JP2000094238A - Holding device and method for electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lead wire-holding device used for electronic parts for positively guiding the lead wire of the electronic parts having various curves and inserting in the lead wire escape hole of a working jig. SOLUTION: This holding device for electronic parts is formed of two components, a can and a base. A driving source 11 couples, with a link, a jig 3 having a can part inserting hole for electronic parts 1 having a lead wire 2 on the base part, guide claws 4A, 4B for guiding the lead wire 2 of the electronic parts 1 inserted in the inserting hole, and holders 5A, 5B having the guide claws 4A, 4B to a linearly moving connecting plate. Where, a slider mounted with holders 5A, 5B 8 is connected to an elevating device.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a holding device for holding an electronic component having a lead wire at the time of processing, and a holding method therefor.

[0002]

2. Description of the Related Art A conventional lead wire guiding device will be described with reference to the drawings. FIG. 4 shows a conventional lead wire guiding device. In FIG. 4, 1 is an electronic component, 2 is a lead wire of the electronic component, 3 is a jig having a can part insertion hole of the electronic component,
4A and 4B are holding claws, 5A and 5B are lead wire guiding claws, 6
A and 6B are links, 7A and 7B are springs, 8A and 8B are rollers, 9A and 9B are levers, 10A and 10B are gears,
11 is a sector gear, 12 is a cam follower, 13 is a cam, 1
4 is a spring, 15 is a processing jig, and 16 is a drive source.

[0003] The operation of the electronic component guide device configured as described above will be described below.

A cam 13 moves by a driving source 16 to give a swinging motion to a sector gear 11 via a cam follower 12 and, at the same time, a rotary motion to gears 10A and 10B. By this movement, the rollers 8A, 8B via the levers 9A, 9B
However, when the links 6A and 6B hit the jig 3 and rotate, the pressing claws 4A and 4B press the base portion of the electronic component 1 and the lead wire guiding claws 5A and 5B hold the lead wire 2 of the electronic component 1. Thereafter, when the processing jig 15 is lowered by an elevating device (not shown) and enters the lead wire 2 of the electronic component 1 by 1 mm, the lead wire guiding claws 5A and 5B and the pressing claws 4A,
4B retracts outside the interference area of the processing jig 15, and a series of operations is completed.

[0005]

However, in the above-described conventional configuration, the lead wire 2 of the electronic component 1 is connected to the processing jig 14.
Must be evacuated at a point of 1 mm, and the lead wire 2 of the electronic component 1 cannot be completely guided because the state of the lead wire 2 is various. Further, the lead wire 2 is processed while being in contact with the inner wall of the processing jig by springback of the lead wire 2 in the processing jig. As a result, the lead wire 2 may be broken or deformed. Such a phenomenon has a problem that the occurrence of defective products and a decrease in the machine operation rate due to an increase in the number of times the machine is stopped lowers the productivity.

For this purpose, there is a problem how to guide the lead wire 2 of the electronic component 1 to a fixed posture and insert it into a processing jig.

The present invention solves such a conventional problem, and provides an electronic component holding apparatus and method for guiding a lead wire of an electronic component, which prevents a decrease in machine operation rate and improves productivity. The purpose is to:

[0008]

According to a first aspect of the present invention, there is provided a jig A for holding a main body of an electronic component having at least one lead wire, and a jig A for holding the lead wire inside. Jig B with lead wire escape hole
And a guide claw for guiding the lead wire to the escape hole,
A groove A sufficiently larger than the diameter of the lead wire is provided at the tip of the guide claw, and a second groove B slightly larger than the diameter of the lead wire and smaller than the groove A is provided inside the groove A.

A second means of the present invention comprises a jig A for holding a main body of an electronic component having at least one lead wire;
A jig B provided with a lead wire escape hole for inserting the lead wire therein, a means for driving the jig B back and forth in the direction of the jig A, and a guide claw for guiding the lead wire to the escape hole Means for driving the guide claw back and forth in the lead wire direction, and means for driving the guide claw back and forth in the jig A direction. A sufficiently large groove A is provided, and a second groove B slightly larger than the diameter of the lead wire and smaller than the groove A is provided inside the groove A.

A third means of the present invention comprises a jig A for holding a main body of an electronic component having at least one lead wire;
A jig B having a lead wire escape hole for inserting the lead wire therein, a guide claw for guiding the lead wire to the escape hole, a holder equipped with the guide claw, and a link connected to the holder. A slider for raising and lowering the holder, a groove A sufficiently larger than the diameter of the lead wire at the tip of the guide claw, and a groove A slightly larger than the diameter of the lead wire and smaller than the groove A inside the groove A. In this case, two grooves B are provided.

According to a fourth aspect of the present invention, in the first to third aspects, the length of the groove B is longer than at least the distance between the lead wires.

According to a fifth aspect of the present invention, in the first to fourth aspects, the length of the groove A is longer than at least the distance between the lead wires.

According to the method of the present invention, the jig A
And moving the guide claw to the leading end of the lead wire to insert the lead wire into the groove A, moving the jig B in the direction of the jig A, inserting the lead wire into the groove B, and guiding Moving the claw in the direction of the jig A, inserting the lead wire into the lead escape hole of the jig B, and connecting the guide claw with the lead wire before holding the electronic component with the jig A and the jig B. It has a step of moving in the opposite direction.

[0014]

According to a first aspect of the present invention, a groove A having a diameter sufficiently larger than the diameter of a lead wire is formed at the tip of the guide claw.
And the second groove B slightly larger than the diameter of the lead wire is provided inside the groove A, so that the lead wire can be easily inserted into the groove A, and the lead wire can be smoothly inserted into the groove B having a width slightly larger than the lead wire. Since the lead wire can be moved, the lead wire can be securely held, and can be reliably inserted into the lead wire escape hole of the jig B.

According to the second means of the present invention, the first means includes means for driving the guide claw back and forth in the lead wire direction, and moving the guide claw back and forth in the jig A direction. Since the driving means is added, the lead wire can be held in the groove A and the groove B when the lead wire is inserted into the lead wire escape hole of the jig B, and the lead wire can be more securely held in the jig B. Can be inserted into the lead wire escape hole.

According to the third aspect of the present invention, since the guide claws can be driven in synchronization with the movement of the jig B by the link, the holder, and the slider, the lead wire can be more reliably connected to the jig B. Can be inserted into the lead wire escape hole.

According to the fourth aspect of the present invention, since the length of the groove B is longer than at least the distance between the lead wires, the lead wire can be reliably inserted into the groove B and held.

According to the fifth aspect of the present invention, since the length of the groove A is longer than at least the distance between the lead wires, it is possible to easily insert the lead wire into the groove A.

According to the method of the present invention, the step of holding the main body of the electronic component with the jig A, the step of moving the guide claw to the tip of the lead wire and inserting the lead wire into the groove A, and the step of fixing the jig B Moving the guide claw toward the jig A, inserting the lead wire into the groove B, and moving the guide claw toward the jig A; inserting the lead wire into the lead wire escape hole of the jig B; Before the electronic component is held by the jig B and the jig B, the guide claw is moved in the direction opposite to the lead wire, so that the lead wire can be more securely inserted into the lead wire escape hole of the jig B.

(Embodiment) An embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, reference numeral 1 denotes an electronic component, reference numeral 2 denotes a lead wire of the electronic component, and reference numeral 3 denotes a jig A having a can insertion hole into which a can portion of the electronic component 1 is inserted. 4A and 4B are guide claws for guiding the lead wire 2 of the electronic component 1. 5A and 5B are holders to which guide claws 4A and 4B are respectively attached. The holders 5A and 5B are attached to the guide 6. Reference numeral 7 denotes a coil spring, and holders 5A and 5A are provided.
B is hooked. 8 is a sledder, guide 6
Is attached. 9 is a link plate and link 10
A and 10B are connected to holders 5A and 5B. A driving source 11 opens and closes the holders 5A and 5B. Reference numeral 12 denotes a processing jig for a jig B having a lead wire escape hole, which is a component of a processing apparatus (not shown), and performs an operation of pressing the electronic component 1 with the jig 3 and the processing jig 12. The slider 8 is connected to a processing device (not shown).

The operation of the electronic component holding device configured as described above will be described below. First, the holders 5A and 5B are guided by the guide 6 by the drive source 11 to perform a direct connection motion. At this time, the guide claws 4A and 4B approach each other, and the guide claws 4B sink under the guide claws 4A, and the lead wires 2 of the electronic component 1 are guided into the grooves of the guide claws 4A. At this time, when the processing device (not shown) is lowered at the same time, the guide claws 4A and 4B are lowered via the slider 8 while the lead wire 2 of the electronic component 1 is guided into the groove of the guide claw 4A. Then, the operation of securely inserting the lead wire 2 of the electronic component 1 into the lead wire escape hole of the processing jig 12 is completed.

FIG. 2 is a top view of FIG. The lead wire 2 is guided by the guide claws 4A and 4B into the grooves of the guide claws 4A. The entrance of the groove of the guide claw 4A is sufficiently larger than the outer diameter of the lead wire 2, and a second groove B having a size slightly larger than the outer diameter of the lead wire 2 is provided at the back of the groove A. Line 2
Is securely held in the groove of the guide claw 4A.

FIG. 3 is a view showing a lead wire holding operation process from the start of processing in the processing step of the electronic component 1 to immediately before the processing in the embodiment of the present invention. In this figure,
1 are given the same reference numerals. (A) ~
(E) shows the order of the lead wire holding operation process. Step (a) is a state in which the electronic component 1 has been inserted into the jig 3 and processing has started. At this time, the guide claws 4A and 4B have not yet guided the lead wire 2 of the electronic component 1. Step (b) is a process in which the processing jig 12 is lowered from the state of (a), and at the same time, the guide claws 4A and 4B are approaching each other while being lowered. In step (c), the guide claws 3A and 3B have completely guided the lead wire 2 of the electronic component 1, and the lead wire 2 has not yet entered the lead wire escape hole of the processing jig 12. Step (d) is a state in which the lead wire 2 of the electronic component 1 enters the lead wire escape hole of the processing jig 12 while maintaining the state where the lead 2 of the electronic component 1 is guided by the guide claws 4A and 4B. e), before the guide claws 4A and 4B process the electronic component 1 with the processing jig 12 and the jig 3, release the guide of the lead wire 2 of the electronic component 1 and retreat outside the interference range of the processing jig 12. It has been done.

Through the series of operations described above, the lead wire 2 of the electronic component 1 is completely inserted into the lead wire escape hole of the processing jig 12 completely.

[0026]

As is apparent from the above description, according to the electronic component lead wire guiding apparatus and holding method of the present invention, even in the case of electronic components having various bent leads, the lead wires of the processing jig can be reliably released. The lead wire of the electronic component can be inserted into the hole, thereby preventing a decrease in the machine operation rate and improving the productivity.

[Brief description of the drawings]

FIG. 1 is a front view showing a configuration of a lead wire holding device according to an embodiment of the present invention.

FIG. 2 is a top view of the lead wire holding device shown in FIG. 1;

FIG. 3 is a diagram showing an operation process of the lead wire holding device from the start of processing of the electronic component to immediately before the processing in the embodiment of the present invention.

FIG. 4 is a front view of a conventional lead wire holding device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Electronic component 2 ... Lead wire of electronic component 3 ... Jig 4A, 4B ... Holder 8 ... Slider 10A, 10B ... Link 11 ... Drive source 12 ... Processing jig

Claims (6)

[Claims] 1. A jig A for holding a main body of an electronic component having at least one lead wire, a jig B having a lead wire escape hole for inserting the lead wire therein, and a jig B for holding the lead wire. A guide claw for guiding to the escape hole, a groove A sufficiently larger than the diameter of the lead wire provided at the tip of the guide claw, and a second groove slightly larger than the diameter of the lead wire and smaller than the groove A inside the groove A; The electronic component holding device provided with the groove B. 2. A jig A for holding a main body of an electronic component having at least one lead wire, a jig B provided with a lead wire escape hole for inserting the lead wire therein, and a jig B. A means for driving the jig A back and forth, a guide claw for guiding the lead wire to the escape hole, a means for driving the guide claw back and forth in the lead wire direction, and a jig A means for driving back and forth in the A direction is provided, a groove A sufficiently larger than the diameter of the lead wire is provided at the tip of the guide claw, and the inside of the groove A is slightly larger than the diameter of the lead wire,
An electronic component holding device provided with a second groove B smaller than the groove A. 3. A jig A for holding a main body of an electronic component having at least one lead wire, a jig B having a lead wire escape hole for inserting the lead wire therein, and a jig B for holding the lead wire. A guide claw leading to the escape hole, a holder equipped with the guide claw, a link connected to the holder,
A slider for raising and lowering the holder is provided, a groove A sufficiently larger than the diameter of the lead wire is provided at the tip of the guide claw, and the inside of the groove A is slightly larger than the diameter of the lead wire,
An electronic component holding device provided with a second groove B smaller than the groove A. 4. The electronic component holding device according to claim 1, wherein the length of the groove B is longer than at least the distance between the lead wires. 5. The electronic component holding device according to claim 1, wherein the length of the groove A is longer than at least the distance between the lead wires. 6. A step of holding a main body of an electronic component by a jig A, a step of moving a guide claw to a tip of a lead wire and inserting a lead wire into a groove A, and a step of moving a jig B in the direction of the jig A. Moving and inserting the lead wire into the groove B and moving the guide claw in the direction of the jig A; inserting the lead wire into the lead wire escape hole of the jig B; A method for holding an electronic component, comprising: moving a guide claw in a direction opposite to a lead wire before holding the electronic component.