JP2000100336A - Barrier rib substrate for image display device and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To put to practical use a barrier rib substrate with insulation proper ties improved to solve a problem of dielectric breakdown, by forming roundness with a radius of a specific value or more at corner parts. SOLUTION: A band steel with a composition of Fe-48% Ni is etched by spray-etching with a solution of FeCl3 to form a metallic barrier rib substrate having a thickness of 0.15 mm and a cross section with a radius of about 2 μm at a corner part 1. When the corner part 1 is worked by wet-sandblasting with fine powder of alumina, the radius, of roundness at the corner part 1, is adapted to 4, 7, or 11 μm, by adjusting the working time. Next, the metal substrate is formed into a film with Al2O3 into about 3 μm thickness at the corner parts 1 through sputtering. Thus, the corner part 1 is formed into roundish shape extending from a surface 2 of the metal barrier rib substrate apart from a corner, what if a etching hole being rectangularly formed, by 3 μm to an inner surface 3 of the etching hole apart from the corner by 3 μm. The roundness of the corner part 1 is specified to have a radius of 3 μm or more.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display (hereinafter referred to as "PDP") used as an image display device and a liquid crystal display (hereinafter referred to as "PA") utilizing plasma.
LC).

[0002]

2. Description of the Related Art Generally, a PDP having a plurality of discharge cells arranged therein.
In the panel, an insulating partition is required in order to prevent crosstalk to an adjacent cell, and a glass-based partition is used by multilayer printing of a glass base or sandblasting. However, in these production methods, the production cost is high, the application range of PDP is limited, and at present, it is not widely used for consumer use. Therefore, Japanese Patent Application Laid-Open No. Hei 3-205738 discloses a method for reducing manufacturing costs.
Although the application of a metal partition is disclosed in the above-mentioned publication, it has not been put to practical use in PDP and PALC at present.

[0003]

When a metal is used as a partition, a partition substrate is formed by etching. However, at this time, the shape of the corner portion in the cross section of the metal partition wall substrate becomes sharp, and the angle becomes a round shape of at most about 2 μm. When a metal partition wall substrate having such a shape is used, when a voltage is applied to an electrode by setting the PDP as a PDP, electric field concentration occurs at a corner portion, and the dielectric breakdown voltage of an insulating film formed on the partition wall decreases. In the case of a partition substrate using a conductive metal plate, this reduction in dielectric strength is one of the most inevitable problems, and one of the problems in which the above metal partition has not been put to practical use.

[0004]

Means for Solving the Problems In order to solve the above-mentioned problems, the present inventors have conducted detailed studies on the electric field intensity generated when a voltage is applied to the electrodes. As a result, they found that the highest voltage was applied to the corners of the partition substrate,
The inventors have found that the electric field intensity is significantly reduced by rounding or chamfering this portion, and arrived at the present invention.

That is, the present invention is a metal partition board for an image display device in which a roundness having a radius of 3 μm or more is formed at a corner in a cross section of the metal partition board. Further, the present invention is a metal partition board for an image display device, wherein a corner portion in a cross section of the metal partition board is chamfered by 3 μm or more. The metal partition wall for an image display device processed by any one of sandblasting, electrolytic polishing, chemical polishing or a combination thereof as a method of forming a roundness having a radius of 3 μm or more at a corner portion in a cross section of the metal partition board substrate of the present invention or chamfering. This is a method for manufacturing a substrate.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail.
When a conductive metal plate is used as the partition substrate, it is desirable that the insulation breakdown voltage of the insulating film formed on the partition substrate is as high as possible. For this purpose, the shape of the corner portion in the vertical cross section of the partition substrate is preferable. It has been found that it is only necessary to form a roundness having a specific radius or more, or to perform a chamfering process on a corner portion which is sharpened by etching.
According to the study of the present inventor, radii of 4 μm, 7 μm, and 11 μm were obtained by processing a metal partition wall substrate having sharp corners with a radius of about 2 μm obtained by ordinary etching.
By spreading to 2 μm, the electric field concentration intensity in the case of the opposed discharge is 12% and 27%, respectively, as compared with the case of 2 μm.
%, 39%. In addition, in order to use a conductive metal plate as a partition substrate, the electrolytic concentration strength is higher than that obtained by a metal partition substrate having a shape after etching.
It is desired to reduce at least 5% or more, and the radius required to reduce the electric field strength is at least 3 μm.
m or more. Therefore, the roundness of the corner is specified to be 3 μm or more in radius.

The same effect as described above can also be obtained by forming a chamfer in which the corners are made obtuse instead of rounding as described above. In this case, the shape of the corner in the cross section is
For example, it may be a shape having a slight unevenness processed by using sand blast or a straight shape.

Here, the corner portion 1 having a radius of 3 μm or more referred to in the present invention means, as shown in FIG. 1, a location of 3 μm on the front side 2 of the metal partition substrate when the etching hole is formed at a right angle. It is sufficient that a rounded shape is formed on the inner surface side 3 of the etching hole from the place of 3 μm to the outside. Also, as shown in FIG. 2, when the etching hole is formed at a right angle, the chamfered portion 4 is also formed at a position of 3 μm on the surface of the metal partition wall substrate and at a position of 3 μm on the inner surface of the etching hole. Shall be.

Next, as a method of forming a corner having a radius greater than a specific radius or chamfering a corner which has been sharpened by etching, the method of the present invention is to use alumina or glass powder. Can be rounded by sand blast processing of spraying, electric field polishing for electrically polishing corner portions, chemical polishing for chemically polishing corner portions, or the like. In particular, among these, sandblasting can be performed in the shortest time and is efficient. However, after sandblasting, the surface skin becomes rough, and it is therefore preferable to perform chemical polishing thereafter.

In the present invention, a metal partition board refers to a metal plate having fine through holes as shown in FIG. 3, for example. In addition, as the material for the metal partition wall substrate that can be used in the present invention, it is necessary to match the coefficient of thermal expansion with the glass plate on the back surface used for PDP or PALC.
Fe—Ni having a coefficient of thermal expansion of 10 × 10 ⁻⁶ / ° C.
It is desirable to use an alloy based on
An Fe-Ni-based steel strip containing 38 to 52% of i is preferable.

[0011]

EXAMPLES The strip of Fe-48% Ni composition is etched in the shape of FIG. 3 processed by spray etching solution FeCl _3, and the metal partition wall substrate 5. The thickness is 0.15mm
It is. At this time, r at the corner 1 of the cross section of the partition substrate was about 2 μm. Next, the corner portion was processed by wet sandblasting using fine powder of alumina. At this time, by adjusting the sand blasting time, the round size r at the corner portion was set to 4,
It was set to 7,11 μm. When the cross-sectional shape after processing was observed with an electron microscope, it was as shown in FIG.

On the above metal substrate, Al ₂ O ₃ was formed into a film having a thickness of about 3 μm at a corner portion by sputtering, and then assembled into a facing discharge type PDP. Then, a voltage was applied between the upper and lower electrodes facing each other, the voltage was gradually increased, and a voltage at which dielectric breakdown occurred was measured. Table 1 shows the results.
Shown in From this, it can be seen that the larger the r of the corner, the weaker the electric field concentration, and the higher the breakdown voltage.

[0013]

【table 1】

[0014]

According to the present invention, even if the thickness of the insulating film of the metal partition wall is the same, the insulating property is greatly improved, so that the problem of dielectric breakdown can be solved and practical use becomes possible.

[Brief description of the drawings]

FIG. 1 is a diagram showing a cross section of a corner portion of a PDP metal partition substrate of the present invention.

FIG. 2 is a diagram showing a cross section of a corner portion of a PDP metal partition substrate of the present invention.

FIG. 3 is a view showing an example of a PDP metal partition substrate.

[Explanation of symbols]

1 corner portion, 2 metal partition substrate surface, 3 etching hole inner surface, 4 chamfered portion, 5 metal partition substrate

Claims (3)

[Claims] 1. A metal partition board for an image display device, wherein a roundness having a radius of 3 μm or more is formed at a corner portion in a cross section of the metal partition board. 2. A metal partition board for an image display device, wherein a corner portion in a cross section of the metal partition board is chamfered by 3 μm or more. 3. The method for manufacturing a metal partition board for an image display device according to claim 1, wherein the processing is performed by any one of sandblasting, electrolytic polishing, and chemical polishing or a combination thereof.