JP2000124371A - Cooling structure for electric apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooling structure, for an electric apparatus, which prevents the degradation of the characteristic of a transistor and which can obtain a sufficient heat dissipating effect. SOLUTION: A transistor 51 is screwed to a heat sink 2, and also radiators 1 are screwed by screws 54. The radiators 1 are constituted in such a way that their extension parts 1b are extended to a direction in which fins of the heat sink 2 are extended. Consequently, when the heak sink 2 is air-cooled forcibly by a fan, also the radiators 1 are air-cooled forcibly, and a sufficient heat dissipating effect is obtained. In addition, since the extension parts 1b are extended not to the upper side of the transistor 51 but to the lower side, the degradation of the characteristic of the transistor 51 is prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for electric equipment, and more particularly, to a cooling structure for a transistor which generates concentrated heat and has a high temperature.

[0002]

2. Description of the Related Art FIG. 7 is a plan view showing a cooling structure of a conventional electric device, FIG. 8 is a sectional view taken along the line BB of the cooling structure, and FIG. 9 is a sectional view taken along the line AA of the cooling structure.

With reference to FIGS. 7 to 9, a conventional cooling structure for electric equipment will be described. FIGS. 7 to 9 show, as an example, a transistor cooling structure in which concentrated heat is generated and the temperature becomes high.

The transistor 51 has a cross-sectional crank (cr).
An end of the heat sink 52 and the heat sink 53 are jointly fastened with screws 54.

Similarly, the transistor 61 is fastened to one end of a radiator 62 and a heat sink 53 with a screw 64 together.

The other ends of the radiators 52 and 62 are attached to the unit cover 71 by screws 54 and 64, respectively.

Further, the heat sink 53 is forcibly air-cooled by the cooling fan 72. The arrow 73 in FIG. 9 indicates the traveling direction of the cooling air flow from the cooling fan 72.

The heat radiating route of this conventional cooling structure includes a first route by the heat sink 53 and a transistor 5
Radiator 5 fastened together with mounting screws 54, 64 of 1, 61
The second route is configured to release the heat of the transistors 52 and 62 from the unit cover 71 via the radiators 52 and 62 by mounting the transistors 2 and 62 above the transistors 51 and 61 and attaching the unit covers 71 to the unit cover 71.

[0009]

However, in this conventional cooling structure, first, since the radiators 52 and 62 extend above the transistors 51 and 61, the heat from the radiators 52 and 62 causes the transistor to be cooled. There is a drawback that the electrical characteristics of the devices 51 and 61 are affected and the characteristics are deteriorated.

Second, the unit cover 71 has a cooling air 7
3, the heat of the transistors 51 and 61 cannot be sufficiently dissipated through the radiators 52 and 62.

SUMMARY OF THE INVENTION An object of the present invention is to provide a cooling structure for electric equipment, which can prevent deterioration of transistor characteristics and obtain a sufficient heat radiation effect.

[0012]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a heating element, first heat radiating means attached to one side of the heating element, and A second heat radiating means extending in a direction in which the first heat radiating means extends.

According to the present invention, by extending the second heat radiating means in the direction in which the first heat radiating means extends, it is possible to prevent heat from being led out to the upper side of the transistor by the second heat radiating means. Therefore, deterioration of transistor characteristics can be prevented.

Further, if cooling air is applied to the extending portion of the first heat radiating means, the cooling air also hits the extending portion of the second heat radiating means, so that a sufficient heat radiating effect can be obtained.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First, an outline of the present invention will be described. Referring to FIG. 1, the radiator 1 and the heat sink 2 are fastened together by using the mounting screws 54, 64 of the transistors 51, 61 which generate concentrated heat and become high in temperature.

The radiator 1 is forcibly air-cooled by being taken out to the heat sink 2 side. Also, transistors 51 and 6
The heat of 1 is also radiated from the radiator 1 separately from the heat radiating route of the heat sink 2.

By using the heat radiating route from the radiator 1, the transistors 51 and 61 can effectively radiate heat without deteriorating electrical characteristics.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a plan view of a preferred embodiment of a cooling structure for electric equipment according to the present invention, FIG. 2 is a cross-sectional view taken along line BB of the cooling structure, FIG. 3 is a bottom view of the cooling structure, and FIG. It is AA sectional drawing of a structure.

In the figure, the same components as those of the conventional example (FIGS. 7 to 9) are denoted by the same reference numerals, and description thereof will be omitted.

Referring to FIG. 1 to FIG.
1 is equipped with transistors 51 and 61, a radiator 1 and a heat sink 2.

The transistor 51 is fastened to one end of the radiator 1 and the heat sink 2 by screws 54.

A plurality of fins 2a are formed on the heat sink 2. Further, the heat sink 2 has a through hole 2b penetrating therethrough.

On the other hand, the radiator 1 has a first member 1a in which a screw hole (not shown) for screwing with a screw 54 is formed,
The first member 1a and the second member 1b extending in a direction perpendicular to the first member 1a are formed, and the first member 1a and the second member 1b are integrally formed.

The second member 1b is configured to penetrate through the through hole 2b of the heat sink 2.

Similarly, the transistor 61 is also fastened to one end of the radiator 1 and the heat sink 2 by screws 64. The structures of the radiator 1 and the heat sink 2 are the same as those used for the transistor 51 described above, and the description is omitted.

Further, the heat sink 2 and the second member 1b of the radiator 1 are forcibly air-cooled by the cooling fan 3.
An arrow 4 in FIG. 4 indicates a traveling direction of the cooling air by the cooling fan 3.

Next, the heat radiation route of the present embodiment will be described with reference to FIGS. Since the transistors 51 and 61 generate concentrated heat and have a high temperature, the cooling air from the cooling fan 3 flows through the heat sink 2 and the transistors 51 and 61
1 is radiated from the heat sink 2.

However, it is difficult to maintain the reliability of the transistors 51 and 61 at a certain temperature or lower while suppressing the size of the heat sink 2 and the amount of cooling air by using only the heat radiation route.

Therefore, a heat radiating route using the radiator 1 is provided separately from the heat radiating route of the heat sink 2.

The radiator 1 is taken out from the heat sink 2 side (below the transistors 51 and 61) and is forcedly cooled to effectively radiate heat to the transistors 51 and 61 and maintain reliability.

That is, regarding the heat radiation route, by using the heat radiator 1, the heat radiation route on the heat sink 2 side (transistor 5) is not used without using the upward heat radiation route of the transistors 51 and 61.
1, 61 downward).

According to this heat dissipation route, the transistors 51,
Further, since the cooling air blows on the radiator 1 without deteriorating the electrical characteristics of the
1, 61 can be lowered.

Next, an embodiment of the present invention will be described.

[0034]

First, the first embodiment will be described. FIG. 5 shows the first
It is a lineblock diagram of an example. FIG. 5 shows the second member 1b of the radiator 1.
Is a cross-sectional view taken in a direction perpendicular to the extending direction.
As shown in the figure, the second member 1b is formed in a cylindrical shape.

When the amount of heat generated by the transistors 51 and 61 is relatively small, the manufacturing cost can be reduced by forming the second member 1b in such a cylindrical shape.

Next, a second embodiment will be described. FIG.
Is a configuration diagram of the second embodiment. FIG. 6 also shows a view in which the second member 1b of the radiator 1 is sectioned in a direction perpendicular to the extending direction thereof. As shown in the figure, the surface of the second member 1b is formed in an uneven shape.

When the amount of heat generated by the transistors 51 and 61 is relatively large, the heat dissipation effect can be improved by forming the surface of the second member 1b in such an uneven shape.

Next, a third embodiment will be described. Third
The embodiment relates to the material of the radiator 1.

As a material of the radiator 1, for example, a metal such as aluminum or copper can be used. Since the two have different weights, prices, and thermal conductivities, by selecting one as needed, it is possible to obtain an optimum one in terms of weight, price, and heat radiation effect.

The three embodiments have been described above.
By providing the radiator 1 together with the heat sink 2,
It is also possible to reduce the size of the heat sink 2 and the amount of cooling air.

Japanese Patent Application Laid-Open No. Hei 7-297328 (see FIG. 2) discloses a convection discharged from the cooling fan 22 to the pins 80 of the heating element 93 via the stationary fins 12b using a heat radiation route on the heat sink 12 side. And a technique for improving the heat radiation effect has been disclosed.

Although the present invention has the same purpose as the present invention in that the heat radiation effect is enhanced, the heat radiation means is only the fin 12 and the second fin is not provided, and the convection through the stationary fin 12b generates heat. The configuration is completely different from that of the present invention, such as being directed toward the body 93.

Therefore, the operation and effect obtained from the technique described in this publication are completely different from those of the present invention.

[0044]

According to the present invention, the heating element, the first radiating means attached to one surface of the heating element, and the direction in which the first radiating means is attached to the other surface of the heating element and extend. Since the cooling structure of the electric device is configured to include the second heat radiating means extending to the above, deterioration of the characteristics of the transistor is prevented and a sufficient heat radiating effect is obtained.

[Brief description of the drawings]

FIG. 1 is a plan view of a preferred embodiment of a cooling structure for electric equipment according to the present invention.

FIG. 2 is a sectional view taken along the line BB of the cooling structure.

FIG. 3 is a bottom view of the cooling structure.

FIG. 4 is a sectional view taken along line AA of the cooling structure.

FIG. 5 is a configuration diagram of the first embodiment.

FIG. 6 is a configuration diagram of a second embodiment.

FIG. 7 is a plan view showing a cooling structure of a conventional electric device.

FIG. 8 is a sectional view taken along the line BB of the cooling structure.

FIG. 9 is a sectional view taken along line AA of the cooling structure.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heat sink 2 Heat sink 3 Cooling fan 11 Unit to be cooled 51,61 Transistor 54,64 Screw

Claims (8)

[Claims] 1. A heating element, a first radiating means attached to one surface of the heating element, and a second radiating means attached to another surface of the heating element and extending in a direction in which the first radiating means extends. A cooling structure for electrical equipment, comprising: heat radiating means. 2. The cooling structure for an electric device according to claim 1, further comprising forced air cooling means for forcibly air cooling the extending portions of said first and second heat radiating means. 3. The device according to claim 1, wherein a through hole is formed in the first heat radiating means, and a part of the second heat radiating means is formed to pass through the through hole. Cooling structure for electrical equipment. 4. A screw hole for screwing the first heat radiating means is formed in the heating element, and the second heat radiating means is screwed together with the first heat radiating means via the screw hole. The cooling structure for an electric device according to claim 1, wherein: 5. The apparatus according to claim 1, wherein the second heat radiating means includes a first member in which the screw hole for screwing is formed, and a second member extending in a direction perpendicular to the first member. Item 5. A cooling structure for an electric device according to Item 4. 6. The cooling structure for an electric device according to claim 5, wherein said second member is formed in a cylindrical shape. 7. The cooling structure for an electric device according to claim 5, wherein the second member has an uneven surface. 8. The cooling structure according to claim 1, wherein said heating element is an active element.