JP2000106445A - Package for optical semiconductor element housing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package for housing an optical semiconductor element which makes an optical fiber transfer the stimulated light of an optical semiconductor element via a light-transmitting member and enhances the transmission efficiency of the light signal. SOLUTION: A package for an optical semiconductor element consists of a base body 1 having a mount part 1a with an optical semiconductor element 4 placed on the upper surface thereof, a frame body 2, which is attached on the base body 1 so as to encircle the optical semiconductor element mount part 1a, has a through hole 2a formed in the side part thereof and consists of an iron, nickel and cobalt-alloy, a cylindrical fixed member 9, which is attached to the periphery of the hole 2a formed in the side part of the frame body 2 and has a space, through which a light signal is transmitted, in the interior thereof, a light-transmitting member 10, which is attached to the member 9, blocks the interior of the member 9 and consists of an amorphous glass, and a cover member 3, which is attached on the upper surface of the frame body 2 and seals hermetically the element 4, and the member 9 consists of an alloy of 40 to 60 wt.% of iron with 40 to 60 wt.% of nickel and is welded to the outer surface of the periphery of the hole 2a formed in the side part of the frame body 1 by a local heating method.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor element housing package for housing an optical semiconductor element.

[0002]

2. Description of the Related Art Conventionally, an optical semiconductor device housing package for housing an optical semiconductor device is generally made of a metal such as an iron-nickel-cobalt alloy or a copper-tungsten alloy. A metal base having a mounting portion to be mounted, a plurality of external lead terminals fixed around the mounting portion so as to penetrate from an upper surface to a lower surface via an insulating member, and a metal substrate surrounding the optical semiconductor element mounting portion. A frame body made of an iron-nickel-cobalt alloy or the like having a through-hole on the side and joined to the metal base via a brazing material such as silver brazing; A cylindrical fixing member made of a metal such as an iron-nickel-cobalt alloy having a space for transmitting an optical signal therein, which is attached through a brazing material such as a tin alloy, and a melting point formed on the cylindrical fixing member. Is 300 ~
A light-transmitting member made of amorphous glass or the like that blocks the inside of the fixed member attached via a low-melting-point brazing material such as a gold-tin alloy at 400 ° C .; And a lid member for hermetically sealing the semiconductor element. The optical semiconductor element is bonded and fixed to the optical semiconductor element mounting portion of the metal base, and each electrode of the optical semiconductor element is connected to an external lead via a bonding wire. The optical semiconductor element is electrically connected to a terminal, and thereafter, a lid member is joined to the upper surface of the frame body, and the optical semiconductor element is hermetically housed in a container including the metal base, the frame body, and the lid member, and the cylindrical fixing member is provided. By connecting an optical fiber to the optical semiconductor device, an optical semiconductor device as a product is obtained.

Such an optical semiconductor device optically excites an optical semiconductor element by a drive signal supplied from an external electric circuit,
By transmitting and receiving the excited light to and from the optical fiber through the light transmitting member, the device functions as an optical semiconductor device used for high-speed optical communication or the like by transmitting the light inside the optical fiber.

[0004]

However, in this conventional package for housing an optical semiconductor device, the thermal expansion coefficient of the amorphous glass constituting the translucent member is about 8.5 ×.
10 ⁻⁶ / ° C. (30 ° C. to 400 ° C.), whereas the thermal expansion coefficient of the iron-nickel-cobalt alloy constituting the cylindrical fixing member is about 4.5 × 10 ⁻⁶ / ° C. (Rt) Up to 400 ° C)
When the translucent member is attached to the cylindrical fixing member via the low melting point brazing material due to the difference, the difference in the thermal expansion coefficient between the translucent member and the fixing member may be caused. The resulting thermal stress is generated and is inherent in the light transmitting member. As a result, when the light excited by the optical semiconductor element is transmitted to and received from the optical fiber through the light transmitting member, the light excited by the optical semiconductor element is transmitted. When passing through the optical member, the intrinsic stress causes birefringence, and only a part of the light is transmitted to and received from the optical fiber, so that the efficiency of transmitting and receiving the light to and from the optical fiber is deteriorated, and the transmission efficiency of the optical signal is reduced. Had the drawback of becoming worse.

In order to solve the above-mentioned drawbacks, a fixing member to which a light-transmitting member made of amorphous glass is attached is required to have a coefficient of thermal expansion close to that of the light-transmitting member of 40 to 60% by weight. Of iron and 40 to 60% by weight of nickel.

When such a fixing member is formed of an alloy of 40 to 60% by weight of iron and 40 to 60% by weight of nickel, the coefficient of thermal expansion of the fixing member is about 9.5 × 10 ^-6 / ° C. (R
t to 400 ° C.), and the coefficient of thermal expansion of the transparent member made of amorphous glass (about 8.5 × 10 ⁻⁶ / ° C .: 30 ° C. to 40 ° C.).
0 ° C.), when attaching the translucent member to the fixing member, almost no thermal stress occurs between the translucent member and the fixing member due to the difference in the thermal expansion coefficient between the translucent member and the fixing member. Not
There is almost no stress in the translucent member.

However, although this fixing member does not generate stress between the fixing member and the translucent member when the translucent member is attached, the outer surface around the through hole of the frame body has gold. When attaching via a brazing material such as a tin alloy, the frame is made of a metal material such as an iron-nickel-cobalt alloy and has a coefficient of thermal expansion of about 4.5 × 10 ⁻⁶ / ° C. (Rt to 400 ℃)
The thermal expansion coefficient of a fixing member made of an alloy of 40 to 60% by weight of iron and 40 to 60% by weight of nickel (about 9.5)
(× 10 ⁻⁶ / ° C .: Rt to 400 ° C.), a thermal stress is generated between the two due to the difference in the coefficient of thermal expansion between the two, and this is generated in the translucent member attached to the fixing member. This causes birefringence in the light excited by the optical semiconductor element passing through the light-transmissive member, thereby inducing a defect that the efficiency of transmitting and receiving the light to and from the optical fiber is deteriorated and the transmission efficiency of the optical signal is deteriorated.

The present invention has been devised in view of the above-mentioned drawbacks, and has as its object to efficiently transmit and receive light excited by an optical semiconductor element to and from an optical fiber via a translucent member, thereby increasing the transmission efficiency of optical signals. An object of the present invention is to provide an optical semiconductor element storage package.

[0009]

According to the present invention, there is provided a base having a mounting portion on which an optical semiconductor element is mounted on an upper surface, and mounted on the base so as to surround the optical semiconductor device mounting portion, A frame made of an iron-nickel-cobalt alloy having a through hole in a side portion, a cylindrical fixing member attached around the through hole of the frame, and having a space in which an optical signal is transmitted, A translucent member made of amorphous glass that is attached to the cylindrical fixing member and seals the inside of the fixing member, and a lid member that is attached to the upper surface of the frame and hermetically seals the optical semiconductor element. Wherein the fixing member is made of an alloy of 40 to 60% by weight of iron and 40 to 60% by weight of nickel, and is formed on the outer surface around the through hole of the frame by a local heating method. It is characterized by being welded.

According to the package for housing an optical semiconductor element of the present invention, since the fixing member is made of an alloy of 40 to 60% by weight of iron and 40 to 60% by weight of nickel, the coefficient of thermal expansion of the fixing member is about 9%. 0.5 × 10 ⁻⁶ / ° C. (Rt to 400
° C), which is a value approximating the coefficient of thermal expansion of the translucent member. As a result, when the translucent member and the fixing member are attached to each other, the heat transfer between the translucent member and the fixing member is caused. Thermal stress due to the difference in expansion coefficient is hardly generated, and thermal stress is hardly present in the translucent member. Therefore, when the light excited by the optical semiconductor element is transmitted to the optical fiber through the light transmitting member, the light excited by the optical semiconductor element does not cause birefringence due to the thermal stress inherent in the light transmitting member. It is transmitted and received as it is to the optical fiber member, and the transmission efficiency of the optical signal becomes extremely high.

Further, since the fixing member is welded and attached to the frame by a local heating method such as irradiation of a laser beam or the like, even if the fixing member and the frame have different coefficients of thermal expansion, the heating area at the time of attachment is small. The thermal stress generated between the two becomes extremely small, and as a result, the thermal stress caused by the difference in the thermal expansion coefficient between the fixing member and the frame does not greatly affect the translucent member. Birefringence of the passing light is effectively prevented, and the light excited by the optical semiconductor element is efficiently transmitted to and received from the optical fiber, so that the transmission efficiency of the optical signal can be improved.

[0012]

Next, the present invention will be described in detail with reference to the accompanying drawings. 1 and 2 show an embodiment of the package for housing an optical semiconductor element of the present invention, wherein 1 is a base, 2 is a frame, and 3 is a lid member. The base 1, the frame 2, and the cover 3
A container for accommodating the optical semiconductor element 4 is formed therein.

The base 1 functions as a support member for supporting the optical semiconductor element 4, and has a mounting section 1a for mounting the optical semiconductor element 4 at a substantially central portion of the upper surface thereof. The optical semiconductor element 4 is bonded and fixed to the portion 1a with an adhesive such as a gold-silicon brazing material with the Peltier element 5 and the like interposed therebetween.

The base 1 is made of a metal material such as an iron-nickel-cobalt alloy or a copper-tungsten alloy. It is manufactured by applying a conventionally known metal working method such as a working method or a punching working method.

The substrate 1 has a metal having excellent corrosion resistance on its outer surface and good wettability to a brazing material, specifically a nickel layer having a thickness of 2 to 6 μm and a thickness of 0.5 to 5 μm. When the gold layers are sequentially applied by a plating method,
Can be effectively prevented from being oxidized and corroded, and the Peltier element 5 and the like disposed below the optical semiconductor element 4 can be firmly adhered and fixed on the upper surface of the base 1. Therefore, the base 1 effectively prevents oxidative corrosion and has a thickness of 2 to 6 μm on its outer surface when the Peltier element 5 or the like disposed below the optical semiconductor element 4 is firmly adhered and fixed on the upper surface.
It is preferable that a nickel layer having a thickness of m and a gold layer having a thickness of 0.5 to 5 μm are sequentially applied by plating.

The base 1 has a plurality of external lead terminals 6 penetrating the base 1 fixed around a mounting portion 1a on which the optical semiconductor element 4 is mounted via an insulating member 7 such as glass. I have.

The external lead terminal 6 functions to electrically connect each electrode of the optical semiconductor element 4 to an external gas circuit. One end of the external lead terminal 6 is connected to the electrode of the optical semiconductor element 4 via a bonding wire 8. The other end is connected to an external electric circuit via a brazing material such as solder.

The external lead terminal 6 is made of, for example, a metal material such as an iron-nickel-cobalt alloy or an iron-nickel alloy.
A hole having a slightly larger diameter is formed, and the insulating member 7 made of a ring-shaped glass and the external lead terminal 6 are inserted into the hole, and then the insulating member 7 made of the glass is heated and melted. .

The external lead terminal 6 is provided with a plating metal layer having excellent corrosion resistance such as a nickel plating layer and a gold plating layer on its surface and having good wettability with a brazing material from 1.0 μm to 2 μm.
When the external lead terminal 6 is adhered to a thickness of 0 μm, oxidation corrosion of the external lead terminal 6 is effectively prevented, and the connection between the external lead terminal 6 and the bonding wire 8 can be made strong. Therefore, the external lead terminal 6 is provided with a plating metal layer having excellent corrosion resistance such as a nickel plating layer and a gold plating layer on its surface and having good wettability with the brazing material from 1.0 μm to 2 μm.
Preferably, it is applied to a thickness of 0 μm.

On the upper surface of the base 1, a frame 2 is mounted so as to surround the mounting portion 1a on which the optical semiconductor element 4 is mounted.
Are formed, and a space for accommodating the optical semiconductor element 4 is formed inside the frame 2.

The frame 2 is made of a metal material such as an iron-nickel-cobalt alloy. For example, the frame 2 is formed by pressing an ingot (a lump) such as an iron-nickel-cobalt alloy into a frame shape by pressing. Attachment is performed by brazing the upper surface of the base 1 and the lower surface of the frame 2 via a silver brazing material.

Further, the frame 2 is provided with a through hole 2a on a side portion thereof, and a cylindrical fixing member 9 is attached to an outer surface around the through hole 2a. A translucent member 10 is attached.

The through hole 2a formed on the side of the frame 2 serves as a transmission hole for transmitting light excited by the optical semiconductor element 4 housed therein to an optical fiber member 11 connected to a fixing member 9 described later. The frame 2 is formed into a predetermined shape by performing a well-known drilling process on a side portion of the frame 2.

A cylindrical fixing member 9 is attached to the side outer surface of the frame 2 around the through hole 2a. The fixing member 9 is used to fix the optical fiber member 11 to the frame 2. It acts as a base fixing member and acts to transmit the excited light of the optical semiconductor element 4 transmitting through the through hole 2a of the frame 2 to the optical fiber member 11, one end of which is located outside the vicinity of the through hole 2a of the frame 2. An optical fiber member 11 is attached and connected to the surface via a brazing material such as a gold-tin alloy and the other end.

The cylindrical fixing member 9 is made of an alloy of 40 to 60% by weight of iron and 40 to 60% by weight of nickel. For example, an iron-nickel alloy ingot is formed into a cylindrical shape by pressing. Formed by

The fixing member 9 has a light-transmitting member 10 attached to the inside thereof. The light-transmitting member 10 closes the inside of the fixing member 9, and the base 1, frame 2, cover 3 And a function of transmitting the excited light of the optical semiconductor element 4 transmitting the internal space of the fixing member 9 to the optical fiber member 11 attached to and connected to the fixing member 9 as it is.

The light transmitting member 10 is made of, for example, silicon oxide,
It is made of lead-based and boric acid containing lead oxide as a main component, and borosilicate-based amorphous glass containing silica sand as a main component.
Since the amorphous glass has no crystal axis, the light excited by the optical semiconductor element 4 is transmitted and received by the optical fiber member 11 through the light-transmitting member 10. The birefringence does not occur in the member 10 and is transmitted / received to the optical fiber member 11 as it is. As a result, the transmission / reception of the light excited by the optical semiconductor element 4 to / from the optical fiber member 11 becomes highly efficient, and the transmission of the optical signal is performed. High efficiency can be achieved.

Further, the light-transmitting member 10 is attached to the fixing member 9 by, for example, previously attaching a metallization layer 12 to the outer periphery of the light-transmitting member 10, and connecting the metallization layer 12 to the fixing member 9. By brazing through a brazing material such as a gold-tin alloy. In this case, since the attachment of the translucent member 10 to the fixing member 9 is performed by brazing with a gold-tin alloy or the like, the attachment is highly reliable. The hermetic sealing of the container housing the optical semiconductor element 4 at the portion where the optical semiconductor element 4 is attached to the container 10 is completed, and the optical semiconductor element 4 housed inside the container can be normally and stably operated for a long period of time. At the same time, the fixing member 9 made of an alloy of 40 to 60% by weight of iron and 40 to 60% by weight of nickel has a thermal expansion coefficient of about 9.5 × 10 ⁻⁶ / ° C. (Rt to 400 ° C.). When the translucent member 10 is brazed to the fixing member 9 because the thermal expansion coefficient of the translucent member 10 is approximately the same as the thermal expansion coefficient of the translucent member 10 made of crystalline glass, the heat transfer between the translucent member 10 and the fixing member 9 occurs. No thermal stress is generated due to the difference in the expansion coefficient, and no thermal stress is inherent in the translucent member 10. Therefore,
When the light excited by the optical semiconductor element 4 is transmitted to the optical fiber member 11 through the light transmitting member 10, the light excited by the optical semiconductor element 4 undergoes birefringence due to the thermal stress inherent in the light transmitting member 10. The signal is transmitted to and received from the optical fiber member 11 as it is without causing the transmission, and the transmission efficiency of the optical signal becomes extremely high.

The metallized layer 12 previously applied to the outer peripheral portion of the light transmitting member 10 has a low melting point of about 700 ° C. of the amorphous glass constituting the light transmitting member 10, and the conventionally known Mo is used. As shown in FIG. 2, since it cannot be formed by employing the -Mn method, it is active against amorphous glass and is formed from at least one of titanium, titanium-tungsten, and tantalum nitride which are strongly bonded. The first layer 12a and the first layer 12a diffuse into a third layer 12c, which will be described later, due to heat generated when the translucent member 10 is brazed to the fixing member 9, and the metallized layer 12 is applied to the translucent member 10. A second layer (12b) made of at least one of platinum, nickel, and nickel-chromium, which effectively prevents a decrease in bonding strength; A third layer 12c made of at least one of gold, platinum, and copper, in which a brazing material is firmly bonded to the oil layer 12 and the translucent member 10 is firmly attached to the fixing member 9, is sequentially laminated. Particularly, the metallized layer 12 formed by sequentially laminating titanium-platinum-gold has a strong bonding strength with the light-transmitting member 10 and a good wettability with the brazing material, so that the light-transmitting member 10 is fixed. Since it can be brazed to the member 9, it is very suitable as the metallized layer 12.

The titanium, titanium-tungsten,
First layer 12a made of at least one kind of tantalum nitride
And at least one of platinum, nickel and nickel-chromium
The metallized layer 12 having a three-layer structure of a second layer 12b made of a seed and a third layer 12c made of at least one of gold, platinum, and copper is made of a metal material and a nitride of the light-transmitting member 10. It is formed by sequentially applying a predetermined thickness to the outer peripheral portion by a sputtering method, a vapor deposition method, an ion plating method, a plating method, or the like.

Further, the metallized layer 12 includes a first layer 12a made of at least one of titanium, titanium-tungsten, and tantalum nitride, a second layer 12b made of at least one of platinum, nickel, and nickel-chromium; When the third layer 12c made of at least one of platinum and copper is used, if the thickness of the first layer 12a is less than 500 angstroms, the bonding strength of the metallized layer 12 to the translucent member 10 tends to be weak. If the thickness exceeds 2000 angstroms, the first layer 12a
When the first layer 12a is adhered, a large stress is inherent in the first layer 12a, and the first layer 12a is
It is preferable that the thickness of the first layer 12a be in the range of 500 Å to 2000 Å because the layer tends to be more easily peeled off, and the light transmitting member 10 is fixed when the thickness of the second layer 12b is less than 500 Å. It is not possible to effectively prevent the first layer 12a from diffusing into the third layer 12c due to heat when brazing to the member 9, and the bonding strength of the metallized layer 12 to the translucent member 10 is reduced. Dangerous, 100
When the thickness exceeds 00 Å, the second layer is formed on the first layer 12a.
When depositing the layer 12b, a large stress is present in the second layer 12b, and the second layer 12b is caused by the first layer 1
The second layer 12 has a tendency to peel off more easily than the second layer 12a.
The thickness of b is preferably in the range of 500 Å to 10000 Å, and if the thickness of the third layer 12 c is less than 0.5 μm, the metallized layer 1
2 does not significantly improve the wettability of the brazing material, making it difficult to firmly braze and attach the translucent member 10 to the fixing member 9.
When the third layer 12c is deposited on the third layer 12b, a large stress is inherent in the third layer 12c, and the third layer 12c
It is preferable that the thickness of the third layer 12c be in the range of 0.5 μm to 5 μm since the second layer 12c tends to be more easily peeled off than the second layer 12b.

Further, the fixing member 9 to which the translucent member 10 is attached is attached to the frame 2 by welding by a local heating method by irradiating a laser beam or the like. The translucent member 10 is provided on the outer surface around the hole 2a.
The laser beam emitted by a method such as YAG and carbon dioxide gas is applied to the cylindrical fixing member 9 at an extremely high level of 10 ⁴ to 10 ⁷ W / cm ^2. This is performed by irradiating in a ring shape with the power of the energy density and melting and integrating a part of the fixing member 9 and a part of the frame 2. In this case, attachment of the fixing member 9 to the frame 2 is performed by welding by a local heating method, and since the heating area is small, even if the fixing member 9 and the frame 2 have different coefficients of thermal expansion, a large difference exists between them. Thermal stress is generated and does not greatly affect the translucent member 10. As a result, it is possible to effectively prevent light passing through the translucent member 10 from causing birefringence. The light excited by the semiconductor element 4 can be efficiently transmitted and received, and the transmission efficiency of the optical signal can be improved.

On the other hand, a lid member 3 made of a metal material such as an iron-nickel-cobalt alloy or an iron-nickel alloy is joined to the upper surface of the frame 2, thereby forming the base 1, frame 2 and lid. The optical semiconductor element 4 is hermetically sealed inside the container including the member 3.

The lid member 3 is joined to the upper surface of the frame 2 by, for example, welding such as a seam welding method.

Thus, according to the package for housing an optical semiconductor element of the present invention, the optical semiconductor element 4 is mounted and fixed on the optical semiconductor element mounting portion 1a of the base 1 with the Peltier element 5 or the like interposed therebetween. 4 are electrically connected to the external lead terminals 6 via bonding wires 8, and then the lid member 3 is joined to the upper surface of the frame 2, and the base 1 and the frame 2
The optical semiconductor element 4 is accommodated in a container including the lid member 3 and the optical fiber element 11.
The optical semiconductor device as a final product is obtained by attaching and connecting the optical semiconductor device 4. Light is excited in the optical semiconductor element 4 by a drive signal supplied from an external electric circuit, and the excited light is transmitted through a light-transmitting material made of amorphous glass. The optical fiber member 11 is used for high-speed optical communication and the like by transmitting and receiving the optical fiber member 11 through the member 10 and transmitting the optical fiber member 11 through the optical fiber.

It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. Although fixed to the base 1, it may be fixed to the frame 2.

[0037]

According to the package for housing an optical semiconductor element of the present invention, since the fixing member is formed of an alloy of 40 to 60% by weight of iron and 40 to 60% by weight of nickel, the coefficient of thermal expansion of the fixing member is reduced. About 9.5 × 10 ⁻⁶ / ° C. (Rt〜40
0 ° C.), which is a value approximating the coefficient of thermal expansion of the translucent member. As a result, when the translucent member and the fixing member are attached to each other, the distance between the translucent member and the fixing member is reduced. Thermal stress due to the difference in thermal expansion coefficient is hardly generated, and thermal stress is hardly present in the translucent member. Therefore, when the light excited by the optical semiconductor element is transmitted to the optical fiber through the light transmitting member, the light excited by the optical semiconductor element does not cause birefringence due to the thermal stress inherent in the light transmitting member. It is transmitted and received as it is to the optical fiber member, and the transmission efficiency of the optical signal becomes extremely high.

Further, since the fixing member is welded and attached to the frame by a local heating method using laser beam irradiation or the like, even if the fixing member and the frame have different coefficients of thermal expansion, the heating area during attachment is narrow. The thermal stress generated between the two becomes extremely small, and as a result, the thermal stress caused by the difference in the thermal expansion coefficient between the fixing member and the frame does not greatly affect the translucent member. Birefringence of the passing light is effectively prevented, and the light excited by the optical semiconductor element is efficiently transmitted to and received from the optical fiber, so that the transmission efficiency of the optical signal can be improved.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of a package for housing an optical semiconductor element of the present invention.

FIG. 2 is an enlarged sectional view of a main part of the package for housing an optical semiconductor element shown in FIG. 1;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Base 1a ... Opto-semiconductor element mounting part 2 ... Frame 2a ... Through-hole 3 ... Lid member 4 ... Optical semiconductor element 9 ... Fixing member 10 ... Translucent Functional member 11: Optical fiber member 12: Metallized layer

Claims (1)

[Claims] 1. A base having a mounting portion on which an optical semiconductor element is mounted on an upper surface, and an iron mounted on the base so as to surround the optical semiconductor device mounting portion and having a through hole in a side portion. A frame member made of a nickel-cobalt alloy, a cylindrical fixing member attached around the through hole of the frame member, and having a space in which an optical signal is transmitted, and attached to the cylindrical fixing member. An optical semiconductor element housing package comprising: a transparent member made of amorphous glass for closing the inside of the fixing member; and a lid member attached to the upper surface of the frame and hermetically sealing the optical semiconductor element. The fixing member is made of an alloy of 40 to 60% by weight of iron and 40 to 60% by weight of nickel, and is welded to an outer surface around a through hole of the frame by a local heating method. Package for storing optical semiconductor elements.