JP2000124594A - Method of applying solder to pad - Google Patents
Method of applying solder to padInfo
- Publication number
- JP2000124594A JP2000124594A JP29861798A JP29861798A JP2000124594A JP 2000124594 A JP2000124594 A JP 2000124594A JP 29861798 A JP29861798 A JP 29861798A JP 29861798 A JP29861798 A JP 29861798A JP 2000124594 A JP2000124594 A JP 2000124594A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- pad
- opening
- insulating layer
- protective insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はパッドへのはんだ付
着方法に関する。The present invention relates to a method for attaching solder to a pad.
【０００２】[0002]
【従来の技術】プリント配線板（基板）の配線パターン
上にはんだレジストによる保護絶縁層を形成し、この保
護絶縁層の開口部に露出させたパッドに、印刷法などに
より電子部品などの電極やリードを接合するための導体
ペースト（はんだペースト）を供給している。2. Description of the Related Art A protective insulating layer made of a solder resist is formed on a wiring pattern of a printed wiring board (substrate), and an electrode such as an electronic component is formed on a pad exposed at an opening of the protective insulating layer by a printing method or the like. A conductive paste (solder paste) for joining the leads is supplied.
【０００３】開口部内に充填されたはんだペーストは、
基板を連続炉中で加熱することによりリフローされ、パ
ッドに付着される。このパッドに付着されるはんだは、
通常予備はんだと称され、比較的低融点のはんだ（共晶
はんだ）が用いられる。実装されるベアチップ等の電子
部品側には比較的高融点のはんだバンプが形成されてお
り、上記の予備はんだを介して基板に接合される。[0003] The solder paste filled in the opening,
The substrate is reflowed by heating in a continuous furnace and adhered to the pad. The solder attached to this pad is
Usually referred to as a preliminary solder, a relatively low melting point solder (eutectic solder) is used. A relatively high melting point solder bump is formed on the side of an electronic component such as a bare chip to be mounted, and is joined to the substrate via the above-mentioned preliminary solder.
【０００４】[0004]
【発明が解決しようとする課題】ところで昨今は半導体
チップなどの電子部品の高密度化が進行し、パッドのピ
ッチが２５０μｍ以下となり、パッド径も１００μｍ程
度と極めて小さくなっている。したがって、保護絶縁層
の開口部も縮小され、そのためパッドへの予備はんだの
形成が困難になってきている。By the way, in recent years, the density of electronic components such as semiconductor chips has been increased, and the pitch of the pads has been reduced to 250 μm or less, and the pad diameter has been extremely reduced to about 100 μm. Therefore, the opening of the protective insulating layer is also reduced, which makes it difficult to form a preliminary solder on the pad.
【０００５】発明者等が検討したところ、保護絶縁層の
開口部の開口径が小さくなってきていることから、開口
部内に充填されたはんだペーストが、溶融時に表面張力
で球形となり（図６）、パッドに濡れにくく、したがっ
て十分な量の予備はんだの形成が行えないことが判明し
た。はんだペーストの量を多くすればする程、予想に反
して十分な予備はんだの形成が行えないことも判明し
た。[0005] The inventors have studied and found that since the diameter of the opening of the protective insulating layer has become smaller, the solder paste filled in the opening becomes spherical due to the surface tension at the time of melting (FIG. 6). It was found that it was difficult to wet the pad, so that a sufficient amount of preliminary solder could not be formed. It has also been found that, as the amount of the solder paste is increased, unexpectedly, sufficient preliminary solder cannot be formed.
【０００６】本発明は上記課題を解決すべくなされたも
のであり、その目的とするところは、濡れ性よく予備は
んだを形成できるパッドへのはんだ付着方法を提供する
にある。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a method of attaching solder to a pad capable of forming a preliminary solder with good wettability.
【０００７】[0007]
【課題を解決するための手段】本発明は上記目的を達成
するため次の構成を備える。すなわち、本発明に係るパ
ッドへのはんだ付着方法では、はんだペーストを保護絶
縁層に囲まれたパッドに供給してリフロー加熱すること
によりパッド上にはんだを付着するはんだ付着方法にお
いて、前記リフロー加熱時、リフロー炉内で基板を加熱
する際、基板温度がはんだの融点より約７℃低い温度か
ら約７℃高い温度となる昇温領域で、基板の昇温速度を
１４℃／分〜１７℃／分となるように調整すると共に、
基板を主として基板の下面側から加熱することを特徴と
している。The present invention has the following arrangement to achieve the above object. That is, in the method of attaching solder to a pad according to the present invention, in the solder attaching method of applying solder paste to a pad surrounded by a protective insulating layer and applying reflow heating to attach solder on the pad, When the substrate is heated in a reflow furnace, the temperature of the substrate is raised from about 7 ° C. lower than the melting point of the solder to about 7 ° C. higher, and the rate of temperature rise of the substrate is 14 ° C./min to 17 ° C. / And adjust it to
It is characterized in that the substrate is heated mainly from the lower surface side of the substrate.
【０００８】開口部奥側のソルダーボールが早く溶融
し、パッドに付着するから、確実にはんだをパッドに付
着させることができる。[0008] Since the solder ball at the back of the opening melts quickly and adheres to the pad, the solder can be securely adhered to the pad.
【０００９】また本発明に係るパッドへのはんだ付着方
法では、はんだペーストを保護絶縁層に囲まれたパッド
に供給してリフロー加熱することによりパッド上にはん
だを付着するはんだ付着方法において、パッドを囲む保
護絶縁層の開口部の開口半径をＡ、パッド表面から保護
絶縁層表面までの開口部の深さをｔとしたとき、パッド
に供給するはんだの体積Ｂを、式：Further, in the method of attaching solder to a pad according to the present invention, in the solder attaching method of applying solder paste to a pad surrounded by a protective insulating layer and performing reflow heating to attach solder to the pad, When the opening radius of the opening of the surrounding protective insulating layer is A, and the depth of the opening from the pad surface to the protective insulating layer surface is t, the volume B of the solder supplied to the pad is expressed by the following formula:
【数３】 を満足する量に設定することを特徴としている。(Equation 3) Is set to an amount that satisfies.
【００１０】はんだが球状になったとしても、パッドに
対して接触するから、パッドに付着した予備はんだを得
ることができる。[0010] Even if the solder becomes spherical, it comes into contact with the pad, so that it is possible to obtain preliminary solder attached to the pad.
【００１１】さらに本発明に係るパッドへのはんだ付着
方法では、はんだペーストを保護絶縁層に囲まれたパッ
ドに供給してリフロー加熱することによりパッド上には
んだを付着するはんだ付着方法において、パッドに供給
するはんだの体積がＢであるとき、パッドを囲む保護絶
縁層の開口部の開口半径Ａ、およびパッド表面から保護
絶縁層の表面までの開口部の深さｔを、式：Further, in the method for attaching solder to a pad according to the present invention, the method for attaching solder to a pad by supplying a solder paste to a pad surrounded by a protective insulating layer and heating the pad by reflow heating. When the volume of the supplied solder is B, the opening radius A of the opening of the protective insulating layer surrounding the pad and the depth t of the opening from the pad surface to the surface of the protective insulating layer are expressed by the following formulas:
【数４】 を満足するように設定することを特徴としている。パッ
ドに密着した一定量の予備はんだを確保できる。(Equation 4) Is set so as to satisfy the following. A certain amount of preliminary solder in close contact with the pad can be secured.
【００１２】[0012]
【発明の実施の形態】以下、本発明の好適な実施の形態
を添付図面に基づいて詳細に説明する。 〔第１の実施の形態〕まず図１に示すように、プリント
配線基板１０の保護絶縁層（ソルダーレジスト層）１２
に形成された開口部１４内に、印刷マスクを用いた印刷
法または転写スタンプを用いた転写法により、導体ペー
スト（はんだペースト）１６を充填する。１８はパッド
である。Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. [First Embodiment] First, as shown in FIG. 1, a protective insulating layer (solder resist layer) 12 of a printed wiring board 10 is formed.
Is filled with a conductive paste (solder paste) 16 by a printing method using a print mask or a transfer method using a transfer stamp. 18 is a pad.
【００１３】はんだペースト１６は、任意のはんだを粒
径２５μｍ以下の球形に加工した微細なソルダーボール
１６ａを高活性のフラックスでペースト状に練ったもの
である。The solder paste 16 is obtained by kneading a fine solder ball 16a obtained by processing an arbitrary solder into a sphere having a particle diameter of 25 μm or less with a highly active flux into a paste.
【００１４】開口部１４の開口径は１００μｍ以下であ
るから、粒径２５μｍ以下の微細なソルダーボール１６
ａとはいえ、開口部１４に対して図示のようにかなり大
きなものとなる。Since the opening 14 has an opening diameter of 100 μm or less, a fine solder ball 16 having a particle diameter of 25 μm or less is used.
However, as shown in FIG.
【００１５】上記のように開口部１４内に充填したはん
だペースト１６をリフロー炉内で窒素雰囲気中でリフロ
ー加熱し、予備はんだに形成する。発明者等は、従来に
おいては、リフロー炉内では基板の表面側からの加熱量
が多く、したがって、はんだペースト１６の表面側のソ
ルダーボール１６ａが加熱されて溶融し、その表面張力
が奥側のソルダーボール１６ａに作用して、奥側のソル
ダーボール１６ａを抱き込むような状態となり、したが
って奥側のソルダーボール１６ａが溶融してパッド１８
を濡らす前に、全体が球形になってしまい、パッド１８
に付着しにくい（図６）ことに想到した。The solder paste 16 filled in the opening 14 as described above is reflow-heated in a nitrogen atmosphere in a reflow furnace to form a preliminary solder. Conventionally, the inventors have found that the amount of heating from the front side of the substrate in the reflow furnace is large, and therefore, the solder balls 16a on the front side of the solder paste 16 are heated and melted, and the surface tension is reduced. The solder ball 16a acts on the solder ball 16a so as to embrace the solder ball 16a on the back side.
Before wetting the pad, the whole becomes spherical and the pad 18
(Fig. 6).
【００１６】そこで、本実施の形態では、基板１０の加
熱を主として基板１０の下面側から行うようにした。す
なわちリフロー炉内で、基板１０の下面側を加熱するヒ
ータを多くし、開口部１４内に充填されたはんだペース
ト１６中の開口部１４奥側のソルダーボール１６ａも溶
融するようにする。好ましくは、開口部１４の入口側の
ソルダーボール１６ａよりも奥側のソルダーボール１６
ａの方が早く溶融するようにする。In the present embodiment, the substrate 10 is heated mainly from the lower surface side of the substrate 10. That is, in the reflow furnace, the number of heaters for heating the lower surface side of the substrate 10 is increased, and the solder balls 16a on the inner side of the opening 14 in the solder paste 16 filled in the opening 14 are also melted. Preferably, the solder ball 16 on the back side of the solder ball 16a on the entrance side of the opening 14
a is to be melted earlier.
【００１７】また、はんだが溶融するはんだの融点付近
の昇温速度を緩やかになるように設定する。共晶はんだ
の場合の融点は１８３℃である。この前後約７℃の領
域、すなわち基板１０の温度が約１７６℃〜１９０℃の
温度領域の昇温時間を約１分程度と長くする。基板１０
温度は熱電対で計測する。Further, the rate of temperature rise near the melting point of the solder in which the solder melts is set to be slow. The melting point for eutectic solder is 183 ° C. The temperature rise time before and after about 7 ° C., that is, the temperature range where the temperature of the substrate 10 is about 176 ° C. to 190 ° C., is increased to about 1 minute. Substrate 10
Temperature is measured with a thermocouple.
【００１８】図４は基板温度プロファイルを示す。ｔ１
（１７６℃）〜ｔ２（１９０℃）の温度領域を１分間程
度の長時間をかけて昇温する。この昇温レートは１４℃
／分〜１７℃／分が好ましい。最終的にはｔ３（２１０
℃以上）まで加熱して確実にはんだを溶融させる。FIG. 4 shows a substrate temperature profile. t1
The temperature in the temperature range of (176 ° C.) to t2 (190 ° C.) is raised over a long time of about 1 minute. The heating rate is 14 ° C
/ Min to 17 ° C / min. Eventually, t3 (210
(° C. or more) to surely melt the solder.
【００１９】上記のように、はんだの融点前後の昇温速
度を緩やかに設定することで、確実に基板１０下面側の
温度が表面側の温度より早く上昇し、開口部１４内の奥
側のソルダーボール１６ａが溶融してパッド１８に付着
し（図２）、次いで全体のソルダーボール１６ａが溶融
して、図３に示すように、パッド１８に全面に付着した
予備はんだ２０が得られる。なお従来は、リフロー加熱
の融点付近の昇温時間が１０秒〜２０秒程度と短い。As described above, by gradually setting the temperature rise rate around the melting point of the solder, the temperature on the lower surface side of the substrate 10 surely rises faster than the temperature on the front surface side, and the temperature on the back side in the opening 14 is increased. The solder balls 16a are melted and adhere to the pads 18 (FIG. 2), and then the entire solder balls 16a are melted to obtain the preliminary solder 20 adhered to the entire surface of the pads 18 as shown in FIG. Conventionally, the temperature rise time near the melting point of reflow heating is as short as about 10 to 20 seconds.
【００２０】上記のように、一旦はんだがパッド１８に
付着したら、図６のようなパッドから分離した球状とな
ることはない。As described above, once the solder adheres to the pad 18, it does not form a sphere separated from the pad as shown in FIG.
【００２１】〔第２の実施の形態）次にはんだの供給量
について検討する。発明者等は、前記のように保護絶縁
層の開口部が小さくなるにつれ、はんだの濡れ性が悪く
なることから、はんだ量を多くすることを試みたが、逆
に多くすると球形になってしまうことを見いだした。[Second Embodiment] Next, the supply amount of solder will be examined. The inventors tried to increase the amount of solder because the wettability of the solder deteriorated as the opening of the protective insulating layer became smaller as described above. I found something.
【００２２】はんだが球形になると、図６のように、球
形になったはんだがパッド１８に接触せず、ためにパッ
ド１８に付着しないことになるのである。そこで、はん
だの供給量（体積）を、例え球形になったとしてもパッ
ド１８に接触する量、すなわち、球形のはんだが開口部
１４内に入り込んでパッド１８に接触する条件を検討し
た。When the solder has a spherical shape, as shown in FIG. 6, the spherical solder does not contact the pad 18 and thus does not adhere to the pad 18. Therefore, the amount of solder supplied (volume) even if it became spherical, that is, the amount of contact with the pad 18, that is, the conditions under which the spherical solder enters the opening 14 and contacts the pad 18 was studied.
【００２３】図５に示すように、開口部１４の開口径を
２Ａ、パッド１８表面から保護絶縁層１２の表面までの
開口部１４の深さをｔとしたとき、球２２が、パッド１
８に接触する条件は、はんだの体積Ｂが、式：As shown in FIG. 5, when the opening diameter of the opening 14 is 2A and the depth of the opening 14 from the surface of the pad 18 to the surface of the protective insulating layer 12 is t, the ball 22
The condition for contacting No. 8 is that the volume B of the solder is
【数５】 で表される量以下であることがわかる。なおはんだの体
積Ｂは、はんだペースト中のソルダーボールの体積であ
る。はんだペースト中のソルダーボールの体積ははんだ
ペーストの組成から計算できる。(Equation 5) It can be seen that the amount is equal to or less than the amount represented by. The volume B of the solder is the volume of the solder ball in the solder paste. The volume of the solder ball in the solder paste can be calculated from the composition of the solder paste.
【００２４】はんだの体積Ｂが上記より大きいと、図６
に示すようにパッド１８に接触しないことになる。If the volume B of the solder is larger than the above, FIG.
As shown in FIG.
【００２５】そこで、はんだ量を上記式で表される量
（推定最大はんだ量）よりも少ないようにしてはんだの
濡れ性を試験した結果を表１に示す。Therefore, Table 1 shows the results of a test of the wettability of the solder in which the amount of solder was made smaller than the amount represented by the above formula (estimated maximum amount of solder).
【表１】 [Table 1]
【００２６】表１から明らかなように、はんだ供給量が
推定最大はんだ量（Ｂmax ）に近くなると濡れ不良が発
生するようになる。したがって、はんだの供給量を上記
式で表される量以下になるようにする。As is clear from Table 1, when the amount of supplied solder approaches the estimated maximum amount of solder (B max ), poor wetting occurs. Therefore, the supply amount of the solder is set to be equal to or less than the amount represented by the above equation.
【００２７】なお、はんだペーストを複数回に分けて供
給して必要量の予備はんだを得る場合には、１回目のは
んだ供給量を上記式で表される量より小さくする。２回
目以降のはんだペースト供給の場合には、１回目の供給
によりはんだがパッドに付着しているので、はんだの濡
れ性は良好となる。When a required amount of preliminary solder is obtained by supplying the solder paste in a plurality of times, the first solder supply amount is made smaller than the amount represented by the above formula. In the case of the second or subsequent supply of the solder paste, since the solder is attached to the pad by the first supply, the wettability of the solder is improved.
【００２８】上記のように、はんだの供給量を制限する
と共に、前記第１の実施形態におけるリフロー加熱条件
を併用すると一層はんだの濡れ性が向上する。As described above, when the supply amount of the solder is limited and the reflow heating conditions in the first embodiment are used together, the wettability of the solder is further improved.
【００２９】また、一定のはんだ付性を得るために、は
んだの供給量（Ｂ）が決まっているときは、保護絶縁層
の開口部の開口半径Ａ、およびパッド表面から保護絶縁
層の表面までの開口部の深さｔを、式：Further, in order to obtain a certain solderability, when the supply amount (B) of the solder is determined, the opening radius A of the opening of the protective insulating layer and the distance from the pad surface to the surface of the protective insulating layer are determined. The depth t of the opening of
【数６】 を満足するように、プリント配線基板１０の設計を行う
ようにする。これにより、パッド１８に密着した必要量
の予備はんだ２０を確保できる。(Equation 6) The printed wiring board 10 is designed so as to satisfy the following. Thereby, a necessary amount of the preliminary solder 20 closely contacting the pad 18 can be secured.
【００３０】[0030]
【発明の効果】請求項１によれば、開口部奥側のソルダ
ーボールが早く溶融し、パッドに付着するから、確実に
はんだをパッドに付着させることができる。請求項２に
よれば、はんだが球状になったとしても、パッドに対し
て接触するから、パッドに付着した予備はんだを得るこ
とができる。請求項３によれば、パッドに密着した一定
量の予備はんだを確保できる。According to the first aspect, the solder ball on the back side of the opening is melted quickly and adheres to the pad, so that the solder can be securely adhered to the pad. According to the second aspect, even if the solder has a spherical shape, the solder comes into contact with the pad, so that the preliminary solder attached to the pad can be obtained. According to the third aspect, it is possible to secure a certain amount of preliminary solder in close contact with the pad.
【図１】はんだペーストをパッドに供給した状態の説明
図、FIG. 1 is an explanatory view showing a state in which a solder paste is supplied to a pad,
【図２】開口部奥側のソルダーボールが溶融した状態の
説明図、FIG. 2 is an explanatory view of a state in which a solder ball on the back side of an opening is melted,
【図３】予備はんだが形成された状態の説明図、FIG. 3 is an explanatory view showing a state in which a preliminary solder is formed;
【図４】基板温度プロファイルを示すグラフ、FIG. 4 is a graph showing a substrate temperature profile;
【図５】はんだが球状になって分離した状況を示す説明
図、FIG. 5 is an explanatory view showing a situation in which the solder has become spherical and separated.
【図６】はんだの球体がパッドに接触している状態を示
す説明図である。FIG. 6 is an explanatory diagram showing a state where a solder ball is in contact with a pad.
１０ プリント配線基板 １２ 保護絶縁層 １４ 開口部 １６ はんだペースト １６ａ ソルダーボール １８ パッド ２０ 予備はんだ DESCRIPTION OF SYMBOLS 10 Printed wiring board 12 Protective insulating layer 14 Opening 16 Solder paste 16a Solder ball 18 Pad 20 Pre-soldering
───────────────────────────────────────────────────── フロントページの続き (72)発明者 奥脇 義仁 神奈川県川崎市中原区上小田中４丁目１番 １号 富士通株式会社内 Ｆターム(参考） 5E319 BB05 CC33 5F047 BA06 BB04 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yoshihito Okwaki 4-1-1, Kamidadanaka, Nakahara-ku, Kawasaki-shi, Kanagawa F-term in Fujitsu Limited (Reference) 5E319 BB05 CC33 5F047 BA06 BB04
Claims (3)
パッドに供給してリフロー加熱することによりパッド上
にはんだを付着するはんだ付着方法において、 前記リフロー加熱時、リフロー炉内で基板を加熱する
際、基板温度がはんだの融点より約７℃低い温度から約
７℃高い温度となる昇温領域で、基板の昇温速度を１４
℃／分〜１７℃／分となるように調整すると共に、基板
を主として基板の下面側から加熱することを特徴とする
パッドへのはんだ付着方法。1. A method for applying solder to a pad surrounded by a protective insulating layer by supplying a solder paste to the pad and heating the substrate by reflow heating, wherein the substrate is heated in a reflow furnace during the reflow heating. In this case, in the temperature rising region where the substrate temperature rises from about 7 ° C. lower than the melting point of the solder to about 7 ° C.
A method for adhering solder to a pad, wherein the method is performed so that the temperature of the substrate is adjusted to be 17 ° C./minute to 17 ° C./minute, and the substrate is heated mainly from the lower surface side of the substrate.
パッドに供給してリフロー加熱することによりパッド上
にはんだを付着するはんだ付着方法において、 パッドを囲む保護絶縁層の開口部の開口半径をＡ、パッ
ド表面から保護絶縁層表面までの開口部の深さをｔとし
たとき、パッドに供給するはんだの体積Ｂを、式： 【数１】 を満足する量に設定することを特徴とするパッドへのは
んだ付着方法。2. A method for applying solder to a pad surrounded by a protective insulating layer by supplying a solder paste to the pad and subjecting the solder to reflow heating, wherein the radius of the opening of the opening of the protective insulating layer surrounding the pad is reduced. A, where t is the depth of the opening from the pad surface to the protective insulating layer surface, the volume B of the solder supplied to the pad is expressed by the following formula: A method for adhering solder to a pad, characterized in that the amount is set to satisfy the following.
パッドに供給してリフロー加熱することによりパッド上
にはんだを付着するはんだ付着方法において、 パッドに供給するはんだの体積がＢであるとき、パッド
を囲む保護絶縁層の開口部の開口半径Ａ、およびパッド
表面から保護絶縁層の表面までの開口部の深さｔを、
式： 【数２】 を満足するように設定することを特徴とするパッドへの
はんだ付着方法。3. A method of applying a solder paste to a pad surrounded by a protective insulating layer and applying reflow heating to apply solder to the pad, wherein when the volume of the solder supplied to the pad is B, The opening radius A of the opening of the protective insulating layer surrounding the pad, and the depth t of the opening from the pad surface to the surface of the protective insulating layer,
Formula: A method for adhering solder to a pad, characterized in that the method is set so as to satisfy the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29861798A JP3691972B2 (en) | 1998-10-20 | 1998-10-20 | How to attach solder to pads |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29861798A JP3691972B2 (en) | 1998-10-20 | 1998-10-20 | How to attach solder to pads |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000124594A true JP2000124594A (en) | 2000-04-28 |
| JP3691972B2 JP3691972B2 (en) | 2005-09-07 |
Family
ID=17862055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29861798A Expired - Fee Related JP3691972B2 (en) | 1998-10-20 | 1998-10-20 | How to attach solder to pads |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3691972B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002158439A (en) * | 2000-11-16 | 2002-05-31 | Fujitsu Ltd | Method and apparatus for evaluating solder shape at the time of bga mounting and computer readable recording medium storing program for evaluating solder shape at the time of bga mounting |
-
1998
- 1998-10-20 JP JP29861798A patent/JP3691972B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002158439A (en) * | 2000-11-16 | 2002-05-31 | Fujitsu Ltd | Method and apparatus for evaluating solder shape at the time of bga mounting and computer readable recording medium storing program for evaluating solder shape at the time of bga mounting |
| JP4502496B2 (en) * | 2000-11-16 | 2010-07-14 | 富士通株式会社 | Solder shape evaluation method for BGA mounting, solder shape evaluation apparatus for BGA mounting, and computer-readable recording medium storing a solder shape evaluation program for BGA mounting |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3691972B2 (en) | 2005-09-07 |
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