JP2000082735A - Apparatus and method for processing substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately take out an abnormally processed or precedently processed substrate by conveying the substrate in a route of a first placing unit for containing a plurality of substrates before and after processing, a processing unit for processing the substrate and a second placing unit for containing the plurality of the substrates abnormally processed by the processing unit. SOLUTION: A precedently processed wafer W to be confirmed whether a desired result is obtained or not in a processing unit for processing a plurality of substrates is contained in a recovery placing unit 20e, and a selective screen of whether the wafer W is returned to placing units 20a to 20d of a wafer placing unit CR or not is displayed. In the case of selecting to return the wafer W to the placing unit, the wafer W is conveyed to a wafer placing unit via a route B different from a route C of the normally processed wafer W by a wafer conveying mechanism 22. At the time of receiving abnormal occurrence information after the normal process is started, the abnormally processed wafer W is contained in a recovering placing unit 20e, and similar selective screen is displayed. In the case of selecting to return the wafer W to the units 20a to 20d, the wafer W is conveyed to the placing unit via the route B.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a substrate processing apparatus and a substrate processing method for applying and developing a resist on a substrate such as a semiconductor wafer or an LCD substrate.

[0002]

2. Description of the Related Art In a photoresist processing step in the manufacture of semiconductor devices, a resist liquid is applied to the surface of a semiconductor wafer (hereinafter, referred to as "wafer") to form a resist film. After exposing a predetermined pattern on the resist film, a developing solution is applied to the substrate and developed.
Conventionally, such a process of applying a resist and a developing process are performed by a processing system configured to integrate a plurality of processing units and transport a substrate between these units by a transport device. Loading and unloading of substrates from and to the processing system are performed using a mounting unit that accommodates a plurality of substrates.

The processing units in the above processing system include, for example, a spinner type resist coating unit and a developing unit, a heating unit and a cooling unit. The processing unit is carried into and out of these processing units via the storage unit, and is again stored in the mounting unit.

In the processing system configured as described above, the wafer may not be processed normally in the processing unit, that is, the wafer may be processed abnormally. For example, the supply of liquid is interrupted in the resist coating unit or the development processing unit, the wafer is not placed at a normal position in the heating processing unit or the cooling processing unit, or a notification of abnormal processing is received from the exposure apparatus. . In such a case, in order to avoid wasting expensive wafers, an abnormally processed wafer is passed to the subsequent process to check whether it can be handled in the same manner as a normally processed wafer. Needs to continue processing.

[0005] In such inspection, for example, an abnormally processed wafer is selected from a plurality of wafers stored in the mounting portion after the processing is completed, the selected wafer is carried to the inspection device, and the inspection device performs the inspection. If it is determined by the inspection that the wafer can be handled in the same manner as a normally processed wafer, the wafer is returned to the mounting portion, and the other wafers are peeled off and the surface is processed again or discarded.

[0006]

However, selecting an abnormally processed wafer from among a plurality of wafers housed in the mounting section after the processing has been completed requires a great deal of work and is accurate. Otherwise, there is a problem that subsequent processing on the wafer is wasted. In particular, in a processing system having a plurality of mounting sections, abnormally processed wafers are scattered in each mounting section, and in that case, it is not easy to accurately select the abnormally processed wafer. Absent.

An object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of accurately taking out an abnormally processed wafer and performing an inspection or the like. It is another object of the present invention to provide a substrate processing apparatus and a substrate processing method that can accurately take out a substrate that has been preliminarily processed prior to normal processing and perform inspection and the like.

[0008]

In order to achieve the above object, a substrate processing apparatus according to the present invention comprises a first mounting portion for accommodating a plurality of substrates before and after processing, and a processing apparatus for processing the substrates. A processing unit, a second mounting unit that houses the plurality of substrates that have been abnormally processed by the processing unit, and the first mounting unit, the processing unit, and the second mounting unit. Means for transporting the substrate between them.

According to one aspect of the present invention, means for detecting whether the substrate has been processed normally in the processing section or whether the substrate has been processed abnormally, and normal processing is detected by the detecting means Transporting the substrate from the process unit to the first mounting unit by the transport unit,
When the processing of the abnormality is detected by the detecting means, the substrate is moved from the process unit to the second
Means for transferring the substrate from the second mounting section to the first mounting section by the transfer means; and the input means. Means for transporting the substrate from the second mounting portion to the first mounting portion based on the input command.

According to one aspect of the present invention, the apparatus further comprises means for notifying the abnormal processing when the abnormal processing is detected by the detecting means.

According to one aspect of the present invention, the apparatus further comprises a means for stopping the processing of the substrate in the processing section when an abnormal processing is detected by the detecting means.

According to an embodiment of the present invention, when an abnormality processing is detected by the detection means, a means for outputting information relating to the abnormality processing, and each of the substrates accommodated in the second mounting portion is provided. Means for storing the output information in correspondence with the above.

According to one embodiment of the present invention, the second mounting section may include, together with the substrate abnormally processed in the process section, the substrate pre-processed in the process section prior to normal processing. It is characterized by being accommodated.

According to one embodiment of the present invention, the means for transferring the substrate pre-processed by the transfer means from the process section to the second placement section, and the pre-processed substrate by the transfer means Means for inputting a command as to whether or not the substrate is to be transported from the second mounting portion to the first mounting portion; and the pre-processing performed by the transporting device based on the command input by the input device. Means for transporting the substrate from the second mounting portion to the first mounting portion.

According to one aspect of the present invention, means for detecting whether the substrate has been processed normally in the processing unit or whether the substrate has been processed abnormally, and a substrate normally processed in the processing unit Means for transferring the abnormally processed substrate from the process section to the first mounting section by the transfer means, and abnormally processing in the process section among the substrates accommodated in the first mounting section. Means for inputting a command as to whether or not the transferred substrate is to be transferred from the first mounting portion to the second mounting portion by the transfer means; and Means for transporting the substrate abnormally processed in the process unit by the means from the first placement unit to the second placement unit.

According to one embodiment of the present invention, when an abnormality process is detected by the detection unit, a unit for outputting information relating to the abnormality process is provided, and the information of the substrate accommodated in the first mounting portion is provided. And a means for storing the output information corresponding to at least each substrate abnormally processed by the process unit.

According to the present invention, there is provided a substrate processing apparatus comprising: a first mounting section for accommodating a plurality of substrates before and after processing; a processing section for processing the substrate; A second mounting portion for accommodating the plurality of processed substrates, and a unit configured to transfer the substrate between the first mounting portion, the processing unit, and the second mounting portion. It is characterized by doing.

According to the substrate processing method of the present invention, a step of transporting a substrate from a first mounting portion accommodating a plurality of substrates to a processing section for processing the substrate, and a step of processing the substrate in the processing section Detecting whether the substrate has been processed normally in the processing unit or whether the substrate has been processed abnormally; and, when the normal processing is detected, removing the substrate from the processing unit to the first process. Transferring the substrate from the process unit to the second mounting unit that accommodates a plurality of substrates when the abnormal processing is detected, and the second mounting unit. The substrate accommodated in the first
Inputting an instruction as to whether or not to convey to the mounting portion of
Transporting the substrate accommodated in the second placement portion to the first placement portion based on the input command.

According to one embodiment of the present invention, the process section pre-processes the substrate prior to normal processing,
The pre-processed substrate is removed from the process section by the second
And transporting to the mounting portion.

According to one embodiment of the present invention, a step of inputting a command as to whether or not the pre-processed substrate is transported from the second mounting portion to the first mounting portion; The pre-processed substrate is transferred to the second
And transporting from the mounting portion to the first mounting portion.

According to the substrate processing method of the present invention, a step of transporting a substrate from a first mounting portion accommodating a plurality of substrates to a processing section for processing the substrate, and a step of processing the substrate in the processing section Detecting whether the substrate has been processed normally or abnormally by the process unit; and placing the normally processed substrate and the abnormally processed substrate on the first mounting surface. Transporting the plurality of substrates from the first placement unit to the plurality of substrates, at least the substrate in which the abnormality has been detected among the substrates contained in the first placement unit. A step of inputting an instruction as to whether or not to transport the substrate to the unit, and a step of transporting the substrate stored in the first mounting unit to the second mounting unit based on the input instruction. It is characterized by.

According to the substrate processing method of the present invention, a step of transporting a substrate from a first mounting portion accommodating a plurality of substrates to a processing section for processing the substrate, and a step of processing the substrate by the processing section And, in the process unit, a step of pre-processing the substrate prior to normal processing; and a step of transporting the pre-processed substrate from the process unit to a second mounting unit that accommodates a plurality of substrates; A step of inputting a command as to whether or not the substrate accommodated in the second receiver is to be transported to the first receiver; and a step of inputting the second command based on the input command.
Transporting the substrate accommodated in the mounting portion to the first mounting portion.

According to the substrate processing method of the present invention, a step of transporting a substrate from a first mounting portion accommodating a plurality of substrates to a processing section for processing the substrate, and a step of processing the substrate in the processing section And, in the process unit, a step of pre-processing the substrate prior to a normal process; a step of transporting the substrate subjected to the normal process and the pre-processed substrate to the first mounting unit; An instruction is input as to whether to transfer at least the preprocessed substrate among the substrates accommodated in the first stage from the first stage to a second stage accommodating a plurality of substrates. And, based on the input command, the substrate accommodated in the first mounting portion is moved to the second
And a step of transporting the sheet to the mounting portion.

According to the present invention, in addition to the first mounting portion for accommodating a plurality of substrates before and after processing, a plurality of substrates abnormally processed in the processing section or a plurality of substrates pre-processed prior to normal processing. The second mounting part for accommodating the substrate is provided, and the abnormally processed substrate or the pre-processed substrate is collected by the second mounting part. The inspection and the like can be performed by taking out the substrate, and the substrate, which has been preliminarily processed before the normal processing, can be accurately taken out and the inspection and the like can be performed.

[0025]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view showing a configuration of a coating and developing processing system of a coating and developing processing system according to an embodiment of the present invention, FIG. 2 is a front view of the coating and developing processing system shown in FIG. 1, and FIG. FIG. 2 is a rear view of the coating and developing system.

As shown in FIG. 1, in the coating and developing system 1, a plurality of wafers W as substrates to be processed are loaded into the system from the outside in units of, for example, 25 wafers while being accommodated in the wafer mounting portion CR.・ Unloading and wafer mounting part C
A loading station 10 for loading / unloading wafers W into / from R and various single-wafer processing units for performing predetermined processing on the wafers W one by one in the coating and developing process are located at predetermined positions. A processing station 12 arranged in multiple stages and an exposure apparatus 13 arranged adjacent to the coating and developing system 1
And an interface unit 14 for transferring the wafer W between them.

The mounting station 10 is provided with a mounting table 20 having an L-shaped mounting surface, and a positioning projection 21 provided on the mounting surface on the mounting table 20. I have. The wafer mounting portion CR is mounted on the positioning protrusion 21 in a state where the wafer mounting portion CR is positioned, and the positions where the positioning protrusions 21 are provided constitute the mounting portions 20a to 20e, respectively. It has become. In addition, each mounting part 20 on which the wafer mounting part CR is mounted is set.
Each of a to 20e is provided with a sensor (not shown) for detecting the presence / absence of the wafer mounting portion CR.

The mounting table 20 has five mounting portions 20a-2
0e, and a total of up to five wafer mounting portions C
R can be placed.

Of these mounting sections, four wafer mounting sections CR control the transfer of wafers into and out of the processing station 12.
Are placed on the receivers 20a to 20d in a line in the X direction toward the side, and the remaining one is turned 90 degrees with respect to the four wafer receivers CR. On the front side of the coating and developing system 1, the wafer entrance is arranged on the mounting portion 20e with the entrance of the wafer facing the rear side. Note that the number and arrangement of the mounting portions are not limited to those described above. For example, the number of mounting portions may be 6 or more or 4 or less. A mounting portion may be provided.

The mounting station 10 is provided with
Stored in the part arrangement direction (X direction) and in the wafer mounting part CR
Wafer arrangement direction of the selected wafer W (Z direction: vertical direction)
And can be rotated in the θ direction.
An wafer transport mechanism 22 is provided, and
The structure 22 selectively accesses each wafer mounting part CR.
At the same time, as described later,
3 processing unit group G ₃Of the multi-stage unit
Alignment unit (ALIM) and extension
Access the unit (EXT) to transfer the wafer W
It is configured to do so.

Of the five wafer mounting portions CR described above,
The four wafer mounting portions CR mounted on the mounting portions 20a to 20d arranged in a line in the X direction accommodate an unprocessed wafer W and a processed wafer W. If the normal processing at the time of
Unprocessed wafer W from one of the wafer mounting portions CR
Is taken out, and the processed wafer W is also stored in any of these four wafer mounting portions CR.
In this case, the processed wafer W may be returned to the original wafer mounting portion CR (wafer mounting portion CR in which the wafer W was stored before the processing).

The remaining wafer mounting portion CR disposed on the mounting portion 20e on the front side includes the wafer W abnormally processed by the processing station 12 and the exposure apparatus 13 as a process section and the normal processing. And a collecting mounting portion for collecting the wafer W that has been subjected to pre-processing prior to the operation.

The precedent process executed prior to the normal process is performed to confirm the status of the process prior to the normal process. Then, after performing the preceding processing, the recovery mounting portion is taken out, the processing status of the wafer W accommodated therein and for which the preceding processing has been completed is confirmed, and the processing of the wafer W is performed favorably. Is confirmed, a normal process is executed, whereby a large number of wafers W
It is intended to prevent a defective process from being performed in advance.

The processing station 12 is provided with a vertical transfer type main wafer transfer mechanism 24 equipped with a wafer transfer device, around which all processing units are arranged in one or more sets in multiple stages. ing.

As shown in FIG. 2, in the first processing unit group G ₁ , two spinner type processing units, for example, a resist coating unit (FIG. 2) for performing a predetermined processing by placing the wafer W on a spin chuck in the cup CP. COT) and the developing unit (DEV) are stacked in two stages from the bottom. In the second processing unit group _{G 2,} two spinner-type processing units, for example of the resist coating unit (COT)
The developing unit (DEV) is stacked in two stages from the bottom. These resist coating units (COT)
Since the drainage of the resist solution is troublesome both mechanically and in terms of maintenance, it is preferable to dispose the resist solution in the lower stage. However, it is of course possible to appropriately arrange the upper stage as needed.

As shown in FIG. 3, the main wafer transfer mechanism 24
In the figure, a wafer transfer device 42 is provided inside the cylindrical support 40 so as to be able to move up and down in the vertical direction (Z direction). The cylindrical support 40 is connected to a rotation shaft of a motor (not shown), and is rotated integrally with the wafer transfer device 42 about the rotation shaft by the rotation driving force of the motor, whereby the wafer transfer The device 42 is rotatable in the θ direction. The tubular support 40 may be configured to be connected to another rotating shaft (not shown) rotated by the motor.

A plurality of holding members 46 movable in the front-rear direction of the transfer base 44 are disposed on the wafer transfer device 42, and these holding members 46 transfer the wafer W between the processing units. Is possible.

Further, as shown in FIG. 1, in this coating and developing processing system 1, five processing unit groups G ₁ , G ₂ ,
G ₃ , G ₄ , and G ₅ can be arranged. The multi-stage units of the first and second processing unit groups G ₁ and G ₂ are arranged on the front side of the system, and the multi-stage units of the third processing unit group G ₃ are arranged. The unit is located adjacent to the receiver station 10,
Multistage unit of the fourth processing unit group G ₄ is disposed adjacent to the interface unit 14, the multi-stage units of the fifth processing unit group G ₅ is capable of being disposed on the rear side.

As shown in FIG. 3, the third processing unit group G _3, the wafer W holder open type processing units placed on a (SP shown in FIG. 1) performs the predetermined processing, for example, a cooling process Cooling unit (COL) to perform, adhesion unit (AD) to perform so-called hydrophobic treatment for improving the fixability of resist, alignment unit (ALIM) to perform alignment, extension unit (EXT), before exposure processing A pre-baking unit (PREBAKE) for performing heat treatment and a post-baking unit (POBAK) for performing heat treatment after exposure processing
E) are stacked, for example, in eight stages from the bottom. 4th
Processing any unit group _{G 4,} open-type processing units, for example, a cooling unit (COL), an extension and cooling unit (EXTCOL), extension unit (EXT), a cooling unit (COL), pre-baking unit (PREBAK
E) and post-baking unit (POBAKE)
Are stacked in order from the bottom, for example, in eight stages.

As described above, the cooling unit (COL) and the extension cooling unit (EXTCOL) each having a low processing temperature are arranged in the lower stage, and the baking unit (PREBAKE), the post-baking unit (POBAKE), and the adhesion unit each having a high processing temperature. By arranging the units (AD) in the upper stage, thermal mutual interference between the units can be reduced. Of course, a random multi-stage arrangement may be used.

As shown in FIG. 1, the interface unit 14
In the depth direction (X direction), the processing station 12
But has a smaller size in the width direction (Y direction). On the front surface of the interface unit 14, a portable pick-up wafer mounting unit CR and a stationary buffer mounting unit BR are arranged in two stages, while a peripheral exposure device 28 is arranged on the rear surface. Has been established.

In the center of the interface unit 14, a wafer transfer device 26 is provided. The wafer transfer device 26 moves in the X direction and the Z direction, and
The R, BR and peripheral exposure device 28 are accessed.

[0043] The wafer transfer apparatus 26 can freely rotate in θ direction, the processing station 12 side of the fourth processing unit group G ₄ of the extension units arranged in multiple stages unit (EXT) and the adjacent The wafer delivery table (not shown) on the side of the exposure apparatus can be accessed.

In the coating and developing system 1, the multi-stage unit of the _fifth processing unit group G5 shown by a broken line in FIG. 1 can be arranged on the back side of the main wafer transfer mechanism 24 as described above. The multi-stage units of the _fifth processing unit group G5 are movable in the Y direction along the guide rails 32.
Therefore, even when provided as a multi-stage unit of the fifth processing unit group G ₅ shown, by moving along the guide rail 32, the space portion can be secured, to the main wafer transfer mechanism 24 Maintenance work can be easily performed from behind.

As shown in FIG. 4, in the coating and developing system 1, a display / input unit 101 having a display device and an input device is connected to a control unit 100 for controlling the above-described units. Further, the control unit 100 is connected with a plurality of detection units 102 for detecting whether the wafer W has been normally processed or whether the wafer W has been processed abnormally in each unit described above.

Here, when the wafer W is processed abnormally, for example, the supply of the liquid is interrupted in the resist coating unit or the development processing unit, or a heating processing unit such as a baking unit (PREBAKE) or a post-baking unit (POBAKE). Alternatively, the wafer may not be placed at a normal position in the cooling unit (COL). The control unit 10
0 is provided with an input terminal 103 for receiving a notification of an abnormal process from the exposure apparatus 13 side. Furthermore, the control unit 100 is connected to a storage unit 104 that stores information output from the detection unit 102 or the input terminal 103 corresponding to each wafer W accommodated in the collection mounting unit. .

Next, the basic operation of the coating and developing system 1 configured as described above will be described.

First, at the receiver station 10, the respective wafer entrances are placed on the receiver 20 on four receivers 20 a to 20 d arranged in a line in the X direction toward the processing station 12. The wafer transfer mechanism 22 accesses one of the placed wafer mounting portions CR that contains the unprocessed wafer W, and takes out one wafer W from the wafer mounting portion CR. After that, the wafer transfer mechanism 2
2, passes the third processing unit group G ₃ of the alignment unit (ALIM) wafer W to the main wafer transfer mechanism 24 of processing Steen Deployment 12 side via the like.

The main wafer transfer mechanism 24 takes out the wafer W that orientation flat alignment and centering is completed by the alignment unit (ALIM), the wafer W in the third processing adhesion unit unit group G ₃ (AD) Carry in and perform hydrophobic treatment.

The wafer W that has been subjected to the hydrophobic treatment is then carried into a predetermined prebaking unit (PREBAKE) by the main wafer transfer mechanism 24 and baked, and then carried into a predetermined cooling unit (COL). In the cooling unit (COL), the wafer W is cooled to a set temperature before the resist coating processing, for example, 23 ° C.

When the cooling process is completed, the wafer W is carried into a predetermined resist coating unit (COT) by the main wafer transfer mechanism 24, and the resist coating unit (C
In OT), a resist is applied to the surface of the wafer W.

When the resist coating process is completed, the main wafer transfer mechanism 24 transfers the wafer W to the resist coating unit (CO
T) and taken out again from the predetermined pre-bake unit (P
REBAKE). Here, the wafer W is heated at a predetermined temperature, for example, 100 ° C. for a predetermined time, so that the residual solvent is evaporated and removed from the coating film on the wafer W.

Thereafter, the wafer W is transferred to the main wafer transfer mechanism 24.
Extension cooling unit (EX
TCOL). Here, the wafer W is cooled to a temperature suitable for the next step, ie, peripheral exposure processing by the peripheral exposure device 28, for example, 24 ° C.

Thereafter, the wafer W is transferred from the extension cooling unit (EXTCOL) to the wafer transfer device 26 by the wafer transfer device 26 provided in the interface section 14.

Next, the wafer transfer device 26
Is carried into the peripheral exposure device 28 in the interface unit 14. In the peripheral exposure device 28, the wafer W is subjected to an exposure process on its peripheral portion.

When the peripheral exposure processing is completed, the wafer transfer device 26 unloads the wafer W from the peripheral exposure device 28 and transfers it to the adjacent wafer receiving table (not shown) on the exposure device 13 side. In this case, the wafer W may be temporarily stored in the buffer mounting part BR before being transferred to the exposure apparatus 13 as necessary.

As described above, the wafer W is exposed
After that, the exposure device 13 performs an exposure process, for example, an exposure process using a reticle. When the exposure processing on the entire surface of the wafer W in the exposure device 13 is completed, the wafer W
Handed over to 6.

Then, the wafer W is further transferred from the wafer transfer device 26 to the processing station 12 side. In this case, before the wafer W is transferred to the processing station 12, the wafer W may be temporarily stored in the buffer mounting part BR in the interface part 14 if necessary.

Thereafter, the main wafer transfer mechanism 24 of the processing station 12 carries the received wafer W into a predetermined post-baking unit (POBAKE). In this post-baking unit (POBAKE), the wafer W is placed on a hot plate and baked for a predetermined time.

Thereafter, the baked wafer W is carried into one of the cooling units (COL) by the main wafer transfer mechanism 24, and the cooling unit (C)
The wafer W is returned to the normal temperature in (OL). Subsequently, the wafer W is carried into a predetermined developing unit (DEV) by the main wafer transfer mechanism 24.

In the developing unit (DEV), the wafer W is placed on a spin chuck, and a developing solution is uniformly applied to a resist on the surface of the wafer W by, for example, a spray method to perform development. After the development, a rinsing liquid is applied to the surface of the wafer W, and the developing liquid is washed off.
Thereafter, the wafer W is rotated at a high speed to perform drying.

Thereafter, the main wafer transfer mechanism 24 unloads the wafer W from the developing unit (DEV), and then transfers the wafer W to a predetermined post-baking unit (POBAKE).
Again. This post baking unit (PO
In BAKE), the wafer W is heated, for example, at 100 ° C. for a predetermined time, whereby the resist swollen by development is hardened, and the chemical resistance is improved.

When the post-baking is completed, the main wafer transfer mechanism 24 carries out the wafer W from the post-baking unit, and then carries the wafer W into a predetermined cooling unit (COL) to perform a cooling process.

After the temperature of the wafer W has returned to the normal temperature, the main wafer transfer mechanism 24 transfers the wafer W to the receiver station 10 and the wafer transfer mechanism 2 of the receiver station 10.
2 is to transfer the received wafer W to the X
The wafer entrances of the four mounting sections 20a to 20d arranged in a row in the direction are inserted into predetermined wafer accommodating grooves of the four wafer mounting sections CR mounted to face the processing station 12 side.

The above is the normal processing. In this coating and developing processing system 1, as shown in FIG. 5, several wafers W are experimentally processed before such normal processing, and it is confirmed whether or not the processing result is a desired result. A preceding process is performed (step 501). The wafer W thus pre-processed passes through the path shown in FIG.
(e) is stored in the collection mounting portion mounted on the e.
02).

Next, on the display / input section 101, a selection screen is displayed for selecting whether or not to return the wafer W stored in the collection mounting section to the wafer mounting section CR mounted on the mounting sections 20a to 20d. Is performed (step 503). If the display / input unit 101 selects to return the wafer W to the wafer mounting unit CR mounted on the mounting units 20a to 20d (step 504), the wafer transfer mechanism 22 sets the recovery mounting. The wafer W accommodated in the section is transferred to the wafer placement section CR placed on the placement sections 20a to 20d as shown by the path B in FIG. 6 (Step 505). FIG. 6C shows the path of the wafer W that has been processed normally.

Thereafter, when the control section 100 receives information on the occurrence of an abnormality from the detection section 102 or the input terminal 103 after the normal processing is started (step 506), the abnormally processed wafer W is stored in A of FIG. It is stored in the collecting receiver placed on the receiver 20e through the indicated path (step 507).

Here, in the display / input unit 101, the information stored in the storage unit 104, that is, the information output from the detection unit 102 or the input terminal 103 corresponding to each wafer W accommodated in the collection mounting unit. Each information is displayed.
The input unit 101 displays a selection screen as to whether or not to return the wafer W stored in the collection mounting unit to the wafer mounting unit CR mounted on the mounting units 20a to 20d (step 50).
8). When the display / input unit 101 selects to return the wafer W to the wafer mounting unit CR mounted on the mounting units 20a to 20d (step 509), the wafer transfer mechanism 22 sets the recovery mounting. Wafer W stored in unit
Is transported to the wafer mounting portion CR mounted on the mounting portions 20a to 20d as shown by the path B in FIG. 6 (Step 5).
10).

When a processing error occurs, an alarm is generated from the display / input unit 101, a speaker, or the like, and the processing of the entire system 1 is stopped. This can be prevented from occurring.

As described above, this coating and developing system 1
In this configuration, the pre-processed wafer W and the abnormally processed wafer W are configured to be temporarily housed in the collection mounting portion, so that the abnormally processed wafer W can be accurately taken out and inspected. In addition, it is possible to accurately take out the wafer W that has been pre-processed prior to the normal process and perform an inspection or the like. After that, since the wafer can be returned to the original mounting portion by the user's selection, when these wafers are handled in the same manner as the normally processed wafer W, it is possible to reduce the labor for returning the wafers. it can.

The present invention is not limited to the above embodiment. For example, as shown in a path D in FIG. 7, the wafers W all of which have been once mounted on the mounting units 20 a to 20 d, similarly to the wafer W which has been processed in advance and the wafer W which has been processed abnormally. It is stored in the receiver CR, and thereafter, as shown by a path E in FIG.
May be accommodated in the collection mounting portion mounted on the storage device. Further, the wafer W accommodated in the collection receiver placed on the receiver 20e in this way is again selected by the user, and the wafer receiver CR mounted on the receivers 20a to 20d again.
It may be configured to be accommodated in

As described above, the present invention is not limited to these embodiments, but can take various forms. For example, the substrate is not limited to the wafer W,
A CD substrate, a glass substrate, a CD substrate, a photomask, a printed substrate, a ceramic substrate, or the like is also possible.

[0073]

As described above, an abnormally processed substrate can be accurately taken out for inspection and the like. In addition, prior to normal processing, a pre-processed substrate can be accurately taken out and an inspection etc. can be performed. be able to.

[Brief description of the drawings]

FIG. 1 is a plan view illustrating a configuration of a coating and developing system according to an embodiment of the present invention.

FIG. 2 is a front view of the coating and developing system shown in FIG.

FIG. 3 is a rear view of the coating and developing system shown in FIG. 1;

FIG. 4 is a block diagram showing a configuration of a control system of the coating and developing system shown in FIG.

FIG. 5 is a flowchart showing an operation of the coating and developing processing system shown in FIG. 1;

FIG. 6 is an explanatory diagram showing an operation of the coating and developing processing system shown in FIG. 1;

FIG. 7 is an explanatory diagram illustrating an operation of a coating and developing processing system according to another embodiment of the present invention.

[Explanation of symbols]

 10 Placement Station 20a to 20d Placement Section 12 Processing Station 24 Main Wafer Transfer Mechanism CR Wafer Placement Section W Wafer

Claims (16)

[Claims] A first mounting unit that stores a plurality of substrates before and after processing; a processing unit that processes the substrates; and a plurality of substrates that are abnormally processed by the processing unit. A substrate processing apparatus, comprising: a second mounting portion; and means for transporting the substrate between the first mounting portion, the processing unit, and the second mounting portion. 2. The substrate processing apparatus according to claim 1, wherein the processing unit detects whether the substrate is processed normally or the substrate is processed abnormally, and the processing unit performs normal processing. Is detected, the substrate is moved from the process section by the transfer means to the first position.
Means for transferring the substrate from the process section to the second mounting section by the transfer means when the abnormal processing is detected by the detection means; and Means for inputting an instruction as to whether or not the substrate is to be transported from the second mounting portion to the first mounting portion; and Means for transporting from the second mounting portion to the first mounting portion. 3. The substrate processing apparatus according to claim 2, further comprising: means for notifying the processing of the abnormality when the processing of the abnormality is detected by the detection means. 4. The substrate processing apparatus according to claim 2, further comprising: a unit that stops processing of the substrate in the processing unit when an abnormal process is detected by the detection unit. Substrate processing equipment. 5. One of claims 2 to 4
In the substrate processing apparatus described in the paragraph, when an abnormal process is detected by the detection unit, a unit that outputs information related to the abnormal process, and a unit corresponding to each substrate accommodated in the second mounting unit. Means for storing the output information. 6. One of claims 1 to 5
In the substrate processing apparatus according to the item, the second mounting section, together with the substrate abnormally processed in the process section, accommodates a substrate that has been pre-processed prior to normal processing in the process section. Characteristic substrate processing equipment. 7. The substrate processing apparatus according to claim 6, wherein the substrate processed by the transport unit is transported from the process unit to the second placement unit, and the transport unit transports the substrate. Treating the treated substrate with the second
Means for inputting a command as to whether or not the substrate is to be transported from the mounting portion to the first mounting portion, and the pre-processed substrate by the transporting device based on the instruction input by the input device. 2. A substrate processing apparatus, further comprising: means for transporting the second mounting portion to the first mounting portion. 8. One of claims 1 to 7
The substrate processing apparatus according to claim 1, wherein the processing unit detects whether the substrate has been processed normally or the substrate has been processed abnormally, and a substrate that has been processed normally in the processing unit and abnormally processed. Means for transferring the processed substrate from the process section to the first mounting section by the transfer means, and a substrate which has been abnormally processed by the process section among the substrates accommodated in the first mounting section. Means for inputting a command as to whether or not the sheet is to be transported from the first mounting portion to the second mounting portion by the transfer means; and the process by the transfer means based on the command input by the input means. Means for transporting the substrate abnormally processed by the unit from the first mounting unit to the second mounting unit. 9. The substrate processing apparatus according to claim 8, wherein, when the processing of the abnormality is detected by the detection means, a means for outputting information relating to the processing of the abnormality, and accommodated in the first mounting portion. Means for storing the output information corresponding to at least each substrate abnormally processed by the process unit among the substrates that have been processed. 10. A first mounting section for accommodating a plurality of substrates before and after processing, a processing section for processing the substrate, and a plurality of pre-processed prior to normal processing in the processing section. A second mounting portion for accommodating a substrate; and a means for transporting the substrate between the first mounting portion, the process section, and the second mounting portion. Substrate processing equipment. 11. A step of transporting a substrate from a first mounting portion accommodating a plurality of substrates to a processing section for processing the substrate; a step of processing the substrate in the processing section; A step of detecting whether the substrate has been processed normally or the substrate has been processed abnormally; and, when the normal processing is detected, transferring the substrate from the process section to the first mounting section. Transporting the substrate from the processing unit to a second mounting unit that houses a plurality of substrates when the processing of the abnormality is detected; and loading the substrate housed in the second mounting unit. A step of inputting a command as to whether or not the substrate is to be transported to the first mounting portion; and, based on the input command, a substrate accommodated in the second mounting portion to the first mounting portion. Transporting the substrate. 12. The substrate processing method according to claim 11, wherein the processing section pre-processes the substrate prior to normal processing, and the pre-processed substrate is removed from the processing section by the second processing section.
Transporting the substrate to a mounting portion. 13. The substrate processing method according to claim 12, wherein an instruction is input as to whether or not the pre-processed substrate is to be transported from the second mounting portion to the first mounting portion. And a step of transporting the preprocessed substrate from the second mounting portion to the first mounting portion based on the input command. 14. A process in which a substrate is transported from a first mounting portion accommodating a plurality of substrates to a processing unit that processes the substrate; a process in which the substrate is processed in the processing unit; A step of detecting whether the substrate has been processed normally or the substrate has been abnormally processed; and a step of transporting the normally processed substrate and the abnormally processed substrate to the first mounting portion. Determining whether at least the substrate in which the abnormality has been detected among the substrates stored in the first mounting portion is transferred from the first mounting portion to the second mounting portion storing a plurality of substrates; A substrate processing step of inputting a command, and a step of transporting the substrate accommodated in the first mounting portion to the second mounting portion based on the input command. Method. 15. A process for transporting a substrate from a first mounting portion accommodating a plurality of substrates to a process unit for processing the substrate, a process for processing the substrate in the process unit, and a process for processing the substrate in the process unit. A step of pre-processing the substrate prior to the normal processing; a step of transporting the pre-processed substrate from the process section to a second mounting section that houses a plurality of substrates; and the second mounting section Inputting a command as to whether or not to transfer the substrate stored in the first mounting portion to the first mounting portion, and, based on the input command, changing the substrate stored in the second mounting portion to the first mounting portion. Transporting the substrate to the first mounting portion. 16. A step of transporting a substrate from a first mounting portion accommodating a plurality of substrates to a processing section for processing the substrate; a step of processing the substrate in the processing section; A step of pre-processing the substrate prior to the normal processing; a step of transporting the substrate that has been subjected to the normal processing and the substrate that has been pre-processed to the first mounting section; Inputting a command as to whether at least the pre-processed substrate among the substrates accommodated in the plurality of substrates is transported from the first mounting portion to a second mounting portion storing a plurality of substrates, Transporting the substrate accommodated in the first mounting portion to the second mounting portion based on the instruction given.