic component mounting according to claim 1, wherein the bonding agent is not less than 3 cm3 and an average particle diameter is 4 to 5 m.
接合剤を回路基板の電極に印刷する工程、塗布された接
合剤上に電子部品を装着する工程および前記接合剤を硬
化させる工程を含むことを特徴とする電子部品の実装方
法。3. The step of printing the bonding agent for mounting electronic components according to claim 1 on an electrode of a circuit board, the step of mounting an electronic component on the applied bonding agent, and the step of curing the bonding agent. A method for mounting an electronic component, comprising:
用接合剤の膜厚が、40〜90μmである請求項3記載
の実装方法。4. The mounting method according to claim 3, wherein the thickness of the electronic component mounting bonding agent applied in the printing step is 40 to 90 μm.
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JP26002899A JP3923687B2 (en) | 1999-09-14 | 1999-09-14 | Bonding agent for mounting electronic components and mounting method of electronic components using the same |
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JP26002899A JP3923687B2 (en) | 1999-09-14 | 1999-09-14 | Bonding agent for mounting electronic components and mounting method of electronic components using the same |
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JP2003206469A (en) * | 2001-11-12 | 2003-07-22 | Hitachi Chem Co Ltd | Adhesive composition and semiconductor device using the same |
JP2003221573A (en) * | 2001-11-12 | 2003-08-08 | Hitachi Chem Co Ltd | Adhesive material and semiconductor device using the same |
JP2007179772A (en) * | 2005-12-27 | 2007-07-12 | Matsushita Electric Ind Co Ltd | Conductive paste and mounting method of electronic part using this |
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JP2003206469A (en) * | 2001-11-12 | 2003-07-22 | Hitachi Chem Co Ltd | Adhesive composition and semiconductor device using the same |
JP2003221573A (en) * | 2001-11-12 | 2003-08-08 | Hitachi Chem Co Ltd | Adhesive material and semiconductor device using the same |
JP4507488B2 (en) * | 2001-11-12 | 2010-07-21 | 日立化成工業株式会社 | Bonding material |
JP2007179772A (en) * | 2005-12-27 | 2007-07-12 | Matsushita Electric Ind Co Ltd | Conductive paste and mounting method of electronic part using this |
JP2008166086A (en) * | 2006-12-28 | 2008-07-17 | Hitachi Ltd | Conductive sintered layer forming composition, and conductive film forming method and jointing method using this |
JP2012532942A (en) * | 2009-07-08 | 2012-12-20 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | Conductive adhesive |
US10524364B2 (en) | 2009-07-08 | 2019-12-31 | Henkel Ag & Co. Kgaa | Electrically conductive adhesives |
JPWO2011046176A1 (en) * | 2009-10-15 | 2013-03-07 | 日立化成株式会社 | Conductive adhesive, solar cell, manufacturing method thereof, and solar cell module |
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