JP2000073162A - Vapor deposition device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the falling of depositions from a deposition preventive board in the process of vapor deposition, to easily remove depositions from the deposition preventive board after the completion of the vapor deposition and to reutilize the deposition preventive board by heating the deposition preventive board before the arrival of material vapor thereto and cooling the deposition preventive board simultaneously with the start of the arrival of the material vapor to the deposition preventive board by the action of vapor deposition. SOLUTION: Preferably, in the case the action of vapor deposition is temporarily interrupted, heating for a deposition preventive board is again executed from the time of point at which, by the interruption, the arrival of the material vapor to the deposition preventive board is stopped, simultaneously with the restart of the action of the vapor deposition, cooling for the deposition preventive board is executed, and in the case the action of the vapor deposition is finally finished, the cooling or the deposition preventive board is continued. Even in the case the vapor deposition is temporarily interrupted and is restarted like this, the falling of depositions from the deposition preventive board is prevented, and, moreover, after the completion of the vapor deposition, the removal of depositions from the deposition preventive board is made easy. As the deposition preventive board, e.g. stainless having 3 mm sheet thickness is used, and it is made a square-shaped hollow structure of 20 mm thickness. As for the material, in addition to stainless, the one different in physical properties and m.p. such as copper, cobalt, nickel or the like may be used.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vapor deposition apparatus for vaporizing a material by heating and evaporating the material on a substrate. The present invention relates to a vapor deposition device for controlling the temperature of a deposition-preventing plate to be prevented.

[0002]

2. Description of the Related Art The process of dissolving and depositing a material in a vacuum chamber is widely used as a means for forming a metal thin film, and is also applied as a method for forming a magnetic recording layer of a tape-shaped magnetic recording medium. I have. When making tape-shaped magnetic recording media, it is necessary to deposit the vapor of the magnetic material at a certain angle on the base film being cooled, preventing the vapor of the material from sticking to the base film at other inappropriate angles There is a need. In addition, a deposition-preventing mechanism is necessary to facilitate protection of the apparatus and recovery of materials, and a large number of deposition-preventing plates are installed in the vapor deposition apparatus.

[0003]

The role of a deposition-preventing plate in a vapor deposition apparatus is very important. In particular, it is important in producing a tape-shaped magnetic recording medium in which material vapor is adhered to a base film only at a specific angle. FIG. 4 shows a schematic view of the inside of a conventional vapor deposition apparatus.

[0004] In order to attach a high-temperature metal vapor (magnetic material vapor) to a base film which is a polymer film, the base film needs to be in close contact with a cooling roll. The magnetic material in the crucible is heated and evaporated by the irradiation of the electron beam, and the vapor evaporates most directly above, but the vapor flies to a substantially horizontal angle in the figure. In this case, in order to improve the recording / reproducing characteristics, it is necessary to prevent the vapor of the material from adhering to the base film at a specific angle by the deposition-preventing plates 1 and 2. Also,
There is a need to protect the equipment from high temperature metal vapor and to facilitate the recovery of material metals.

[0005] Here, since only the material evaporated at a specific narrow angle adheres to the base film, the utilization efficiency of the magnetic material in the crucible is about 10%, and the remaining 90% is composed of the adhered matter in the apparatus. Become. Therefore, the amount of material adhering to the deposition-preventing plate becomes large depending on the location. If the deposition is interrupted after the continuous deposition on the long base film and the deposition is performed again, the deposits on the deposition-preventing plate fall into the apparatus. This phenomenon occurs. The falling phenomenon of the deposit causes generation of dust, damage to the apparatus due to the increase in the weight of the deposit, falling to the molten material in the crucible, and scattering of the molten material due to the falling. As a means for preventing such a phenomenon, there is a method of providing irregularities on the surface of the deposition preventing plate. Although this method makes it possible to almost completely prevent the fall of the deposits, it has become extremely difficult to remove the deposits from the deposition-preventing plate, and it has become virtually impossible to reuse the deposition-prevention plate.

According to the present invention, it is possible to prevent the deposits from dropping from the deposition-preventing plate during the deposition on the substrate, to facilitate the removal of the deposits from the deposition-preventing plate after the vapor deposition, and to reuse the deposition-preventing plate. It is an object of the present invention to provide a vapor deposition apparatus that enables the above.

[0007]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention relates to a vapor deposition apparatus which shields material vapor by a deposition-preventing plate and prevents the vapor from adhering to an inappropriate portion of a substrate. Controlling the temperature of the deposition-preventing plate; heating the deposition-preventing plate before the material vapor reaches the deposition-preventing plate; It is intended to provide a vapor deposition apparatus characterized in that the deposition is performed in such a manner that the deposition is cooled.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention controls the temperature of a deposition-preventing plate by heating and cooling the deposition-preventing plate in a vapor deposition apparatus.
Prevents falling off of deposits from the deposition prevention plate during the vapor deposition operation,
Further, after the deposition is completed, it is easy to remove the deposits from the deposition-preventing plate.

Here, depending on the melting point of the material to be evaporated, the amount of evaporation, the distance between the deposition-preventing plate and the evaporation source, etc., the content of temperature control of the deposition-preventing plate, specifically, the temperature of the deposition-preventing plate, heating and cooling are required. It goes without saying that time needs to be optimized.
Examples of the present invention in which conditions are optimized at the present stage will be described below, but these numerical values do not limit the claims of the present invention.

As the material used for the anti-adhesion plate, stainless steel is used as an example. No problems occurred and the device was usable. Therefore, in the present invention, the material used as the deposition preventing plate is not limited by the following specific description.

Hereinafter, the present invention will be described more specifically based on experimental results. The thing shown in FIG. 1 was created as a deposition prevention plate. The material is stainless steel with a thickness of 3 mm,
The hollow structure had a substantially square shape with a thickness of 20 mm. As shown in FIG. 2, the vertical and horizontal external dimensions were both 500 mm, and the internal path of the hollow structure was as shown in FIG.

As shown in FIG. 3, the deposition-preventing plate was placed just above the crucible to form a vapor deposition apparatus for an experiment. The distance from the crucible was 300 mm. The crucible used here has an inner dimension of 100 mm both vertically and horizontally and a depth of 80 mm, and the material is MgO. Cobalt as a magnetic material was put therein, and heated and evaporated by a 90-degree deflection type electron gun that changes the direction of an electron beam using a magnetic field. In this series of experiments, the beam power of the electron gun was 10 KW. In addition, a pipe is connected to the path inside the deposition-preventing plate so that a heating / cooling medium can be introduced or discharged into the path. Further, a thermocouple was provided outside the crucible side (adhered matter side) of the adhesion preventing plate, and the temperature of the stainless steel plate was measured. The following experiment was performed using these facilities.

Experiment 1 (Example 1) Air at 500 ° C. was introduced into the deposition-inhibiting plate. The thermocouple then showed 300 ° C. and the return air was saturated at 330 ° C.
In this state, the electron gun was operated to heat and evaporate cobalt. The temperature of the thermocouple of the deposition-preventing plate immediately before moving the shutter to deposit cobalt was 310 ° C. Here, the shutter was opened to start the deposition of cobalt on the deposition-preventing plate, and at the same time, the air introduced into the deposition-preventing plate was at -20 ° C. In this state, deposition of cobalt was performed for 30 minutes.
At this time, the thermocouple was in the range of 305 to 323 ° C and was calm. As soon as the shutter was closed and the adhesion was completed, the temperature dropped, and after one minute the cooling proceeded to 50 ° C. During this experiment, cobalt adhering to the deposition-preventing plate did not peel off from the deposition-preventing plate and did not fall. Thereafter, the chamber was opened, the anti-adhesion plate was taken out, and attached matter was removed. Deposits could be easily removed by applying an impact to the anti-adhesion plate with a plastic hammer.

Experiment 2 (Comparative Example to Example 1: Comparative Example 1) Cooling water at 20 ° C. was flowed into the deposition-preventing plate, and the cobalt in the crucible was heated by an electron gun. Was moved to deposit cobalt on the deposition-preventing plate.
The thermocouple showed a temperature of 22 ° C. with no cobalt adhering to the deposit before the shutter was moved. The temperature indicated by the thermocouple increased after the shutter was moved and cobalt began to adhere, and reached 83 ° C. 16 minutes after the shutter was moved. At this point, the experiment was terminated because the cobalt adhering to the deposition-preventing plate was peeled off from the deposition-preventing plate and dropped. After the chamber was opened, falling objects were confirmed, but the thickness was 3 mm.

Experiment 3 (Comparative Example to Example 1: Comparative Example 2) An experiment similar to Experiment 2 was performed without introducing anything into the deposition-preventing plate. Since the expansion of the air in the deposition-preventing plate was expected, the inside of the deposition-preventing plate was evacuated to 1.0 × 10 ⁴ pa by a vacuum rotary pump in advance, and the pipe was closed and sealed. The temperature indicated by the thermocouple was 132 ° C. by the time the cobalt in the crucible was heated using an electron gun to evaporate and move the shutter. When the shutter was moved and the adhesion to the anti-adhesion plate started, the temperature further increased and reached 590 ° C. After depositing cobalt on the deposition-preventing plate for 30 minutes, the shutter was moved to terminate the deposition of cobalt, and after the heating with the electron gun was completed, the chamber was opened. Thereafter, the anti-adhesion plate was removed and an attempt was made to remove cobalt. Although force and impact were applied to the extent that the anti-adhesion plate was deformed using a rag and a hammer, only a small part of the deposited cobalt could be removed.

Experiment 4 (Example 2) Air at 500 ° C was introduced into the deposition-preventing plate. 300 thermocouples
° C. In this state, the electron gun was operated to heat and evaporate the cobalt. The temperature of the thermocouple immediately before the deposition of cobalt was 316 ° C. Here, the shutter is opened to start adhering to the deposition-preventing plate, and simultaneously the air introduced into the deposition-preventing plate is-
Air at 20 ° C was used. In this state, 15
Minutes. Thereafter, the shutter was closed to suspend the adhesion, but at the same time, the air was switched to air at 500 ° C. by introducing the air into the deposition prevention plate. In this state, the adhesion was interrupted for 5 minutes, and then the shutter was opened again to resume the adhesion.
The air introduced into the deposition-preventing plate was changed to air at −20 ° C., and adhesion was performed again for 15 minutes. During this deposition, the thermocouple, including interruptions, showed a temperature of 300-325 ° C.
The shutter was closed in a state where the air at −20 ° C. was introduced into the deposition-preventing plate to terminate the deposition of cobalt. The temperature of the thermocouple also dropped sharply. Specifically, cooling progressed to 50 ° C. after one minute. During this experiment, cobalt adhering to the deposition-preventing plate did not peel off from the deposition-preventing plate and did not fall. Thereafter, the chamber was opened, the anti-adhesion plate was taken out, and attached matter was removed. However, the attached matter was easily removed by applying an impact with a plastic hammer.

Experiment 5 (Comparative Example to Example 2: Comparative Example 3) An experiment was started in the same procedure as in Experiment 3. That is, the air in the deposition-preventing plate is evacuated to 1.0 × 10 ⁴ p by a vacuum rotary pump.
The air was exhausted to a, and the pipe was closed and sealed. afterwards,
The cobalt in the crucible was heated and evaporated using an electron gun. By the time the shutter was moved, the temperature indicated by the thermocouple was 131 ° C., and when the shutter was moved and the adhesion to the anti-adhesion plate started, the temperature rose to 595 ° C. In this state, adhesion was performed for 15 minutes, the shutter was closed, the adhesion was interrupted for 5 minutes, and then adhesion was performed again for 15 minutes. With the 5 minute break in deposition, the temperature of the thermocouple dropped to 573 ° C, but increased to 589 ° C with subsequent deposition. After the completion of the two depositions of cobalt, the chamber was opened, the anti-adhesion plate was removed, and an attempt was made to remove the deposits. Although a force and an impact were applied to the extent that the adhesion-preventing plate was deformed using a hammer and a rag, the attached cobalt could not be removed.

Experiment 6 (Comparative Example to Example 2: Comparative Example 4) Air at 500 ° C was introduced into the deposition-inhibiting plate. Then, the thermocouple showed 300 ° C., and the temperature of the returning air was saturated at 332 ° C. In this state, the electron gun was operated to heat and evaporate the cobalt. The thermocouple of the deposition-preventing plate immediately before the deposition of cobalt was 315 ° C. At this time, the shutter was opened to start deposition of cobalt on the deposition-preventing plate, and at the same time, the air introduced into the deposition-preventing plate was changed to air at -20 ° C. In this state, cobalt was deposited. The thermocouple at this time showed almost 320 ° C. Let adhere for 15 minutes in this state,
Thereafter, the shutter was closed to suspend the adhesion for 5 minutes, and then the shutter was opened to resume the adhesion. Upon discontinuation of the 5 minute deposition, the thermocouple temperature dropped sharply to 38 ° C. Immediately after the adhesion was resumed, the adhesion dropped. This experiment was terminated here.

In Example 1, which was shown in Experiment 1 as Example 1, the deposition-preventing plate was heated before the deposition of cobalt, and the deposition-preventing plate was cooled during and after the deposition of cobalt. No fall-off, and the deposits on the anti-adhesion plate could be easily removed.

On the other hand, what was shown in Experiment 2 as Comparative Example 1 was one in which the deposition-preventing plate was continuously cooled by cooling water, which was prevented during the deposition of cobalt. Extraneous matter came off from the plate. Comparative Example 2
In Experiment 3, the temperature of the deposition-preventing plate was increased by the heat of cobalt adhering to the deposition-preventing plate without introducing anything. Deposits did not occur from the deposits, but the deposits could not be removed by opening the chamber, removing the deposits and applying a strong impact.

Next, what was shown in Experiment 4 as Example 2 was to heat the deposition-preventing plate before deposition and during the suspension of deposition, and to cool the deposition-prevention plate during deposition and after the final deposition was completed. is there.
During the attachment and during the suspension of the attachment, there was no drop of the attached matter, and the attached matter was easily removed from the adhesion preventing plate.

On the other hand, in Comparative Example 3 shown in Experiment 5, the temperature of the deposition-preventing plate was increased by the heat of cobalt adhering to the deposition-preventing plate without any introduction. Even if the adhesion was interrupted and the adhesion was restarted, the adhesion did not drop, but the adhesion on the anti-adhesion plate could not be removed. Further, in Comparative Example 4 shown in Experiment 6, the deposition-preventing plate was heated with air at 500 ° C. before the deposition of cobalt, and after the deposition was started, including the time during which the deposition was interrupted. Although it was always cooled with air at −20 ° C., the adhered material dropped almost at the same time as the resumed adhesion after the suspension of the adhesion.

[0023]

As described above, the vapor deposition apparatus of the present invention prevents the deposits from falling from the deposition-preventing plate during the vapor deposition on the substrate,
Furthermore, after the deposition is completed, it is possible to easily remove the deposits from the deposition-preventing plate, and to reuse the deposition-preventing plate. Further, according to the vapor deposition apparatus of claim 2, even when the vapor deposition is temporarily interrupted and resumed, it is possible to prevent the adhered substance from falling from the deposition-preventing plate, and further, to prevent the deposition from the deposition-prevented plate after the vapor deposition is completed. Facilitates removal,
Enables reuse of anti-corrosion plates.

[Brief description of the drawings]

FIG. 1 is a view showing a structure of a deposition prevention plate according to an embodiment.

FIG. 2 is a diagram showing an internal path of a deposition-preventing plate according to one embodiment.

FIG. 3 is a view for explaining an installation position of a deposition prevention plate according to one embodiment.

FIG. 4 is a diagram showing a conventional example.

Claims (2)

[Claims] 1. A vapor deposition apparatus for shielding a material vapor by an anti-adhesion plate to prevent the material vapor from adhering to an inappropriate portion of a substrate. A vapor deposition apparatus characterized in that the deposition plate is heated before the material vapor reaches, and the deposition plate is cooled at the same time as the material vapor starts to reach the deposition plate by a vapor deposition operation. . 2. The vapor deposition apparatus according to claim 1, wherein when the vapor deposition operation is temporarily interrupted, the vapor deposition plate is heated again when the material vapor stops reaching the vapor deposition plate due to the interruption. A vapor deposition apparatus that cools the deposition-preventing plate at the same time as restarting the vapor deposition operation, and continues cooling the deposition-preventing plate when the vapor deposition operation is finally ended.