JP2000091387A - Equipment and method for thermocompression bonding - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an equipment and a method for thermocompression bonding which can shorten tact time by making an efficient heating control. SOLUTION: A method for thermocompression bonding having an electronic component is pressed against a work to be subjected to thermocompression bonding, while being heated by a thermocompression bonding head constituted of a heater 4 and a thermocouple 5 for detecting the heating temperature of the heater 4. The heater 4 is controlled by a temperature control section 22, based on the temperature detection result by the thermocouple 5. When a fixed contact 6 and a movable contact 7 for connecting and disconnecting a circuit for electrically connecting the temperature control section 22 to the thermocouple 5 and the heater 4 are in a disconnected state, the thermocouple 4 holds the temperature value detected, immediately before it is disconnected from the temperature control section 22 and inputs the value to the temperature control section 22. Thereby, the temperature control can be conducted continuously without interruption. Thus, heating control can be conducted efficiently without having to discontinue temperature control.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a thermocompression bonding apparatus and a thermocompression bonding method for thermocompression bonding an electronic component to a work.

[0002]

2. Description of the Related Art As a method for mounting an electronic component on a work, a method using thermocompression bonding is known. In this method, an electronic component is joined to a workpiece by soldering, a thermosetting adhesive, or the like by pressing the electronic component against the workpiece while heating the component. In this thermocompression bonding process, it is necessary to control the heating temperature. Therefore, the thermocompression bonding head that heats and presses the electronic components has a heater as a heating means and a temperature such as a thermocouple for detecting the heating temperature. Detection means is provided.

[0003]

By the way, as a type of thermocompression bonding apparatus, there is a type having a rotary head. In order to speed up the operation of the thermocompression bonding device and improve the efficiency, this rotary head mounts a plurality of thermocompression heads on a rotary table, and sequentially rotates the thermocompression bonding device while rotating the index by the plurality of thermocompression heads. The part is thermocompression-bonded. However, this rotary head system has a problem specific to electric wiring for power supply and control to a movable portion that performs a rotating operation.

That is, since the thermocompression bonding head is sequentially moved by the index rotation operation, the fixed wiring is used when electric wiring for connecting a heater, a thermocouple or the like provided in the thermocompression head to another fixed portion is performed. Can not be wiring. Therefore, only when the thermocompression bonding head is at the position where the thermocompression bonding operation is performed, a connecting means for electrically connecting the heater or the thermocouple to the fixed portion is provided.

However, in this method, the heater is connected to the power supply only when the thermocompression bonding head is at the thermocompression bonding position.
Also, since the thermocouple will be connected to the temperature controller,
During the rotation of the thermocompression head, the heating control is temporarily interrupted, and each time the thermocompression head moves to the thermocompression position and is newly connected, the interrupted temperature control is newly started.
As a result, a predetermined time is required until the heating temperature of the thermocompression bonding head is controlled to stabilize the actual temperature, and there is a problem that the tact time required for thermocompression bonding is increased.

Accordingly, an object of the present invention is to provide a thermocompression bonding apparatus and a thermocompression bonding method capable of efficiently performing heating control and reducing tact time.

[0007]

According to a first aspect of the present invention, there is provided a thermocompression bonding apparatus for thermocompression bonding an electronic component to a workpiece.
A heating unit provided in the thermocompression bonding head for heating the electronic component; a temperature detection unit for detecting a heating temperature of the heating unit; and a temperature control unit for controlling the heating unit based on a detection result of the temperature detection unit. An interrupting means provided in a circuit for electrically connecting the temperature control section, the heating means and the temperature detecting means, for interrupting these circuits, and the temperature detecting means when the interrupting means is in an interrupted state. And a detection value holding input means for holding a temperature detection value immediately before disconnection from the temperature control unit and inputting the detected temperature value to the temperature control unit.

According to a second aspect of the present invention, there is provided a thermocompression bonding method in which a thermocompression head having a heating means and a temperature detection means for detecting a heating temperature of the heating means presses an electronic component against a work while heating the electronic component. A thermocompression bonding method, wherein the temperature control unit controls the heating unit based on a temperature detection result of the temperature detection unit, and electrically connects the temperature control unit to the temperature detection unit and the heating unit. When the interrupting means for interrupting the circuit to be interrupted is in the interrupted state, the temperature detection means holds the temperature detection value immediately before disconnection from the temperature control unit and inputs the temperature detection value to the temperature control means to perform temperature control. Continued without interruption.

According to the present invention, when the temperature detecting means provided in the thermocompression bonding head is in an electrically disconnected state, the temperature detecting means is connected immediately before disconnection from the temperature control unit. By holding the detected temperature value and inputting it to the temperature control unit, efficient heating control can be performed without interrupting the temperature control.

[0010]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a side view of a thermocompression bonding apparatus according to an embodiment of the present invention, FIG. 2 is a block diagram showing a configuration of a control system of the thermocompression bonding apparatus, and FIG. FIG. 4 is a graph showing the detected temperature of the thermocompression bonding apparatus.

First, the configuration of the thermocompression bonding apparatus will be described with reference to FIG. In FIG. 1, the one-turn table 1 includes a rotation drive unit 1A. By driving the rotation drive unit 1A, the turntable 1 performs an index rotation operation. A plurality of thermocompression bonding heads 2 are provided on the outer edge of the turntable 1.
Are mounted symmetrically with respect to the rotation axis. At the lower end of the thermocompression head 2, a thermocompression tool 3 is mounted.
The thermocompression bonding head 2 is provided with elevating means for moving the thermocompression bonding tool 3 up and down. The thermocompression bonding tool 3 includes a heater 4 as a heating unit and a thermocouple 5 as a temperature detecting unit.
The heater 4 and the thermocouple 5 are respectively connected to terminals 6a and 6b of a fixed contact 6 fixed to the lower surface of the turntable 1 by electric wiring.

Below the edge on one side of the turntable 1, a supply section 10 for electronic components is provided. The supply unit 10 includes a tray 12 provided on an XY table 11, and a large number of electronic components 13 are stored in the tray 12. The tray 12 is driven by driving the XY table 11.
The electronic component 13 in the inside moves in the horizontal direction and the thermocompression bonding tool 3
The electronic component 13 located immediately below the thermocompression bonding head 2 is picked up by the thermocompression bonding tool 3 by driving the elevating means of the thermocompression bonding head 2. When the rotary table 1 is rotated by the rotary drive unit, the thermocompression bonding head 2 picking up the electronic component 13 rotates and moves to the opposite edge along with the rotation of the rotary table 1.

Below the other edge of the turntable 1,
A work positioning portion 14 is provided. The positioning unit 14 has an XY table 15 and the XY table 1
A work 16 is placed on 5. The electronic component 13 is thermocompression-bonded to the work 16 by lowering the thermocompression bonding tool 3 holding the electronic component 13 with respect to the work 16 and heating and pressing the tool according to a predetermined heating pattern.

When the fixed contact 6 of the rotary table 1 is located on the positioning portion 14 side, the fixed contact 6 is located above the movable contact 7, and the movable contact 7 is raised by the cylinder 8 to move the movable contact 7. The terminals 7a and 7b of the contact 7 come into contact with the terminals 6a and 6b of the fixed contact 6. This allows
The heater 4 and the thermocouple 5 are electrically connected to the control means 9. That is, the fixed contact 6, the movable contact 7, and the cylinder 8 constitute an intermittent unit.

Next, the control means 9 will be described with reference to FIG. The control unit 9 has a function as a temperature control unit for controlling the temperature of the thermocompression bonding tool 3, a rotation driving unit 3 of the rotary table 1, a raising / lowering operation of the thermocompression bonding head 2, and an X of the supply unit 10.
It has a function as a control unit that controls the operations of the Y table 11, the XY table 15 of the positioning unit 14, and the cylinder 8 that moves the movable contact 7 up and down. In FIG. 2, A
The / D converter 20 A / D converts a temperature signal sent from the thermocouple 5 via the fixed contact 6 and the movable contact 7. A /
The D-converted temperature data is input to the A side of the changeover switch 21, transmitted to the control unit 24, and further stored in the storage unit 23. The stored temperature data is input to the B side of the changeover switch 21.

The changeover switch 21 switches the temperature data input to the temperature control unit 22 according to a command from the control unit 24. In other words, either the temperature data directly input from the thermocouple 5 or the temperature data stored in the storage unit 23 can be switched and input to the temperature control unit 22. That is, the control section 24 and the changeover switch 1 constitute detection value holding input means. The temperature control unit 22 includes the control unit 2
The electric power controlled on the basis of the command temperature given from the controller 4 and the detected temperature data is supplied to the heater 4.

This thermocompression bonding apparatus is configured as described above, and the operation will be described below with reference to the drawings. First, in FIG. 1, the thermocompression bonding head 2 that has picked up the electronic component 13 from the supply unit 10 moves onto the work 16 by the index rotation operation of the turntable 1. Next, the movable contact 7 is raised by driving the cylinder 8, and the terminals 6a,
6b is brought into contact with the terminals 7a and 7b, respectively, and the heater 4 and the thermocouple 5 are conducted to the temperature control unit 22. This allows
The heating of the thermocompression bonding tool 3 and the temperature control by the temperature control unit 22 are enabled. Thereafter, the thermocompression bonding tool 3 is lowered to press the held electronic component 13 against the work 16 and to heat the electronic component 13 according to a predetermined heating pattern.

After a lapse of a predetermined time, the thermocompression bonding tool 3 is raised, and the thermocompression bonding of the electronic component 13 is completed. Thereafter, the thermocompression bonding head 2 moves together with the indexing rotation operation of the turntable 1. At this time, the process of changing the connection of the thermocouple 5 will be described with reference to the flow of FIG. First, a temperature detection value immediately before the thermocouple 5 is disconnected from the temperature control unit 22 is read by the thermocouple 5 and stored in the storage unit 23 via the control unit 24 (ST1). Next, the changeover switch 21 is switched to the B side according to a command from the control unit 24 (ST2).
Accordingly, the temperature of the thermocompression bonding tool 3 stored in the storage unit 23 is input to the temperature control unit 22 and is maintained in this state.

Thereafter, the cylinder 8 is lowered to move the thermocompression bonding head 2 to separate the fixed contact 6 from the movable contact 7 (S
T3). This disconnects the heater 4 and the thermocouple 5 from the temperature control unit 22, but the temperature of the thermocompression bonding tool 3 is continuously input to the temperature control unit 22.
The temperature control operation by the temperature control unit 22 is continued without interruption.

Thereafter, the rotary table 1 is again rotated by the index to move the thermocompression bonding head 2 (ST4). When the thermocompression bonding head 2 stops at the thermocompression bonding position, the movable contact 7 is raised and the fixed contact 6 is moved. (ST5). From this timing, the disconnection determination timer of the control unit 24 starts counting time (ST6), and switches the changeover switch to the A side in response to a command from the control unit 24 (ST7).
As a result, the temperature detected by the thermocouple 5 is input to the temperature control unit 22, and the heating of the thermocompression bonding tool 3 is controlled.

FIG. 4 shows the temperature T of the thermocompression bonding tool 3 during this time.
This shows the change of The timing t1 is the same as the above S
At the timing T3, the fixed contact 6 and the movable contact 7 are separated from each other. After the timing 1, the power supply to the heater 4 is stopped, and the temperature gradually decreases from the set temperature [T].
Then, when the fixed contact 6 and the movable contact 7 come into contact again at the timing t2, the actually detected temperature of the thermocouple 5 is changed to the temperature control unit 2.
2 and the above-mentioned temperature drop is detected. Then, the temperature control unit 22 controls the power supply to the heater 4 so as to recover the temperature decrease, whereby the temperature of the thermocompression bonding tool 3 returns to the set temperature [T].

At this time, it is detected whether or not the contact between the fixed contact 6 and the movable contact 7 has been detected during the period from the start of the timing of the disconnection determination timer to the elapse of the predetermined time T1. That is, when the contacts are separated at the timing t4 and the contact of the contacts is not detected even at the timing t5 after the elapse of the predetermined time T1, the disconnection determination processing is performed (ST8), and an alarm to that effect is issued.

As described above, even when the thermocouple 5 cannot be always connected to the temperature control unit 22 because the thermocompression bonding head 2 moves, the detected temperature value immediately before the disconnection is used as a dummy signal. By inputting, the temperature control operation can be maintained without interruption every time the thermocompression bonding head 2 moves. Therefore, immediately after the reconnection, the temperature control function is activated and the temperature can be quickly returned to the set temperature, and the takt time required for heating can be reduced.

[0024]

According to the present invention, when the temperature detecting means provided in the thermocompression bonding head is in an electrically disconnected state,
By inputting the temperature detection value immediately before the disconnection as the dummy signal, the temperature control operation can be maintained without interruption every time the thermocompression head moves. Therefore, immediately after the reconnection, the temperature control function is activated, the temperature can be quickly returned to the set temperature, and the effective heating control can be performed to shorten the tact time.

[Brief description of the drawings]

FIG. 1 is a side view of a thermocompression bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a block diagram showing a configuration of a control system of the thermocompression bonding apparatus according to one embodiment of the present invention.

FIG. 3 is a flowchart of a thermocompression bonding head moving process of the thermocompression bonding apparatus according to the embodiment of the present invention;

FIG. 4 is a graph showing a detected temperature of the thermocompression bonding apparatus according to the embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 1 rotary table 2 thermocompression bonding head 4 heater 5 thermocouple 6 fixed contact 7 movable contact 8 cylinder 13 electronic component 22 temperature controller

Claims (2)

[Claims] 1. A thermocompression bonding head for thermocompression bonding an electronic component to a work, heating means provided on the thermocompression bonding head for heating the electronic component, temperature detection means for detecting a heating temperature of the heating means, A temperature control unit that controls the heating unit based on the detection result of the temperature detection unit; and a circuit that electrically connects the temperature control unit, the heating unit, and the temperature detection unit, and disconnects these circuits. Interrupting means, and when the interrupting means is in an interrupted state, a detection value holding input means for holding the temperature detection value immediately before the temperature detecting means is disconnected from the temperature control section and inputting the detected temperature value to the temperature control section. A thermocompression bonding apparatus comprising: 2. A thermocompression bonding method in which a thermocompression bonding head including a heating means and a temperature detection means for detecting a heating temperature of the heating means presses an electronic component against a work while heating the electronic component to perform thermocompression bonding. An intermittent unit that controls the heating unit by a temperature control unit based on a temperature detection result of the temperature detection unit and intermittently interrupts a circuit that electrically connects the temperature control unit to the temperature detection unit and the heating unit. When in the disconnection state, the temperature control unit keeps the temperature detection value immediately before disconnection from the temperature control unit and inputs the temperature detection value to the temperature control unit, thereby performing the temperature control without interruption. A thermocompression bonding method, characterized in that: