JP2000096291A - Production of linear conductor for cable having flexibility - Google Patents
Production of linear conductor for cable having flexibilityInfo
- Publication number
- JP2000096291A JP2000096291A JP10270130A JP27013098A JP2000096291A JP 2000096291 A JP2000096291 A JP 2000096291A JP 10270130 A JP10270130 A JP 10270130A JP 27013098 A JP27013098 A JP 27013098A JP 2000096291 A JP2000096291 A JP 2000096291A
- Authority
- JP
- Japan
- Prior art keywords
- silver plating
- phosphor bronze
- annealing
- cable
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】この発明は、主に通信、コン
ピュータ用のケーブルにおける柔軟性のある線状導体の
製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a flexible linear conductor in a cable for communication and a computer.
【0002】[0002]
【従来の技術】ケーブルの線状導体を製造するに際して
は、例えば銅又は銅合金(リン青銅)の線状素材を伸線
処理した後に、焼鈍処理を行い、更に溶融状態にあるス
ズ(Sn)をメッキ浴として用いる溶融金属メッキ処理
を施すのが普通である。2. Description of the Related Art When manufacturing a linear conductor of a cable, for example, a linear material such as copper or a copper alloy (phosphor bronze) is drawn, then annealed, and then tin (Sn) in a molten state is obtained. Usually, a hot-dip metal plating treatment is carried out using as a plating bath.
【0003】[0003]
【発明が解決しようとする課題】前記の例では、約70
0°Cの温度の炉の内部にリン青銅(CuSnP)の線
状導体をほぼ1分ぐらい通して焼鈍し、その後にスズメ
ッキを施しているが、スズ(Sn)の溶融温度は240
°Cであるため、スズのメッキを先に行うことは不可能
であった。In the above example, about 70
Although a linear conductor of phosphor bronze (CuSnP) is passed through the furnace at a temperature of 0 ° C. for approximately one minute to anneal, and then tin-plated, the melting temperature of tin (Sn) is 240
° C, it was not possible to perform the tin plating first.
【0004】スズメッキに限らず、金属メッキを先に行
うことができれば、焼鈍処理に於ける工程にあって、金
属のメッキ処理を外注加工ができるようになり、加工工
程が簡易となるものである。そこで、焼鈍処理は、ほぼ
700°Cの温度では行われるので、これより高い溶融
温度を持つ金属でなければならない。しかも、接触抵抗
や濡れ性が良くなければならない。[0004] In addition to tin plating, if metal plating can be performed first, metal plating can be outsourced in the annealing process, and the processing process can be simplified. . Therefore, since the annealing treatment is performed at a temperature of approximately 700 ° C., the metal must have a higher melting temperature. In addition, the contact resistance and wettability must be good.
【0005】そこで、この発明は、焼鈍処理の前にメッ
キ処理が可能とするケーブル用線状導体の製造方法を提
供するものである。Accordingly, the present invention provides a method of manufacturing a linear conductor for a cable, which allows plating before annealing.
【0006】[0006]
【課題を解決するための手段】この発明に係る柔軟性の
あるケーブル用線状導体の製造方法は、所望の線状に加
工したリン青銅に銀メッキを施し、その後に700°C
から800°C前後の高温にて焼鈍処理を施したもので
ある(請求項1)。According to the present invention, there is provided a method for manufacturing a flexible linear conductor for a cable, which comprises applying a silver plating to phosphor bronze processed into a desired linear shape, and thereafter applying 700 ° C.
From 800 ° C. to 800 ° C. (claim 1).
【0007】このため、銀メッキの溶点が961°Cで
あるため、この溶点温度以下で充分に焼鈍処理ができる
ようになる。しかも、スズメッキ時の焼鈍処理より高く
保つことができることから焼鈍時間も短縮できるもので
あると共に、スズメッキよりも接触抵抗値の減少、はん
だ濡れ性の向上、低摩擦性を保つようになる。For this reason, since the melting point of silver plating is 961 ° C., annealing can be sufficiently performed at a temperature equal to or lower than the melting point temperature. In addition, since the annealing time can be kept higher than the annealing treatment at the time of tin plating, the annealing time can be shortened, and the contact resistance value is improved, the solder wettability is improved, and the low friction property is maintained as compared with the tin plating.
【0008】[0008]
【発明の実施の形態】図1において、この発明の工程が
示され、リン青銅(Cu−Sn−P)が伸線工程1にて
所望の線状に加工が施される。例えば、リン青銅として
は、スズ(Sn)が3〜9%、リン(P)が0.03〜
0.35%、銅(Cu)91〜97%の合金で、厚さが
0.100mm、幅0.500mmに加工される。FIG. 1 shows a process of the present invention, in which phosphor bronze (Cu-Sn-P) is processed into a desired linear shape in a wire drawing process 1. For example, as the phosphor bronze, tin (Sn) is 3 to 9% and phosphorus (P) is 0.03 to
An alloy of 0.35% and copper (Cu) 91 to 97% is processed to a thickness of 0.100 mm and a width of 0.500 mm.
【0009】銀メッキ工程2は、電気メッキにより行わ
れ、素材であるリン青銅の線状を一側に帯電させて行わ
れる。銀メッキの厚みは約3ミクロンである。この銀メ
ッキ処理した後に焼鈍が行われる。The silver plating step 2 is performed by electroplating, and is performed by charging a phosphor bronze linear material on one side. The thickness of the silver plating is about 3 microns. After the silver plating, annealing is performed.
【0010】焼鈍工程3は、加熱炉を通すことで行わ
れ、700°C〜800°Cぐらいの温度中を1分ぐら
い通すことにて行われる。焼鈍後は巻き取られ、所望の
ケーブル加工工場へ送られる。The annealing step 3 is performed by passing through a heating furnace and passing through a temperature of about 700 ° C. to 800 ° C. for about 1 minute. After annealing, it is wound and sent to a desired cable processing plant.
【0011】銀メッキ処理が行われることで、従来のス
ズメッキ処理のものに比べて、接触抵抗が1/2程度減
少した。また、はんだ濡れ性は従来のスズメッキ処理の
ものに比べて20%ほど向上した。更に、銀がスズに比
べて低摩擦特性を有するようになった。By performing the silver plating process, the contact resistance is reduced by about 1/2 compared with the conventional tin plating process. Further, the solder wettability was improved by about 20% as compared with that of the conventional tin plating. Furthermore, silver has low friction properties compared to tin.
【0012】[0012]
【発明の効果】以上のように、この発明によれば、焼鈍
前に銀メッキ処理が行われ、銀メッキの溶点が961°
Cであるので、この溶点以下で充分に焼鈍が行われ、し
かも焼鈍温度も従来のスズメッキ処理に比べて700°
C〜800°Cぐらいで行うことができる。銀メッキ時
に生地部(リン青銅)と銀メッキ層との境界部に水素が
発生するが、焼鈍時の加熱により排出させることがで
き、水素の存在にて銀メッキ層が剥離することを防止で
きる。また、スズメッキよりも銀メッキの方が接触抵抗
の減少(略1/2)となると共に、はんだの濡れ性が向
上するし、更に低摩擦特性をも備えることとなる。As described above, according to the present invention, silver plating is performed before annealing, and the melting point of silver plating is 961 °.
C, annealing is sufficiently performed below this melting point, and the annealing temperature is 700 ° C. lower than that of the conventional tin plating.
It can be performed at about C to 800 ° C. Hydrogen is generated at the boundary between the cloth (phosphor bronze) and the silver plating layer during silver plating, but can be discharged by heating during annealing, and the silver plating layer can be prevented from peeling off in the presence of hydrogen. . In addition, silver plating reduces contact resistance (approximately 2) than tin plating, improves solder wettability, and also has low friction characteristics.
【図1】柔軟性のあるケーブル用線状導体の製造工程図
である。FIG. 1 is a manufacturing process diagram of a flexible cable linear conductor.
1 伸線工程 2 銀メッキ工程 3 焼鈍工程 1 wire drawing process 2 silver plating process 3 annealing process
Claims (1)
キを施し、その後に700°Cから800°C前後の高
温にて焼鈍処理を施した柔軟性のあるケーブル用線状導
体の製造方法。1. Manufacture of a flexible linear conductor for a cable in which phosphor bronze processed into a desired linear shape is subjected to silver plating and then subjected to an annealing treatment at a high temperature of about 700 ° C. to 800 ° C. Method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27013098A JP3314268B2 (en) | 1998-09-24 | 1998-09-24 | Method of manufacturing flexible linear conductor for cable |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27013098A JP3314268B2 (en) | 1998-09-24 | 1998-09-24 | Method of manufacturing flexible linear conductor for cable |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2000096291A true JP2000096291A (en) | 2000-04-04 |
JP3314268B2 JP3314268B2 (en) | 2002-08-12 |
Family
ID=17481980
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27013098A Expired - Fee Related JP3314268B2 (en) | 1998-09-24 | 1998-09-24 | Method of manufacturing flexible linear conductor for cable |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3314268B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109609735A (en) * | 2019-02-22 | 2019-04-12 | 西安泰力松新材料股份有限公司 | A kind of welding annealing device and method for annealing |
-
1998
- 1998-09-24 JP JP27013098A patent/JP3314268B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109609735A (en) * | 2019-02-22 | 2019-04-12 | 西安泰力松新材料股份有限公司 | A kind of welding annealing device and method for annealing |
CN109609735B (en) * | 2019-02-22 | 2023-12-22 | 西安泰力松新材料股份有限公司 | Welding strip annealing device and annealing method |
Also Published As
Publication number | Publication date |
---|---|
JP3314268B2 (en) | 2002-08-12 |
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