JP2000131383A - Ic-testing system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the reliability of an IC test, to reduce the load of an operator, and to reduce recovery time by detecting the interruption of the test due to such factors as power failure, and at the same time, by detecting elimination of the factors when the factors are eliminated for performing the self diagnosis of a test device, and by determing whether or not the operation is normal. SOLUTION: When a control part 21 in a burn-in control device 20 detects power failure of a power supply part 30, test conditions being currently executed and/or test development information is stored into an execution state storage part 28, and the interruption of a test is displayed at a display part 23. When power failure is recovered and power is supplied to a burn-in test device 10, the control part 21 displays the input screen of a self-diagnostic start instruction on the display part 23 and waits for a self-diagnostic program start instruction by an operator. When the self-diagnostic program start instruction of the operator is inputted from an input part 22, the control part 21 outputs a self- diagnostic pattern signal to the test and control devices 10 and 20 according to setting diagnostic items for performing self diagnosis, and continues with the test, if the diagnostic result is normal.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC test system, and more particularly to an IC test system which is used when an IC test is interrupted due to a power failure or the like.
The present invention relates to an IC test system having a function of executing self-diagnosis of the IC test system itself.

[0002]

2. Description of the Related Art Conventionally, a semiconductor integrated circuit (IC (Integrated Circuit)) or an
arge Scale Integrated circuit), etc.)
The functions of each element such as a capacitor and a transistor are printed,
It is realized by a circuit formed by a method such as vapor deposition,
There is some variation in characteristics between the products mass-produced. It is necessary to ensure the reliability of the semiconductor integrated circuits by testing whether or not the characteristics of the semiconductor integrated circuits meet the standards, thereby determining the quality of each semiconductor integrated circuit. Performs such an IC test.

[0003] For example, as one form of this IC test, there is a burn-in test in which a semiconductor integrated circuit is placed in a furnace of a thermostat and a power supply voltage or a test pattern signal is applied to the semiconductor integrated circuit in the furnace from outside. is there.

[0004] In the burn-in test, the temperature of the furnace in the constant temperature bath is set to a high or low temperature, a test pattern signal is applied for a long time to apply stress, and an initial failure is detected. In the burn-in test, the test time per semiconductor integrated circuit is long, so thousands to 10,000 semiconductor integrated circuits are simultaneously placed in a furnace to shorten the test time and reduce the burden of costs. Let me.

[0005] Further, in a burn-in test execution program used by a burn-in control device for controlling test conditions in a thermostat, test items necessary for the burn-in test and convergence conditions of the burn-in test are set according to the type of the semiconductor integrated circuit. Have been.

[0006] If the burn-in test is interrupted due to a power failure, a momentary interruption, or any other factor that interrupts the burn-in test, an unexecuted or unconverged test item occurs, and the interrupted test starts from the beginning. Will have to start over
The results of tests performed before the interruption and the test time were wasted.

On the other hand, in a burn-in test system (Japanese Patent Application No. 9-355815) developed and filed by the present applicant, there is the following technique. That is, when the burn-in test is interrupted due to a power failure or the like, the burn-in test is restarted, the test is executed from the test item after the burn-in test was interrupted, and the waste test is restarted from the beginning. And prevent the occurrence of test time. For this reason, the burn-in test apparatus uses the burn-in test execution program to determine the progress of the burn-in test during execution, the burn-in test result non-defective / defective product determination map of the semiconductor integrated circuit, and the defect rate derived from the non-defective / defective product of the semiconductor integrated circuit. A function is provided to record all analysis results and information used by the control computer for controlling the burn-in test apparatus during the execution of the burn-in test.

[0008]

However, power outages,
Instantaneous interruptions and all other factors that interrupt the IC test
When the IC test is interrupted, it is necessary to perform a self-diagnosis of the IC test apparatus itself in order to restore the IC test apparatus to the state before the interruption including its reliability. That is, when the IC test is interrupted due to a power failure, an instantaneous interruption, or the like, the IC test apparatus does not always stop in a normal state.
A defective part of the semiconductor integrated circuit obtained by the test continued when the part of the C test apparatus has a failure and is not restored to the normal state is meaningless, and as a result, for example, about several tens of hours. Time-consuming burn-in tests
The C test has to be performed again.

At present, the execution of the self-diagnosis must be performed by the operator, and the self-diagnosis needs to be performed manually. However, the recovery procedure is complicated and requires a lot of labor.

The present invention has been made in view of the above problems, and when an IC test including a burn-in test or the like is interrupted, a power failure, an instantaneous interruption, etc. are recovered, and the IC test apparatus becomes operable. At this point, before the interrupted IC test is continuously executed, the self-diagnosis of the IC test apparatus is automatically performed, thereby improving the reliability of the IC test and reducing the burden on the operator, It is another object of the present invention to provide an IC test apparatus capable of shortening a recovery time.

[0011]

According to the first aspect of the present invention,
A test signal generated and input based on test conditions for testing a plurality of ICs under test is input to the IC under test, and a process is executed based on the test signal. An IC test device that outputs a detection signal detected from the IC test device; and a test signal based on the test condition is generated and output to the IC test device, and the IC under test is generated based on a detection signal input from the IC test device. A control device for executing the test of the IC under test by determining pass / fail of the test, wherein the control device detects the interruption of the test when the test is interrupted by any interruption factor, and Interruption detection means for detecting disappearance of the interruption factor when the interruption factor has disappeared;
If the interruption of the test is detected by the interruption detecting means, and then the disappearance of the interruption factor is detected, the IC test device and the control device are self-diagnosed to determine whether the IC test device and the control device operate normally. And self-diagnosis means for determining whether

According to the IC test system of the present invention, a test signal generated and input based on test conditions for testing a plurality of ICs under test is input to the IC under test, An IC test apparatus that executes a process based on the test signal and outputs a detection signal detected from the IC under test by the process, and generates a test signal based on the test conditions and outputs the test signal to the IC test apparatus , Said I
A control device for executing the test of the IC under test by determining the quality of the IC under test based on the detection signal input from the C test device. When the test is interrupted, the interruption of the test is detected by interruption detection means for detecting the interruption of the test and detecting the disappearance of the interruption factor when the cause of the interruption is eliminated, and thereafter, the disappearance of the interruption factor is detected. Then, the IC test device and the control device are self-diagnosed to determine whether the IC test device and the control device operate normally.

Therefore, in the IC test, the power failure, instantaneous interruption, or any other factor that interrupts the IC test may cause the IC test to fail.
If the test is interrupted, it is diagnosed whether the IC test device or the control device itself operates normally, so that self-diagnosis, which is usually performed manually by an operator, can be performed with a simple operation. After the disappearance of the factors, the time required for the test to be restored is reduced, the work load is reduced, and the overall test time can be minimized.

According to a second aspect of the present invention, there is provided the first aspect of the present invention.
In the C test system, the control device includes a test condition storage unit that stores the test conditions, an execution status storage unit that stores test results of the test, test progress information, and the like, and a test condition storage unit. A test condition for resetting is set based on the test condition and the test progress information stored in the execution status storage means, and a test signal is generated based on the test condition for resetting. And a test continuation means for outputting the test result to the IC test apparatus.

According to the IC test system according to the second aspect of the present invention, in the IC test system according to the first aspect, the control device stores a test condition, and stores a test result of the test, test progress information, and the like. Setting a resetting test condition for continuously executing the test based on the stored test condition and the test progress information, generating a test signal based on the resetting test condition, and Output to test equipment.

Therefore, in addition to the effect of the first aspect of the present invention, the self-diagnosis of the IC test system itself is performed to confirm whether the IC test system operates normally, and further, to check the test results before the interruption. , Based on the course of the test,
Since it is possible to continue the test after the interruption,
The same validity as before the interruption can be restored to the test results of the test continued after the interruption.

According to a third aspect of the present invention, there is provided the first aspect of the present invention.
In the C test system, the test continuation means generates a test signal based on the resetting test condition when the self-diagnosis means determines that the IC test device and the control device operate normally. It is characterized in that it is output to a test device.

According to the IC test system according to the third aspect of the present invention, in the IC test system according to the second aspect, the test continuation means determines in the self-diagnosis means that the IC test apparatus and the control apparatus operate normally. In this case, a test signal is generated based on the resetting test condition and output to the IC test apparatus.

When the self-diagnosis unit determines that the IC test device and the control device operate normally, the control unit generates a test signal based on the resetting test condition by the test continuation unit. In addition to outputting to the IC test apparatus, the test may be started from the beginning, or the test may be ended.

Therefore, in addition to the effect of the invention described in claim 2, the test can be continued only when the self-diagnosis confirms that the IC test system operates normally, and there is an abnormality in the IC test system. In this case, since the test is not continued, the reliability of the result obtained by the IC test can be guaranteed.

According to a fourth aspect of the present invention, in the IC test system according to any one of the first to third aspects, when the self-diagnosis means determines that the IC test apparatus and the control apparatus do not operate normally, And a self-diagnosis of the IC test apparatus and the control apparatus.

According to the IC test system according to the fourth aspect of the present invention, in the IC test system according to any one of the first to third aspects, the self-diagnosis means determines that the IC test apparatus and the control apparatus do not operate normally. When it is determined, the self-diagnosis of the IC test device and the control device is further performed.

When the self-diagnosis means determines that the IC test apparatus and the control apparatus do not operate normally, the control apparatus further performs a self-diagnosis of the IC test apparatus and the control apparatus by the self-diagnosis means. Besides the execution, the test may be terminated.

Therefore, in addition to the effect of the invention according to any one of the first to third aspects, after the repair of the abnormal part is performed by the operator, the IC test system is again self-diagnosed to confirm that the IC test system operates normally. I can
The legitimacy of the C test system can be further improved, the time required for the self-diagnosis again can be shortened, and the burden of the work labor can be reduced.

According to a fifth aspect of the present invention, there is provided the IC test system according to any one of the first to fourth aspects, wherein the control device includes a test result of the test, test progress information, and the like.
And a display unit that displays a diagnosis result of the self-diagnosis, and a display control unit that displays the test result of the test, test progress information, and the like, and the diagnosis result of the self-diagnosis on the display unit. Features.

According to the IC test system of the fifth aspect of the present invention, in the IC test system according to any one of the first to fourth aspects, a test result, test progress information, etc., and a self-diagnosis result are provided. Is displayed on the display unit.

Therefore, in addition to the effects of the invention according to any one of claims 1 to 4, the operator can display the displayed IC.
The test progress information can be used to confirm the interruption of the test, etc., and the results of the self-diagnosis are displayed, so that the abnormal part of the IC test system can be easily grasped, and the operator can repair the parts to be repaired. Can be clearly confirmed, so that a quick and efficient recovery operation of the IC test system can be performed.

According to a sixth aspect of the present invention, in the IC test system according to any one of the first to fifth aspects, the test is installed in a thermostatic chamber adjusted to a set temperature set by a burn-in test condition. The burn-in test is performed on a plurality of ICs to be tested.

According to the sixth aspect of the present invention, in addition to the effect of the first aspect of the present invention, in the burn-in test, an abnormality occurs in the setting of the test temperature due to the occurrence of a power failure or the like. Since the possibility of the burn-in test is high and the time required for the burn-in test is long, the time required for restoration for one test interruption and the burden of labor are large, and the validity of the IC test system by self-diagnosis is confirmed. The continuous execution of the burn-in test significantly reduces the time required for the test and reduces the burden on the work.

[0030]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIGS.
A burn-in test system as an embodiment of the IC test system of the present invention will be described in detail.

First, the configuration will be described. FIG. 1 is a block diagram showing a main configuration of a burn-in test system 1 according to the present embodiment. In FIG. 1, a burn-in test system 1 includes a burn-in test device (IC test device) 1
0 and a burn-in control device (control device) 20.
Heater unit 12, temperature sensor 13, control unit 14, and I
/ F unit 15 and a burn-in control device 20
Is a control unit (self-diagnosis unit, test continuation unit, display control unit) 21, an input unit 22, a display unit 23, a test condition storage unit (test condition storage unit) 24, a program storage unit 25, a clock unit 26, a power failure detection (Interruption detecting means) 27, an implementation status storage section (implementation status storage means) 28, an I / F section 29, and a power supply section 30.

In the burn-in test apparatus 10, the thermostat 1
1 is a semiconductor integrated circuit (IC or L
A furnace 11a for setting and heating a plurality of (eg, several thousands to 10,000) SIs is built in, and the test temperature inside the furnace 11a is set to the heat generation temperature of the heater unit 12.
A test signal input terminal 11b for supplying a power supply voltage and a test pattern signal input from the control unit 14 to the semiconductor integrated circuit set in the furnace 11a is provided in the constant temperature bath 11.
Is provided.

The heating temperature of the heater section 12 is controlled by a temperature control signal input from the control section 14.
The heating temperature in the furnace 11a of the thermostat 11 is set. Temperature sensor 13 detects a heating temperature in furnace 11a and outputs the detected temperature to control unit 14 as a predetermined temperature detection signal.

The control unit 14 outputs a temperature control signal to the heater unit 12 in accordance with a temperature setting signal input from the burn-in control unit 20 via the I / F unit 15 to control the heat generation temperature of the heater unit 12. Then, it monitors whether or not the heating temperature in the furnace 11a is within a set temperature range based on a temperature detection signal input from the temperature sensor 13. If the heating temperature is outside the set temperature range, the temperature is set so as to be within the set temperature range. A control signal is output to the heater section 12 to control the heating temperature so that the heating temperature in the furnace 11a is constant at the test condition temperature.

The control unit 14 also supplies a power supply voltage, a test pattern signal, and the like input from the burn-in control unit 20 via the I / F unit 15 to a test signal input terminal 11 of the thermostatic chamber 11.
The test items are supplied to the semiconductor integrated circuit in the furnace 11a via the b, and the test items based on the test conditions set in the burn-in control device 20 are executed. Further, the control unit 14 outputs a temperature detection signal input from the temperature sensor 13 to the I / F unit 15.
To the burn-in control device 20 through which the progress of the burn-in test is monitored.

The control unit 14 transmits the self-diagnosis pattern signal input from the burn-in control device 20 via the I / F unit 15 to each unit (the constant temperature bath 11, the heater unit 12, the temperature sensor 13) of the burn-in test device 10. , And other parts constituting the burn-in test apparatus 10), and detects whether or not the normal operation is performed. The diagnostic result is used as self-diagnosis data to provide information that each part is normal or abnormal.
Output to the burn-in control device 20 via the / F unit 15.

The I / F unit 15 includes a predetermined connection cable 40
The control unit 14 and the burn-in control device 20 transmit and receive a temperature setting signal, a power supply voltage, a test pattern signal, a temperature detection signal, and the like.

The control unit 2 in the burn-in control device 20
1 executes a burn-in test process (see FIG. 2), which will be described later, based on a burn-in test process program stored in the program storage unit 25 and a burn-in test condition stored in the test condition storage unit 24. The temperature setting signal is sent to the burn-in test apparatus 10 via the I / F unit 29.
And the test temperature is set, and the power supply voltage, the test pattern signal, and the like are output to the burn-in test apparatus 10 via the I / F unit 29 to set the test conditions and execute the burn-in test.

The control unit 21 is provided with the program storage unit 2
When a power failure is detected by the power failure detection unit 27 by executing a test recovery process (see FIG. 3) described later based on the test recovery process program stored in the test program 5, the test being executed immediately before the power failure is detected. The condition and the progress of the test (elapsed time of the test item with reference to the clock unit 26) are stored in the execution status storage unit 2.
8 and the display unit 23 displays that the power failure has been detected.

Further, when the power supply is restored, the control section 21 executes a self-diagnosis processing based on a self-diagnosis processing program stored in the program storage section 25,
The self-diagnosis pattern signal is output to the burn-in test device 10 via the I / F unit 29, and the burn-in control device 2
0 (test condition storage unit 24, clock unit 26, power supply unit 3)
0, and other parts constituting the burn-in control device 20), a self-diagnosis pattern signal is supplied, and a self-diagnosis, which is a test for confirming whether or not each part of the burn-in test device 10 and the burn-in control device 20 operate normally, is performed. Then, it is determined whether or not each part of the burn-in test apparatus 10 and the burn-in control apparatus 20 has an abnormality, and information that each part is normal or abnormal is obtained as a diagnosis result. And display it on the display unit 23.

Further, only when the result of the self-diagnosis processing is normal, the control unit 21 displays a selection screen for selecting any one of “continue”, “restart” and “cancel” of the interrupted burn-in test. 23, and executes processing based on the selection.

When "continue" is selected, continuation processing (see FIG. 4) described later is executed based on the continuation processing program stored in the program storage unit 25, and when "restart" is selected. Outputs a temperature setting signal, a test pattern signal, and the like to the burn-in test apparatus 10 via the I / F 29, and re-executes the burn-in test from the beginning.

In the continuation processing, the control unit 21 reads the continuation processing program stored in the program storage unit 25, reads out the test conditions and the test progress status, and reads out the read out test conditions when a power failure occurs. The test condition (set temperature, set temperature, etc.) is set in the burn-in test apparatus 10 so that the reset test condition for continuing the burn-in test is set based on the test progress state and the burn-in test is restarted from the remaining test items. Reset the power supply voltage, test pattern signal, test time, etc.).

Further, the control unit 21 stores the test result of the burn-in test in the execution status storage unit 28 and displays the test result on the display unit 23. The control unit 21
Stores a new burn-in test item in the test condition storage unit 24 according to the burn-in test condition (each set value such as a test condition, a power supply voltage, a test pattern signal, and a test time) input from the input unit 22.

The input unit 22 includes numerical keys and various function keys, and the like, and burn-in test conditions (each set value such as a test temperature, a power supply voltage, a test pattern signal, and a test time) input by operating the keys, and other information. Are output to the control unit 21.

The display 23 is a CRT (Cathode Ray Tu)
be) and a liquid crystal display panel.
1. The test result and progress information of the burn-in test process input from the control unit 1 and the burn-in test conditions input from the input unit 22 are displayed. Each unit of the burn-in test device 10 and the burn-in control device 20 input from the control unit 21 is displayed. Displays the result of the self-diagnosis.

The test condition storage unit 24 has a RAM (Random
Access Memory) and the like, and burn-in test conditions (such as test temperature, power supply voltage, test pattern signal, and test time for pre-test, room temperature test, and burn-in test) set in advance or input from the input unit 22. Each set value) is stored.

The program storage unit 25 is constituted by a programmable ROM (Read Only Memory) or the like, and stores a burn-in test processing program, a test return processing program, a self-diagnosis processing program, and a continuation processing program executed by the control unit 21. .

The clock unit 26 measures the date and the current time, and outputs the date and the current time data to the control unit 21.

The power failure detection unit 27 detects the occurrence of a power failure in a commercial power supply (not shown) supplied from the outside to the burn-in test system 1 to the power supply unit 30, detects the recovery of the power failure, and detects the power failure. The state is output to the control unit 21 as a power failure detection signal.

The execution status storage unit 28 is composed of a large-capacity storage medium such as a replaceable hard disk device, and stores the test result of the burn-in test processing executed by the control unit 21 and, when a power failure occurs, immediately before the power failure. , Test information such as a test condition being executed and a test progress state (elapsed time of the test item with reference to the timer unit 26) is stored.

The I / F unit 29 includes a predetermined connection cable 40
Is connected to the burn-in test apparatus 10 through the
A temperature setting signal, a power supply voltage, a test pattern signal, and a temperature detection signal are supplied between the apparatus and the burn-in test apparatus 10.

The power supply section 30 generates and supplies a power supply voltage required in each section in the burn-in control device 20 from a commercial power supply (not shown) supplied from the outside. The power supply unit 30
Also has a function as a storage battery. When a power failure occurs, the storage battery function supplies a necessary power supply voltage to each unit in the burn-in control device 20 for a predetermined time.
To execute the test return process executed by

Next, the operation of this embodiment will be described.

First, the burn-in test processing executed in the burn-in test system 1 of the present embodiment will be described with reference to the flowchart shown in FIG.

The burn-in test process for a semiconductor integrated circuit in the burn-in test system 1 is usually performed, for example, as shown in FIG.
The flowchart shown in FIG.

When the burn-in control device 20 of the burn-in test system 1 confirms the input of the execution of the test start command from the input unit 22, the burn-in test is performed according to the test items set in the burn-in test processing program stored in the program storage unit 25. First, in the burn-in test apparatus 10, a pretest in which a predetermined power supply voltage and a test pattern signal are applied to the semiconductor integrated circuit at normal temperature without heating the semiconductor integrated circuit set in the furnace 11a in the constant temperature chamber 11 Is performed (step S1).

After performing the pretest, the heater unit 12 is further heated so that the temperature in the furnace 11a in the constant temperature bath 11 rises to, for example, 125 degrees Celsius, and the burn-in test is performed at 125 degrees Celsius ( Step S2). Then, the heating control of the heater unit 12 is stopped again so that the temperature in the furnace 11a in the constant temperature bath 11 decreases, and the control unit 14
Outputs a test end signal to the burn-in test apparatus 10 via the I / F unit 15.

Further, after performing the burn-in test processing as described above, a non-defective / defective product judgment map of the semiconductor integrated circuit, various information such as log data and the like are prepared, and the test result is stored in the burn-in control device 20 to perform the burn-in test. The test processing ends.

The above is the burn-in test processing executed in the burn-in test system 1 of the present embodiment.

In the burn-in test process shown in FIG.
The control unit 21 in the burn-in control device 20 detects a power failure of the burn-in test system 1 at a predetermined timing such as a one-second cycle. The flow of the test return processing including the power failure detection and the subsequent self-diagnosis processing will be described with reference to the flowchart of FIG.

Control unit 21 in burn-in control unit 20
Detects whether there is a power failure (including an instantaneous interruption) in the commercial power supplied from the outside to the power supply unit 30 (step S20).
1) When a power failure is detected (Step S201; Ye)
s), the currently executed test conditions, that is, the test conditions (each set value such as a test temperature, a power supply voltage, a test pattern signal, and a test time) read from the test condition storage unit 24 and set in the burn-in test apparatus 10 are stored. The test progress information (elapsed time of the test, actual heating temperature information, and information on the actual heating temperature, which is monitored during the power failure in the burn-in test apparatus 10, as well as being stored in the execution status storage unit 28 (step S 202)). The non-defective / defective product determination map, various information such as log data, and the like created in step S203 are stored in the execution status storage unit 28 (step S203).

Next, the control unit 21 in the burn-in control device 20 displays a message indicating that the burn-in test has been interrupted.
To notify the operator of the interruption of the burn-in test (step S204).

Thereafter, the commercial power supplied from the outside to the power supply section 30 recovers from the power failure, and the burn-in test apparatus 10
Is supplied (step S205), the control unit 21 in the burn-in control device 20 causes the display unit 23 to display an input screen for a self-diagnosis start instruction, and waits for a self-diagnosis program start instruction from the operator. At this time, operations other than the start instruction are prohibited in order to give top priority to the reliability check of the burn-in test apparatus 10.

Then, when the operator inputs a self-diagnosis start instruction from the input unit 22 (step S20).
6) The control unit 21 in the burn-in control device 20 reads the self-diagnosis program stored in the program storage unit 25, and according to the diagnosis items set in the self-diagnosis program, the burn-in test device 10 and the burn-in control device. Then, a self-diagnosis pattern signal is output to each of the units 20 to perform self-diagnosis (step S207).

After that, when the self-diagnosis of each part of the burn-in test device 10 and the burn-in control device 20 is completed, the control unit 21 acquires self-diagnosis data for notifying the normality or abnormality of the diagnosis location, and completes the diagnosis results. It is determined whether or not it is normal (step S208).

When the diagnosis result is normal (step S
208: normal) is the control unit 2 of the burn-in control device 20
1 displays on the display unit 23 a recovery operation selection screen for inputting a selection instruction for continuing the interrupted burn-in test, restarting the interrupted burn-in test, and canceling the interrupted burn-in test. (Step S209).

When the operator selects to continue the burn-in test (step S209; continue),
A continuation process for continuing and restarting the burn-in test from the test condition and the test progress status at the time of the occurrence of the power failure is executed (Step S210), and thereafter, the process returns to Step S201.

The continuation processing executed by the control unit 21 will be described with reference to the flowchart shown in FIG.

In this continuation process, the control unit 21 first reads out the test conditions and the test progress information at the time of the occurrence of the power failure stored in the execution status storage unit 28 (steps S301 and S302), and reads the test conditions and the test progress. The test condition is reset based on the information (step S30).
3). That is, the test conditions (test temperature, power supply voltage, test pattern signal,
Each set value such as a test time) is re-transferred to the burn-in test apparatus 10 by the I / F unit 29 to reset the test condition at the time of the occurrence of the power failure as the resetting test condition, and to store the execution status at the time of the power failure. In order to execute a reset process such as resetting the test time by subtracting the test elapsed time from the elapsed time until the occurrence of the power failure based on the test progress information stored in the burn-in test apparatus 28, A signal indicating the start is output, and the test content executed at the time of the occurrence of the power failure is executed again (step S304).

At this time, the control section 14 in the burn-in test apparatus 10 sends the I / F section 15
Furnace 11 based on the resetting test conditions input via
While monitoring the temperature inside the furnace a, the heater unit 12 is controlled to adjust the temperature inside the furnace 11a to a set temperature.
3 outputs the monitor temperature in the furnace 11a detected by the burn-in control device 20 to the burn-in control device 20 and receives the retest start signal input from the burn-in control device 20 under the resetting test conditions input from the burn-in control device 20. A certain power supply voltage, a test pattern signal, or the like is supplied to the semiconductor integrated circuit in the furnace 11a through the test signal input terminal 11b of the constant temperature chamber 11, and a power failure occurs based on the resetting test conditions set in the burn-in control device 20. The test is continuously executed, and a signal indicating the end of the retest is output to the burn-in control device 20 when the retest is completed.

Control unit 21 in burn-in control unit 20
After confirming the reception of the retest end signal output from the burn-in test apparatus 10, it checks whether there are any remaining test items based on the test conditions stored in the test condition storage unit 24 (step S 305). If there are no remaining test items (step S305; No), the continuation process is terminated. If there are remaining test items, the test conditions (each set value such as test temperature, power supply voltage, test pattern signal, test time, etc.) Is read out from the test condition storage unit 24 and transferred to the burn-in test apparatus 10 by the I / F unit 29 to set the test condition (step S306).

Next, the control section 21 confirms the temperature setting based on the temperature state in the furnace 11b transmitted from the burn-in test apparatus 10 via the I / F section 29, and indicates the start of the test to the burn-in test apparatus 10. A signal is output to execute the test (step S307).

At this time, the control section 14 in the burn-in test apparatus 10 sends the I / F section 15
The heater unit 12 is controlled while monitoring the temperature in the furnace 11a based on the test conditions input through the furnace 11a.
The inside temperature is adjusted to the test temperature, the monitor temperature in the furnace 11a detected by the temperature sensor 13 is output to the burn-in control device 20, and when the test start signal input from the burn-in control device 20 is received, the burn-in control device A power supply voltage, a test pattern signal, and the like, which are test conditions input from 20, are supplied to the semiconductor integrated circuit in the furnace 11 a via a test signal input terminal 11 b of the thermostat 11, and a test set in the burn-in control device 20. The test based on the condition is continuously executed, and a signal indicating the end of the test is output to the burn-in control device 20 at the end of the test.

When the control section 21 in the burn-in control apparatus 20 confirms the reception of the test end signal output from the burn-in test apparatus 10, the control section 21 uses the test conditions stored in the test condition storage section 24 to execute the burn-in test item. Is completed (step S308), and if it is completed (step S308; Yes), the continuation process is completed. If not (step S308; No), the process returns to step S305 to return to the remaining process. The presence or absence of a test item is checked again, and if there are remaining test items, step S306
Steps S308 to S308 are repeatedly executed until the test item ends, and the continuation processing ends.

When the continuation process is executed, a temperature rise time or a temperature fall time is required for restoring the temperature stress, and the burn-in test itself is in a waiting state during that time.

In the return process of the burn-in test shown in FIG. 3, when “restart” is selected and input through the input unit 22 by the recovery operation selection in step S209, the control unit 21 of the burn-in control device 20 The burn-in test is performed from the beginning.

That is, the burn-in test is restarted from the beginning in accordance with the test items set in the burn-in test processing program stored in the program storage unit 25, and the semiconductor set in the furnace 11a in the thermostat 11 in the burn-in test apparatus 10. A pretest in which a predetermined power supply voltage and a test pattern signal are applied to the semiconductor integrated circuit at room temperature without heating the integrated circuit (step S1; see FIG. 2), and a burn-in test at 125 degrees Celsius (step S2; FIG. 2) (See FIG. 2) to create various types of information such as a non-defective / defective product determination map, log data, and the like of the semiconductor integrated circuit, and save the test results in the burn-in control device 20.

Further, in the test return processing shown in FIG.
"Cancel" by selecting the recovery operation in step S209
Is selected, the control unit 2 of the burn-in control device 20
1 discards the execution condition of the burn-in test such as the test conditions and the test progress status stored in the execution status storage unit 28 (step S211), and returns to the process of step S201 without continuing or restarting the burn-in test.

Step S20 of the test return processing shown in FIG.
In 8, when it is determined that the result of the self-diagnosis of the burn-in test apparatus 10 and the burn-in control apparatus 20 is abnormal (step S <b>208; abnormal), the control unit 21 of the burn-in control apparatus 20 performs the burn-in An abnormal portion of the test device 10 or the burn-in control device 20 is displayed on the display unit 23 to notify the operator (step S2).
12) Further, a screen for selecting whether or not to re-execute the self-diagnosis is displayed on the display unit 23 (step S213).

Here, after the operator repairs the abnormal part of the burn-in test apparatus 10 or the burn-in control apparatus 20 and repairs the abnormal part, "re-execution" of the self-diagnosis is selected. (Step S
213; re-execution), the control unit 21 returns to the process of step S207, and re-diagnoses each unit of the burn-in test apparatus 10 and the burn-in control device 20 based on the diagnostic items set in the self-diagnosis program (step S207). .

If there is no abnormal part in the burn-in test apparatus 10 and the burn-in control apparatus 20 due to the repair by the operator, the result is determined to be normal in the re-executed self-diagnosis (step S208; normal), and the subsequent recovery is performed. The operation of “continue”, “restart”, or “cancel” of the interrupted burn-in test selected in the operation selection (step S209) is started.

When "end" is selected in the diagnosis processing selection in step S213, the test return processing is ended, and the burn-in test is ended while the state interrupted by a power failure or the like is maintained. That is, the burn-in test is terminated in a state where the test conditions and the progress of the burn-in test at the time of the occurrence of the power failure are stored in the execution status storage unit 28.

As described above, when the burn-in control device 20 of the burn-in test system 1 detects a power failure during the execution of the burn-in test, the burn-in control device 20 stores the test condition, test progress status and execution status storage unit 28 at the time of the power failure. Then, the burn-in test device 10 and the burn-in control device 2
When the burn-in test apparatus 10 and the burn-in control apparatus 20 operate normally, the self-diagnosis processing is performed on each unit of 0, and it is possible to continue the test after the test item of the burn-in test interrupted by the power failure.

As a result, the burn-in test apparatus 10 and the burn-in control apparatus 20 continue the test after self-diagnosis confirms that they operate normally as before the interruption. The validity of the test results can be guaranteed.

The test return processing step when the burn-in test is interrupted is stored in the program storage unit 25 of the burn-in control device 20 as a test return processing program, and the control unit 21 stores this test return processing program. Since the read-out operation is performed to detect the interruption of the burn-in test, perform the self-diagnosis processing of each part of the burn-in test apparatus 10 and the burn-in control apparatus 20, and continue the burn-in test after the interruption of the burn-in test, the operator manually operates the apparatus. The work load of performing a self-diagnosis of each part can be omitted, and the result of the self-diagnosis can be obtained by a simple operation, so that the burn-in test can be efficiently restored.

Further, since the time required for the self-diagnosis processing is about several tens of minutes, the time required for restoring the interrupted burn-in test can be reduced, and the extension of the interrupted test time can be minimized as a whole. Becomes

In addition, the result of the self-diagnosis is notified to the operator of the normal or abnormal part as self-diagnosis data. Therefore, the operator checks the abnormal part only when there is an abnormality in the self-diagnosis result. Then, the work can be repaired, and the work load can be reduced.

Further, the control unit 2 of the burn-in control device 20
1 always executes the self-diagnosis process when recovering from the power failure,
Since the test can be continued thereafter, the reliability of the test result of the burn-in test can be restored to the same condition as before the interruption.

The burn-in test process shown in FIG. 2 in the above embodiment is an example, and the present invention can be applied to other various burn-in test processes.

The burn-in test system has been described as an example of the IC test system to which the present invention is applied. However, the present invention is not limited to this burn-in test system, but may be applied to various IC test systems for testing semiconductor integrated circuits. However, the present invention can be applied.

[0092]

According to the first aspect of the present invention, when an IC test is interrupted due to a power failure, an instantaneous interruption, or any other factor that interrupts the IC test, an IC test apparatus or a control apparatus is provided. Diagnosis as to whether or not the device itself operates normally allows self-diagnosis, which is usually performed manually by the operator, to be performed with simple operations, and the time required for the test to recover after the disappearance of the interruption factor is reduced. In addition, the work load can be reduced, and the overall test time can be minimized.

According to the second aspect of the present invention, the self-diagnosis of the IC test system itself is used to confirm whether the IC test system operates normally, and further to check the test results and test progress before the interruption. Based on this, it is possible to continue the test after the interruption, so that the test results of the test continued after the interruption can be restored to the same validity as before the interruption.

According to the third aspect of the invention, the test can be continued only when it is confirmed by the self-diagnosis that the IC test system operates normally. IC will not be continued
The reliability of the results obtained by the test can be guaranteed.

According to the fourth aspect of the present invention, the self-diagnosis of the IC test system can be performed again after the operator repairs the abnormal part, and it can be confirmed that the IC test system operates normally. The legitimacy can be further improved, the time required for the self-diagnosis again can be shortened, and the burden of the work labor can be reduced.

According to the fifth aspect of the present invention, the operator can confirm the interruption of the test or the like based on the displayed IC test progress information, and the result of the self-diagnosis is displayed. Abnormal spots and the like can be easily grasped, and the operator can clearly confirm the parts to be repaired.
The C test system can be restored.

According to the invention of claim 6, in the burn-in test, there is a high possibility that an abnormality occurs in the setting of the test temperature or the like due to the occurrence of a power failure or the like, and the time required for the burn-in test is long. The time required for recovery from the interruption of the test, the burden of work labor, etc. is large, and confirming the validity of the IC test system by self-diagnosis, and then continuing to execute the burn-in test shortens the time required for the test, The effect of reducing the burden of work labor is remarkably exhibited.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a configuration of a control system of a burn-in test system 1 according to an embodiment to which the present invention is applied.

FIG. 2 is a flowchart showing a burn-in test process performed in the burn-in test system 1 of FIG.

FIG. 3 is a control unit 21 in the burn-in control device 20 of FIG.
Is a flowchart showing the flow of a test return process executed by the test.

4 is a control unit 21 in the burn-in control device 20 of FIG.
5 is a flowchart showing a flow of a continuation process executed by the.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Burn-in test system 10 Burn-in test apparatus 11 Constant temperature chamber 11a Furnace 11b Test signal input terminal 12 Heater section 13 Temperature sensor 14 Control section 15 I / F section 20 Burn-in control apparatus 21 Control section 22 Input section 23 Display section 24 Test condition storage section 25 Program storage unit 26 Clock unit 27 Power failure detection unit 28 Implementation status storage unit 29 I / F unit 30 Power supply unit 40 Connection cable

Claims (6)

[Claims] 1. A test signal generated and input based on test conditions for testing a plurality of ICs under test is input to the IC under test, and a process is executed based on the test signals. An IC test apparatus that outputs a detection signal detected from the IC under test, and generates a test signal based on the test conditions, outputs the test signal to the IC test apparatus, and outputs a test signal based on the detection signal input from the IC test apparatus. And a control device for executing the test of the IC under test by determining the quality of the IC under test. The control device, when the test is interrupted by any interruption factor, interrupts the test. And interruption detection means for detecting disappearance of the interruption factor when the interruption factor has disappeared, and interruption of the test is detected by the interruption detection means. And self-diagnosis means for self-diagnosing the IC test device and the control device when the disappearance of the interruption factor is detected, and determining whether the IC test device and the control device operate normally. Characteristic IC test system. 2. The control device according to claim 1, wherein: the test condition storage means stores the test condition; the test condition storage means stores test results and test progress information of the test; and the test condition storage means stores the test condition information. A test condition for resetting is set based on the test condition and the test progress information stored in the execution status storage means, and a test signal is generated based on the test condition for resetting. The IC test system according to claim 1, further comprising: a test continuation unit that outputs the test result to the IC test apparatus. 3. The test continuation means generates a test signal based on the resetting test condition when the self-diagnosis means determines that the IC test device and the control device operate normally. 3. The IC test system according to claim 2, wherein the output is outputted to a test apparatus. 4. The self-diagnosis means, when it is determined that the IC test device and the control device do not operate normally, further performs a self-diagnosis of the IC test device and the control device. 4. The IC test system according to any one of 1 to 3. 5. The control device according to claim 1, further comprising: a display unit for displaying test results and test progress information of the test and a diagnosis result of the self-diagnosis; a test result and test progress information of the test and the self-diagnosis; 5. The IC test system according to claim 1, further comprising: a display control unit configured to display the diagnosis result on the display unit. 6. 6. The burn-in test according to claim 1, wherein said test is a burn-in test performed on a plurality of ICs to be tested set in a constant temperature chamber adjusted to a set temperature set by a burn-in test condition. 6. The IC test system according to any one of claims 1 to 5,