JP2000097989A - Electronic component tester - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make alterable the number of test trays circularly conveyed into a constant temperature oven by providing a buffer stage for temporarily containing an electronic component conveying medium. SOLUTION: A buffer stage CRB is provided between positions CR6 and CR6 of an IC carrier CR in a test chamber. The stage CRB is a stage for optimizing the number of IC carriers CR to be conveyed through a circulating route for starting from the CR1 and returning to CR1 and temporarily taking out the IC carrier CR from the route and storing it. If temperature conditions are severe and a soak time is longer than a test time of a test head 302, the stage CRB does not store the carrier C but circulates the carrier CR of full number, and shortens the time of waiting the head 302. If the test time is loner thin the soak time, several number of the carriers CR are stored in the stage CRB, the retaining carriers CR are circulated to prevent a loss of thermal energy in the test chamber.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component test apparatus for testing electronic components (hereinafter, also simply referred to as ICs) such as semiconductor integrated circuit elements, and more particularly, to a test tray circulated and transported in a thermostat. The present invention relates to an electronic component test apparatus capable of appropriately changing the number of electronic components.

[0002]

2. Description of the Related Art In an electronic component testing apparatus called a handler, a large number of ICs under test stored in a tray are conveyed into a handler, and each IC under test is brought into electrical contact with a test head. A test is performed by a component test apparatus main body (hereinafter, also referred to as a tester). When the test is completed, the ICs to be tested are paid out from the test head and replaced on a tray according to the test result, whereby sorting into categories such as non-defective products and defective products is performed.

Conventional handlers include trays for circulating and transporting the inside of the handler (hereinafter referred to as customer trays) in addition to trays for storing ICs before testing or for storing tested ICs (hereinafter, also referred to as customer trays). , Also called a test tray.)
There is a type with a handler of this kind,
Before and after the test, the IC under test is replaced between the customer tray and the test tray.

Further, in order to confirm the heat resistance of the IC, the IC under test is subjected to a low-temperature or high-temperature stress to the IC under test.
A functional test of C may be performed. In such a case, a handler having a constant temperature bath for raising or lowering the temperature of the IC under test mounted on the test tray to a predetermined temperature is used.

[0005]

In this type of handler having a constant temperature bath, a test tray on which the ICs to be tested are mounted is carried into the constant temperature bath, and then the test ICs are brought to a predetermined temperature. Do not send to the test process until it reaches.

However, the time required for the IC under test to reach a predetermined temperature (soak time) is longer than the test time (period time between the loading of the test tray in the test process and the loading of the next test tray). This causes a time for waiting for the next test tray in the test process, which lowers the throughput.

For this reason, in a conventional chamber type handler, a certain amount of test trays is retained in a soak chamber in a constant temperature bath, and the time required for one test tray to pass through the soak chamber is increased. Even when the soak time is longer than that of the test tray, the test tray is sent in a timely manner in the test process.

However, when the soak time becomes shorter than the test time due to a change in the type of the IC under test or the condition of the temperature stress to be applied, the test tray is set in the soak chamber as described above. There is no need to stay the test equipment. On the contrary, since many test trays are present in the soak chamber, there arises a problem that the heat capacity increases and the start-up time (time required for starting) of the test apparatus becomes longer.

SUMMARY OF THE INVENTION The present invention has been made in view of such problems of the prior art, and has as its object to provide an electronic component testing apparatus capable of appropriately changing the number of test trays circulated and conveyed in a thermostat. And

[0010]

(1) In order to achieve the above object, an electronic component test apparatus according to the present invention includes at least a test step in a circulation path of an electronic component transport medium on which an electronic component under test is mounted. And a buffer stage for temporarily storing the electronic component transport medium.

Since the electronic component test apparatus of the present invention has the buffer stage for temporarily storing the electronic component transport medium, the electronic component transport medium becomes unnecessary depending on the length of the soak time and the test time. Can be temporarily stored in the buffer stage, and the electronic component transport medium can be circulated and transported in an optimal quantity.

For example, if the soak time is longer than the test time, a relatively large amount of the electronic component carrying medium is circulated and transported, and the passage time of the soak chamber is lengthened, so that the electronic component can be timed. The transport medium is sent to the test process.

Conversely, if the soak time is shorter than the test time, some electronic component transport media are temporarily stored in the buffer stage, and the remaining relatively small amount of electronic component transport media is circulated. By carrying the wafer, the waiting time in the test process due to the stay in the soak chamber is minimized. In addition, by minimizing the number of electronic component transport media that are circulated and transported, the amount of heat supplied to the thermostat can be minimized, saving energy and shortening the startup time of the test equipment. it can.

In an operation check test or the like when installing an electronic component test apparatus, it is often necessary to repeatedly execute the operation check of the entire electronic component test apparatus in a short time. Even in such a case, by using the electronic component test apparatus of the present invention, unnecessary electronic component transport media can be temporarily stored in the buffer stage, so that the circulating transport time of the electronic component transport media can be minimized. It is convenient.

As described above, since the electronic component testing apparatus of the present invention can control the circulating transport time of the electronic component transport medium according to the difference in the test conditions, it is particularly effective when used for testing various types of electronic components produced in small quantities. is there.

(2) Although not particularly limited in the above invention, the electronic component test apparatus according to the second aspect is characterized in that the electronic component test apparatus further comprises a transport unit for taking the electronic component transport medium into and out of the buffer stage. .

When the unnecessary electronic component transport medium is stored in the buffer stage, or when the required electronic component transport medium is taken out of the buffer stage, the transport medium described above can be used. Can be automatically increased or decreased.

(3) In the above-mentioned invention, the circulating transport path of the electronic component transport medium is not particularly limited, and may include one that circulates and transports the inside and outside of the thermostat. In the above invention, the installation position of the buffer stage is not particularly limited,
What is provided in a thermostat and what is provided outside a thermostat are also included.

According to a third aspect of the present invention, in the electronic component test apparatus, the electronic component transport medium is transported while being circulated in a constant temperature bath for applying a temperature stress to the electronic component under test. , Provided in the constant temperature bath.

The temperature of the transport medium itself can be maintained and the amount of heat taken by the transport medium can be reduced by circulating the electronic component transport medium in the thermostat, so that the time for raising or lowering the temperature of the thermostat can be shortened. Further, heat energy required for raising and lowering the temperature can be reduced. Moreover, in this case, since the buffer stage is also provided in the constant temperature bath, the thermal energy when the electronic component transport medium temporarily stored in the buffer stage is reused can be reduced.

(4) In the above invention, at least one system for circulating and conveying the electronic component conveying medium may be provided, and the case where a plurality of systems are provided is also within the scope of the present invention.

In particular, in the electronic component test apparatus according to the present invention, the electronic component transport medium has a pair of circulating transport systems in which the electronic component transport medium is circulated and transported on both sides of the test process.
The buffer stage is provided between the pair of circulating transport systems.

By providing the circulating transport system for the electronic component transport medium on both sides of the test process, while the test is being executed in one circulating transport system, the next circulating transport system is used to carry in the next electronic component under test. Preparation can be performed, and standby time in the test process can be reduced. Moreover, if a pair of circulating transport systems are provided on both sides of the test process, a dead space often occurs between them in the layout. Therefore, by providing a buffer stage here, it is possible to test the thermostat, and thus the electronic components. An increase in the size of the device can be suppressed.

(5) In the above invention, the buffer stage for temporarily taking in and out the electronic component transport medium may be provided at any position in the circulation transport system of the electronic component transport medium.

However, in the electronic component test apparatus according to the fifth aspect, the buffer stage is provided in proximity to the transport position of the electronic component transport medium that has been emptied after the test in the circulating transport system. It is characterized by having.

The electronic component transport medium circulated and transported across the test process becomes empty after the transfer because the tested electronic component is replaced on another transport medium after the test process is completed. It may be desirable to temporarily store the transport medium in the buffer zone. By installing a buffer stage near the transport position of such an empty transport medium, the transport medium can be quickly and easily taken in and out. Since the number of component transport media can be adjusted, the rise time until the next test can be reduced.

[0027]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a partially cutaway perspective view showing an embodiment of an electronic component test apparatus of the present invention, and FIG. 3 is a plan view schematically showing various transfer devices provided in the electronic component test apparatus, FIG. 4 is a perspective view showing the structure of an IC stocker of the electronic component test apparatus,
FIG. 5 is a perspective view showing a customer tray used in the electronic component test apparatus, and FIG. 12 is a cross-sectional view (XI in FIG. 3) for explaining a method of routing an IC under test in a test chamber.
13 is a cross-sectional view (a cross-sectional view taken along the line XIII-XIII in FIG. 3) for explaining a method of routing the IC under test in the unloader section.

FIGS. 2 and 3 are diagrams for understanding the method of handling the IC under test and the operating range of the transporting device in the electronic component testing apparatus of the present embodiment. In some parts, the members arranged side by side are shown in a plan view. Therefore, the mechanical (three-dimensional) structure will be described with reference to FIG.

The electronic component test apparatus 1 according to the present embodiment provides an IC under test with a high temperature of about 125 ° C. or a low temperature of about −30 ° C.
Is a device that tests (inspects) whether the IC operates properly and classifies the ICs according to the test results. In such an operation test under the condition of applying a temperature stress, the IC under test to be tested is An IC carrier CR (see FIG. 7) transported in the electronic component test apparatus 1 from a large number of loaded trays (hereinafter, also referred to as customer trays KT; see FIG. 5).
The test is performed by replacing the IC under test.

For this reason, as shown in FIGS. 1 and 2, the electronic component testing apparatus 1 of the present embodiment stores ICs to be tested from now on, and classifies and stores tested ICs. A storage unit 100, a loader unit 200 for sending an IC under test sent from the IC storage unit 100 to the chamber unit 300, a chamber unit (corresponding to a thermostat of the present invention) 300 including a test head, and a chamber unit 300.
And an unloader section 400 for classifying and extracting the tested ICs subjected to the test.

[0031] The IC magazine 100 IC storage section 100, a pre-test IC stocker 101 for storing the IC before test, post-test IC stores the IC classified according to the result of the test stocker 102
Are provided.

The pre-test IC stocker 101 and the tested IC stocker 102, as shown in FIG. 4, have a frame-shaped tray support frame 103, and enter from the lower portion of the tray support frame 103 and move upward and downward. Elevator 1 to be possible
04 is provided. Tray support frame 103
, A plurality of customer trays KT as shown in the enlarged view of FIG. 5 are stacked and supported, and only the stacked customer trays KT are moved up and down by the elevator 104.

The pre-test IC stocker 101 includes:
While the customer trays KT storing the ICs to be tested to be tested are stacked and held,
In the C stocker 102, customer trays KT in which ICs to be tested after the test are appropriately classified are stacked and held.

Since the pre-test IC stocker 101 and the tested IC stocker 102 have the same structure, the pre-test IC stocker 101 and the tested IC stocker 1 have the same structure.
02 can be set to an appropriate number as needed.

In the example shown in FIGS. 1 and 2, one stocker LD is allocated to the pre-test stocker 101, and an empty stocker EMP sent to the unloader 400 next to it.
Is assigned, and the tested IC stocker 1
02, five stockers UL1, UL2, ..., UL5
, And can be sorted and stored in a maximum of five categories according to the test results. In other words, besides the non-defective products and the defective products, the non-defective products are classified into those having a high operation speed, medium-speed ones, low-speed ones, and some of the defective ones requiring retesting.

The customer tray KT which loader unit 200 described above, the lower device substrate 201 to the window 202 of the loader unit 200 by the tray transfer arm (not shown) provided between the IC storage section 100 and the device substrate 201 Carried from. And this loader unit 2
At 00, the IC under test loaded on the customer tray KT is once transferred to the pitch conversion stage 203 by the first transfer device 204, where the IC under test is
Of the pitch conversion stage 203 after correcting the mutual position of the
The IC under test transferred to the IC carrier CR stopped at the position CR1 (see FIG. 6) in the chamber 300 by using the second transfer device 205.

The pitch conversion stage 203 provided on the device substrate 201 between the window 202 and the chamber 300 has a relatively deep concave portion, and the peripheral portion of the concave portion has a shape surrounded by an inclined surface. Means for correcting the position of the IC and pitch change of the IC.
When the IC under test sucked into the IC chip 4 is dropped, the falling position of the IC under test is corrected on the inclined surface. Thereby, for example, the mutual positions of the four ICs to be tested are accurately determined, and the customer tray KT and the IC carrier CR are determined.
Even if the mounting pitch differs, the IC under test whose position has been corrected and the pitch has been changed is adsorbed by the second transfer device 205 and transferred to the IC carrier CR, whereby the IC carrier C is transferred.
The IC under test can be reloaded into the IC accommodating portion 14 formed in the R with high accuracy.

As shown in FIG. 3, a first transfer device 204 for transferring an IC under test from the customer tray KT to the pitch conversion stage 203 includes a rail 204a provided on an upper portion of the device substrate 201 and a rail 204a.
a movable arm 204b capable of reciprocating between the customer tray KT and the pitch conversion stage 203 (this direction is defined as a Y direction), and an X direction supported by the movable arm 204b along the movable arm 204b. And a movable head 204c that can move to

The movable head 2 of the first transfer device 204
The suction head 204d is attached to the downward direction of the suction tray 204d. The suction head 204d moves while sucking air, thereby sucking the IC under test from the customer tray KT, and moving the IC under test to the pitch conversion stage. 203. Such a suction head 204d is
For example, about four ICs are mounted on the movable head 204c, and four ICs to be tested can be dropped into the pitch conversion stage 203 at a time.

On the other hand, the pitch conversion stage 20
The second transfer device 205 for transferring the IC under test from the IC card 3 to the IC carrier CR1 in the chamber 300 has the same configuration, and as shown in FIGS.
A rail 205a erected above the test chamber 301, a movable arm 205b capable of reciprocating between the pitch conversion stage 203 and the IC carrier CR1 by the rail 205a, and a movable arm 205b supported by the movable arm 205b. Arm 205b
And a movable head 205c that can move in the X direction along the axis.

The movable head 2 of the second transfer device 205
At 05c, a suction head 205d is mounted in a downward direction. The suction head 205d moves while sucking air to suck the IC under test from the pitch conversion stage 203. The IC under test is transferred to the IC carrier CR1 through the opened entrance 303. Such a suction head 205
d indicates that about four ICs are mounted on the movable head 205c, and four ICs to be tested are
Can be transshipped to R1.

Chamber 300 The chamber 300 according to the present embodiment comprises an IC carrier C
The IC has a constant temperature function of applying a desired high-temperature or low-temperature stress to the IC under test loaded in the R. The IC under test to which the thermal stress has been applied is brought into contact with the contact portion 302a of the test head 302 at a constant temperature. Contact
Have a tester (not shown) perform the test.

By the way, in the electronic component test apparatus 1 of the present embodiment, when a low temperature stress is applied to the IC under test, the heat is removed by the hot plate 401 described later to prevent the dew condensation on the IC under test. However, when a high temperature stress is applied to the IC under test, heat is removed by natural heat radiation. However, a separate heat removal tank or heat removal zone is provided,
When a high temperature is applied, the IC under test is cooled by blowing air to return it to room temperature, and when a low temperature is applied, the IC to be tested is heated with warm air or a heater to return the temperature to a temperature at which dew condensation does not occur. You may comprise.

The test head 302 having the contact portion 302a is provided below the center of the test chamber 301, and the stationary position CR5 of the IC carrier CR is provided on both sides of the test head 302. Then, the IC under test placed on the IC carrier CR conveyed to this position CR5 is directly carried onto the test head 302 by the third transfer device 304, and the IC under test is brought into electrical contact with the contact portion 302a. The test is performed by letting it go.

The IC under test that has completed the test is an IC under test.
An exit carrier EX that does not return to the carrier CR and moves to and from the position CR5 on both sides of the test head 102
It is remounted on T and carried out of the chamber 300. When a high temperature stress is applied, the heat is naturally removed after being carried out of the chamber section 300.

FIG. 6 is a perspective view for explaining a transport path of an IC carrier (corresponding to an electronic component transport medium of the present invention) used in the electronic component test apparatus 1 of the present embodiment, and FIG.
Is a perspective view showing an embodiment of the IC carrier, and FIG.
9 is a sectional view taken along line VIII-VIII, FIG. 9 is a sectional view taken along line IX-IX in FIG. 7 (shutter closed), FIG. 10 is a sectional view taken along line XX in FIG. 7 (shutter open), and FIG. FIG. 3 is a plan view for explaining a test order of an IC under test in a test chamber of the electronic component test apparatus.

First, the IC carrier CR of this embodiment is
The wafer is conveyed while circulating in the chamber section 300. FIG. 6 shows how this is done. In the present embodiment, first, the loader unit 200 is placed at the front and back of the chamber unit 300, respectively.
The IC carrier CR1 loaded with the IC under test sent from the
Is a horizontal position CR2 by a horizontal transport device (not shown).
Transported to

It is to be noted that the test target I
Strictly speaking, the position for receiving C is the position CR shown in FIG.
The position is slightly higher than 1 (this position is indicated by a two-dot chain line in FIG. 6). This is because the IC carrier CR faces the entrance 303 opened on the ceiling of the test chamber 301 from below, and the entrance 303 is shielded by the IC carrier CR.
This is to prevent heat release in the chamber section 300. For this reason, the IC carrier CR slightly rises from the position CR1 when receiving the IC under test.

The IC carrier CR transported to the position CR2
Are transported in a vertically stacked state by the elevator 311 shown in FIG. 8 in a state where the IC carrier at the position CR5 becomes empty, and then the test head 302 is moved from the lowest position CR3 to the test head 302. It is transported by the horizontal transport device 312 to the substantially same level position CR4. Mainly during this transportation, a high or low temperature stress is applied to the IC under test.

Further, a horizontal transport device (not shown) transports the test head 302 from the position CR4 to a horizontal position CR5, where only the IC under test is sent to the contact portion 302a of the test head 302. IC after the IC under test has been sent to contact section 302a
The carrier CR is transported from the position CR5 to the horizontal position CR6 by the horizontal transport device 313, and then transported vertically upward by the elevator 314 to return to the original position CR1.

As described above, since the IC carrier CR is circulated and conveyed only in the chamber section 300, once the temperature is raised or lowered, the temperature of the IC carrier itself is maintained as it is. The thermal efficiency in the part 300 will be improved.

FIG. 7 is a perspective view showing the structure of the IC carrier CR of the present embodiment. Eight concave portions 12 are formed on the upper surface of a strip-shaped plate 11, and the IC under test is placed in each of the concave portions 12. Are formed two by two.

In the present embodiment, the IC accommodating portion 14
16 are formed along the longitudinal direction of the plate 11 by mounting the blocks 13, and the mounting pitches P ₁ (see FIG. 11) of the ICs to be tested in the longitudinal direction of the plate 11 are set at equal intervals.

Incidentally, a guide plate 17 in which a guide hole (see FIG. 9) 171 is formed between the concave portion 12 of the plate 11 and the blocks 13, 13 is held in the IC accommodating portion 14 of the present embodiment. I have. When the positioning accuracy cannot be ensured depending on the outer periphery of the package mold, such as the case where the IC under test is a BGA type IC of a chip size package, the guide hole 171 of the guide plate 17 is provided.
The solder ball terminals of the IC under test are positioned by the peripheral edge of the IC chip, thereby improving the contact accuracy with the contact pins.

As shown in FIG. 7, the IC carrier CR is used to open and close the upper opening surface of the IC under test accommodated in the IC accommodating portion 14 of the IC carrier CR in order to prevent displacement and pop-out. Shutter 15 is provided.

The shutter 15 is openable and closable with respect to the plate 11 by a spring 16. When the IC under test is housed in the IC housing 14 or taken out of the IC housing 14, the shutter opening and closing mechanism 182 is provided. When the shutter 15 is opened as shown in FIG. On the other hand, when the shutter opening / closing mechanism 182 is released, the shutter 15 returns to the original state by the elastic force of the spring 16, and the opening surface of the IC housing portion 14 of the plate 11 is covered by the shutter 15 as shown in FIG. As a result, the IC under test accommodated in the IC accommodating section 14 is held without displacement or jumping out even during high-speed conveyance.

As shown in FIG. 7, the shutter 15 of this embodiment includes three pulleys 1 provided on the upper surface of the plate 11.
The pulley 112 at the center is engaged with an elongated hole 152 formed in the shutter 15, and the two pulleys 112 provided at both ends hold both end edges of the shutter 15.

However, the center pulley 112 and the shutter 15
Engagement with the long hole 152 is such that there is almost no backlash in the longitudinal direction of the plate 11, whereas a slight gap is provided between the pulleys 112 at both ends and both end edges of the shutter 15. Is provided. By doing so, even if a thermal stress acts on the IC carrier CR in the chamber section 300, the expansion or contraction due to the thermal stress is caused by the central pulley 1
It is distributed to both ends with the center at 12, and is appropriately absorbed by gaps provided at both ends. Therefore, the amount of expansion or contraction of the entire length of the shutter 15 in the longitudinal direction is halved even at both ends where the shutter 15 expands or contracts the most, whereby a difference between the amount of expansion and contraction of the plate 11 can be reduced.

The shutter opening / closing mechanism of this embodiment is configured as follows. First, in the routing path of the IC carrier CR shown in FIG. 6, the position where the shutter 15 needs to be opened is the position CR1 for receiving the IC under test from the second transfer device 205 (strictly, a slightly upper window portion thereof). 3
03) and a position CR5 for transferring the IC under test to the contact portion 302a of the test head 302 by the third transfer device 304.

In this embodiment, as shown in FIGS. 6, 9 and 10, at the position CR1, as a shutter opening / closing mechanism, a fluid pressure cylinder which is opened and closed by hooking an opening / closing block 181 provided on the upper surface of the shutter 15. 182 are employed. The fluid pressure cylinder 182 is mounted on the test chamber 301 side. Then, as shown in FIGS. 9 and 10, the rod of the fluid pressure cylinder 182 is retracted with respect to the IC carrier CR in the stopped state, so that the opening / closing block 1 provided on the shutter 15 is moved.
The shutter 15 is opened while hooking 81. Also,
When the mounting of the IC under test is completed, the fluid pressure cylinder 182
The shutter 15 is closed by advancing the rod.

On the other hand, at the position CR5 near the test head 302, the IC carrier CR itself is moved by a horizontal transfer device (not shown), and the shutter 15 is opened and closed using this. For example, the IC carrier CR is transported horizontally from the position CR4 to the position CR5, and a stopper for opening and closing the shutter 15 is provided on the test chamber 301 side in the middle of the IC carrier CR.
When R moves from position CR4 to position CR5, it is provided at a position where it comes into contact with opening / closing block 181 of shutter 15.
The position where this stopper is provided is the position of the IC carrier CR.
Is also the position where the shutter 15 is fully opened when stopped at the position CR5. In this example, since two opening / closing blocks 181 are provided on the shutter 15, two stoppers are also provided. As a result, the shutter 15 is also fully opened with the horizontal transport of the IC carrier CR.

The IC carrier CR is moved from this position CR5 to C
When transporting to R6, the shutter 15 needs to be closed. Therefore, for example, a cam surface is formed on the above-described stopper, and the IC carrier CR is moved from the position CR5 to the position C.
When the sheet is transported toward R6, the rear end of the opening / closing block 181 of the shutter 15 keeps contacting the cam surface, so that the shutter 15 is gradually closed.

Incidentally, the movable heads 205c and 304b of the second transfer device 205 and the third transfer device 304 have
Positioning pins for aligning the IC under test with the IC carrier CR when transferring the IC under test are provided.
As a representative example, FIG. 9 shows the movable head 205c of the second transfer device 205, but the movable head 304b of the third transfer device 304 has the same configuration.

As shown in the drawing, the movable head 205c is provided with two positioning pins 205e, 205e straddling one IC under test. Therefore, the positioning pins 2 are provided on the plate 11 side of the IC carrier CR.
Positioning holes 11 with which 05e and 205e engage respectively
3, 113 are formed. Although not particularly limited, in this example, one positioning hole 113 (the right side in FIG. 9) is a perfect circular hole, and the other positioning hole (the left side in FIG. 9) is a long oval hole in the width direction. As a result, the positioning is performed mainly in one positioning hole 113 and the positioning pin 205e is positioned in the other positioning hole 113.
And the position error of the position is absorbed. The positioning pins 20 are provided on the upper surface of each positioning hole 113.
A tapered surface for inviting 5e is formed.

Reference numeral “153” shown in FIG. 10 is an opening for allowing the positioning pin 205e to engage with the positioning hole 113 when the shutter 15 is opened.

In the electronic component test apparatus 1 of the present embodiment, the third position CR5 near the test head 302
When all the ICs to be tested are transferred to the test head 302 by the transfer device 304, the IC carrier CR is returned from the position CR5 to the position CR6.
The IC under test is placed in any of the IC accommodation sections 14 of the C carrier CR.
In order to confirm that no residue remains, a residue detection device is provided.

This residual detecting device has a position CR shown in FIG.
It has a photoelectric sensor provided in the middle of 5 to CR6, irradiates detection light in the Z-axis direction along the center line CL of the IC carrier CR shown in FIG. 9, and receives it. In order to allow the detection light to pass therethrough, through holes 111 are provided in the bottom surface of the IC accommodating portion 14 of the plate 11, respectively.
4 are provided. As a result, when the IC carrier CR moves from the position CR5 to the position CR6 after completing the delivery of the IC under test, it receives a movement pulse signal from the encoder of the horizontal transfer device, and thereby receives the IC carrier CR.
The position timing of the IC accommodating portion 14 is confirmed, and the light receiving state of the photoelectric sensor at that timing is confirmed. Here, if the IC under test remains in the IC accommodating section 14, since light reception by the photoelectric sensor is not confirmed, for example, an alarm is issued to alert the user that the IC is abnormal.

The test head 302 of this embodiment has 8
Contact portions 302a have a constant pitch P₂Provided by
And the contact ground as shown in FIG.
The same pitch P₂It is provided in.
The IC carrier CR has a pitch P₁With 16
The IC under test is housed,₂= 2 · P₁ of
Relationship.

The ICs to be tested that are connected to the test head 302 at one time are different from the ICs to be tested arranged in one row × 16 columns as shown in FIG.
(Shaded area) are tested simultaneously.

That is, in the first test, 1, 3, 5,
Eight ICs to be tested arranged in rows 7, 9, 11, 13, and 15 are connected to the contact portion 302a of the test head 302 for testing. In the second test, the IC carrier CR is moved by P for one row pitch. Move _one , 2, 4, 6, 8,
ICs to be tested arranged in 10, 12, 14, and 16 columns are similarly tested. Therefore, IC carrier CR that has been transported to either side of the position CR5 the test head 302 is moved in the longitudinal direction by horizontal conveyor unit 313 by the pitch _{P 1.}

Incidentally, the result of this test is stored in an address determined by, for example, the identification number given to the IC carrier CR and the number of the IC under test allocated inside the IC carrier CR.

In the electronic component test apparatus 1 of the present embodiment, a third transfer device 304 is provided near the test head 302 to transfer the IC under test to the contact portion 302a of the test head 302 for testing. ing.
FIG. 12 is a cross-sectional view taken along the line XII-XII in FIG. 3. The third transfer device 304 includes a stationary position CR5 of the IC carrier CR and an extending direction (Y direction) of the test head 302.
And a rail 304a provided along the
4a, a movable head 304b capable of reciprocating between the test head 302 and the stationary position CR5 of the IC carrier CR, and a suction head 304c provided downward on the movable head 304b. The suction head 304c is configured to be movable in the vertical direction by a driving device (for example, a fluid pressure cylinder) not shown. By moving the suction head 304c up and down, the IC under test can be sucked and the contact portion 302a can be held.
Can be pressed against the IC under test.

In the third transfer device 304 of the present embodiment,
Two movable heads 304b are provided on one rail 304a, and the distance between them is the distance between the test head 302 and the IC.
It is set equal to the interval between the carrier CR and the stationary position CR5. And these two movable heads 304b
Are simultaneously moved in the Y direction by one drive source (for example, a ball screw device), while the respective suction heads 304c are vertically moved by independent drive devices.

As described above, each suction head 3
04c can suck and hold eight ICs at a time, and the interval between them is set equal to the interval between the contact portions 302a.

In particular, in the electronic component test apparatus 1 of the present embodiment, as shown in FIGS.
The buffer stage CRB is provided between the positions CR6 and CR6 of the IC carrier CR.

The buffer stage CRB is connected to the circulation path CR1 → CR2 → CR3 → CR4 → CR5 → CR6 → C
This is a stage for optimizing the number of IC carriers CR transporting R1. The IC carriers CR are taken out from the circulation path and temporarily stored.

For example, when the temperature condition is extremely severe and the soak time is longer than the test time in the test head 302, a large number of IC carriers CR are transported in the circulation path and the positions CR1 to CR4 are set.
It is better to extend the transit time until
This is advantageous because the waiting time of 02 is eliminated. Therefore, in such a case, IC is provided in the buffer stage CRB.
It is operated with the full number of sheets without storing the carrier CR.

On the other hand, when the test time is longer than the soak time, the temperature reaches the predetermined temperature sufficiently without inserting many IC carriers CR into the positions CR1 to CR4. Conversely, when a large number of IC carriers CR are loaded, the amount of heat absorbing medium in the test chamber 301 increases, and the rise time becomes longer, leading to a loss of thermal energy. Therefore, some IC carriers CR are temporarily stored in the buffer stage CRB, and only the remaining IC carriers CR are circulated and transported. In addition, in an operation check test or the like when newly installing the electronic component test apparatus 1, it is often necessary to repeatedly check the operation of the entire electronic component test apparatus in a short time. Even in such a case, it is desirable to temporarily store unnecessary IC carriers CR in the buffer stage CRB.

The buffer stage CRB of the present embodiment
It is provided between the positions CR6 and CR6 to effectively use the dead space in the test chamber 301.

The two test heads provided on both sides of the test head 302
Circulation route of two IC carriers and buffer stage CR
B, between them, in this example, at position CR6
Fluid pressure cylinders (corresponding to the conveying means of the present invention) for transferring the carrier CR are provided.

As shown in FIG. 8, buffer stage CR
In B, the IC carriers CR are stacked and accommodated, but when the IC carriers CR are loaded into the buffer stage CRB and when the IC carriers CR are paid out from the buffer stage CRB, the IC carriers CR at the lowermost stage are It is moved in and out by the hydraulic cylinder CRB1. For this reason, the hook CRB3 for temporarily holding the IC carrier of the second or higher stage is located at the position of the second stage from the bottom.
Is provided below buffer stage CRB.
Elevator CRB2 for raising and lowering C carrier CR
Is provided.

The hook CRB3 is connected to the IC carrier C
The IC carrier CR is provided at a position that does not interfere with the legs 19 of the R (see FIG. 9), and opens and closes to hold and release the IC carrier CR.

From one circulation path to the buffer stage CR
When the IC carrier CR is loaded into B, the elevator CRB2 is first lifted with the hook CRB3 opened, lifted to a position where the lowermost IC carrier can be held by the hook CRB3, and then the hook CRB3 is closed and the elevator CRB2 is closed. Is lowered, and all the IC carriers present in the buffer stage CRB are held by the hook CRB3. By this, hook CRB
The IC carrier CR does not exist in the lowermost transfer position below the IC carrier CR.

In this state, the fluid pressure cylinder CRB1 is operated, and the IC carrier CR is carried into the lowermost stage of the buffer stage CRB from the position CR6 of the circulation path. Subsequently, when the IC carrier CR is loaded into the buffer stage CRB, the above procedure is repeated.

On the other hand, IC carrier CR stored in buffer stage CRB is transferred to buffer stage CRB.
In order to take out the IC carrier CR, first, while leaving one IC carrier CR at the bottom, the hook CRB3 is closed to hold all the IC carriers at the upper stage. In this state, the hydraulic cylinder CRB1 is operated to convey the IC carrier CR existing at the lowermost stage to the position CR6 in the circulation path. This is repeated when paying out the IC carrier CR continuously.

The adjustment of the number of IC carriers is performed when the type of the IC under test is different or when the test conditions are changed.

[0087] The unloader section 400 unloader section 400, exit carriers EX for paying out the test IC described above from the chamber section 300
T is provided. This exit carrier EXT
Is a test head 30 as shown in FIGS.
2 and the unloader 40
It is configured to be able to reciprocate in the X direction between the position EXT2 at position 0. Position E on both sides of test head 302
In XT1, as shown in FIG. 12, in order to avoid interference with the IC carrier CR, the stationary position CR5 of the IC carrier is used.
It comes up and down slightly above and slightly below the suction head 304c of the third transfer device 304.

The specific structure of the exit carrier EXT is not particularly limited. However, as in the IC carrier CR shown in FIG.
Individual) formed plates.

Two exit carriers EXT are provided on each side of the test head 302 for convenience. While one exit carrier EXT is moved to the position EXT1 of the test chamber 301, the other is located at the position EXT of the unloader unit 400.
An almost symmetric operation such as moving to step 2 is performed.

Returning to FIG. 3, in the electronic component test apparatus 1 of this embodiment, a hot plate 401 is provided near the exit carrier EXT at the position EXT2. The hot plate 401 is for heating the IC under test to a temperature at which dew condensation does not occur when a low temperature stress is applied to the IC under test. Therefore, when a high temperature stress is applied, the hot plate 401 is heated. 401 need not be used.

The hot plate 401 of the present embodiment has a structure corresponding to the fact that a suction head 404d of a fourth transfer device 404 described later can hold eight ICs at a time.
It is configured to be able to accommodate 32 ICs under test (columns × 16 rows). Then, the hot plate 401 is divided into four areas corresponding to the suction head 404d of the fourth transfer device 404, and the eight tested ICs sucked and held from the exit carrier EXT2 are sequentially placed in those areas.
The eight ICs under test heated the longest are sucked by the suction head 404d as they are and transferred to the buffer unit 402.

In the vicinity of the hot plate 401, two buffer units 402 each having a lifting table 405 are provided.
Is provided. FIG. 13 is a sectional view taken along line XIII-XIII in FIG.
5 moves in the Z direction between the same level position (Z direction) as the exit carrier EXT2 and the hot plate 401 and a level position above it, specifically, the level position of the device substrate 201. The specific structure of the buffer section 402 is not particularly limited. For example, like the IC carrier CR and the exit carrier EXT, the buffer section 402 may be formed of a plate having a plurality of recesses (eight in this case) capable of accommodating the IC under test. Can be.

Further, the pair of elevating tables 405
Performs an almost symmetric operation such that while one is stationary at the ascending position, the other is stationary at the descending position.

The exit carrier EXT2 described above
Unloader section 400 ranging from buffer section 402 to buffer section 402
Is provided with a fourth transfer device 404. As shown in FIGS. 3 and 13, the fourth transfer device 404 includes a rail 404 a
And the exit carrier E by the rail 404a.
A movable arm 404b that can move between the XT2 and the buffer section 402 in the Y direction; and a suction head 404c that is supported by the movable arm 404b and that can move up and down in the Z direction with respect to the movable arm 404b. Moves in the Z direction and the Y direction while sucking air, thereby adsorbing the IC under test from the exit carrier EXT, and placing the IC under test on the hot plate 401.
And the IC under test is attracted from the hot plate 401 to drop the IC under test into the buffer unit 402. The eight suction heads 404c of this embodiment are mounted on the movable arm 404b, and can transfer eight ICs under test at a time.

As shown in FIG. 13, the movable arm 404b and the suction head 404c are
02 is set at a position where it can pass through the level position between the ascending position and the descending position of the ascending / descending table 405, so that even if one ascending / descending table 405 is at the ascending position, the other ascending / descending table is not interfered with. The IC under test can be transferred to 405.

Further, the unloader unit 400 is provided with a fifth transfer device 406 and a sixth transfer device 407, and the test device transferred to the buffer unit 402 by the third and sixth transfer devices 406 and 407. The tested ICs are reloaded on the customer tray KT.

For this reason, the apparatus board 201 has a window 403 for arranging an empty customer tray KT carried from the empty stocker EMP of the IC storage unit 100 so as to face the upper surface of the apparatus board 201. One has been established.

As shown in FIGS. 1, 3 and 13, the fifth transfer device 406 connects a rail 406a provided on the upper portion of the device substrate 201, and the buffer portion 402 and the window portion 403 by the rail 406a. A movable arm 406b that can move in the Y direction, a movable head 406c that is supported by the movable arm 406b, and that can move in the X direction with respect to the movable arm 406b, and a suction device that is attached downward to the movable head 406c and that can move up and down in the Z direction And a head 406d. And this suction head 4
06d moves in the X, Y and Z directions while sucking air, thereby sucking the IC under test from the buffer unit 402 and transferring the IC under test to the customer tray KT of the corresponding category. Suction head 406d of the present embodiment
Are mounted on the movable head 406c, and can transfer two ICs at a time.

The fifth transfer device 406 of this embodiment
The movable arm 406b is formed so as to be short so that the IC under test is transferred only to the customer tray KT set in the two rightmost windows 403. It is effective to set a customer tray KT of a category having a high category.

On the other hand, the sixth transfer device 406
As shown in FIGS. 1, 3 and 13, two rails 407a, 407a installed on the upper portion of the device substrate 201, and the buffer section 402 is formed by the rails 407a, 407a.
Arm 4 that can move in the Y direction between the window and the window 403
07b and supported by the movable arm 407b,
A movable head 407c that can move in the X direction with respect to the movable arm 407b; and a suction head 407d that is attached downward to the movable head 407c and that can move up and down in the Z direction.
And Then, the suction head 407d moves in the X, Y and Z directions while sucking air, thereby sucking the IC under test from the buffer unit 402 and transferring the IC under test to the customer tray KT of the corresponding category. . Two suction heads 407d of this embodiment are mounted on the movable head 407c, and can transfer two ICs at a time.

While the above-described fifth transfer device 406 transfers the IC under test only to the customer tray KT set in the two rightmost windows 403, the sixth transfer device 4
07 can transfer the IC under test to the customer tray KT set in all the windows 403. Therefore, the IC under test of the category with a high frequency of occurrence is classified using the fifth transfer device 406 and the sixth transfer device 407, and the I under test of the category with a low frequency of occurrence is tested.
C can be classified only by the sixth transfer device 407.

The two transfer devices 406 and 407
The rails 406a and 407a are provided at different heights as shown in FIGS. 1 and 13 so that the suction heads 406d and 407d do not interfere with each other. It is configured to hardly interfere. In this embodiment,
The fifth transfer device 406 is provided at a position lower than the sixth transfer device 407.

Incidentally, although not shown, a lifting table for raising and lowering the customer tray KT is provided below the device substrate 201 in each window 403, and the tested ICs to be tested are reloaded. The customer tray KT, which is filled and filled, is lowered, and the full tray is transferred to a tray transfer arm.
Transported to L5. Further, the empty customer tray KT is transported from the empty stocker EMP by the tray transfer arm to the empty window portion 403 where the customer tray KT has been paid out, and is set on the window portion 403 after being replaced on the elevating table. You.

In one buffer section 402 of this embodiment, 16 ICs to be tested can be stored.
There is provided a memory for storing the category of the IC under test stored in each IC storage location 02.

The category and position of the IC under test deposited in the buffer 402 are stored for each IC under test, and the IC under test deposited in the buffer 402 is stored.
The customer tray KT of the category to which the
00 (UL1 to UL5), and the third
Then, the tested ICs are stored in the corresponding customer trays KT by the sixth transfer devices 406 and 407.

Next, the operation will be described. The customer tray KT on which the IC before the test is mounted is stored in the stocker LD of the IC storage unit 100.
Is set in the window 202 of the loader unit 200. From the customer tray KT facing the upper surface of the device substrate 201, for example, four ICs to be tested are sucked at a time by using the first transfer device 204, and the ICs are dropped on the pitch conversion stage 203 once to be tested. IC position correction and pitch change are performed.

Next, by using the second transfer device 205, for example, four ICs to be tested dropped into the pitch conversion stage 203 are sucked at a time, for example, four ICs at a time.
From the test chamber 301 to the position CR1
On the IC carrier CR that is stationary. Since two positions CR1 are provided in the test chamber 301, the second transfer device 205
The IC under test is carried alternately to the carrier CR. At this time, the shutter 15 of the IC carrier CR is opened and closed by the fluid pressure cylinder 153 (see FIG. 6).

At each position CR1, the number of ICs to be tested is 16
When individually mounted, the IC carrier CR is transported in the test chamber 301 in the order of CR1 → CR2 →... → CR4 shown in FIG. 6, during which high-temperature or low-temperature stress is applied to the IC under test.

An IC carrier CR on which a pre-test IC is mounted
Is transported to the position CR5 on both sides of the test head 302, the shutter 15 of the IC carrier 15 is opened by a stopper (not shown), and as shown in FIG. (Left here) 304
c descends and sucks every other IC under test (see FIG. 11), rises again, and stands by here. At the same time, the other suction head (here, right side) 304c presses the eight suctioned ICs to be tested against the contact portions 302a of the test head 302 to execute a test.

At this time, an exit carrier EXT (shown by a two-dot chain line) is provided above the left IC carrier CR5.
Does not exist, the position EXT2 outside the test chamber 301
Have moved to. The exit carrier EXT exists in EXT1 above the right IC carrier CR5, and the IC under test sucked by the right suction head 304c.
Wait for the test to finish.

8 sucked by the right suction head 304c
When the test of the ICs to be tested is completed, as shown in FIG. 12B, the movable heads 304b, 304b are moved to the right, and the eight ICs to be tested adsorbed to the suction head 304c on the left are tested. The test is performed by pressing against the contact portion 302a of the head 302.

On the other hand, the eight tested ICs sucked by the suction head 304c on the right side are placed on the exit carrier EXT waiting, and then the exit carrier EXT on which the tested ICs are placed is placed in the test chamber. 3
01 moves from the position EXT1 inside the test chamber 301 to the position EXT2 outside the test chamber 301.

When the exit carrier EXT moves outside the test chamber 301, the right suction head 304c moves the IC carrier CR located at the right position CR5.
, And sucks the remaining eight ICs to be tested, rises again, and waits for the test of the ICs to be sucked to the left suction head 304c to be completed. Before the suction head 304c is adsorbed, IC carrier CR is the rest of the IC so as to be adsorbed by the suction heads 304c, moves by the pitch _{P 1} (see FIG. 11).

At about the same time, the left exit carrier EXT moves into the test chamber 301, and waits at this position EXT1 to complete the test of the IC under test sucked by the left suction head 304c.

When the test of the IC under test sucked by the left suction head 304c is completed, the movable heads 304b, 304b are moved to the left, and the remaining eight test heads sucked by the right suction head 304c are moved. Test IC
Is pressed against the contact portion 302a of the test head 302 to perform a test.

On the other hand, the eight tested ICs sucked by the suction head 304c on the left side are placed on the exit carrier EXT which is waiting, and then the exit carrier EXT on which the tested IC is placed is placed in the test chamber. 3
01 moves from the position EXT1 inside the test chamber 301 to the position EXT2 outside the test chamber 301.

Hereinafter, this operation is repeated, and the two suction heads 3 are applied to one contact portion 302a.
04c are alternately accessed, and one waits for the other test to end, so that the time for attracting the IC under test to one suction head 304c is absorbed by the other test time, The index time can be reduced.

On the other hand, the ICs to be tested which have completed the test using the test head 302 are alternately moved to the test chamber 30 by two exit carriers EXT by eight.
It is paid out to the position EXT2 outside the position 1.

As shown in FIG. 13, the eight tested ICs discharged to the right position EXT2 by the exit carrier EXT are connected to the suction head 4 of the fourth transfer device 404.
04c is collectively adsorbed on the hot plate 401c.
On one of the two areas. In the following description of the present embodiment, it is assumed that a low-temperature thermal stress is applied. However, when a high-temperature thermal stress is applied, the buffer section 40 is directly transmitted from the exit carrier EXT.
It is carried to 2.

The suction head 404c of the fourth transfer device 404, which has carried the tested IC to one area of the hot plate 401, does not return to its original position, but is located in the tested IC previously mounted on the hot plate 401. Then, the eight ICs with the longest elapsed time are sucked at that position, and the heated tested ICs are replaced on the lifting table 405 (here, the right side) of the buffer unit 402 at the lower position.

As shown in FIG. 13, the fourth transfer device 40
The lifting table 405 on the left on which the eight tested ICs are mounted by the previous operation of Step 4 moves to the lifting position, and accordingly, the lifting table 405 on the right.
Moves to the lowered position. Eight tested ICs are mounted on the left elevating table 405 moved to the ascending position, and the tested ICs are stored in the fifth and sixth transfer devices 406 and 407 as test result storage contents. Is transferred to the customer tray KT of the corresponding category according to FIG. 13 shows a test I
An example in which C is replaced on the customer tray KT is shown.

The above operation is repeated, and the tested I
C is reloaded to the customer tray KT of the corresponding category.
04 and the fifth or sixth transfer device 406, 407 at different levels, the fourth transfer device 404
And the fifth and sixth transfer devices 406 and 407 can be operated simultaneously, thereby increasing the throughput.

The embodiments described above are described for facilitating the understanding of the present invention, and are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

For example, in the above embodiment,
The thermal stress on the IC under test is
Although the electronic component test apparatus of the type given by using the above is described as an example, the present invention can be applied to electronic component test apparatuses other than the so-called chamber type.

[0125]

As described above, according to the present invention, unnecessary electronic component transport media can be temporarily stored in the buffer stage according to the length of the soak time and the test time. The electronic component transport medium can be circulated and transported in an optimal quantity. As a result, it is possible to reduce the throughput or the rise time in the thermostat.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of an electronic component test apparatus of the present invention.

FIG. 2 is a conceptual diagram showing a method of routing an IC under test in the electronic component test apparatus of FIG.

FIG. 3 is a plan view schematically showing various transfer devices provided in the electronic component test device of FIG.

FIG. 4 is a perspective view showing a structure of an IC stocker of the electronic component test apparatus of FIG.

FIG. 5 is a perspective view showing a customer tray used in the electronic component test apparatus of FIG. 1;

FIG. 6 is a perspective view of a main part for describing a transport path and a buffer stage of an electronic component transport medium (IC carrier) applied to the electronic component test apparatus of FIG. 1;

FIG. 7 is a perspective view showing an embodiment of an electronic component transport medium (IC carrier) applied to the electronic component test apparatus of FIG. 1;

FIG. 8 is a sectional view taken along the line VIII-VIII in FIG. 3;

9 is a cross-sectional view (shutter closed) along the line IX-IX of FIG. 7;

FIG. 10 is a cross-sectional view (shutter open) along line XX in FIG. 7;

11 is a plan view for explaining a test order of an IC under test in a test chamber of the electronic component test apparatus of FIG. 1;

FIG. 12 is a cross-sectional view (corresponding to line XII-XII in FIG. 3) for describing a method of arranging the IC under test in the test chamber of the electronic component test apparatus in FIG. 1;

13 is a cross-sectional view (corresponding to line XIII-XIII in FIG. 3) for explaining a method of arranging the IC under test in the unloader section of the electronic component test apparatus in FIG. 1;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Electronic component test apparatus 100 ... IC storage part 200 ... Loader part 300 ... Chamber part 301 ... Test chamber 302 ... Test head 302a ... Contact part 303 ... Entrance of a chamber part 304 ... Third transfer device 400 ... Unloader part KT ... Customer tray CR: IC carrier (electronic component transport medium) CRB: Buffer stage CRB1: Fluid pressure cylinder (transport means) CRB2: Elevator CRB3: Hook EXT: Exit carrier

Claims (5)

[Claims] 1. An electronic component test apparatus including at least a test step in a circulation path of an electronic component transport medium on which an electronic component under test is mounted, comprising: a buffer stage for temporarily storing the electronic component transport medium. Characteristic electronic component testing equipment. 2. The electronic component test apparatus according to claim 1, further comprising a transport unit that takes the electronic component transport medium into and out of the buffer stage. 3. The electronic component conveying medium is circulated and conveyed in a thermostat for applying a temperature stress to the electronic component under test, and the buffer stage is provided in the thermostat. The electronic component test apparatus according to claim 1 or 2, wherein: 4. A pair of circulating transport systems in which the electronic component transport medium is circulated and transported on both sides of the test process, wherein the buffer stage is provided between the pair of circulating transport systems. The electronic component test apparatus according to any one of claims 1 to 3, wherein: 5. The buffer stage according to claim 4, wherein the buffer stage is provided in proximity to a transport position of the electronic component transport medium which has been emptied after the test in the circulating transport system. Electronic parts testing equipment.