JP2000094631A - Method for offset printing and image display device using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten a printing tact and to completely transfer print an ink by providing an ink supply unit before a doctor unit to an intaglio pattern, and simultaneously performing supplying of the ink and doctoring. SOLUTION: A doctor blade 4 is mounted at the same horizontal bar as a dispenser 3, and as the bar is moved in a printing direction, ink discharging and doctoring are simultaneously conducted. At this time the ink supply dispenser 3 discharges the ink while moving to reciprocate in a direction perpendicular to the printing direction, and hence the ink is supplied in saw blade shape 6 over the entire surface of the intaglio pattern. Immediately thereafter, since the ink is doctored by the blade 4 mounted at the same bar, printing can be executed without stopping time of the printer. At this time, since the doctoring is conducted immediately after the ink is supplied, no ink is dried, and the ink is charged in a homogeneous state. As a result, printing can be conducted without defect over the whole of pattern.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a method for forming a pattern of an electronic device by offset printing, and more particularly to an image display device manufactured by the offset printing, mainly a flat display device. The present invention also relates to a surface conduction electron-emitting device used for the image display device, an electron source using the electron emission device, an image display device using the electron source, and a method for manufacturing the electron emission device.

[0002]

2. Description of the Related Art Conventionally, offset printing has been widely used for printing graphics mainly for graphics printing. In recent years, technical development for producing electrodes of a recording thermal head, color filters of a liquid crystal display device, and the like has been made as applications to electronic devices. FIG. 4 is a plan view showing a flatbed proofing machine type printing apparatus.
In this drawing, reference numeral 101 denotes an ink roller 104,
Reference numeral 07 denotes an ink mixing table for developing an intaglio, and reference numeral 102 denotes an intaglio 10
5 is a platen for fixing 5. Reference numeral 103 denotes a work surface plate for fixing a work 106 to be printed, which is fixedly arranged on a main body frame 108. Two rack gears 109 and 110 are provided on both sides of the three platens arranged in a row.
Are arranged, and a blanket 113 in which the gears 111 and 112 are engaged is arranged on the rack gears 109 and 110. The blanket 113 has its axis fixed by carriages 114 and 115 at both ends.
Forward and backward by the cranking motion of the blanket 113
Are sequentially rotated and slid on the ink mixing table 101, the intaglio 105, and the work 106. The surface of the blanket 113 is provided with a rubber-like blanket rubber.

FIGS. 5A to 5D are cross-sectional views showing an offset printing process. In this drawing, 101 is an ink mixing table, 105 is an intaglio, and 106 is a glass substrate serving as a work, which is arranged in series on the same plane. Reference numeral 104 denotes an ink roll, and the ink 10 kneaded on the ink kneading table 101.
7 is transferred onto the intaglio 105 (FIG. 5A). 117
Is a doctor blade, which scrapes out the ink 107 transferred by sliding on the upper surface of the intaglio 105, except the ink filled in the concave portion (FIG. 5B). Reference numeral 113 denotes a blanket, which receives the ink filled in the concave portions of the intaglio 105 by rotatingly contacting the upper surface of the intaglio 105 and the upper surface of the glass substrate 106 (FIG. 5C).
The ink 107 is transferred to the pattern 05 (FIG. 5D). Thus, the printing process is completed. The printing ink 107 can be appropriately selected depending on the function of the pattern to be manufactured. That is, the electrodes of the recording thermal head or the like are mainly made of an organic Au metal ink called Au resinate paste, and the color filter contains an ink in which R, G, and B color pigments are dispersed or an organic dye. An ink or the like is used.

[0004] Conventionally, as a display technology for realizing a flat display device, a simple matrix liquid crystal display device (LC) has been used.
D), thin film transistor liquid crystal display (TFT / LC)
D), flat panel display technologies such as a plasma display (PDP), a slow electron beam fluorescent display (VFD), and a multi-electron source flat CRT.

[0005] As examples of these display techniques, a light emitting element that emits a phosphor using a multi-electron source and a flat display device using the same will be described.

Heretofore, two types of electron-emitting devices, which use a thermionic electron-emitting device and a cold cathode electron-emitting device, have been known as electron sources. The cold cathode electron emitting device includes a field emission type (hereinafter, referred to as “FE type”), a metal / insulating layer / metal type (hereinafter, referred to as “MIM type”), a surface conduction type electron emitting device, and the like. As an example of the FE type, W. P.
Dyke & W. W. Doran's Field Emis
zone ", Advance in Electron
Physics, 8, 89 (1956) or C.I. A.
Spindt "Physical Property
s of thin-film field emissi
on cathodes with mollybdeni
um cones ", J. Appl. Phys., 47,
5248 (1976) and the like are known.

In the MIM type, C.I. A. Mead, "Ope
ratio of Tunnel-Emission
Devices ", J. Appl. Phys. 32,
646 (1961) and the like are known.

[0008]

In the offset printing, however, the ink supply is performed by moving the ink supply device to a position in front of the pattern on the intaglio plate and stopping the ink supply. At this time, the ink discharge nozzle is moved several times in the direction perpendicular to the doctor ring. In a reciprocating operation, the ink is ejected so that a predetermined amount of the ink reaches the pattern width. Then, the doctoring operation starts after the end of the ink supply. Therefore, when the ink is ejected, the apparatus waits for the apparatus, and a printing time loss occurs. Further, in order to perform ink discharge corresponding to a large area and a thick pattern, there is a problem that the reciprocating operation of the ink discharge device increases, the standby time of the device increases, and the time loss increases. .

Further, when the doctor discharges a large area by increasing the ink discharge at one place on the intaglio, the dry state of the ink and the change of the ink components due to the difference in the place occur, thereby causing pattern defects and deterioration of print quality. The problem arose.

An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide an offset printing method capable of shortening the printing tact and enabling complete transfer printing of ink.

[0011]

In order to achieve this object, in an intaglio offset printing method according to the present invention, ink ejection and doctoring operation are performed simultaneously, and an ink supply device moves forward in a doctoring direction. It is characterized in that ink is ejected while reciprocating in the orthogonal direction.

That is, the offset printing method according to the first aspect of the present invention comprises a device for supplying an ink to a pattern portion of an intaglio and a doctor device for scraping off excess ink. In the offset printing method performed by using an offset printing apparatus that transfers the pattern on the blanket cylinder to a printing target, the ink supply is performed before the doctor apparatus with respect to the intaglio pattern portion. An offset printing method, comprising a device, and wherein the ink supply device simultaneously performs ink supply and doctoring while moving forward in a doctoring direction.

According to a second aspect of the present invention, there is provided an offset printing method according to the first aspect, wherein the ink supply device ejects ink while reciprocating in a direction orthogonal to a doctor ring.

According to a third aspect of the present invention, there is provided an image display device having element electrodes formed by using the first and second offset printing methods.

According to the offset printing method of the present invention, the doctoring operation can be performed without waiting for the apparatus while the necessary ink is dispensed to the intaglio pattern portion by adopting such a configuration. Will be possible. On the other hand, the ink is discharged over the entire surface of the pattern, so that the ink filled in the intaglio pattern by doctoring is hard to dry and uniform regardless of the location, and as a result, the print quality is improved. Further, by using a high-precision printing pattern created by the method of the present invention, a high-definition SCE panel can be manufactured.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the offset printing method of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 1 is a drawing of an offset printing apparatus that best illustrates the features of the present invention, and is a plan view showing an ink supply and dispenser apparatus, a doctor apparatus, and an ink discharge state on a pattern. FIG. 2 is a sectional view thereof.

In the offset printing apparatus used in the embodiment of the present invention, as shown in FIGS. 1 and 2, the dispenser 3 moves the intaglio 1 and the intaglio pattern 2 in the printing and doctoring directions indicated by arrows. The dispenser is mounted on a horizontal bar 7 which is movable in the printing and orthogonal directions, as shown in FIG. The doctor blade 4 is also mounted on the same horizontal bar.
As it moves at a speed of mm / sec, ink ejection and doctoring are performed simultaneously. At this time, the ink supply and dispenser 3 ejects ink while reciprocating at a speed of 200 mm / sec in a direction orthogonal to the printing, so that the ink is supplied over the entire intaglio pattern portion in a saw blade shape 6 as shown in FIG. Immediately after that, the ink was doctored by the doctor blade 4 attached to the same bar as the dispenser 3, so that printing could be performed without stopping the apparatus. At this time, since the doctoring is performed immediately after the ink is supplied over the entire pattern area, the ink is not dried and is filled with the ink in a uniform state. As a result, the defect-free printing is performed over the entire pattern area. Was completed.

FIG. 3 is a plan view showing the state of ink ejection in the conventional offset printing method. In order to eject a predetermined amount of ink, the dispenser is reciprocated four times at a speed of 200 mm / sec before the intaglio pattern portion. The apparatus was stopped for about 10 seconds when the ink was ejected, resulting in a printing time loss. Further, at the time of doctoring thereafter, a printing defect occurred on the entire surface presumably due to drying of the ink while the apparatus was stopped.

(Embodiment 2) An example of manufacturing an image forming apparatus using element electrodes of electron-emitting devices formed by offset printing will be described below.

The device electrodes of the electron-emitting devices were printed and transferred onto a glass substrate by the printing method and the printing apparatus described in the first embodiment. In this embodiment, the ink uses a Pt resinate paste made of an organic metal. The ink transferred onto the glass substrate is dried at about 70 ° C and dried at about 580 ° C.
Can be used as an element electrode made of Pt. The thickness of the transferred ink on the glass substrate after printing and drying was as small as about 2 microns, and the width of the printed electrode pattern was very small. Further, the thickness of the fired Pt electrode was as thin as about 1000 angstroms. Here, the pattern shape of the device electrode has a device electrode interval for arranging the electron-emitting material, and its dimension is about 20 mm.
Set to microns.

An electron source substrate can be manufactured by forming a thin film composed of wiring and Pd fine particles on the device electrode formed as described above. This will be described below with reference to the drawings.

FIG. 8 is a cross-sectional view showing the image display device of the present embodiment. In FIG. 8, reference numeral 401 denotes an electron source substrate made of blue plate glass. Reference numerals 405 and 406 denote printed wirings having a thickness of about 7 μm obtained by printing and baking Ag paste ink. The device electrodes 402 and 403 are printed wirings 405 and 406.
And each is connected. Reference numeral 404 denotes a thin film made of Pd fine particles having a thickness of about 200 angstroms obtained by coating and baking an organic metal solution, and patterned by reverse etching of a Cr thin film so as to be arranged at the device electrodes 402 and 403 and the space between the electrodes. Reference numerals 407 and 408 denote plating wirings having a thickness of about 50 μm on the printed wirings 405 and 406.
It was formed by Cu plating having a width of 400 microns. Reference numeral 409 denotes a glass substrate made of blue sheet glass, which faces the electron source substrate 401 at a distance of 5 mm. 410
Is a phosphor, which is disposed on a substrate 409, and which has device electrodes 402, 40 disposed on an electron source substrate 401 facing the phosphor.
3 are formed at positions corresponding to the electrode spacing portions. The phosphor 410 is formed by mixing a photosensitive resin and a phosphor into a slurry, coating and drying, and then performing patterning by photolithography. 411 is the phosphor 41
This is a metal back obtained by subjecting a filming process to a film on top of an aluminum film 0, forming an Al thin film having a thickness of about 300 angstroms by vacuum evaporation, firing the film, and burning out the film layer. The above-described phosphor and metal back formed on the glass substrate 409 are called a face plate.

Reference numeral 413 denotes a grid electrode disposed between the element substrate and the face plate. After arranging the above in a vacuum envelope, a voltage was applied between the plating wirings 407 and 408 to energize the thin film 404 to obtain an electron emission portion 412. Thereafter, a voltage of 3 kV for extracting electrons is applied using the metal back 410 as an anode electrode, and
When a voltage of 14 V was applied from the device electrodes 402 and 403 to the electron emission portions 412 through the gaps 6 and 407, electrons were emitted. The emitted electrons were modulated by changing the voltage of the grid electrode 413, and the amount of emitted electrons emitted to the phosphor 410 could be adjusted. As a result, the phosphor 410 could emit light arbitrarily and an image could be displayed.

As described above, by using the high-precision printing pattern formed according to the present invention, a high-definition panel can be manufactured.

(Embodiment 3) FIG. 9 is a top view showing a process of manufacturing an element substrate of an image display device of this embodiment. FIGS. 9 (a) to 9 (f) show the surface conduction produced by offset printing. The figure which combined the type | mold electron emission element and the matrix wiring is shown.

FIG. 9 (f) shows an example in which 3 × 3 electron-emitting devices are formed on a blue glass substrate (not shown) in a matrix of nine in total, together with wirings. In this figure, 501 is a lower printed wiring, 502 is a lower printed wiring 501
Are formed by firing the printed metal paste in the same step as the lower layer printed wiring 501.
Reference numeral 503 denotes a strip-shaped insulating layer which is formed by sintering the printing glass paste and is orthogonal to the lower printed wiring 501, and has an opening 504 for a contact hole at the center of the intersection with the printing pad 502. Reference numeral 505 shown in FIG. 9D is an upper layer printed wiring, which is not exposed in the drawing of FIG. 9F because it is a lower layer of the plated wiring 506 shown in FIG. 9F. The upper printed wiring 505 has a strip shape on the insulating layer 503, is electrically connected to the printing pad 502 by a contact hole 504, and is formed by firing a printed metal base. Element electrodes 507 and 508 are connected to the lower printed wiring 501 and the print pad 502, respectively, and are formed by offset printing and firing of a resinate paste ink. Device electrodes 507, 5
08 is an adjacent part of the electrode and has an electrode gap of 30 μm and an electrode width of 20
It has a shape of 0 microns. Reference numeral 509 denotes a thin film made of Pd fine particles as an electron-emitting material, and a device electrode 507;
Wiring is formed at 508 and the electrode interval. Reference numeral 510 denotes a thin film portion of the electrode interval, which is a portion to be an electron emitting portion described later. Reference numeral 506 denotes a metal wiring, which is a metal wiring having a thickness of about 100 microns and formed in a strip shape on the upper printed wiring 505 by a plating method.

The following figures (a), (b), (c),
(D), (e), and (f) will be used to sequentially describe the steps of manufacturing the element substrate.

First, Pt element electrodes 507 and 508 having a thickness of 1000 angstroms were pattern-formed on a well-cleaned substrate made of blue plate glass by offset printing and baking of a resinate paste ink (FIG. 9A).

Next, an Ag paste ink was screen-printed and baked to form a lower printed wiring 501 and a print pad 502 having a width of 300 μm and a thickness of 7 μm. At this time, the lower printed wiring 501 and the print pad 502 are electrically connected to the device electrodes 507 and 508, respectively (FIG. 9).
(B)).

Next, the glass paste ink was screen-printed and baked to form an insulating layer 503 having a width of 500 μm and a thickness of about 20 μm, and a contact hole 504 having an opening size of 100 μm square (FIG. 9C).

Further, an Ag paste ink was screen-printed on the insulating layer 503 and baked to form an upper printed wiring 505 having a width of 300 μm and a thickness of 10 μm. At this time, the upper printed wiring 505 and the print pad 502 are electrically connected through the contact hole 504. In addition, a sufficient step cover at the contact hole is realized by forming a plated wiring in a later process (FIG. 9D).

Next, a Cr film is formed by sputtering on a portion where the thin film 509 is not desired to be disposed, and then a Cr pattern is formed by photolitho etching, and then an organic palladium solution (Catapaste CCP42, Okuno Pharmaceutical Co., Ltd.)
30) was applied and baked to obtain a Pd fine particle film. Further, the Cr pattern was reverse-etched, and a thin film 509 was formed by patterning in a space between the device electrodes 507 and 508 and the electrode (FIG. 9E).

Next, a plating resist is formed by photolithography so that the upper printed wiring 505 is exposed.
The upper printed wiring 505 was energized, and Cu electroplating was performed on this portion to a thickness of 100 μm. An element substrate was manufactured by removing the plating resist. At this time, the Cu plating film was sufficiently deposited and grown in the contact hole 504 at the contact hole 504, and sufficient electrical continuity was obtained between the print pad 502 and the upper printed wiring 505 (FIG. 9F). ).

The present device substrate is arranged on a 40 cm square substrate on which 350 × 350 electron-emitting devices are arranged in a matrix, together with a face plate having phosphors corresponding to R, G, and B in a vacuum envelope. Placed. After this,
After the electron-emitting device is energized, an arbitrary voltage signal of 14 V is sequentially applied to the upper printed wiring of the element substrate, and a potential of 0 V is applied to the lower printed wiring, and scanning is performed. Potential. When an anode voltage of 3 kV was applied to the metal back of the face plate, an arbitrary image could be displayed. At this time, there was no crosstalk between the fluorescent luminescent spots caused by the misalignment between the electron-emitting device and the phosphor. Further, the wiring resistance of the plating wiring can be reduced to about 0.5 ohm between both ends of the substrate, and the voltage drop and the delay of the driving signal can be greatly improved.

In this step, device electrodes 507 and 508 were formed before printing and firing of the printed wiring. However, since this device electrode has undergone a printing and firing process once, thermal damage to the device electrode did not occur in the same printed wiring firing.
The lower printed wiring 501 and the print pad 502 are the same layer on the substrate, and the contacts with the device electrodes 507 and 508 are formed on the substrate without the stepped device electrodes 507 and 508. There was no disconnection on the way to connect to 502.

As described above, as in the case of the second embodiment, the use of the high-precision printing pattern formed according to the present invention makes it possible to manufacture a high-definition SCE panel.

[0038]

As described above, according to the present invention,
The ink ejection device and the doctor device are operated at the same time, and at this time, the ink ejection device ejects the ink while reciprocating in the direction orthogonal to the doctor ring, so that the printing tact can be reduced without waiting for the device. In addition, since ink is ejected over the entire intaglio pattern and at the same time, doctoring is performed quickly, it is difficult to dry and uniform ink filling,
A printing station pattern with good print quality without defects can be obtained by offset printing. Further, by using the high-precision printing pattern according to the present invention, a high-definition SCE panel can be manufactured.

[Brief description of the drawings]

FIG. 1 is a plan view showing an ink supply and dispenser device and a doctor device of an offset printing device used in the present invention and an ink discharge state on a pattern.

FIG. 2 is a sectional view of the offset printing apparatus shown in FIG.

FIG. 3 is a schematic plan configuration diagram of a conventional offset printing apparatus showing an ink discharge state in a conventional offset printing method.

FIG. 4 is a schematic plan view showing a flatbed proofing machine type offset printing apparatus.

FIG. 5 is a schematic cross-sectional view showing a conventional offset printing process, and (a) to (d) show the offset printing process.

FIG. 6 is a schematic plan view of a conventional surface conduction electron-emitting device.

FIG. 7 is a schematic view of a conventional surface conduction electron-emitting device.
(A) is a plan view and (b) is a cross-sectional view.

FIG. 8 is a schematic sectional view illustrating an image display device according to a second embodiment of the present invention.

FIG. 9 is a top view illustrating a manufacturing process of the element substrate of the image display device according to the third embodiment of the present invention, and illustrates the order of the processes from (a) to (f).

[Explanation of symbols]

 1,105: intaglio 2: intaglio pattern 3: dispenser device 4, 117: doctor blade 5: blanket cylinder 6: saw blade-shaped ink ejection shape 7: horizontal moving bar 8: ink mixing table 102: plate for fixing intaglio Surface plate 103: Work surface plate for fixing the work 104: Ink roller 106: Work 107: Ink 108: Body frame 109, 110: Rack gear 111, 112: Gear 113: Blanket 114, 115: Carriage 116: Crank arm 401: Electron source substrate 402, 403, 507, 508: device electrode 404, 509: thin film 405, 406: printed wiring 407, 408: plated wiring 409: substrate 410: phosphor 411: metal back 412, 510: electron emitting portion 413: Grid electrode 501: lower layer Printing wiring 502: Printing Pad 503: insulating layer 504: contact hole 505: upper layer printed wiring 506: plated wiring

Claims (3)

[Claims] 1. A device for dispensing ink to a pattern portion of an intaglio plate, and a doctor device for scraping off excess ink, transferring the pattern on the intaglio plate to a blanket cylinder, and transferring the pattern on the blanket cylinder to the blanket cylinder. In an offset printing method using an offset printing apparatus for printing on an object to be printed, in the offset printing apparatus, the ink supply device is provided in front of the doctor device with respect to the intaglio pattern portion, and the ink supply device is provided. An offset printing method, wherein the ink supply and the doctoring are simultaneously performed while the apparatus advances in the doctoring direction. 2. The offset printing method according to claim 1, wherein said ink supply device ejects ink while reciprocating in a direction orthogonal to a doctor ring. 3. An image display device, wherein an element electrode is formed by using the offset printing method according to claim 1.