JP2000091179A - Method for constructing semiconductor wafer production process system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize a method for constructing a semiconductor wafer production process system capable of lessening a conveying distance of a wafer and taking partial charge of works appropriately in each operator. SOLUTION: This embodiment comprises a work unit dividing process of dividing a production process of a semiconductor wafer (step 101); a work module preparing process of collecting work units using the same facilities in combination (step 102); a work module group preparing process of allocating facilities in combination of a plurality of work modules from use frequencies of each facility in the work module, and setting this combination as a work module group (steps 103, 104); a work module group proximity evaluating process of evaluating proximity from frequencies of the number of times of transfer between work module groups in the production process (step 105); and a layout process of laying out the work module group near the work module group having high proximity centering the work module group having high use frequencies (step 106).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for constructing a production processing system, and more particularly to a semiconductor wafer production processing system.

[0002]

2. Description of the Related Art In a semiconductor wafer production process,
A so-called line production system that lays out processing equipment in line with the production process flow itself is a method that can minimize the wafer transfer distance, reduce the number of steps, and minimize the number of in-process products in the process. is there. But,
Since there is a limit on the number of apparatuses, it is difficult to perform a complete process flow layout, and a job shop type layout in which a part of the process flow is inevitably employed is employed. Since the layout of the job shop type usually has a format in which the same processing apparatus is laid out collectively, every time one processing is completed, it is necessary to transport a wafer to be processed between the processing apparatuses. There has been a problem that the transfer distance and the number of transfer steps are increased throughout the entire process. In addition, since workers always operate the same type of equipment, the status of the preceding and following processes is not known, the number of processes is increased, and the division of quality and responsibility is unclear as a result of the division of work between processing and measurement. There is also the problem of becoming.

[0003]

As described above, in the conventional method of constructing a semiconductor wafer production processing system, a job shop type production process and one and the same apparatus are required.
Due to the layout of the devices gathered in several places, it is necessary to transport the wafers between the processing devices, and there is a problem that the transport distance and the number of transport steps are increased. Also,
As an adverse effect of the operator always operating the same type of device, there is also a problem that the number of processes is increased and the responsibilities of quality are unclear.

The present invention solves this problem and makes it possible to reduce the wafer transfer distance and the transfer process during the production process by a relatively simple method, and to allow each worker to appropriately share work. It is an object of the present invention to realize a method of constructing a semiconductor wafer production processing system including a device layout that can be performed.

[0005]

In order to achieve the above object, the present invention relates to a method for constructing a semiconductor wafer production processing system in which a plurality of facilities used for a semiconductor wafer production process are arranged. A work unit dividing step of dividing the production process into work units, which are a series of work units, a work module creating step of combining the work units using the same equipment into a work module, and a processing module of each equipment in the work module. Each facility is allocated to a combination of a plurality of work modules from the use frequency, and a work module group creation process in which the work module combination is used as a work module group, and a frequency of the number of times of movement between the work modules in the production process The proximity of the work module group from A work module group proximity evaluation process, a work module group layout step of laying out the work modules by bringing the work modules with high proximity close to each other with a focus on the work modules frequently used, and the work module group And a facility arranging step of arranging the facilities according to the above layout.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method for constructing a semiconductor wafer production processing system according to the present invention will be described in detail with reference to the accompanying drawings. In the present invention, a semiconductor wafer production processing system is constructed according to the following process. 1) First, the process of semiconductor wafer production processing is divided into a combination of a series of operations of cleaning, processing, and measurement, and this is defined as an operation unit. 2) Next, the working units using the same device are put together from the viewpoint that one worker can work continuously,
This is defined as a work module. 3) Furthermore, paying attention to the use frequency of the used facilities in the work modules, the work facilities are collectively defined from the viewpoint of effectively using the used facilities and defined as a work module group. 4) Next, the frequency of use of the equipment used in the work module group and the proximity of the equipment to each other (the relevance of the use progress) are evaluated.
Finally, the layout of the equipment used is determined so that the transfer distance and transfer process of the wafer can be reduced. by this,
Even when the number of devices is limited, a layout closer to a free shop can be created.

FIG. 1 is a flowchart showing a method of constructing the semiconductor wafer production processing system. In the creation of a work unit in step 101, a work unit is created with cleaning, processing, and measurement as a summary of work. Next, in the creation of a work module in step 102, work units using the same device are collectively set as a work module and correspond to one worker. Next, in the creation of a work module group in step 103, work modules using the common device are put together to create a work module group.

Next, in the assignment of the devices to the work module groups in step 104, the required number of the limited devices is assigned to each work module group, judging from the number of times the devices are used. Next, in the creation of the proximity diagram for each work module group in step 105, the proximity is evaluated based on the number of movements between each work module group, and a diagram capable of displaying the evaluation result of the proximity is created. Next, step 1
In the creation of the layout 06, the work modules are arranged in consideration of the proximity between the work modules from the one with the largest number of processes among the work modules, and the layout of the device corresponding to each work module is performed. .

In the following, each of the processes described above will be described with reference to the drawings. 1) Method of creating work units In the semiconductor wafer production processing process, basic processes such as thin film formation, oxidation and etching, and cleaning, processing, and measurement as pre-processing and post-processing for the processing are one operation. The unit is defined as a work unit (1). In FIG.
1 shows a process flow image of a semiconductor wafer production processing step and an operation unit (1) therein. Fig. 2 shows the first part of the process flow of the wafer production process, in which the wafer is pre-cleaned, a silicon oxide film or a nitride film is formed, a photoresist is coated on the silicon oxide film or a nitride film, and exposure, development, and etching are performed. Unit (1)
It is an example showing. Thus, the work unit (1)
When one worker performs continuous work, the work is grouped so as to be completed at each work unit (1) as a work break. By the way, one worker can usually operate a plurality of work units (1). Therefore, for example, a work unit group that one worker processes continuously for one day is referred to as a work module (1). 2) is defined.

2) Method of creating a work module a) The work units (1) having the same work content as the equipment to be used among the work units (1) are summarized as shown in FIG. b) The required man-hours of the worker are calculated for each work unit (1), and a group of work units that can be handled by one worker continuously for one day, for example, is collected as a work module (2). At this time, the work units (1) in the work module (2) are combined in ascending order of process numbers.

3) Method of creating work module group Equipment is assigned to each work module (2) created based on the required number of equipment calculated in advance from the wafer production quantity. FIG. 4 is a table showing a list of equipment used for each work module. The number column is the required number of each equipment calculated, and the number of processes occurring for each work module (2) (in FIG. 4, the number is shown in parentheses). Assign the number of equipment based on the ratio in (). At this time, the work module 2 and the work module 3 both use the CVA1, the CVA2, and the measurement equipment. However, the equipment is not assigned to the module 3 due to the limitation of the process processing ratio and the number of equipment.
In such a case, the module 2 and the module 3 are collectively defined as one work module group (3). Here, the work module group (3) refers to a group of a plurality of work modules (2).

4) Layout Creation Method A from-to-chart shown in FIG. 5 is created for each work module group (3), and the number of flows is summarized. Thereby, the connection between the work modules (3) is determined. The proximity is evaluated based on the number of times of processing between the work modules (3). The proximity is summarized in a proximity diagram as shown in FIG. 6 and used as basic data at the time of layout creation. Next, as shown in FIG. 7, a work module group (3) having a large number of processings is first laid out at the center, and the other working module groups (3) are sequentially radiated in descending order of the processing number. To place. At this time, the layout is made such that the work modules (3) having high proximity to each other are brought close to each other, and the work modules (3) having a large processing access from other work modules (3) are arranged as centrally as possible. create. FIG. 7 is an example in which the work module group (3) is laid out over a plurality of installation spaces.

[0013]

As described above, the invention of claim 1 of the present invention relates to a method of constructing a semiconductor wafer production processing system in which a plurality of facilities used for a semiconductor wafer production process are arranged. Work unit division process that divides a production process into work units that are a series of work units, work module creation process that combines work units that use the same equipment into a work module, and usage frequency of each equipment in the work module , Each equipment is allocated to a combination of a plurality of work modules, a work module group creation process in which the combination of work modules is used as a work module group, and a work module based on a frequency of movement between work modules in a production process. Work modules for evaluating group proximity The contact evaluation process, the work module group layout process of laying out the work modules by bringing close work modules around the frequently used work modules, and the equipment according to the layout of the work modules And a step of arranging facilities. As a result, a method of constructing a semiconductor wafer production processing system capable of easily realizing an apparatus layout capable of reducing the number of processes and the number of processes by minimizing the transfer distance of the wafer can be obtained.

The invention according to a second aspect of the present invention is characterized in that, in the work unit dividing process, the work units are grouped by a combination of cleaning, processing, and measurement work processes. As a result, the work unit itself can be made complete, and subsequent processing can be facilitated.

The invention according to a third aspect of the present invention is characterized in that in the process of creating a work module, the work modules are put together in a processable range of one worker. As a result, a work combination according to the processing capacity of the worker can be realized, and the worker can be multi-skilled.

[Brief description of the drawings]

FIG. 1 is a flowchart showing a method for constructing a semiconductor wafer production processing system according to the present invention.

FIG. 2 is a chart showing a process flow image in a semiconductor wafer production processing step and work units therein.

FIG. 3 is a chart showing a method of creating a work module for integrating work units having the same equipment.

FIG. 4 is a list of equipment used for each work module.

FIG. 5 is a from-to-chart chart showing the relationship between work module groups.

FIG. 6 is a proximity diagram showing the proximity of work modules.

FIG. 7 is a layout diagram showing an arrangement of work module groups.

[Explanation of symbols]

1. Working unit, 2. Working module, 3. Working module group.

 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshiro Kizakihara 6-35 Kitashinagawa, Shinagawa-ku, Tokyo Sony Corporation F-term (reference) 5F031 PA01

Claims (3)

[Claims] In a method for constructing a semiconductor wafer production processing system in which a plurality of facilities used in correspondence with a semiconductor wafer production process are arranged, the semiconductor wafer production process is divided into a series of operation units, ie, operation units. A work unit dividing step; a work module creating step of combining the work units using the same equipment into a work module; and a facility for each combination of a plurality of work modules from the use frequency of each equipment in the work module. A work module group creation process in which the combination of the work modules is used as a work module group; and a work module group proximity for evaluating the proximity of the work module group from the frequency of the number of times of movement between the work modules in a production process. Sex evaluation process and frequency of use A work module group layout process of laying out the work module group by bringing the work modules close to each other with a close proximity to the high work module group; and a facility arrangement process of arranging equipment along the layout of the work module group. A method for constructing a semiconductor wafer production processing system, characterized by being realized with: 2. The method for constructing a semiconductor wafer production processing system according to claim 1, wherein in the work unit dividing step, the work units are grouped by a combination of cleaning, processing, and measurement work processes. 3. The method for constructing a semiconductor wafer production processing system according to claim 1, wherein in the work module creation process, the work modules are put together in a processable range of one worker.