JPH09187913A - Printer and production of image display device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance printing accuracy by providing a relative position detection means to a blanket cylinder and providing relative position-to-be-detected means to a work surface plate and a plate surface plate and correcting the axial direction of the blanket cylinder on the basis of the relative position detected by both of them. SOLUTION: An ink distributing stand 1, a plate surface plate 2 and a work surface plate 3 are arranged on a main body frame 8 in one row and rack gears 9a, 9b are provided on both sides of this row. Conductive processing parts 17a, 17b being relative position-to-be-detected means are respectively provided on both sides of the direction vertical to the moving direction of the blanket cylinder 11 on an intaglio 5 and a work 6 and static capacity monitor probes 18a, 18b being relative position detection means are provided on both sides of a place where the blanket 15 of the blanket cylinder 11 is mounted so as to come into contact with the conductive processing parts 17a, 17b at a time of the movement of the blanket cylinder 11.

Description

Detailed Description of the Invention

[0001]

The present invention relates to a printing apparatus,
In particular, the present invention relates to a printing device for printing an element substrate of an image display device with high accuracy.

[0002]

2. Description of the Related Art Conventionally, offset printing has been widely used for printing graphics, mainly for printing patterns that are visually perceptible to human eyes.

Further, in recent years, technical development has been made for producing electrodes of recording thermal heads, color filters of liquid crystal display devices, and the like for application to electronic equipment.

FIG. 14 is a perspective view showing a structural example of a conventional flatbed proofing machine type offset printing apparatus.

In this conventional example, as shown in FIG.
An ink roller 1004 and an ink kneading table 1001 for developing 007 and a plate surface plate 1002 for fixing an intaglio plate 1005.
A work surface plate 1003 for fixing a work 1006 as a printing target, a cylindrical blanket cylinder 1011 around which a blanket 1015 is wound, and a blanket cylinder 1011.
Pinion gears 1010a provided on both ends of the
1010b, rack gears 1009a and 1009b provided on the main body frame 1008 so as to mesh with the pinion gears 1010a and 1010b, and a carriage 101 that fixes both ends of the axis of the blanket cylinder 1011.
2a and 1012b, side bearings 1013a and 1013b respectively connected to the carriages 1012a and 1012b for moving the blanket cylinder 1011 on the body frame 1008, and the body frame 10
08 side bearings 1013a, 1013
rails 1014a, 1 for moving b while rotating
014b and the ink mixing stand 100
1, the plate surface plate 1002 and the work surface plate 1003 are arranged in a line on the main body frame 1008, and rack gears 1009a and 1009b are provided on both sides of this line.

In the flatbed proofing machine type offset printing apparatus configured as described above, the carriages 1012a and 1012b are moved by the crank operation of the crank arm (not shown) extending from the lower portion of the main body frame 1008,
The blanket cylinder 1011 rotates and slides on the ink mixing table 1001, the intaglio plate 1005, and the work 1006 in sequence.

The offset printing process in the flatbed proofing machine type offset printing apparatus described above will be described below.

FIG. 15 is a view showing an offset printing process in the flatbed proofing machine type offset printing apparatus shown in FIG.

First, on the ink mixing stand 1001,
The ink 1007 is kneaded by the ink roller 1004 and transferred onto the intaglio plate 1005.

Next, the blanket cylinder 1011 is intaglio 10
05, the ink on the intaglio 1005 is transferred to the blanket 1015 wound on the blanket cylinder 1011. Here, a doctor blade 1016 is provided in front of the moving direction of the blanket cylinder 1011.
The ink other than the ink filled in the concave portion on 005 is scraped off (FIG. 15A).

Thereafter, the blanket cylinder 1011 moves onto the work 1006, and the ink transferred to the blanket 1011 according to the pattern of the intaglio 1005 is transferred to the work 100.
6 (Fig. 15 (b)).

By repeating the above steps (FIGS. 15C and 15D), the printing step is completed.

Here, the ink 10 used in the printing process
In 07, it can be appropriately selected depending on the function of the pattern to be created. That is, an ink mainly made of an organic Au metal called Au resinate paste is used for the electrodes of a recording thermal head or the like, and in the case of a color filter, an ink or an organic dye in which pigments of R, G and B colors are dispersed is used. Ink or the like containing is used.

Conventionally, as a display technology for realizing a flat panel display device, a liquid crystal display device (LCD), a plasma display (PDP), a low speed electron beam fluorescent display tube (V).
There are flat panel display technologies such as FD) and multi-electron source flat CRT.

As an example of the above-mentioned display technique, a flat display device using an electron source will be described.

Conventionally, as an element which can emit electrons with a simple structure, M. I. Elinson, Radio
Eng. Electron Phys. 10,
A surface conduction electron-emitting device disclosed by (1965) and the like is known.

This utilizes a phenomenon in which electron emission occurs when a current is passed through a thin film having a small area formed on a substrate in parallel to the film surface.

As the surface conduction electron-emitting device, one using the SnO ₂ thin film by Erinson et al.
Thin film [G. Dittmer: "Thin S
old Films ", 9, 317 (1972)],
In203 / SnO ₂ thin film [M. Hartw
ell and C.I. G. FIG. Fonstad: "IEEE
Trans. ED Conf. 519 (197
5)], using a carbon thin film [Hisashi Araki et al .: Vacuum,
26, No. 1, p. 22 (1983)].

As a typical device configuration of the above-mentioned surface conduction electron-emitting device, M. The element structure of Hartwell will be described.

FIG. 16 is a diagram showing a structural example of a surface conduction electron-emitting device.

In the device shown in FIG. 16, thin films 402 to 40 for forming electron emission portions are formed on an insulating substrate 401.
4 is formed, and the electron emitting portion 405 is formed on the thin film 404.

Conventionally, in the surface conduction electron-emitting device as shown in FIG. 16, the thin film 4 is previously formed before electron emission.
It is general that the electron-emitting portion 405 is formed by performing an energization process called energization forming on 02 to 404. Here, forming means the thin film 402,
A voltage is applied across both ends of 403 to locally destroy, deform or alter the thin film 404 to form an electron emitting portion 405 in an electrically high resistance state. still,
In the electron emission portion 405, a crack may occur in a part of the thin film 404 and electrons may be emitted from the vicinity of the crack.

The inventors of the present invention have also reported that USP 5,066,
883, technically disclosed a novel surface conduction electron-emitting device in which fine particles for emitting electrons are dispersedly arranged between device electrodes. Compared with the conventional surface conduction electron-emitting device shown in FIG. 16, this electron-emitting device can precisely control the electron-emitting position and can arrange the electron-emitting devices with higher precision.

FIG. 17 is a diagram showing another configuration example of the surface conduction electron-emitting device.

In the device shown in FIG. 17, device electrodes 502 and 503 made of a metal film are formed on an insulating substrate 501.
Are opposed to each other and are arranged at a predetermined interval, and the thin film 5 made of fine particles extends over the device electrodes 502 and 503.
04 is arranged, and further, an electron emitting portion 505 made of conductive fine particles is provided in the thin film 504.

The distance between the device electrodes 502 and 503 is 0.01 to 100 μm, and the sheet resistance of the electron emission portion 505 is 1 × 10 ³ to 1 × 10 ^9.
Ω / □ is appropriate.

When the surface conduction electron-emitting device described above is used as an electron-emitting device, it is necessary to arrange the device in a vacuum container in order to fly an electron beam. An element is placed in a vacuum container, a face plate is provided almost vertically above the element to form an electron emitting device, and a voltage is applied between electrodes to irradiate the phosphor with an electron beam obtained from the electron emitting portion. The phosphor can emit light to be used as a light emitting element or a flat display device.

In the element electrode of the above flat panel display device, an element electrode having a thinner film thickness is desired in consideration of the step coverage with the thin film made of the fine particle electron emitting material.
Further, in order to cope with the large screen of the flat panel display device, it is necessary to introduce a process for a large area substrate. For this reason,
There is a method using an offset printing machine as a method of manufacturing a thin film element electrode which realizes a precise and large area by a simpler method.

[0029]

However, FIG.
There are the following problems in manufacturing the element electrodes of the flat panel display device using the conventional flatbed proofing machine type offset printing device as shown in FIG.

When the blanket cylinder 1011 is moved, the side bearings 1013a and 1013b connected to the carriages 1012a and 1012b fixing both ends of the axis of the blanket cylinder 1011 are moved to the main frame 10.
Since it is performed by moving along the rails 1014a and 1014b provided on 08, the straightness of the blanket cylinder 1011 during printing is affected by the dimensional accuracy of the printing apparatus main body.

Here, in a printing apparatus that requires high precision in printing, in order to improve the dimensional accuracy of the printing apparatus main body, the main body frame 1008 is generally made of casting, but the main body frame made of casting is used. 100
In No. 8, a subsidence occurs partially due to its own weight, and the plate surface plate 1002 or the work surface plate 1003 is liable to be out of alignment and the components of the printing apparatus are out of size.

The above-mentioned deviation in the levelness and dimension causes a drift in the axial direction of the blanket cylinder 1011 at the time of printing, and the printing accompanied by such drift consequently deteriorates the positional accuracy of the print pattern. . Further, the deterioration of the positional accuracy of the print pattern deteriorates the alignment with the extraction wiring and the thin film made of the particulate electron-emitting material when manufacturing the element electrode of the flat panel display device, which causes pixel defects and crosstalk. There is fear.

In the deterioration of the alignment described above,
This has been a particular problem when forming pixels with high precision that cannot be escaped by increasing the design margin.

The present invention has been made in view of the above problems of the conventional technique, and an object of the present invention is to provide a printing apparatus capable of improving the printing accuracy of offset printing.

[0035]

In order to achieve the above object, the present invention provides a work surface plate for fixing a work, a plate surface plate for fixing an intaglio plate, and a work plate and an intaglio plate attached to the work plate. An ink kneading table in which the ink to be kneaded, a work surface plate, a plate surface plate, and a blanket cylinder rotating and moving on the ink mixing table, and wrapped around the blanket cylinder,
In a printing apparatus comprising a blanket for adhering the ink on the ink mixing table onto the work and the platen by the rotational movement of the blanket, the blanket cylinders are provided on both sides of the blanket with the workable platen. And a relative position detection means wound in the axial direction to detect the relative position with the plate surface plate, the work surface plate and the plate surface plate, the relative position when the blanket cylinder moves. The relative position detection means for detecting the relative position to the blanket is provided at a position in contact with the detection means, and the relative position detection means and the relative position detection means detect the relative position based on the relative position. It is characterized by having a drift correction means for correcting the axial direction of the blanket cylinder.

Further, the relative position detecting means is a capacitance monitor probe, and the relative position detected means is a conductive processed portion.

Further, the relative position detecting means is a conductive processed portion, and the relative position detected means is a capacitance monitor probe.

Further, the relative position detecting means is a Hall element, and the relative position detected means is a magnetic processed portion.

Further, the relative position detecting means is a magnetically processed portion, and the relative position detected means is a Hall element.

The relative position detecting means is a convex portion, and the relative position detected means is a concave portion.

Further, the relative position detecting means is a concave portion, and the relative position detected means is a convex portion.

The drift correction means is a side bearing for moving the blanket cylinder.

Also, in the method of manufacturing an image forming apparatus using the printing apparatus, the relative position detecting means detects the relative position on the element substrate forming the image forming apparatus. A detection means is provided, the element substrate is mounted on the work surface plate, and printing is performed on the element substrate by rotating the blanket cylinder on the ink mixing table and the element substrate. And

(Operation) In the present invention configured as described above, when printing is performed by moving the blanket cylinder on the work and the intaglio, the relative position detection wound on both sides of the blanket of the blanket cylinder is detected. The means detects the relative position detection means provided on the work surface plate and the plate surface plate, and the orientation of the blanket cylinder is controlled by the drift correction means based on the detection result to correct the drift in the axial direction of the blanket cylinder. Done.

[0045]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

First, one mode of the substrate manufactured by the printing apparatus of the present invention will be described.

The offset printing by the printing apparatus of the present invention is generally used for graphic printing in which ink is transferred onto paper, but the offset printing is compared with the screen printing used for forming thick film electronic circuits, and the ink transfer film is used. There is a feature that the thickness can be reduced.

Here, in order to carry out high-definition printing,
It is necessary to realize finer printing original plate and to maintain the ink transfer pattern in the printing process. However, the thinner the thickness of the ink to be transferred, the higher the resolution can be. This is because as the aspect ratio of the thickness of the ink to the pattern width is smaller, the thickening of the pattern width due to dripping of ink after transfer and bleeding can be reduced. Therefore, the offset printing capable of reducing the transfer film thickness has the possibility of controlling the pattern thickening for high-definition printing.

FIG. 11 is a diagram showing an example of the configuration of a flat panel display device using a surface conduction electron-emitting device. FIG. 11A is a sectional view showing a face plate, and FIG. 11B is a surface conduction electron-emitting device. FIG.

The face plate in this embodiment is shown in FIG.
As shown in (a), the glass substrate 109, the phosphor 110 and the metal back 1 laminated on the glass substrate 109.
11 is comprised.

On the other hand, the surface conduction electron-emitting device according to this embodiment has a substrate 10 made of an insulator as shown in FIG. 11 (b).
1 and element electrodes 102, 103 for obtaining electrical connection
And a thin film 10 made of a fine particle electron emission material dispersedly arranged.
4 and printed wirings 105 and 106 connected to the device electrodes 102 and 103, respectively. An electron emitting portion 112 is formed in the central portion of the thin film 104, and an opening is formed on the electron emitting portion 112. Device electrode 10 so as to have a part
A grid electrode 113 that is orthogonal to the wiring to which a plurality of 2, 103 are connected is provided.

Here, the electrode interval between the device electrodes 102 and 103 is several μm to several hundred μm, the film thickness is several hundred Å to several thousand Å, and
The film thickness of the thin film 104 is preferably in the range of several tens of to several thousand
It can be set appropriately. Furthermore, the printed wiring 105,
The film thickness of 106 is usually a thickness obtained by firing the printing paste ink, and is in the range of several μm to several tens of μm.

In order to manufacture a flat-panel display device using the surface conduction electron-emitting device substrate and the face plate described above, first, the surface conduction electron-emitting device substrate is placed in a vacuum container and is placed substantially vertically above the device substrate. Install a face plate on.

Next, a voltage is applied between the device electrodes 102 and 103 so that the metal back 111 has a + side potential, and a voltage is applied to form an electron emitting portion 112 in the thin film 104 between the device electrodes 102 and 103.

After that, the phosphor 11 is removed from the electron emitting portion 112.
When 0 is irradiated with electrons, the phosphor 110 emits light, which can be used as a light emitting element or a flat panel display device.

When a plurality of electron-emitting devices are used, a grid electrode 113 having an opening is arranged on the electron-emitting portion 112 so as to be orthogonal to the wiring to which the plurality of device electrodes 102 and 103 are connected. A matrix is formed with 112 as an intersection of the wiring and the grid electrode 113.

Then, the grid electrode 113 and the printed wiring 1
Electrons can be selectively taken out from the electron emitting portion 112 by irradiating the fluorescent material 110 by applying a voltage to the electron emitting portions 112 and 112, and any fluorescent material 110 can emit light to obtain an image.

The manufacturing process of the surface conduction electron-emitting device shown in FIG. 11 will be described below.

FIG. 12 is a diagram for explaining a manufacturing process of the surface conduction electron-emitting device shown in FIG.

First, a resinate paste made of an organic metal is printed and fired on the washed substrate 101 by an offset printing method to form element electrodes 102 and 103 (FIG. 12A).

Next, a conductive paste ink is printed by a screen printing method and baked to print the printed wiring 1.
05 and 106 are formed (FIG. 12B). At this time, the printed wirings 105 and 106 are stacked on the element electrodes 102 and 103 and are electrically connected.

After that, a thin film 104 made of an electron emitting material is formed between the device electrodes 105 and 106 by a reverse etching method (FIG. 12C). The electron-emitting material is formed into a film by coating and baking an organic metal solution, vacuum vapor deposition, sputtering, chemical vapor deposition, dispersion coating and baking of ultrafine particles of an electron-emitting material, and the like.

Here, as the substrate 101, quartz glass, glass having a reduced content of impurities such as Na, soda-lime glass, and SiO2 formed on soda-lime glass by a sputtering method or the like.
Examples thereof include a glass substrate and the like laminated with, and a ceramic such as alumina.

The facing element electrodes 105 and 106 may be made of any material as long as they have conductivity. For example, Ni, Cr, Au and M may be used.
Metals or alloys such as o, W, Pt, Ti, Al, Cu and Pd, and Pd, Ag, Au, RuO2, Pd-Ag
And the like, semiconductor materials such as polysilicon, and transparent conductive pairs such as In203-SnO2.

Further, the thin film 10 including the electron emitting portion 112.
Specific examples of the material forming No. 4 are Pt and R
u, Ag, Au, Ti, In, Cu, Cr, Fe, Z
n, Sn, Ta, W, Pb and other metals, PdO, SnO
2, oxides such as In203, PbO, Sb203, Hf
B2, ZrB2, LaB6, CeB6, YB4, GdB
Boride such as 4, TiC, ZrC, HfC, TaC, S
Carbides such as iC and WC, nitrides such as TiN, ZrN and HfN, semiconductors such as Si and Ge, carbon, AgMg and N
There are iCu, Pb, Sn, etc., and it is composed of a fine particle film. Note that the fine particle film described here is a film in which a plurality of fine particles are aggregated, and its fine structure is not only in a state in which the fine particles are individually dispersed and arranged, but also in a state in which the fine particles are adjacent to each other or overlap each other (also in an island shape). (Including) film.

The manufacturing process of the face plate shown in FIG. 11 will be described below.

FIG. 13 is a diagram for explaining a manufacturing process of the face plate shown in FIG.

First, a phosphor slurry 114 containing a resin such as PVA (polyvinyl alcohol) and a photosensitizing agent for sensitizing the same is applied on a well washed glass substrate 109 in a solid state and dried. (Fig. 13
(A)). Here, in the coating method, methods such as spinner, dipping, spray coating, roll coating, screen printing and offset printing are used.

Next, the coated phosphor slurry 114 is exposed to light by using a photomask (not shown) only on the necessary portions, and then developed to remove unnecessary portions of the phosphor slurry 114 and bake. . As a result, the photosensitive resin is oxidized and burned off, and the patterned phosphor 110 is formed (FIG. 13B).

Next, in the case where three primary color phosphors of red (R), green (G) and blue (B) are required for colorizing the display device, the above-mentioned FIG. 13 (a) (b) is used. The process in (1) is repeated for each color, and patterning is performed so that the phosphors are separately coated on the glass substrate 109.

Next, the phosphor 110 is immersed in water in a solution, and a resin thin film 117 such as clear lacquer is spread on the water surface. After that, the water in the solution is wiped off, the spread resin thin film 117 is spread and arranged on the phosphor 110, and then dried (FIG. 13C). This process is called filming.

Next, the phosphor 11 which has been subjected to filming
A thin metal film of Al or the like is formed on the surface of 0 by a vacuum deposition method to a thickness of several hundred liters to form a metal back 111 (FIG. 13D).

Next, the resin thin film 117 is burnt out and removed from the face plate. At this time, the metal back 11
1 is flattened and placed on the phosphor 110 which is a continuous film without cutting (FIG. 13E).

In the flat display device manufactured in the above process, when the electron-emitting devices and the phosphors are arranged in multiple, the size thereof is determined by the number of pixels required for the image display device and the size of the screen. To be done. For example, if a resolution of 560 lines is intended for a screen length of 40 cm, the pitch is about 720 μm per pixel. Furthermore, in order to color this, it is necessary to divide one picture element into three primary colors of R, G and B. If it is simply divided into three, the pitch is 24
0 μm.

Here, the electron emitting portion 112 (see FIG. 11)
It is desirable that the positions of the phosphors 110 (see FIG. 11) corresponding to and are arranged one to one. In the above-described flat panel display device, the electron emitting portion 112 (see FIG. 11) is the device electrode 102, 1 obtained by the photolithography method.
It is precisely arranged by 03 on the substrate 101 (see FIG. 11). Further, the phosphor 110 (see FIG. 11) corresponding to the electron emitting portion 112 (see FIG. 11) is also precisely formed on the glass substrate 109 (see FIG. 11) by the photolithography method.
(See) is placed above.

In general, the patterning accuracy by the photolithography method is high, and the accuracy of the patterning can be kept within 4 μm within a 40 cm square, although the accuracy varies depending on the specifications of the mask exposure apparatus. Therefore,
The electron emitting portion 112 (see FIG. 11) and the phosphor 110 (see FIG. 1)
The center position can be set within a positional accuracy error of 4 μm or less for each part accuracy. If this positional error is large, for example, if a displacement of 40 μm occurs with respect to the pixel pitch of approximately 240 μm, the electron emitting portion 112 (see FIG. 11) is in a size range of approximately 1/6 of the pixel pitch.
Electrons emitted from the phosphor are irradiated to the adjacent phosphor 110 (see FIG. 11), and crosstalk between fluorescent bright spots occurs.

It should be noted that using the above display device, a length of 40c
An electrophotographic recording device could be constructed by producing an array-shaped light emitting element of m and disposing it on a photosensitive drum. Furthermore, the same effect can be obtained when the array-shaped light emitting element is manufactured in the electrophotographic recording device.

(First Embodiment) FIG. 1 is a perspective view showing an embodiment of a printing apparatus according to the present invention.

In this embodiment, as shown in FIG. 1, an ink roller 4 for spreading an ink 7 and an ink kneading table 1, a platen plate 2 for fixing an intaglio plate 5, and a work plate for fixing a work 6 to be printed. The board 3, the cylindrical blanket cylinder 11 around which the blanket 15 is wound, the pinion gears 10a and 10b provided at both ends of the blanket cylinder 11, and the body frame 08 so as to mesh with the pinion gears 10a and 10b, respectively. Rack gears 9a, 9b provided
And carriages 12a and 12b for fixing both ends of the shaft of the blanket cylinder 11, blanket cylinder correction mechanisms 16a and 16b for adjusting the orientation of the blanket cylinder 11 respectively fixed to the carriages 12a and 12b, and the main body frame 8 , Side bearings 13a and 13b respectively connected to blanket cylinder correction mechanisms 16a and 16b for moving the blanket cylinder 11 and side bearings 13a and 1b provided on the main body frame 1008.
Rails 14a, 14 for moving 3b while rotating
The ink mixing table 1, the plate surface plate 2 and the work surface plate 3 are arranged in a line on the main body frame 8 and rack gears 9a and 9b are provided on both sides of this line. Further, conductive processing parts 17a and 17b as relative position detection means are provided on both sides of the platen plate 2 and the work platen 3 in the direction perpendicular to the moving direction of the blanket cylinder 11, respectively. Blanket 1
Capacitance monitor probes 18a and 18b, which are relative position detection means, are provided on both sides where the blanket cylinder 5 is mounted so as to come into contact with the conductive processed portions 17a and 17b when the blanket cylinder 11 moves.

In the printing apparatus constructed as described above, the carriages 12a, 1 are driven by the crank operation of the crank arm (not shown) extending from the lower portion of the main body frame 8.
2b is moved, and the blanket cylinder 11 is rotationally slid in sequence on the ink mixing stand 1, the intaglio 5 and the work 6.

FIG. 2 is a diagram for explaining the configuration of the capacitance monitor probes 18a and 18b in the printing apparatus shown in FIG.

As shown in FIG. 2, the capacitance monitor probes 18a and 18b have their tips (tip size of 0.1 mm square size) arranged along the circumference of the blanket cylinder 11 at a pitch of 1 mm, and have a conductive processed portion 17a. , 17b are formed so as to face each other. A wiring (not shown) for extracting a signal is connected to each of the capacitance monitor probes 18a and 18b.

FIG. 3 shows the electrostatically processed portion 17 shown in FIG.
It is a figure for demonstrating the structure of a, 17b.

As shown in FIG. 3, the electrostatically processed portion 17a,
Each of 17b has a capacitance monitor probe 18
Capacitance monitor units 19a and 19b, which are detection areas, are provided in the probes in a and 18b,
When the capacitance monitor probes 18a and 18b are in contact with the conductive processed portions 17a and 17b, the closest capacitance monitor units 19a and 19b are detected in the probes inside the capacitance monitor probes 18a and 18b. In addition,
The capacitance monitoring units 19a and 19b are the conductive processing unit 17
It is provided at the end on the side opposite to the side on which the blanket 15 of a, 17b is mounted.

In the conductive processed portions 17a and 17b, the plate surface plate 2 and the work surface plate 3 are formed with a width of 1 mm. For the intaglio plate 5, for example, an electrically non-conductive tape is used, and predetermined portions are formed. Except for this, the intaglio plate 5 is easily manufactured by masking, and the work 6 is easily manufactured by, for example, attaching a tape having a conductive surface.

FIG. 4 is a diagram showing the time variation of the capacitance detected by the capacitance monitor probe shown in FIG.

As shown in FIG. 4, when the capacitance monitor units 19a and 19b are detected by the probes inside the capacitance monitor probes 18a and 18b, respectively, the capacitance becomes large (portion A in the figure), When not detected, the capacitance becomes small (point B in the figure).

The case where printing is performed by the printing apparatus having the above-described structure will be described below.

FIG. 5 is a block diagram showing a mechanism for correcting the axial drift of the blanket cylinder of the printing apparatus shown in FIG.

First, the signals detected by the capacitance monitor probes 18a and 18b, which are the sensor units, are sent to the microcomputer.

Then, in the microcomputer, the amount to be corrected with respect to the orientation of the blanket cylinder 11 is calculated based on the sent signal, and is output to the blanket cylinder correction mechanisms 16a and 16b which are the drive units.

Thereafter, the blanket cylinder correcting mechanism 16a,
At 16b, the blanket cylinder 11 operates by an appropriate amount based on the value output from the microcomputer.

The sequence of operations described above will be described below with reference to FIG.
This will be described in detail with reference to FIG.

The blanket cylinder 11 has rack gears 9a, 9
When rotated by the mechanism of b and the pinion gears 10a and 10b, the electrostatic capacitance monitor probes 18a and 18b sequentially detect the closest electrostatic capacitance monitor units 19a and 19b from the conductive processing units 17a and 17b.

As a result, the signals output from the capacitance monitor probes 18a and 18b with the rotation of the blanket cylinder 15 are as shown in FIG.

The closest capacitance monitor probe 18a,
The operation of selecting 18b can be easily achieved by switching the electrostatic capacity monitor to the adjacent electrostatic monitor probes 18a and 18b after the detection of the minimum value such as the portion B shown in FIG.

Since the capacitance monitor portions 19a and 19b have the positional relationship with the conductive processed portions 17a and 17b as shown in FIG. 3, for example, the traveling direction of the blanket cylinder 11 is 10.
When it is swung to the left by μm, the output from the capacitance monitor probe 18b is reduced by 1% with respect to the output from the capacitance monitor probe 18a.

The displacement of the output is fed back to the blanket cylinder correcting mechanisms 16a and 16b to correct the traveling direction of the blanket cylinder 11.

In the above case, the blanket cylinder correcting mechanism 16
The side bearing 13b is moved so as to be pressed against the printing apparatus main body by b, and the blanket cylinder correction mechanism 16 is moved.
The side bearing 13a moves in a direction away from the printing apparatus main body by a.

This operation is an operation for correcting the drift of the blanket cylinder 11 in the axial direction via the carriages 12a and 12b.

Further, as means for correcting the axial drift of the blanket cylinder 11, means for driving an actuator utilizing electromagnetic force or changing the force for pressing the side bearings by gas pressure between the left and right sides of the main body. is there.

As described above, according to the present invention, the conductive processed portions 17a and 17b and the capacitance monitor probe 18 are provided.
a and 18b detect the drift of the blanket cylinder 11 in the axial direction.
The side bearings 9a and 9b are moved by a and 16b, and the traveling directions of the carriages 12a and 12b are corrected. In this embodiment, the capacitance monitor probe 1
The distance between 8a and 18b and the electroconductive processed portions 17a and 17b was set to 0.1 mm.

An image forming apparatus manufactured by using the above-mentioned printing apparatus will be described below.

FIG. 6 is a top view showing the manufacturing process of the element substrate of the image forming apparatus manufactured by using the printing apparatus of the present invention.

The image forming apparatus shown in FIG. 6 has 3 × 3 electron-emitting devices on a soda-lime glass substrate (not shown).
This is an example in which a total of nine wirings are formed in a matrix, and the lower printed wiring 201 is printed in parallel with the lower printed wiring 201 by firing the printed metal paste in the same step as the lower printed wiring 201. A pad 202, a strip-shaped insulating layer 203 that is orthogonal to the lower-layer printed wiring 201 and is formed by firing a printing glass paste, and an opening provided at the center of the intersection of the printing pad 202 and the insulating layer 203. Contact hole 204 and insulating layer 2
03 is formed by firing the printing metal paste in a strip shape on the printing pad 03, and the printing pad 20 is formed by the contact hole 204.
2, upper layer printed wiring 205 electrically connected to the lower layer, element electrodes 207 and 208 formed by offset printing and firing of resinate paste ink and connected to the lower layer printed wiring 201 and printing pad 202, respectively, and the element electrode 20.
7, 208, and a thin film 209 made of Pd fine particles which is an electron emitting material and is arranged at an electrode interval, and an electron emitting portion 210 which is an electron emitting portion. The device electrodes 207 and 208 are adjacent to each other. The electrode spacing is 30 μm and the electrode width is 200 μm.

The method of manufacturing the element substrate having the above structure will be described below.

First, Au element electrodes 207 and 208 each having a thickness of 1000 Å were patterned by offset printing of resinate paste ink and firing on a substrate made of washed blue plate glass (FIG. 6A).

Next, Ag paste ink was screen-printed and baked to form a lower layer printed wiring 201 and a printing pad 202 having a width of 300 μm and a thickness of 7 μm. At this time, the lower-layer printed wiring 201 and the printed pad 202 are connected to the device electrode 20.
7 and 208 are electrically connected to each other (FIG. 6B).

Next, glass paste ink was screen-printed and baked to form an insulating layer 203 having a width of 500 μm and a thickness of about 20 μm, and a contact hole 204 having an opening size of 100 μm square (FIG. 6C).

Next, Ag paste ink is screen-printed on the insulating layer 203 and baked to have a width of 300 μm and a thickness of 1.
An upper layer printed wiring 205 having a thickness of 0 μm was formed. At this time, the upper print wiring 205 and the print pad 202 are electrically connected to each other through the contact hole 204 (FIG. 6D).

In the above process, the lower layer printed wiring 2
01 and the upper layer printed wiring 203 before printing and firing the device electrode 2
07 and 208 are produced, but the device electrodes 207 and 208
In the above, since the printing and firing step has been performed once, thermal damage did not occur in the same firing of the printed wiring. Also,
The lower layer printed wiring 201 and the printing pad 202 are the same formation layer on the substrate, and the element electrodes 207 and 208 are formed on the substrate without steps in contact with the element electrodes 207 and 208. There was no disconnection in the middle for connecting the upper layer printed wiring 203 and the printing pad 202.

Next, a Cr pattern serving as a mask is formed in a portion where the thin film 209 is not arranged by a Cr film formation by a sputtering method and a photolithography etching method, and then an organic palladium solution (catapaste CC manufactured by Okuno Chemical Industries Co., Ltd.) is formed.
P4230) is applied and baked to obtain a Pd fine particle film. Further, the thin film 20 is formed by reverse etching of the Cr pattern.
9 is patterned on the device electrodes 207 and 208 and the electrode gap portion to form an electron emission portion (FIG. 6E).

Since the element substrate manufactured in the above process was printed with high precision by the printing apparatus of the present invention, the thin film 20 manufactured by the photolithography method.
9 could be formed at predetermined portions of the device electrodes 207 and 208.

The element substrate manufactured by the above process is
350 × 350 electron-emitting devices were arranged in a matrix on a 0 cm square substrate and were arranged in a vacuum envelope together with a face plate having phosphors corresponding to R, G, and B.

In this embodiment, the ink is an Au resinate paste made of organic metal. The ink transferred to the glass substrate is dried at about 70 ℃ and about 580
It can be used as a device electrode made of Au by firing at ℃. The ink transfer thickness on the glass substrate after printing and drying is about 2
It was as small as about μm, and the thickening of the printed electrode pattern width was very small. Furthermore, the thickness of the Au electrode after firing is about 100.
It could be formed as thin as 0Å. Here, as the pattern shape of the device electrodes, the size of the device electrodes where the electron-emitting material is arranged is set to about 30 μm.

After that, the electron-emitting device is energized,
An arbitrary voltage signal of 14V is sequentially applied to the upper printed wiring of the element substrate, and a potential of 0V is sequentially applied to the lower printed wiring to scan,
The other lower layer printed wirings were set to a potential of 7V. And
When an anode voltage of 3 kV was applied to the metal back of the face plate, an arbitrary image could be displayed. At this time, there was no crosstalk between the fluorescent bright spots caused by the positional deviation between the electron-emitting device and the phosphor.

Further, the electroconductive processed portion and the capacitance monitor probe may be provided at positions opposite to each other.

FIG. 7 is a diagram showing a structure in which the electroconductive processed portion and the electrostatic monitor probe shown in FIG. 2 are provided in reverse.

(Second Embodiment) The second embodiment is different from the one shown in the first embodiment in that a Hall element is provided instead of the capacitance monitor probe, and the conductivity is reduced. The magnetic processed portion is provided instead of the magnetic processed portion. Other configurations are the same as those shown in the first embodiment. A magnetic force monitor is provided instead of the capacitance monitor.

The tip diameter and pitch of the Hall element are the same as those of the capacitance monitor probe shown in the first embodiment. In addition, the magnetic processed portion was formed on the plate surface plate and the work surface plate with a width of 1 mm, similarly to the conductive processed portion shown in the first embodiment.

The magnetically processed portion can be easily formed, for example, by applying a magnetized tape. A cable for extracting a signal is connected to the hall element.

FIG. 8 is a diagram showing the change over time in the magnetic force detected in the Hall element.

As shown in FIG. 8, the magnetic force increases when the magnetic force monitor portions are detected in the Hall element (A portion in the figure), and the magnetic force decreases when they are not detected (point B in the figure).

Precision printing was performed using the printing apparatus of this embodiment. At this time, the magnetic force of the magnetically processed portion was 1 kG, and the current passed through the Hall element was set to 10 mA.

As a result, it was possible to correct the drift of the blanket cylinder as in the case of the first embodiment.

The device electrode printed by the method is
A flat display device that achieves good positional accuracy as shown in the first embodiment and that is made by using this substrate is as good as that shown in the first embodiment. Characterized.

Further, the Hall element and the magnetic processed portion may be provided opposite to each other.

(Third Embodiment) FIGS. 9 and 10 show
It is a figure for demonstrating the characteristic in 3rd Embodiment of the printer of this invention.

The third embodiment is different from the one shown in the first embodiment in that a convex portion 20 is provided instead of the capacitance monitor probe, and a concave portion is provided instead of the conductive processed portion. 21 is provided. Other configurations are the same as those shown in the first embodiment. Further, as shown in FIG. 10, the convex portion is provided with a taper portion 22 in the traveling direction of the blanket cylinder.

The concave portion in this embodiment has an opening width of 1.2 mm,
The depth is 1 mm, and the convex portion is formed with an opening width of 1 mm and a height of 1 mm.

The convex portion 20 and the concave portion 21 can be easily formed on the blanket cylinder by ordinary machining, and the intaglio and the work can be easily formed by ordinary etching.

When the convex portion 20 and the concave portion 21 are fitted together, FIG.
As shown in, the tip angle of the convex portion 20 abuts on the side wall of the concave portion 21, and printing is performed while the relative positions of the blanket cylinder, the intaglio plate, and the work are accurately maintained.

Even when the convex portion 20 and the concave portion 21 are disengaged from each other due to the elevation of the blanket, the convex portion 21 is provided with the taper portion 22, and therefore when the blanket cylinder descends again. Easily convex 20
The fitting between the groove 21 and the concave portion 21 is reproduced.

As described above, according to the present embodiment, the fitting and the fitting of the convex portion 20 and the concave portion 21 detect and correct the drift in the blanket axial direction.

The device electrode printed by the method is
A flat display device that achieves good positional accuracy as shown in the first embodiment and that is made by using this substrate is as good as that shown in the first embodiment. Characterized.

Further, the convex portion and the concave portion may be provided opposite to each other.

[0137]

As described above, according to the present invention, the relative position detecting means for detecting the relative position of the work surface plate and the plate surface plate to the blanket is provided on both sides of the blanket of the blanket cylinder, and the work surface plate and the plate are also provided. Since the relative position detection means for detecting the relative position with respect to the blanket is provided on the surface plate, the deviation of the direction in the movement of the blanket cylinder is detected, and the drift in the axial direction of the blanket cylinder is corrected.

As a result, the printing dimension accuracy of offset printing can be improved.

By using the printing apparatus of the present invention for manufacturing an image forming apparatus, an image forming apparatus having good characteristics can be manufactured.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of a printing apparatus of the present invention.

FIG. 2 is a diagram for explaining a configuration of a capacitance monitor probe in the printing apparatus shown in FIG.

FIG. 3 is a diagram for explaining a configuration of an electrostatically processed portion shown in FIG.

FIG. 4 is a diagram showing a change with time of an electrostatic capacitance detected by the electrostatic capacitance monitor probe shown in FIG.

5 is a block diagram showing an axial drift correction mechanism of the blanket cylinder of the printing apparatus shown in FIG. 1. FIG.

FIG. 6 is a top view showing a manufacturing process of an element substrate of an image forming apparatus manufactured by using the printing apparatus of the present invention.

FIG. 7 is a diagram showing a configuration in which the electroconductive processed portion and the electrostatic monitor probe shown in FIG. 2 are provided in reverse.

FIG. 8 is a diagram showing the change over time in the magnetic force detected in the Hall element.

FIG. 9 is a diagram for explaining the characteristics of the printing apparatus according to the third embodiment of the present invention.

FIG. 10 is a diagram for explaining the features of the printing apparatus according to the third embodiment of the present invention.

11A and 11B are views showing a configuration example of a flat panel display device using a surface conduction electron-emitting device, wherein FIG. 11A is a sectional view showing a face plate, and FIG. 11B is a view showing a surface conduction electron emission device. Is.

12 is a diagram for explaining a manufacturing process of the surface conduction electron-emitting device shown in FIG.

FIG. 13 is a diagram for explaining a manufacturing process of the face plate shown in FIG. 11.

FIG. 14 is a perspective view showing a configuration example of a conventional flatbed proofreading machine type offset printing apparatus.

15 is a diagram showing an offset printing process in the flatbed proofing machine type offset printing apparatus shown in FIG.

FIG. 16 is a diagram showing a configuration example of a surface conduction electron-emitting device.

FIG. 17 is a diagram showing another configuration example of the surface conduction electron-emitting device.

[Explanation of symbols]

 1 Ink mixing table 2 Plate surface plate 3 Work surface plate 4 Ink roller 5 Intaglio 6 Work 7 Ink 8 Frame 9a, 9b Rack gear 10a, 10b Pinion gear 11 Blanket cylinder 12a, 12b Carriage 13a, 13b Side bearing 14a, 14b Rail 15 Blanket 16a, 16b Blanket cylinder correction mechanism 17a, 17b Conductive processing part 18a, 18b Capacitance monitor probe 19a, 19b Capacitance monitor part 20a, 20b Convex part 21a, 21b Recessed part 22a, 22b Tapered part 101 Substrate 102, 103, 207, 208 Element electrode 104, 209 Thin film 105, 106 Printed wiring 109 Glass substrate 110 Fluorescent substance 111 Metal back 112 Electron emission part 113 Grid electrode 114 Fluorescent substance slurry 117 Resin thin 201 lower printed wiring 202 printing pad 203 insulating layer 204 contact hole 205 upper printed wiring 210 electron emission sites

Claims (9)

[Claims] 1. A work surface plate for fixing a work, a plate surface plate for fixing an intaglio plate, an ink kneading table for kneading ink to be deposited on the work plate and the intaglio plate, the work surface plate, A blanket cylinder that rotates and moves on a plate surface plate and an ink kneading table, and is wound around the blanket cylinder, and the ink on the ink mixing table is attached to the work and the plate surface plate by the rotation and movement of the blanket. In a printing device comprising a blanket, the blanket cylinder has relative position detection means axially wound on both sides of the blanket to detect a relative position between the work surface plate and the plate surface plate. The workpiece surface plate and the plate surface plate are positioned relative to the blanket at a position in contact with the relative position detection means when the blanket cylinder moves. A drift correction for correcting the axial direction of the blanket cylinder based on the relative position detected by the relative position detection means and the relative position detected means. A printing apparatus having means. 2. The printing apparatus according to claim 1, wherein the relative position detection unit is a capacitance monitor probe, and the relative position detection unit is a conductive processing unit. apparatus. 3. The printing apparatus according to claim 1, wherein the relative position detection unit is a conductive processing unit, and the relative position detection unit is a capacitance monitor probe. apparatus. 4. The printing apparatus according to claim 1, wherein the relative position detection unit is a Hall element, and the relative position detection target unit is a magnetic processing unit. 5. The printing apparatus according to claim 1, wherein the relative position detection unit is a magnetic processing unit, and the relative position detection unit is a Hall element. 6. The printing apparatus according to claim 1, wherein the relative position detecting means is a convex portion, and the relative position detected means is a concave portion. 7. The printing apparatus according to claim 1, wherein the relative position detecting means is a concave portion, and the relative position detected means is a convex portion. 8. The printing apparatus according to claim 1, wherein the drift correction unit is a side bearing that moves the blanket cylinder. 9. A method of manufacturing an image forming apparatus using the printing apparatus according to claim 1, wherein the relative position detecting means on the element substrate forming the image forming apparatus is used. Detecting means detected by the relative position detecting means are provided at opposing positions, the element substrate is mounted on the work surface plate, and the blanket cylinder is rotationally moved on the ink kneading stand and the element substrate. A method for manufacturing an image forming apparatus, wherein printing is performed on the element substrate according to the above method.