JP2000124648A - Heat sink fan device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat sink fan device capable of exhibiting stable high efficiency cooling performance, without crossing an air current generated by a part of fans. SOLUTION: This device comprises a heat sink 3, having a substrate 4 and a plurality of fins 5a, 5b, 5c standing erect on the substrate 4, and a first fan 1 and a second fan 2 provided in the heat sink 3. The substrate 4 has a substantially square configuration. The first fan 1 and the second fan 2 are disposed on a diagonal of the substrate 4. Recess parts 6, 7 are formed at a corresponding position of the first fan 1 and the second fan 2, to accommodate the first fan 1 and the second fan 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink fan device for cooling electronic components such as semiconductor elements which are high heat generating elements.

[0002]

2. Description of the Related Art In order to cool electronic components such as semiconductor elements, a heat sink fan device having a heat sink provided with a plurality of cooling fins and one fan attached to the heat sink has been conventionally used. .

[0003]

However, in recent years, electronic components such as semiconductor elements have been increased in scale and processing speed has been greatly improved. With the heat dissipation power of a heat sink fan device having only one fan, the entire electronic components such as semiconductor elements, which have been increased in size and have increased the amount of heat generated, cannot be efficiently and reliably cooled. In such a case, the processing capability is greatly reduced due to the high temperature of the electronic components such as the semiconductor elements. Therefore, a heat sink fan device having a constantly stable cooling performance is required.

Accordingly, the present invention is capable of reliably and efficiently cooling electronic components such as semiconductor elements having a large and high calorific value, and has a cooling performance even when one of the fans is rotated down due to a failure or the like. It is an object of the present invention to provide a heat sink fan device in which the heat sink does not decrease.

[0005]

In order to solve the above-mentioned problems, a heat sink fan device according to the present invention comprises a substrate, a plurality of band-shaped cooling fins erected on the substrate, and band-shaped cooling fins for partitioning. A heat sink fan device comprising: a heat sink having: a first fan and a second fan located above the substrate, wherein the first substrate is provided on the substrate.
The first air flow generated by the fan and the second fan flows
An air flow region and a second air flow region are formed, and the first air flow region and the second air flow region are partitioned by the partition band cooling fins located between the first fan and the second fan. It is.

The substrate of the heat sink is thermally conductively bonded to an electronic component such as a semiconductor device, and conducts heat generated by the electronic component such as the semiconductor device to the substrate and a plurality of strip-shaped cooling fins provided on the substrate. Let it. The first located above the substrate
Each of the fan and the second fan has a plurality of fan blades in a rotor. When the fan rotates, an airflow is generated between the plurality of cooling fins, and the heat conducted to the substrate and the band-shaped cooling fins is efficiently transferred. Dissipate heat.

As described above, by providing two first and second fans for one heat sink,
It is possible to reliably and efficiently cool the entire electronic component such as a semiconductor device having a large and high calorific value.

However, when the airflow generated by each fan intersects, a turbulent flow such as a vortex occurs in the heat sink, which hinders smooth intake and exhaust and lowers the cooling efficiency. By extending at least one partition-like cooling fin located at one end from one end of the substrate to the other end of the substrate, the flow region of the airflow from each fan is partitioned to prevent turbulence.

In another heat sink fan device according to the present invention, the first fan and the second fan are arranged on a diagonal line of a substrate having a substantially square shape, and are located between the first fan and the second fan. At least one partition-like cooling fin for partitioning the first air flow region and the second air flow region is erected substantially perpendicular to a diagonal line where the first fan and the second fan are disposed.

[0010] By arranging each fan on a diagonal line as described above, the space on the substrate can be effectively used. For example, a fan having a larger fan blade can be arranged, and cooling can be performed. Efficiency can be further improved. In addition, the band-shaped cooling fins located between the fans and partitioning the flow area of the airflow from each fan are arranged upright so as to be substantially perpendicular to the diagonal line where the fans are arranged, so that the airflows from the fans are mutually separated. Interference and a reduction in cooling efficiency are prevented.

Further, in another heat sink fan device according to the present invention, the plurality of cooling fins are erected and arranged so as to form a pair of concave portions in portions of the heat sink corresponding to the first fan and the second fan. The first fan and the second fan are housed in corresponding recesses.

In this method, a plurality of cooling fins are radially arranged around the first fan and the second fan, and the height of the radiation fins located on the orbital portions of the fan blades of each fan is made higher than the fins of the other portions. By lowering the height of the fan blade, interference with a rotating fan blade is prevented, and a cooling fin is arranged immediately below the fan blade to obtain a larger heat radiation area.

In another heat sink fan device according to the present invention, the first fan and the second fan are provided in a housing having a pair of substantially circular air intake holes and attached to the heat sink in opposition to the substrate. The first fan and the second fan are arranged so as to be supported through a plurality of arms so as to be located in the intake hole.

A pair of substantially circular air intake holes are provided in a housing attached to the heat sink so as to face the substrate, and a first fan and a second fan are arranged in the respective air intake holes. Is generated in the circumferential direction. By generating such an airflow, the air taken in from the outside can directly hit the heat sink substrate which is thermally conductively bonded to the electronic component such as the semiconductor element, thereby increasing the cooling efficiency. it can.

Further, another heat sink fan device according to the present invention controls the first fan and the second fan to rotate at a first rotation speed which is a predetermined rotation speed, and the first fan or the second fan is controlled. When the rotation speed of any one of the fans decreases to a predetermined second rotation speed that is lower than the first rotation speed, the drive control is performed such that the other fan has a rotation speed higher than the first rotation speed.

That is, each of the first fan and the second fan independently has a drive circuit having a rotation speed detection circuit and a speed controller. Normally, the power supply amount of the first fan and the second fan is controlled by the speed controller, and the driving control is performed at a predetermined rotation speed lower than the maximum rotation speed. When the rotation speed detection circuit provided detects that the rotation speed has decreased to the predetermined rotation speed, a detection signal is transmitted from the rotation speed detection circuit to the speed controller of the other fan, and based on this signal, the detection signal to the other fan is transmitted. By increasing the power supply amount, the other fan is driven to rotate at the maximum rotation speed, and the cooling performance is maintained.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings showing embodiments.

1 to 7 show an embodiment of the present invention. FIG. 1 is a plan view of a heat sink fan device, and FIG. 2 is a front view thereof. This heat sink fan device includes a heat sink 3 and first and second fans 1 and 2.

Reference numeral 13 denotes a housing which covers the upper surface of the heat sink 3. When the heat sink 3 has a substantially square shape,
Correspondingly, the housing 13 also has a substantially square shape, and the two are vertically overlapped and connected by screws. A pair of substantially circular intake holes 47, 47 are formed in the housing 13, and the first fan 1 and the second fan 2 are located below the pair of substantially circular intake holes 47, 47, respectively ( FIG.
), And is supported by the housing 13 via a plurality of arms 48.

Reference numeral 26 denotes a circular cover for covering the bottom of the motor.
And the plurality of arms 48 form fan-shaped ventilation holes 24. The cover 26 is connected to a fixed portion of the fan motor, and the fan motors are provided under the covers 26, 26, respectively.
As shown in FIG. 1, the first fan 1 and the second fan 2 are arranged in a diagonal direction of the substantially rectangular housing 13 (heat sink 3).
Is arranged.

Numerals 12 indicate fan motor blades, and numeral 19 indicates
The connector is provided at the corners 38 and 39 of the substantially rectangular housing 13, and is used to electrically connect the fan motor to an external power supply.

FIG. 3 is a plan view showing a heat sink portion in which the housing 13 and the fan motor are removed from the heat sink fan device in the assembled state of FIG.
FIG. 4 is a sectional view taken along a line CC in FIG. 3 and a sectional view taken along a line DD in FIG. 3.

In FIG. 3, FIG. 6 and FIG. 7, the heat sink 3 is made of a material such as aluminum having good heat conductivity, and has a substantially rectangular (rectangular) substrate 4 and an upright standing on the substrate 4. It has a plurality of band-shaped cooling fins 5a, 5b, 5c provided and is integrally molded.

O ₁ and O ₂ are points where the rotation axis of the fan motor is located when the fan motor is attached to the heat sink 3. The plurality of cooling fins 5a and 5b are erected and arranged at positions corresponding to the first fan 1 and the second fan 2 so as to form circular concave portions 6 and 7 in plan view. That is, the concave portions 6 and 7 have a circular shape centered on the points O ₁ and O ₂ .

In FIG. 3, E ₁ and E ₂ are represented by (see FIG.
1) shows the trajectory through which the outer ends pass when the blades 12 of the first fan 1 and the blades 12 of the second fan 2 rotate.

A plurality of belt-shaped cooling fins 5a, 5b, 5c
Among them, the fin 5c is composed of a fin 5a for guiding the wind of the first fan 1 disposed at the lower right in FIG. 3 and a fin 5b for guiding the wind of the second fan 2 disposed at the upper left. It is a partition fin that serves as a partition wall. The upper end of the partition fin 5c is in contact with the housing 13 (see FIG. 4), and blocks the area between the fin 5a and the area of the fin 5b. The fins 5a and 5b extend at least in the peripheral region of the first fan 1 and the second fan 2 through a line M passing through the points O ₁ and O ₂ and forming 45 ° with the side of the substrate 4.
_1, those outside than M ₂ extends radially as toward the point O _1, O _2. That is, the end 40 of the fin 5a is
₁ and the end 43 of the other fin 5b is at point O ₂
Extending towards.

The fins 5a and 5b are provided at least in the area around the first fan 1 and the second fan 2.
45 ° those inside than the line M _1, M _2, and the line M _1,
Extend in parallel and M _2. That is, (in FIG. 3) the end 41 and the center 42 of the fin 5a and the other fin 5a
The end 44 and the center 45 of b are parallel to the lines M ₁ and M ₂ .
The fin ends crossing the left and right sides (long sides) of the substrate 4 are substantially orthogonal to the long sides near the left and right sides (long sides).

Further, the fins 5a, 5b are part located from a little outside of the locus E _1, E ₂ of the aforementioned blade inside the the locus E _1, E ₂ ─── ends 40,43,41,44 And central part 4
At 2,45 °, the height is set short so that the blades 12 (see FIG. 4) do not interfere.

The fins 5a and 5b are set at a position slightly outside the trajectory circles E ₁ and E ₂ at a height corresponding to the housing 13 (see FIG. 4) as shown in FIGS. Is done. However, the fins 5a and 5b shown at both ends in FIG.
Only the clearance for mounting the connector 19 (see FIG. 1)
It is lower.

Next, FIG. 4 is an enlarged sectional view of a main part of FIG. 1, showing a state in which the first fan 1 and the second fan 2 are incorporated in the vacant space surrounded by the heat sink 3 and the housing 13. Is shown.

In FIG. 4, two first fans 1 and a second fan 1
Although the fan 2 is provided, since the internal structure and the mounting structure are the same, the corresponding parts are denoted by the same reference numerals, respectively.
explain.

The cover 26 (as already described with reference to FIG. 1)
Below, a substrate as a motor fixing portion formed integrally with the housing 13 is provided, and a cylindrical portion 14 is formed in a hole of the substrate.
Are fitted and fixed so as to extend downward. A shaft 16 is rotatably supported inside the cylindrical portion 14 via a pair of bearings 15 and 15. A cup-shaped rotor 17 is fixed to the lower end of the shaft 16 and rotates integrally with the shaft 16.

More specifically, referring to FIG. 4, the first fan 1 and the second fan 2 each include a motor unit 10 and a plurality of blades 12 protruding from the outer peripheral surface of a rotor 17 of the motor unit 10. And The motor unit 10 is connected to the housing 13 via the arm unit 48.
, A cylindrical portion 14 fitted vertically into the hole of the substrate 49, bearings 15, 15, a shaft 16, a cup-shaped rotor 17, and externally fitted to the cylindrical portion 14. And a stator 18 fixed in a shape. A circuit board 28 is mounted on the cylindrical portion 14. The rotor 17 includes a rotor holder 20 and a rotor magnet 21. The stator 18 includes a stator core 22 and a coil 23.

The outer ends of the blades 12 fixed to the outer peripheral surface of the rotor holder 20 correspond to the inner peripheral surfaces of the concave portions 6 and 7 of the heat sink 3 (the stepped edges of the fins 5a and 5b) with a small gap. ing.

In FIG. 4, FIG. 1 and FIG.
When the second fan 2 is driven to rotate, air is sucked from the ventilation holes 24 and enters the recesses 6 and 7 and the fins 5 a and 5
The gas flows through the flow path 25 formed by b and 5c and is exhausted outward as indicated by the arrow in FIG.

The above-mentioned partitioning fin 5c is connected to the housing
13 abuts on the lower surface of the first fan 1 and allows the first fan 1
The air flow area Z ₁ and the second flow of the wind only from the second fan 2
Dividing the air flow area Z ₂ (partitions) are those (see FIG. 3), the first air flow area Z ₁ the first cooling fin 5
a is disposed in the second air flow area Z ₂ is disposed a second cooling fin 5b, between the first cooling fin 5a and the second cooling fin 5b is by partitioning fin 5c, are partitioned.

More specifically, a first fan 1 and a second fan 2 are disposed at two diagonal points O ₁ and O ₂ on a substantially square substrate 4, respectively. the partitioning fins 5c located between _first and second air flow area Z ₂ is first
The fan 1 and the second fan 2 are disposed substantially orthogonal to the diagonal line where the fan 1 and the second fan 2 are disposed (see FIG. 3). Although FIG. 3 shows an example in which the number of partitioning fins 5c is one, this is
It is free to use more than books.

A circuit for rotating the first fan 1 and the second fan 2 has, for example, the configuration shown in FIG. That is, a first circuit unit for driving the first fan 1
30 and a second circuit unit 31 for driving the second fan 2
And. The first circuit unit 30 includes a drive IC
The second circuit unit 31 includes a drive IC 35, a rotation speed reduction detector 36, a speed controller 37, and the like. The speed controller 34 of the first circuit section 30, the transistor Q ₁ and the resistor R
Comprises a _1, the speed controller 37 of the second circuit portion 31 includes a transistor Q ₂ and a resistor R _2.

The first fan 1 and the second fan 2 are normally controlled to rotate at a first rotation speed N ₁ which is a predetermined rotation speed. Then, for example, when reduced to a second rotational speed N ₂ of a predetermined below the first rotational speed N ₁ by the first fan 1 is failure or the like, detects a drop in the rotational speed by the rotational speed decrease detector 33, The detection signal is S
The signal is input to the CONT of the second circuit unit 31 through the IG. Thereby, the second speed controller 37 of the second circuit unit 31
Transistor Q ₂ is turned ON, and a resistor R ₂ to begin feeding in the form of a bypass to the second fan 2 of the stator coil 23, by canceling the resistor R _2, power supply amount to the stator coil 23 without being limited, the second fan 2 is a rotational speed higher than the first rotational speed N ₁ (in this case, the first
(High speed enough to replenish the reduced rotation of fan 1)
Is driven and controlled.

[0040] Conversely, if the reduction by the second fan 2 is failure or the like to a predetermined second rotational speed N ₂ below the rotational speed N ₁ of the first, detects a decrease in the rotational speed by the rotational speed decrease detector 36 Then, the detection signal is input to CONT of the first circuit unit 30 through SIG. Thus, the transistors to Q ₁ first speed controller 34 of the first circuit portion 30 becomes an ON state, first in the form of bypassing the resistor R ₁ fan 1
By starting power supply to the stator coil 23 and canceling the resistance R ₁ , the first fan 1 can rotate at a higher rotation speed than the first rotation speed N ₁ without limiting the amount of current supplied to the stator coil 23. (In this case, the first fan 1 is driven at a high speed enough to supplement the reduced rotation speed.)

Therefore, even if one of the first fan 1 and the second fan 2 fails and the number of rotations decreases, the other fan 1 (or 2) rotates to replenish the reduced amount. The number increases, and the cooling performance of the heat sink fan device does not decrease.

In the above description of the embodiment, the vertical positional relationship is merely for convenience of explanation based on the drawings, and does not limit the actual use state and the like. In addition, the dimensions, the number, the materials, the shapes, the relative arrangements, and the like of the components are not intended to limit the scope of the present invention only to them, unless otherwise specified. It is only an example.

[0043]

Since the present invention is configured as described above, the following effects can be obtained.

According to the heat sink fan device of the first aspect, the first air flow region Z ₁ and the second air flow region Z ₂
And the airflow generated by the first fan 1 and the second
The airflow generated by the fan 2 does not intersect, so that the entire electronic component such as a semiconductor element having a large and high calorific value can be reliably and efficiently cooled.

According to the heat sink fan device of the second aspect, the space on the substrate 4 can be effectively used, and the entire device can be made compact.

According to the heat sink fan device of the third aspect, cooling can be performed more effectively while preventing interference with the rotating blades 12.

According to the heat sink fan device of the fourth aspect, an airflow that flows from above the cooling fins 5a and 5b in the circumferential direction of the heat sink 3 is generated, and the heat sink 3 is thermally conductively bonded to an electronic component such as a semiconductor element. The air from the outside is stronger and directly hits the substrate 4, and the cooling efficiency can be further improved.

According to the heat sink fan device of the fifth aspect, when one of the first fan 1 and the second fan 2 has a reduced rotation speed due to a failure or the like, the rotation speed of the other fan increases. As a result, the cooling performance of the entire apparatus can be constantly exhibited without deteriorating the cooling performance.

[Brief description of the drawings]

FIG. 1 is a plan view showing one embodiment of a heat sink fan device according to the present invention.

FIG. 2 is a front view.

FIG. 3 is a plan view of a heat sink.

FIG. 4 is an enlarged sectional view.

FIG. 5 is a circuit diagram.

FIG. 6 is a sectional view taken along line CC of FIG. 3;

FIG. 7 is a sectional view taken along line DD of FIG. 3;

[Explanation of symbols]

1 first fan 2 second fan 3 heatsink 4 substrate 5a fin 5b fins 5c fins 6 recess 7 the recess 13 the housing 30 first circuit portion 31 and the second circuit section 34 speed controller 37 the speed controller 47 suction holes 48 arms Z ₁ first Air flow zone Z2 _Second air flow zone

Claims (5)

[Claims] 1. A heat sink 3 having a substrate 4, a plurality of band-shaped cooling fins 5a, 5b erected on the substrate 4, and a partition-shaped band-shaped cooling fin 5c, and a first heat sink 3 located above the substrate 4. A heat sink fan device comprising a fan 1 and a second fan 2, wherein a first air flow zone Z ₁ through which air flows generated by the first fan 1 and the second fan 2 flow on the substrate 4. 2 together with the air flow area Z ₂ are formed, the first air flow region Z ₁ and a second air flow area Z ₂ is the first fan 1 and the second strip for the partition located between the fan 2 cooling fins 5c A heat sink fan device characterized by being partitioned by: 2. The substrate 4 has a substantially quadrangular shape, the first fan 1 and the second fan 2 are arranged on a diagonal line of the substrate 4, and the first air flow zone Z ₁ claim partitioning strip cooling fins 5c are vertically disposed generally perpendicular to the diagonal of the first fan 1-second fan 2 is disposed to be located between second air flow area Z ₂ 1
The heat sink fan device as described in the above. 3. The plurality of cooling fins 5a and 5b are connected to the first fan 1 and the second fan 2 of the heat sink 3.
The first fan 1 and the second fan 2 are housed in the corresponding recesses 6, 7, respectively, wherein the first fan 1 and the second fan 2 are accommodated in the corresponding recesses 6, 7. Heat sink fan device. 4. The plurality of strip-shaped cooling fins 5a, 5
A housing 13 having a pair of substantially circular air intake holes 47 is attached to the upper portions of b and 5c so as to face the substrate 4, and the first fan 1 and the second fan 2 are mounted on a pair of housings 13 formed in the housing 13. The heat sink fan device according to claim 1, 2 or 3, wherein the heat sink fan device is supported by the housing 13 via a plurality of arms 48 so as to be located in the substantially circular air intake hole 47. 5. The first fan 1 and the second fan 2 are controlled so as to rotate at a first rotation speed that is a predetermined rotation speed, and the rotation speed of one of the first fan 1 and the second fan 2 is controlled. When the rotation speed of the second fan decreases to a predetermined second rotation speed that is lower than the first rotation speed, the other fan is controlled to be driven at a higher rotation speed than the first rotation speed.
5. The heat sink fan device according to 3 or 4.