JP2000124688A - Equipment and method for holding and fixing substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate holding and fixing equipment which can hold and fix a substrate placed at a mounting position of an electronic component mounting equipment reliably through easy operation, by widely using one type of member for various thicknesses of substrates. SOLUTION: Below a transfer path of an electronic component mounting equipment, a supporting body which is raised and lowered by an elevation means is located. A substrate-holding and fixing body (c) is constituted of a main member 5 removably installed in the supporting body, a pressing member 7 which is installed in the main member 5 through a height adjustment means so as to move vertically, and a fixing means 6 for fixing the pressing member 7 to the main member 5. This substrate holding and fixing body (c) is provided with a substrate-holding section 17 for adjusting the height of an upper end part 7a of the pressing member 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate holding / fixing device and a method for holding and fixing a substrate at a mounting position of an electronic component mounting device easily and reliably even if the substrate thickness is different.

[0002]

2. Description of the Related Art Conventionally, in an electronic component mounting apparatus, a board carried in by a conveyor is positioned at a predetermined position in the apparatus, and FIG. 8 is shown in FIG. It was fixed by such fixing means 50.

In this device, a large number of push-up pins 52 that come into contact with the lower surface of a substrate 51 are provided so as to be freely inserted into and removed from a plate 53, and the plate 53 is moved up and down by an air cylinder 54 so that the lower surface of the substrate 51 We were separated.

The thickness of the substrate 51 to be processed in the electronic component mounting apparatus may be various (5 to 10 types) different from each other.
It is necessary to change the length of the push-up pins 52 in accordance with the thickness of the substrate 51. For example, different sizes L1 and L2 as shown in FIG. Only the number is prepared.

Therefore, not only is it difficult to store and manage the push-up pins 52, but also when replacing the push-up pins 52 in accordance with the change of the substrate 51 to be processed, the operator must first determine the thickness of the substrate. It is necessary to remember the type of the push-up pin 52 corresponding to the following. For example, by looking at the mark engraved on the push-up pin 52,
It is necessary to select a predetermined one that matches with the substrate, and gives a labor burden to the operator.

[0006] For this reason, there has been a problem that a mistake in replacing the push-up pin occurs to cause inconvenience to the substrate and that the mounting of the electronic component is not performed smoothly. And other various problems.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and comprises a support member which is lifted and lowered by lifting means below a transfer path of an electronic component mounting apparatus. The body member of the substrate holding and fixing body is provided with a pressing member movably in the vertical direction via height adjusting means, and the upper end of the pressing member abuts on the lower surface of the substrate, and the lifting means moves the By mounting a pressing member that presses and fixes the substrate against the side guide when the support body is lifted, the substrate at the mounting position of the electronic component mounting apparatus can be replaced by one type of member even if the substrate thickness is different. Accordingly, it is an object of the present invention to provide a substrate holding and fixing device that can be used for general purposes and can hold and fix with a simple operation and reliably.

[0008]

Means of the present invention for achieving the above object is to hold and fix a substrate which is conveyed along a side guide in a transfer path in an electronic component mounting apparatus and fixed at a predetermined position. In the apparatus, there is provided a support member which is lifted and lowered by a lifting means below the transfer path, and is detachably mounted on the support body so as to be freely disposed and positionable. A pressing member for pressing the substrate against the side guide to hold and fix the substrate when the supporting body is lifted by the elevating means; In a substrate holding / fixing body comprising a fixing member for fixing a member to the main body member, a target substrate is sandwiched between the main body member and a lower abutting portion of the pressing member, whereby a height of an upper end portion of the pressing member is increased. Adjustment In the configuration of the substrate holding and fixing apparatus having a power sale substrate holding portions.

The substrate holding portion has a cutout in the main body member serving as an insertion opening for the target substrate, and a lower portion of the pressing member opposing the upper surface of the insertion opening on the main body member side. The target substrate is sandwiched between the contact portion.

The height adjusting means has a fixing member for fixing the pressing member to the main body member when the target substrate is sandwiched between the main body member and the pressing member lower contact portion.

[0011] The substrate holding and fixing body is provided on the supporting body so as to be detachable and disposable by a fixing means provided on the main body member.

Further, the present invention relates to a method for holding and fixing a substrate which is conveyed along a side guide in a transfer path in an electronic component mounting apparatus and is fixed at a predetermined position. A main body member which is provided on the support body so as to be attachable / detachable and freely positionable, and is provided on the main body member so as to be vertically movable via height adjusting means, and an upper end thereof abuts against the lower surface of the substrate, When the support body is lifted by the elevating means, a pressing member for pressing and holding the substrate against the side guide to hold and fix the substrate, and a fixing member for fixing the pressing member to the main body member are provided. In the method of adjusting the height of the upper end portion, when inserting the target substrate into a main body member having a cutout serving as an insertion opening of the target substrate, when inserting the target substrate into the main body member side, the main body member of the insertion opening Side top Between the opposing pressing member lower contact portion, the target substrate is inserted, and then the pressing member is moved upward to move the target substrate to the upper surface of the main body member side of the insertion port and the insertion port. The pressing member is fixed to the main body member by the fixing member, and the height of the upper end of the pressing member is adjusted.

[0013]

Next, an embodiment of a substrate holding and fixing apparatus according to the present invention will be described with reference to the drawings.

FIG. 1 is a schematic overall plan view of an electronic component mounting apparatus F employing a substrate holding and fixing apparatus A according to an embodiment of the present invention. A conveyor 2 is provided, and the substrate b is transported by the transport conveyor along the transport path s along the side guides 3, 3 (see FIG. 2) in the direction of the arrow, and is held and fixed at a predetermined position.

The side guides 3 have a U-shaped cross section, and the upper and lower locking pieces 3a and 3b support and lock the side edges of the substrate b.

2 and 7, reference numeral A denotes a substrate holding and fixing device, which is basically constituted by a support 4 and a substrate holding and fixing member c comprising a main body 5, a fixing member 6 and a pressing member 7. You.

Among these, the above-mentioned bearing body 4 is provided with a transfer path s.
And is moved up and down by a lifting means 8, and moves along a lifting guide 9 on the side attached to the machine base 1.

The elevating means 8 is mounted on one end of a rotatably supported lever 12 using a fluid cylinder 10 of air pressure or the like, and the supporting body 4 is attached to the other end of the lever 12. A push-up body 13 that contacts the lower surface is provided.

The above-mentioned substrate holding / fixing member c is preferably disposed at a plurality of positions corresponding to the uniform position with respect to the substrate b. When electronic parts are also mounted on the lower surface of the substrate b, this arrangement is preferred. The mounting position is shifted.

The main body member 5 of the substrate holding / fixing member c is provided on the upper surface of the supporting member 4 and is fixed to the supporting member 4 or detachable by fixing means 26 described later. In addition, in any case, the main body member 5 is fixed to the support body 4 at the time of use in any case.

The pressing member 7 is provided with a substrate holding and fixing member c.
Is vertically movably provided to the main body member 5 via the height adjusting means 14, and the pressing member upper end portion 7a
And supports the substrate b. When the support body 4 is lifted by the elevating means 8, the upper side edge of the substrate b is pressed against the upper locking piece 3a of the side guide 3 to push the substrate b. Fix it.

The above-mentioned height adjusting means 14 is provided with the main body member 5.
An insertion hole 18 which is a notch provided in the main body member side upper surface 5a of the insertion hole 18 and a pressing member lower contact portion 7b; a screw 16 for providing the main body member 5; It is composed of the external thread 15 of the pressing member 7 screwed to the female screw 16, and the pressing member 7 is moved by the screwing of the external thread 15 and the internal thread 16, and the pressing member 7 moves to a desired height, that is, When the pressing member 7 is adjusted to correspond to the thickness of the substrate b, a fixing member 6 for fixing the pressing member 7 to the main body member 5 is provided.

The fixing member 6 is a lock nut.

In the screwing of the pressing member 7, by rotating the pressing member 7, the pressing member 7 moves up and down due to the engagement of the male screw 15 and the female screw 16.

Further, the main body member 5 is provided so as to be detachable and movable with respect to the support body 4 by fixing means 26. When the support body 4 is a magnetic material, it is provided on the bottom of the main body 5. Although a magnet to be attached is used, although not shown, it is also possible to employ a suction pad type or a means for selectively inserting a pin-like body into a large number of attachment holes formed in the support body, if necessary. it can.

Therefore, according to the fixing means 26,
The mounting and dismounting operations of the substrate holding and fixing body c on the support 4 can be easily performed, and the mounting can be performed at any position on the support 4.

In addition, even in the case of double-sided mounting in which electronic components are mounted on the lower surface side of the substrate b, it is possible to cope with it by a simple operation of changing the setting of the substrate holding and fixing member c. The versatility of mounting electronic components increases.

As the substrate holding / fixing member c, a substrate holding / fixing member d which can be detachably attached to the elevating means 8 can be used.

That is, the substrate holding and fixing assembly d is
As shown in FIGS. 6 and 7, a mounting body 27 provided with a plurality of sets of substrate holding and fixing bodies c is made detachable with respect to the support body 4. By providing two or more sets of the mounting bodies 27, other plate thicknesses can be obtained. While the electronic components are being mounted on the substrate b, the height of the pressing member 7 for the next different thickness of the substrate b can be adjusted with respect to the substrate holding and fixing assembly d separately prepared, Further, at the time of the setup change, the entire board holding / fixing assembly d to which the board holding / fixing body c is attached may be replaced, so that the workability is improved and the setup time due to the type change can be greatly reduced.

The substrate holding and fixing assembly d on the support 4
In the case of mounting, positioning members 28 such as locking pieces and pins
Is used.

Further, the substrate holding and fixing assembly d is not shown, but the mounting body 27 is omitted, and the substrate holding and fixing body c is directly mounted on the support 4, and the support 4 is moved to the elevating means 8. It can also be provided detachably.

Therefore, the substrate holding / fixing device A according to the embodiment of the present invention configured as described above has the following effects.

First, as shown in FIG. 1, the substrate b is transported by the transport conveyor 2 in one direction (in the direction of the arrow) to the electronic component mounting apparatus F. When the electronic component reaches a predetermined position, that is, the mounting position of the electronic component, the electronic component is positioned by the outer shape reference or the pin reference method applied to the substrate b.

Further, the height of the pressing member 7 in the substrate holding / fixing body c is set in advance for the substrate holding / fixing body c which stands by below the positioned substrate b in accordance with the thickness of the substrate b. It is adjusted by the adjusting means 14.

That is, the substrate b is inserted into the insertion opening 18 of the substrate holding portion 17 of the substrate holding / fixing member c, the upper surface of the substrate comes into contact with the upper surface 5a of the insertion opening 18 on the body member side, and the lower portion of the pressing member 7 The pressing member 7 is rotated so that the contact portion 7b contacts the lower surface of the substrate b, that is, the substrate is sandwiched between the upper surface 5a of the insertion member 18 on the main body member side and the lower contact portion 7b of the pressing member 7. Move up and down.

Then, the pressing member 7 is moved up or down by the screwing of the male screw 15 and the female screw 16, so that the upper surface 5 a on the main body member side of the insertion opening 18 of the main body 5 and the lower contact portion of the pressing member 7 are formed. 7b, the pressing member 7 has a desired height, that is, the height of the upper end portion 7a of the pressing member 7 is adjusted according to the thickness of the substrate b.

The pressing member 7 is, as shown in FIG.
When the board b is sandwiched between the board holding portions 17, the pressing member 7 is pushed down to insert the board b into the insertion opening 18 of the board holding portion 17, and then the board b is pressed. The depression of the member 7 may be released to hold the substrate b.

After the height of the upper end portion 7a of the pressing member 7 is determined by the above method, the lock nut 6 is tightened,
The pressing member 7 is fixed at a desired height.

Therefore, in this state, when the lifting means 8 is operated to raise the support 4, the upper end 7 a of the pressing member 7 of the substrate holding and fixing body c comes into contact with the lower surface of the substrate b,
Since the edge of the board b is pressed against the upper locking piece 3a of the side guide 3 with a predetermined pressure, the board b is securely fixed at this mounting position, and does not cause any inconvenience when mounting electronic components.

Since the height of the pressing member 7 is adjusted in accordance with the thickness of the substrate b, when the substrate b is supported at the mounting reference position, the substrate b is pushed up more than necessary or conversely. There is no inconvenience such as not being in contact with the substrate b and being unable to be pushed up reliably.

In the case of mounting electronic components on substrates b having different thicknesses, that is, in the case of a type change, the substrate to be held is changed, and the height of the pressing member 7 is increased by a one-touch operation similar to the above. Adjustment can be performed, and the setup time for preparations can be greatly reduced.

If the main body 5 of the substrate holding / fixing member c is provided with fixing means 26 made of a magnet, the substrate holding / fixing member c can be moved and fixed at an arbitrary position on the support member 4, so that the substrate b is most stable. The pressing member 7 can correspond to a position where the pressing member 7 is to be mounted, and even when the electronic components are mounted on both sides of the substrate, the pressing member 7 is kept in contact with the electronic component that has already been mounted. Can be.

[0043]

As described above, in the substrate holding and fixing apparatus of the present invention, according to the first aspect of the present invention, the pressing member for pressing and fixing the substrate is adjusted to an arbitrary height by the height adjusting means. It is possible to apply a uniform pressing force to substrates of various thicknesses using only one type of substrate holding and fixing body, and demonstrate the versatility of the substrate holding and fixing body However, unlike the related art, there is no need to prepare a push-up pin for each type of board, and management is easy.

According to a second aspect of the present invention, the height of the pressing member can be adjusted by a one-touch operation of sandwiching the target substrate between the substrate holding portions of the substrate holding and fixing body, and an efficient step can be performed on substrates having different thicknesses. It can be replaced, and the setup time can be greatly reduced.

According to the third aspect of the present invention, the position of the pressing member, the height of which is adjusted by the height adjusting means, is fixed, and the improper fixing of the substrate due to delusion during use is eliminated.

According to a fourth aspect of the present invention, by providing fixing means to the substrate holding and fixing body, the substrate holding and fixing body can be moved to an arbitrary position on the support and fixed, and both sides of the electronic component can be fixed. Even in the case of mounting, it is possible to make contact with the pressing member while avoiding the position of the already mounted electronic component.

The invention according to claim 5 relates to a method for adjusting the height of the top end of the pressing member of the substrate holding / fixing member, and enables a changeover of substrates of different thicknesses accurately and efficiently. Thus, the setup time can be significantly reduced. And so on.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing an electronic component mounting device employing a substrate holding and fixing device according to the present invention.

FIG. 2 is a partially longitudinal front view showing a main part of the substrate holding and fixing device in FIG. 1;

3A and 3B show a substrate holding and fixing body of the apparatus in FIG. 1, wherein FIG. 3A is a sectional view and FIG. 3B is a front view.

FIGS. 4A and 4B show a state in which a substrate is inserted into the substrate holding and fixing body of the present invention and the height of the upper end portion of the pressing member is adjusted; FIG. 4A is a cross-sectional view, and FIG. And (c)
FIG. 3A shows an AA cross-sectional view of FIG.

FIGS. 5A and 5B are main part longitudinal sectional front views showing another embodiment of the substrate holding and fixing body in FIG. 4, in which FIG. 5A is a sectional view, FIG. 5B is a front view, and FIG. BB sectional views are shown, respectively.

FIG. 6 is a perspective view showing another embodiment of the device in FIG. 2;

FIG. 7 is a front view showing an attached state of the device in FIG. 6;

FIG. 8 is an explanatory view showing a conventional substrate fixing mechanism.

FIG. 9 is a perspective view showing a push-up pin in FIG. 8;

[Explanation of symbols]

 Reference Signs List A board holding / fixing device F electronic component mounting device b board c board holding / fixing body s transfer path 3 side guide 4 support 5 body member 6 fixing member 7 pressing member 7a pressing member upper end portion 8 elevating means 14 height adjusting means 17 Board holding part 18 Insertion port 26 Fixing means

Claims (5)

[Claims] An apparatus for holding and fixing a substrate, which is conveyed along a side guide in a transfer path in an electronic component mounting apparatus and is fixed at a predetermined position, wherein the support is moved up and down by a lifting means below the transfer path. And a body member detachably mounted on the support body and disposed freely on the support body, and provided on the body member so as to be vertically movable via height adjusting means, and an upper end portion thereof contacts the lower surface of the substrate. A pressing member that presses and holds the substrate against the side guide when the support body is in contact with and lifts the supporting member by the elevating means, and a fixing member that fixes the pressing member to the main body member. A substrate holding / fixing device, comprising: a substrate holding portion for adjusting a height of an upper end portion of the pressing member by holding a target substrate between the main body member and a lower contact portion of the pressing member. . 2. The substrate holding portion has a cutout in the main body member serving as an insertion opening for a target substrate, and an upper surface of the insertion opening on the main body member side and a lower portion of the pressing member opposed to the upper surface of the insertion opening on the main body member side. 2. The substrate holding and fixing device according to claim 1, wherein the target substrate is sandwiched between the contact portion and the contact portion. 3. The height adjusting means has a fixing member for fixing the pressing member to the main body member when the target substrate is sandwiched between the main body member and the lower contact portion of the pressing member. 3. The substrate holding and fixing device according to 1 or 2. 4. The substrate holding device according to claim 1, wherein the substrate holding and fixing member is provided in a detachable manner and at a freely positionable position with respect to the support member by fixing means provided on the main body member. Fixing device. 5. A method for holding and fixing a substrate, which is conveyed along a side guide in a transfer path in an electronic component mounting apparatus and is fixed at a predetermined position, comprising: A main body member which is provided on the support body so as to be attachable / detachable and freely positionable, and is provided on the main body member so as to be vertically movable via height adjusting means, and an upper end thereof abuts against the lower surface of the substrate, When the support body is lifted by the elevating means, a pressing member for pressing and holding the substrate against the side guide to hold and fix the substrate, and a fixing member for fixing the pressing member to the main body member are provided. In the method of adjusting the height of the upper end portion, when inserting the target substrate into a main body member having a notch serving as an insertion opening of the target substrate, the upper surface of the insertion opening on the main body member side, and the main body member of the insertion opening On the top side The target substrate is inserted between the pressing member and the lower contact portion, and then the pressing member is moved upward to move the target substrate to the upper surface of the insertion member on the main body member side and the main body of the insertion hole. The pressing member is fixed to the main body member by the fixing member, and the height of the top end of the pressing member is adjusted. Substrate holding and fixing method.