JP2000113784A - Manufacture of thin temperature fuse - Google Patents

Manufacture of thin temperature fuse

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Publication number
JP2000113784A
JP2000113784A JP10296153A JP29615398A JP2000113784A JP 2000113784 A JP2000113784 A JP 2000113784A JP 10296153 A JP10296153 A JP 10296153A JP 29615398 A JP29615398 A JP 29615398A JP 2000113784 A JP2000113784 A JP 2000113784A
Authority
JP
Japan
Prior art keywords
alloy piece
melting point
flux
low melting
fusible alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10296153A
Other languages
Japanese (ja)
Other versions
JP4097806B2 (en
Inventor
Toshiaki Kawanishi
俊朗 川西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uchihashi Estec Co Ltd
Original Assignee
Uchihashi Estec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uchihashi Estec Co Ltd filed Critical Uchihashi Estec Co Ltd
Priority to JP29615398A priority Critical patent/JP4097806B2/en
Publication of JP2000113784A publication Critical patent/JP2000113784A/en
Application granted granted Critical
Publication of JP4097806B2 publication Critical patent/JP4097806B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To provide a fuse easily having good sealing ability by fusing a resin cover film with a periphery surrounding a fusable alloy piece with flux coating low melting point of a resin base film, and sealing this fusible alloy piece with low melting point alloy. SOLUTION: A long resin cover film 120 extending orthogonally to the longitudinal direction of a lead conductor 2 of a temperature fuse body A is placed on a resin base film 11, and positioning of the cover film 120 in relation to the longitudinal direction is performed by a positioning jig. A heating die D having a recessed part (c) for accommodating a fusible alloy piece (a) with flux coating low melting point is dropped, the cover film 120 is thermally fused with a periphery surrounding the fusible alloy piece (a) with flux coating low melting point on the base film 11. The heating die D is provided with a Thomson blade for cutting the cover film 120 at the both edges of the width of the base film 11, and the blade cuts the cover film 120 at thermally fusing time.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は薄型温度ヒュ−ズの
製造方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a thin temperature fuse.

【0002】[0002]

【従来の技術】合金型温度ヒュ−ズにおいては、機器の
過電流に基づく発熱で低融点可溶合金のヒュ−ズエレメ
ントを溶断させて機器の通電を遮断し機器の異常発熱ひ
いては火災の発生を未然に防止している。近来、携帯電
話、ノ−トブックパソコン、ビデオカメラ等のパ−ソナ
ルユ−ス電子機器の小型化・薄型化に伴い、その電源で
ある二次電池(リチウムイオン電池、ニッケル水素電池
等)も小型化されている。
2. Description of the Related Art In an alloy type temperature fuse, a fuse element of a low melting point fusible alloy is blown off by heat generated due to an overcurrent of the device to cut off the power supply to the device, thereby causing abnormal heat generation of the device and a fire. Is prevented beforehand. In recent years, as personal electronic devices such as mobile phones, notebook PCs, and video cameras have become smaller and thinner, secondary batteries (lithium-ion batteries, nickel-metal hydride batteries, etc.) as power sources have also become smaller. Have been.

【0003】このリチウムイオン二次電池等では、エネ
ルギ−密度が高く放電時や充電時に相当に大きな電流が
流れて昇温する可能性があるので、二次電池の底面また
は側面に合金型温度ヒュ−ズを配設して昇温防止するこ
とが検討されている。この合金型温度ヒュ−ズにおいて
は、電池の小型化に対応して薄型であることが要請さ
れ、本出願人においてはかかる薄型温度ヒュ−ズとし
て、「樹脂ベ−スフィルムに一対のリ−ド導体の各先端
部を裏面より表面に表出させ、その表出部間に低融点可
溶合金片を接続し、該低融点可溶合金片にフラックスを
塗布し、樹脂カバ−フィルムを前記樹脂ベ−スフィルム
での前記フラックス塗布低融点可溶合金片を囲む周囲部
に融着した合金型の温度ヒュ−ズ」を既に提示した(特
公平7−95419号)。
In this lithium ion secondary battery or the like, since the energy density is high and a considerably large current flows during discharging or charging and the temperature may rise, an alloy-type temperature hue is formed on the bottom or side surface of the secondary battery. It has been considered to dispose a heater to prevent the temperature from rising. This alloy-type temperature fuse is required to be thin in order to reduce the size of the battery, and the applicant of the present invention has described such a thin temperature fuse as "a pair of leads on a resin base film." Each tip of the conductor is exposed from the back surface to the front surface, a low-melting-point fusible alloy piece is connected between the exposed portions, and a flux is applied to the low-melting-point fusible alloy piece to form a resin cover film. An alloy-type temperature fuse fused to the periphery of the flux-coated low melting point fusible alloy piece with a resin base film "has already been proposed (Japanese Patent Publication No. 7-95419).

【0004】[0004]

【発明が解決しようとする課題】合金型温度ヒュ−ズに
おいては、低融点可溶合金片の表面に不可避的に形成さ
れる酸化膜を温度ヒュ−ズの作動時にフラックスの溶融
活性化により溶解して溶融合金の球状化分断を促進して
いる。従って、上記薄型温度ヒュ−ズの樹脂カバ−フィ
ルムによる封止においては、フラックスの加圧変形によ
る低融点可溶合金片の露出を排除するように、樹脂カバ
−フィルムを予め容器状に成形してフラックスに過大な
応力を作用させないようにしている。
In the alloy type temperature fuse, an oxide film inevitably formed on the surface of the low melting point fusible alloy piece is melted by activating the flux during the operation of the temperature fuse. As a result, the spheroidization of the molten alloy is promoted. Therefore, in sealing the thin temperature fuse with the resin cover film, the resin cover film is formed in a container shape in advance so as to eliminate the exposure of the low melting point fusible alloy piece due to the pressure deformation of the flux. To prevent excessive stress from acting on the flux.

【0005】しかし、かかる成形樹脂カバ−フィルムを
使用すると、樹脂カバ−フィルム内の空間にフラックス
塗布低融点可溶合金片を納めるようにフラックス塗布低
融点可溶合金片に対する厳格な位置合わせが必要であ
り、製造能率の低下や製造設備のコストアップが招来さ
れる。一方、ラフな位置合わせのもとでは、封止界面に
フラックスが噛み込んで所定の封止性を確保し得ず、製
品の歩留まりの低下が避けられない。
However, when such a molded resin cover film is used, strict alignment with the flux-coated low-melting-point fusible alloy piece is required so that the flux-coated low-melting-point fusible alloy piece is accommodated in the space in the resin cover film. This leads to a decrease in manufacturing efficiency and an increase in cost of manufacturing equipment. On the other hand, under the rough alignment, the flux is stuck in the sealing interface, and a predetermined sealing property cannot be ensured, so that a reduction in product yield cannot be avoided.

【0006】本発明の目的は、樹脂カバ−フィルムを樹
脂ベ−スフィルムにおけるフラックス塗布低融点可溶合
金片を囲む周囲部に融着してフラックス塗布低融点可溶
合金片を封止する薄型温度ヒュ−ズを容易に優れた封止
性のもとで製造できる薄型温度ヒュ−ズの製造方法を提
供することにある。
SUMMARY OF THE INVENTION It is an object of the present invention to provide a thin resin sealing film for a flux-coated low-melting fusible alloy piece by fusing the resin cover film to a peripheral portion of the resin-based film surrounding the flux-coated low-melting fusible alloy piece. It is an object of the present invention to provide a method of manufacturing a thin temperature fuse that can easily produce a temperature fuse with excellent sealing properties.

【0007】[0007]

【課題を解決するための手段】本発明に係る一の薄型温
度ヒュ−ズの製造方法は、樹脂ベ−スフィルムに一対の
リ−ド導体の各先端部を裏面より表面に表出させ、その
表出部間に低融点可溶合金片を接続し、該低融点可溶合
金片にフラックスを塗布した温度ヒュ−ズ本体を製作
し、上記フラックス塗布低融点可溶合金片の全長を納め
得る巾の連続溝を成形した長尺樹脂カバ−フィルムを上
記温度ヒュ−ズ本体の樹脂ベ−スフィルム上に配置し、
その樹脂ベ−スフィルムでの上記フラックス塗布低融点
可溶合金片を囲む周囲部において長尺樹脂カバ−フィル
ムを樹脂ベ−スフィルムに融着することを特徴とする構
成である。
According to one aspect of the present invention, there is provided a method of manufacturing a thin temperature fuse, in which a resin base film exposes the respective tips of a pair of lead conductors from the back surface to the front surface. A low melting point fusible alloy piece is connected between the exposed portions, a temperature fuse body is formed by applying a flux to the low melting point fusible alloy piece, and the entire length of the flux coated low melting point fusible alloy piece is stored. A long resin cover film formed with a continuous groove having a width to be obtained is disposed on the resin base film of the temperature fuse body,
A long resin cover film is fused to the resin base film at a peripheral portion surrounding the flux-coated low melting point fusible alloy piece on the resin base film.

【0008】本発明に係る他の薄型温度ヒュ−ズの製造
方法は、一対のリ−ド導体の先端部間に低融点可溶合金
片を接続し、該低融点可溶合金片にフラックスを塗布
し、このフラックス塗布低融点可溶合金片を樹脂ベ−ス
フィルムと樹脂カバ−フィルムとの周囲部の融着により
封止した温度ヒュ−ズを製造する方法であり、上記リ−
ド導体間のフラックス塗布低融点可溶合金片を挾んで上
記リ−ド導体の長手方向と直交する方向に延びる長尺樹
脂ベ−スフィルムと長尺樹脂カバ−フィルムとを配し、
両長尺フィルムの少なくとも一方には上記フラックス塗
布低融点可溶合金片の全長を納め得る巾の連続溝を成形
しておき、これらの両長尺フィルムを上記フラックス塗
布低融点可溶合金片を囲む周囲部において融着し、所定
の巾で切断することを特徴とする構成である。
In another method for manufacturing a thin temperature fuse according to the present invention, a low melting point fusible alloy piece is connected between tips of a pair of lead conductors, and a flux is applied to the low melting point fusible alloy piece. A method for producing a temperature fuse in which the flux-coated low-melting-point fusible alloy piece is sealed by fusing a peripheral portion between a resin base film and a resin cover film.
A long resin base film and a long resin cover film extending in a direction orthogonal to the longitudinal direction of the lead conductor with the flux-coated low melting point fusible alloy piece interposed between the lead conductors;
At least one of the two long films is formed with a continuous groove having a width that can accommodate the entire length of the flux-coated low-melting fusible alloy piece, and these two long films are coated with the flux-coated low-melting fusible alloy piece. This is a configuration characterized by being fused at a surrounding portion and cut at a predetermined width.

【0009】[0009]

【発明の実施の形態】BEST MODE FOR CARRYING OUT THE INVENTION

【発明の実施の形態】以下、図面を参照しつつ本発明の
実施の形態について説明する。図1の(イ)及び図1の
(ロ)〔図1の(イ)のロ−ロ断面図〕は請求項1に係
る方法により製造される薄型温度ヒュ−ズの一例を示し
ている。図1において、11は樹脂ベ−スフィルムであ
り、同一直線上に配置した一対の帯状リ−ド導体2,2
をその各先端部20をフィルム裏面から表面に表出させ
て融着または接着剤により固着してある。3はヒュ−ズ
エレメントとしての低融点可溶合金片であり、帯状リ−
ド導体の表出先端部20,20間に接続し、フラックス
4を塗布してある。12は樹脂カバ−フィルムであり、
周囲部を樹脂ベ−スフィルム11に熱融着や超音波溶接
により封止してある。
Embodiments of the present invention will be described below with reference to the drawings. FIGS. 1A and 1B show an example of a thin temperature fuse manufactured by the method according to the first aspect. In FIG. 1, reference numeral 11 denotes a resin base film, and a pair of strip-shaped lead conductors 2, 2 arranged on the same straight line.
The front end portions 20 are exposed from the back surface of the film to the front surface, and are fixed by fusion or an adhesive. Reference numeral 3 denotes a low-melting-point fusible alloy piece as a fuse element.
The flux 4 is applied between the exposed ends 20, 20 of the conductors. 12 is a resin cover film,
The peripheral portion is sealed to the resin base film 11 by heat fusion or ultrasonic welding.

【0010】図2の(イ)は本発明において使用する長
尺の樹脂カバ−フィルム120の一例を示し、上記フラ
ックス塗布低融点可溶合金片の全長よりやや広い巾の溝
121を成形してある。この溝121の形状はフラック
ス塗布低融点可溶合金片の全長を収容し得る可及的に浅
いものであれば特に限定されず、例えば図2の(ロ)に
示すように溝底部にリブ用の凸条122または凹条を形
成することもできる。
FIG. 2A shows an example of a long resin cover film 120 used in the present invention. A groove 121 having a width slightly wider than the entire length of the flux-coated low melting point fusible alloy piece is formed. is there. The shape of the groove 121 is not particularly limited as long as it is as shallow as possible to accommodate the entire length of the flux-coated low melting point fusible alloy piece. For example, as shown in FIG. May be formed.

【0011】請求項1に係る発明により図1に示す薄型
温度ヒュ−ズを製造するには、樹脂ベ−スフィルムの両
端部に一対のリ−ド導体の各先端部を裏面より表面に表
出させ、その表出部間に低融点可溶合金片を接続し、該
低融点可溶合金片にフラックスを塗布した温度ヒュ−ズ
本体(図1におけるA)を製作しておき、図3におい
て、まず温度ヒュ−ズ本体Aの樹脂ベ−スフィルム11
を基台B上にをセットし、この樹脂ベ−スフィルム11
上に温度ヒュ−ズ本体Aのリ−ド導体2の長手方向と直
交する方向に前記の長尺樹脂カバ−フィルム120(長
尺樹脂カバ−フィルム120と樹脂ベ−スフィルム11
とは等巾)を延在させて載置し(図3では図示の便宜上
間隔をおいて配してある)、位置合わせ治具(図示して
いない)により長尺樹脂カバ−フィルム120の位置合
わせを行い(後述するようにリ−ド導体の長手方向に対
しての位置合わせ)、上記フラックス塗布低融点可溶合
金片aを収容する凹部cを有する加熱金型Dを降下させ
て樹脂ベ−スフィルム11でのフラックス塗布低融点可
溶合金片aを囲む周囲部に長尺樹脂ベ−スフィルム12
0を熱融着する。
In order to manufacture the thin temperature fuse shown in FIG. 1 according to the first aspect of the present invention, each end of a pair of lead conductors is provided on both ends of the resin base film from the back to the front. A low-melting-point fusible alloy piece was connected between the exposed portions, and a temperature fuse body (A in FIG. 1) in which a flux was applied to the low-melting-point fusible alloy piece was manufactured. First, the resin-based film 11 of the temperature fuse body A
Is set on the base B, and the resin base film 11 is set.
The long resin cover film 120 (the long resin cover film 120 and the resin base film 11) are placed on the temperature fuse body A in a direction orthogonal to the longitudinal direction of the lead conductor 2.
(Equal width) is extended and placed (spaced in FIG. 3 for convenience of illustration), and the position of the long resin cover film 120 is adjusted by an alignment jig (not shown). The heating die D having the concave portion c for accommodating the flux-coated low-melting-point fusible alloy piece a is lowered by performing alignment (positioning in the longitudinal direction of the lead conductor as described later). A long resin base film 12 is provided around the periphery of the flux-coated low melting point fusible alloy piece a.
0 is heat-sealed.

【0012】上記加熱金型Dに、樹脂ベ−スフィルム1
1の巾の両端縁において樹脂カバ−フィルム120を切
断するようにトムソン刃を設けておき前記の熱融着と同
時に樹脂カバ−フィルム120を切断するか、または加
熱金型Dとは別体のカッタ−で前記の熱融着後に樹脂カ
バ−フィルム120を切断し、これにて図1に示した薄
型温度ヒュ−ズの製造を終了する。上記において、樹脂
ベ−スフィルムも最終寸法よりも長くしておき、上記熱
融着後、樹脂カバ−フィルム120と樹脂カバ−フィル
ムとを一挙に切断することもできる。
In the heating mold D, a resin base film 1
A Thomson blade is provided so as to cut the resin cover film 120 at both end edges having a width of 1, and the resin cover film 120 is cut at the same time as the above-mentioned heat fusion, or a separate heat mold D is used. The resin cover film 120 is cut by the cutter after the above-mentioned heat fusion, and the production of the thin temperature fuse shown in FIG. 1 is completed. In the above, the resin base film may be made longer than the final size, and after the above-mentioned heat fusion, the resin cover film 120 and the resin cover film may be cut at once.

【0013】上記において、長尺樹脂カバ−フィルム1
20を樹脂ベ−スフィルム11上の空間に延在させ、そ
の両端をクランプ等により一定の低把持力で支持し、上
記加熱金型を長尺樹脂カバ−フィルムの前記低把持力に
抗して低張力(長尺樹脂カバ−フィルムに実質上伸びを
生じさせない程度の低張力)のもとで降下させてもよ
い。また、上記フラックス塗布低融点可溶合金片を収容
する凹部を有する超音波溶着工具ホ−ンを上記の加熱金
型Dに代え使用して超音波溶接することもできる。
In the above, the long resin cover film 1
20 is extended into the space above the resin base film 11, and both ends thereof are supported by a clamp or the like with a constant low gripping force, so that the heating mold resists the low gripping force of the long resin cover film. Thus, the lowering may be performed under a low tension (a low tension that does not substantially cause elongation of the long resin cover film). The ultrasonic welding tool horn having a recess for accommodating the flux-coated low-melting-point fusible alloy piece may be used instead of the heating mold D for ultrasonic welding.

【0014】上記において基台Bと金型Dとはガイドピ
ンで連結してあり、基台Bに設けた位置合わせ手段で温
度ヒュ−ズ本体aの樹脂ベ−スフィルム11を基台B上
にセットすれば、上記金型Dの凹部cの輪郭内にフラッ
クス塗布フラックスaを収容させるように、自ずから位
置合わせできる。
In the above description, the base B and the mold D are connected by guide pins, and the resin base film 11 of the temperature fuse body a is placed on the base B by a positioning means provided on the base B. In this case, the position can be naturally adjusted such that the flux application flux a is accommodated in the contour of the concave portion c of the mold D.

【0015】上記において、長尺樹脂カバ−フィルム1
20の溝121内にフラックス塗布低融点可溶合金片a
を収容させるように、その長尺フィルム120を温度ヒ
ュ−ズ本体Aのリ−ド導体2の長手方向に対して位置合
わせする必要があるが、その長手方向と直交する方向に
対する位置合わせは不要である。従って、長尺樹脂カバ
−フィルムの位置合わせを一方向についてのみ行えばよ
く、二方向についての位置合わせを必要とする場合に較
べて位置合わせが容易であり、作業性の向上乃至は製造
設備の簡易化を図ることができる。そして、充分な精度
の位置合わせを保証でき、封止界面へのフラックスの噛
み込みを排除して封止性に優れた高品質の薄型温度ヒュ
−ズを製造できる。
In the above, the long resin cover film 1
Flux coated low melting point fusible alloy piece a in groove 121
, It is necessary to align the long film 120 with respect to the longitudinal direction of the lead conductor 2 of the temperature fuse body A, but there is no need to align with the direction perpendicular to the longitudinal direction. It is. Therefore, the alignment of the long resin cover film only needs to be performed in one direction, and the alignment is easier than in the case where the alignment in two directions is required. Simplification can be achieved. In addition, it is possible to guarantee the positioning with sufficient accuracy, and eliminate the flux from being caught in the sealing interface, thereby producing a high-quality thin temperature fuse having excellent sealing properties.

【0016】請求項1に係る発明は、図4に示すように
樹脂ベ−スフィルム11に一対のリ−ド導体の一方21
の先端部を裏面より表面に表出させ、他方のリ−ド導体
22の先端部を表面に固定し、それらの先端部間に低融
点可溶合金片3を接続し、該低融点可溶合金片3にフラ
ックス4を塗布した温度ヒュ−ズ本体aを樹脂ベ−スフ
ィルム12で封止する薄型温度ヒュ−ズの製造にも適用
できる。
According to the first aspect of the present invention, as shown in FIG.
Of the other lead conductor 22 is fixed to the front surface, and a low melting point fusible alloy piece 3 is connected between the front ends of the lead conductors 22. The present invention can also be applied to the manufacture of a thin temperature fuse in which the temperature fuse body a in which the flux 4 is applied to the alloy piece 3 is sealed with the resin base film 12.

【0017】請求項1にかかわる薄型温度ヒュ−ズの製
造方法は、温度ヒュ−ズ本体を複数個並列に配し、これ
らの上に連続溝成形の長尺樹脂カバ−フィルムを配し、
この長尺樹脂カバ−フィルムを用いて並列配置の全温度
ヒュ−ズ本体を一挙に封止する態様で実施することもで
きる。この場合、複数並列の温度ヒュ−ズ本体の樹脂カ
バ−フィルムを連続の長尺としておき、封止後に両方の
長尺樹脂フィルムを所定巾に接続することもできる。
According to a first aspect of the present invention, there is provided a method for manufacturing a thin temperature fuse, comprising: arranging a plurality of temperature fuse bodies in parallel, and arranging a long resin cover film having a continuous groove thereon.
The present invention can also be implemented in such a manner that all the temperature fuse bodies arranged in parallel are sealed at once using this long resin cover film. In this case, the resin cover films of the plurality of temperature fuse bodies in parallel may be made continuous and long, and both long resin films may be connected to a predetermined width after sealing.

【0018】図5の(イ)及び図5の(ロ)〔図5の
(イ)のロ−ロ断面図〕は請求項2に係る発明により製
造される薄型温度ヒュ−ズの一例を示している。図5に
おいて、11はベ−ス樹脂フィルムを、12は樹脂カバ
−フィルムを、2は帯状リ−ド導体を、3は帯状リ−ド
導体2,2の先端部間に接続された低融点可溶合金片
を、4は低融点可溶合金片3に塗布されたフラックスを
それぞれ示し、樹脂カバ−フィルム12はフラックス塗
布低融点可溶合金片aの収容空間を備えている。
FIGS. 5 (a) and 5 (b) [a cross-sectional view taken along the roll of FIG. 5 (a)] show an example of a thin temperature fuse manufactured according to the second aspect of the present invention. ing. In FIG. 5, 11 is a base resin film, 12 is a resin cover film, 2 is a strip-shaped lead conductor, and 3 is a low melting point connected between the tips of the strip-shaped lead conductors 2 and 2. The fusible alloy pieces 4 indicate the flux applied to the low melting point fusible alloy pieces 3, respectively, and the resin cover film 12 has a space for accommodating the flux applied low melting point fusible alloy pieces a.

【0019】請求項2に係る発明により図5に示す薄型
温度ヒュ−ズを製造するには、同一直線上に配置した一
対の帯状リ−ド導体の先端間に低融点可溶合金片を接続
し、この低融点可溶合金片にフラックスを塗布して温度
ヒュ−ズ主体を製作しておき、図6において、まず基台
B上に上記リ−ド導体2,2間のフラックス塗布低融点
可溶合金片aを載置すると共にそのフラックス塗布低融
点可溶合金片aの直下に平滑な長尺樹脂ベ−スフィルム
110をリ−ド導体2の長手方向と直交する方向に延在
させて配し、またフラックス塗布低融点可溶合金片aの
直上に前記の連続溝成形長尺樹脂カバ−フィルム120
をリ−ド導体2の長手方向と直交する方向に延在させて
配し(長尺樹脂カバ−フィルム120と長尺樹脂ベ−ス
フィルム110とは等巾)、上記フラックス塗布低融点
可溶合金片aを収容する凹部cを有する加熱金型Dまた
は超音波溶着工具ホ−ンを降下させて樹脂ベ−スフィル
ム110でのフラックス塗布低融点可溶合金片aを囲む
周囲部に長尺樹脂カバ−フィルム120を熱融着乃至は
超音波溶接し、これらの溶着と同時に両長尺フィルム1
10,120を切断するか、加熱金型または超音波溶着
工具ホ−ンと別体のカッタ−で前記の熱融着後に両長尺
フィルムを切断し、これにて図5に示す薄型温度ヒュ−
ズの製造を終了する。
In order to manufacture the thin temperature fuse shown in FIG. 5 according to the second aspect of the present invention, a low melting point fusible alloy piece is connected between the tips of a pair of strip-shaped lead conductors arranged on the same straight line. Then, a flux is applied to the low-melting-point fusible alloy piece to form a main body of the temperature fuse. In FIG. The fusible alloy piece a is placed and a smooth long resin base film 110 is extended immediately below the flux-coated low melting point fusible alloy piece a in a direction perpendicular to the longitudinal direction of the lead conductor 2. And the continuous groove forming long resin cover film 120 immediately above the flux-applied low melting point fusible alloy piece a.
Is extended in the direction perpendicular to the longitudinal direction of the lead conductor 2 (the length of the long resin cover film 120 and the length of the long resin base film 110 are the same), and the flux is coated with a low melting point. The heating die D having the concave portion c for accommodating the alloy piece a or the ultrasonic welding tool horn is lowered so that the flux-applied low melting point fusible alloy piece a on the resin base film 110 is elongated in the peripheral portion. The resin cover film 120 is heat-sealed or ultrasonic-welded, and the two long films 1 are simultaneously welded together.
10, 120, or both the long films are cut after the above-mentioned heat welding by a cutter separate from a heating mold or an ultrasonic welding tool horn. −
End of production

【0020】請求項2に係る薄型温度ヒュ−ズの製造方
法では、長尺樹脂ベ−スフィルム110に長尺樹脂カバ
−フィルム120と同様に連続溝を成形したものを使用
して図7に示すような薄型温度ヒュ−ズの製造にも使用
できる。
FIG. 7 shows a method for manufacturing a thin temperature fuse according to a second embodiment of the present invention, in which a continuous groove is formed on a long resin base film 110 in the same manner as the long resin cover film 120. It can also be used to produce a thin temperature fuse as shown.

【0021】請求項2に係る薄型温度ヒュ−ズの製造方
法においても、樹脂カバ−フィルム120の位置合わせ
を一方向(リ−ド導体の方向)についてのみ行えばよ
く、位置合わせが容易であり、作業性の向上乃至は製造
設備の簡易化を図ることができ、而して、充分な精度の
位置合わせのもとで、封止界面へのフラックスの噛み込
みを排除して封止性に優れた高品質の薄型温度ヒュ−ズ
を容易に製造できる。
In the method for manufacturing a thin temperature fuse according to the second aspect, the alignment of the resin cover film 120 may be performed only in one direction (the direction of the lead conductor), and the alignment is easy. Therefore, the workability can be improved or the manufacturing equipment can be simplified. Therefore, under the alignment with sufficient accuracy, the entrapment of the flux into the sealing interface is eliminated to improve the sealing property. An excellent high quality thin temperature fuse can be easily manufactured.

【0022】請求項2にかかわる薄型温度ヒュ−ズの製
造方法は、温度ヒュ−ズ主体を複数個並列に配し、これ
らの上下に長尺樹脂カバ−フィルムと長尺樹脂ベ−スフ
ィルムを配し、この長尺樹脂フィルムを用い全温度ヒュ
−ズ本体を一挙に封止する態様で実施することもでき
る。
According to a second aspect of the present invention, there is provided a method of manufacturing a thin temperature fuse, wherein a plurality of temperature fuses are arranged in parallel, and a long resin cover film and a long resin base film are provided above and below these. The entire temperature fuse body may be sealed at once using the long resin film.

【0023】本発明において使用する樹脂ベ−スフィル
ムや樹脂カバ−フィルムには、例えばポリエチレンテレ
フタレ−ト、ポリフェニレンサルファイド、ポリアミ
ド、ポリイミド、ポリフェニレンオキシド、ポリサルホ
ン等のエンジニアリングプラスチック等の熱可塑性樹脂
フィルムを使用できる。特に、長尺樹脂ベ−スフィルム
や樹脂カバ−フィルムに、図2の(ロ)に示すように溝
121の底面に凸条122または凹条を形成したものを
使用すれば、薄型温度ヒュ−ズの長手方向(リ−ド導線
方向)に沿う曲げに対し凸条または凹条にリブ作用を営
なましめ得、温度ヒュ−ズの曲げ強度を向上できる。
The resin base film and the resin cover film used in the present invention include thermoplastic resin films such as engineering plastics such as polyethylene terephthalate, polyphenylene sulfide, polyamide, polyimide, polyphenylene oxide and polysulfone. Can be used. In particular, when a long resin base film or a resin cover film having a convex portion 122 or a concave portion formed on the bottom surface of the groove 121 as shown in FIG. The rib can act as a ridge or a ridge against bending along the longitudinal direction of the fuse (lead wire direction), and the bending strength of the temperature fuse can be improved.

【0024】上記帯状リ−ド導体には、例えば銅、アル
ミニウム、ニッケル等を使用できる。低融点可溶合金片
には温度ヒュ−ズの作動温度に応じた融点のものを使用
し、また、フラックスにはロジンを主成分とするものを
使用できる。
For the strip-shaped lead conductor, for example, copper, aluminum, nickel or the like can be used. As the low melting point fusible alloy piece, one having a melting point corresponding to the operating temperature of the temperature fuse can be used, and as the flux, one containing rosin as a main component can be used.

【0025】本発明により製造される薄型温度ヒュ−ズ
の寸法や材質の一例を示せば、樹脂ベ−スフィルム及び
樹脂カバ−フィルムが厚み200μm、平面寸法5mm
×11mmのポリエチレンテレフタレ−トフィルムであ
り、帯状リ−ド導体が厚み100μm、巾3.5mm、
長さ13mmのニッケル帯状体(先端部に銅箔をクラッ
ド)であり、低融点可溶合金片が共晶点温度94℃,断
面積0.07mm2,厚み50μmであり、フラックス
がロジンを主成分とするものを例示できる。
An example of the dimensions and materials of the thin temperature fuse manufactured according to the present invention is as follows. The resin base film and the resin cover film have a thickness of 200 μm and a plane size of 5 mm.
× 11 mm polyethylene terephthalate film, strip-shaped lead conductor having a thickness of 100 μm, a width of 3.5 mm,
It is a 13 mm long nickel strip (copper clad at the tip) with a low melting point fusible alloy piece having a eutectic point temperature of 94 ° C, a cross-sectional area of 0.07 mm 2 , and a thickness of 50 μm. What is used as a component can be illustrated.

【0026】[0026]

【発明の効果】本発明に係る薄型温度ヒュ−ズの製造方
法によれば、樹脂カバ−フィルムにフラックス塗布低融
点可溶合金片を収容させるための空間を具備させている
にもかかわらず、その樹脂カバ−フィルムの空間内にフ
ラックス塗布低融点可溶合金片を納めるための位置合わ
せを一方向(例えば、リ−ド導体の方向)についてのみ
行えばよく、その一方向に直交する方向に対しての位置
合わせが不要であるから、位置合わせが容易であり、製
造の容易化乃至は製造設備の簡易化を図ることができ
る。また、位置合わせの優れた精度のために良好な封止
性を保証でき、良品質の薄型温度ヒュ−ズを容易に良好
な歩留で製造できる。
According to the method for manufacturing a thin temperature fuse according to the present invention, although the resin cover film is provided with a space for accommodating the flux-coated low melting point fusible alloy piece, Positioning for placing the flux-coated low-melting-point fusible alloy piece in the space of the resin cover film only needs to be performed in one direction (for example, the direction of the lead conductor), and in a direction orthogonal to the one direction. No positioning is required, so positioning is easy, and manufacturing can be facilitated or manufacturing equipment can be simplified. In addition, good sealing performance can be ensured due to excellent positioning accuracy, and a high-quality thin temperature fuse can be easily manufactured with a good yield.

【図面の簡単な説明】[Brief description of the drawings]

【図1】請求項1に係る方法で製造される薄型温度ヒュ
−ズの一例を示す図面である。
FIG. 1 is a view showing an example of a thin temperature fuse manufactured by the method according to claim 1;

【図2】本発明において使用する長尺樹脂カバ−フィル
ムを示す図面である。
FIG. 2 is a view showing a long resin cover film used in the present invention.

【図3】請求項1に係る薄型温度ヒュ−ズの製造方法の
実施例を示す図面である。
FIG. 3 is a view showing an embodiment of a method of manufacturing a thin temperature fuse according to claim 1;

【図4】請求項1に係る方法で製造される薄型温度ヒュ
−ズの別例を示す図面である。
FIG. 4 is a drawing showing another example of a thin temperature fuse manufactured by the method according to claim 1;

【図5】請求項2に係る方法で製造される薄型温度ヒュ
−ズの一例を示す図面である。
FIG. 5 is a view showing an example of a thin temperature fuse manufactured by the method according to claim 2;

【図6】請求項2に係る薄型温度ヒュ−ズの製造方法の
実施例を示す図面である。
FIG. 6 is a view showing an embodiment of a method of manufacturing a thin temperature fuse according to claim 2;

【図7】請求項2に係る方法で製造される薄型温度ヒュ
−ズの別例を示す図面である。
FIG. 7 is a drawing showing another example of a thin temperature fuse manufactured by the method according to claim 2;

【符号の説明】 11 樹脂ベ−スフィルム 12 樹脂カバ−フィルム 2 リ−ド導体 3 低融点可溶合金片 4 フラックス a フラックス塗布低融点可溶合金片 A 温度ヒュ−ズ本体 120 長尺樹脂カバ−フィルム 121 連続溝 B 基台 c 凹部 D 金型[Description of Signs] 11 Resin base film 12 Resin cover film 2 Lead conductor 3 Low melting point fusible alloy piece 4 Flux a Flux coated low melting point fusible alloy piece A Temperature fuse body 120 Long resin cover -Film 121 continuous groove B base c concave D mold

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】樹脂ベ−スフィルムに一対のリ−ド導体の
各先端部を裏面より表面に表出させ、その表出部間に低
融点可溶合金片を接続し、該低融点可溶合金片にフラッ
クスを塗布して温度ヒュ−ズ本体を製作し、上記フラッ
クス塗布低融点可溶合金片の全長を納め得る巾の連続溝
を成形した長尺樹脂カバ−フィルムを上記温度ヒュ−ズ
本体の樹脂ベ−スフィルム上に配置し、その樹脂ベ−ス
フィルムでの上記フラックス塗布低融点可溶合金片を囲
む周囲部において長尺樹脂カバ−フィルムを樹脂ベ−ス
フィルムに融着することを特徴とする薄型温度ヒュ−ズ
の製造方法。
1. A pair of lead conductors are exposed on a resin-based film from the back surface to the front surface, and a low melting point fusible alloy piece is connected between the exposed portions. A flux fuse is applied to the molten alloy piece to produce a temperature fuse body, and a long resin cover film formed with a continuous groove having a width sufficient to accommodate the entire length of the flux-coated low melting point fusible alloy piece is subjected to the temperature fuse. A long resin cover film is fused to the resin base film at the periphery surrounding the above-mentioned flux-coated low melting point fusible alloy piece placed on the resin base film of the base body. A method of manufacturing a thin temperature fuse.
【請求項2】一対のリ−ド導体の先端部間に低融点可溶
合金片を接続し、該低融点可溶合金片にフラックスを塗
布し、このフラックス塗布低融点可溶合金片を樹脂ベ−
スフィルムと樹脂カバ−フィルムとの周囲部の融着によ
り封止した温度ヒュ−ズを製造する方法であり、上記リ
−ド導体間のフラックス塗布低融点可溶合金片を挾んで
上記リ−ド導体の長手方向と交叉する方向に延びる長尺
樹脂ベ−スフィルムと長尺樹脂カバ−フィルムとを配
し、両長尺フィルムの少なくとも一方には上記フラック
ス塗布低融点可溶合金片の全長を納め得る巾の連続溝を
成形しておき、これらの両長尺フィルムを上記フラック
ス塗布低融点可溶合金片を囲む周囲部において融着し、
所定の巾で切断することを特徴とする薄型温度ヒュ−ズ
の製造方法。
2. A low melting point fusible alloy piece is connected between the tips of a pair of lead conductors, and a flux is applied to the low melting point fusible alloy piece. Bee
This is a method for producing a temperature fuse which is sealed by fusing a peripheral portion of a resin film and a resin cover film, wherein the flux-coated low melting point fusible alloy piece is sandwiched between the lead conductors. A long resin base film and a long resin cover film extending in a direction crossing the longitudinal direction of the conductor, and at least one of the two long films has a total length of the flux-coated low melting point fusible alloy piece. A continuous groove having a width capable of accommodating is formed, and these two long films are fused at a peripheral portion surrounding the flux-coated low melting point fusible alloy piece,
A method for producing a thin temperature fuse, comprising cutting at a predetermined width.
【請求項3】樹脂ベ−スフィルムに一対のリ−ド導体の
一方の先端部を裏面より表面に表出させ、他方のリ−ド
導体の先端部を表面に固定し、それらの先端部間を接続
し、該低融点可溶合金片にフラックスを塗布したものを
温度ヒュ−ズ本体として使用する請求項1記載の薄型温
度ヒュ−ズの製造方法。
3. A resin base film having one end of a pair of lead conductors exposed from the back surface to the front surface, the other end of the lead conductor fixed to the front surface, and the end portions thereof being fixed. 2. The method of manufacturing a thin temperature fuse according to claim 1, wherein the temperature fuse is formed by connecting a flux and applying a flux to the low melting point fusible alloy piece.
JP29615398A 1998-10-02 1998-10-02 Manufacturing method of thin temperature fuse Expired - Fee Related JP4097806B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29615398A JP4097806B2 (en) 1998-10-02 1998-10-02 Manufacturing method of thin temperature fuse

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29615398A JP4097806B2 (en) 1998-10-02 1998-10-02 Manufacturing method of thin temperature fuse

Publications (2)

Publication Number Publication Date
JP2000113784A true JP2000113784A (en) 2000-04-21
JP4097806B2 JP4097806B2 (en) 2008-06-11

Family

ID=17829852

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP4097806B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002095783A1 (en) * 2001-05-21 2002-11-28 Matsushita Electric Industrial Co., Ltd. Thermal fuse
US6556122B2 (en) 2000-07-21 2003-04-29 Matsushita Electric Industrial Co., Ltd. Thermal fuse, battery pack, and method of manufacturing thermal fuse
WO2003079390A1 (en) * 2002-03-15 2003-09-25 Alpi Co., Ltd. Method of producing fuses
CN110296762A (en) * 2019-07-29 2019-10-01 鹤壁天海环球电器有限公司 A kind of seal protecting device of temperature sensor

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH072428U (en) * 1993-06-19 1995-01-13 有限会社三和 Garland name tag cover

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6556122B2 (en) 2000-07-21 2003-04-29 Matsushita Electric Industrial Co., Ltd. Thermal fuse, battery pack, and method of manufacturing thermal fuse
KR100757623B1 (en) * 2000-07-21 2007-09-10 마츠시타 덴끼 산교 가부시키가이샤 Thermal fuse, packed cell and method for manufacturing a thermal fuse
WO2002095783A1 (en) * 2001-05-21 2002-11-28 Matsushita Electric Industrial Co., Ltd. Thermal fuse
US6838971B2 (en) 2001-05-21 2005-01-04 Matsushita Electric Industrial Co., Ltd. Thermal fuse
JPWO2002095783A1 (en) * 2001-05-21 2005-04-07 松下電器産業株式会社 Thermal fuse
WO2003079390A1 (en) * 2002-03-15 2003-09-25 Alpi Co., Ltd. Method of producing fuses
CN110296762A (en) * 2019-07-29 2019-10-01 鹤壁天海环球电器有限公司 A kind of seal protecting device of temperature sensor

Also Published As

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