JP2000058216A - Socket for electric component and its assembling method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket for an electric component and its contact pin ranging method capable of enhancing assembling capability of plate member by positioning and ranging contact pin tips. SOLUTION: In an IC socket 11, a plurality of contact pins 14 are arranged in matrix, a slide plate 16 which is a plate member is arranged, and the tips of the contact pins 14 are placed on the top of the slide plate 16. A center plate 15 acting as a positioning member is installed so as to be moveable in the extending direction of the contact pin 14 in a socket body 13, a positioning hole 15c into which each contact pin 14 is inserted is formed in a center plate 15, each contact pin 14 is pressure-inserted into the socket body 13, then the center plate 15 is moved toward the tip of the contact pin 14 to position the tip of the contact pin 14 inserted into the positioning hole 15c.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket for an electric component for detachably holding an electric component such as a semiconductor device (hereinafter referred to as an "IC package"), and more particularly to a method for aligning contact pins when assembling the socket. The present invention relates to a suitable socket for electrical components and a method for assembling the socket.

[0002]

2. Description of the Related Art Conventionally, as this kind of "socket for electric parts", there is an IC socket for detachably holding an IC package as an "electric part".

[0003] In this method, a plurality of contact pins are arranged in a matrix and press-fitted into a socket body, and a slide plate and a top plate, for example, are sequentially laminated on the upper side thereof.

An insertion hole is formed in each of the plates, and the upper portions of the contact pins are inserted into the insertion holes.

On the top plate, for example, an IC package called BGA (Ball Grid Alley) is mounted, and a slide plate is slidably mounted on the socket body. By moving the upper operation member vertically movable with respect to the socket body up and down, the slide plate is slid via the link mechanism.

When the upper operation member is lowered, the slide plate is slid and pushed by the slide plate, whereby the tip end (upper end) of the contact pin is elastically deformed and retracted from the IC package terminal (solder ball) insertion area. Is done. Next, after placing the IC package on the top plate, inserting the solder balls of the IC package into the through holes of the top plate, and then raising the upper operation member, the slide plate returns to the original position, The upper ends of the contact pins are brought into contact with the solder balls of the IC package.

[0007]

However, in such a conventional device, when assembling a plate member such as a slide plate or a top plate, the upper ends of the contact pins press-fitted into the socket main body are separated from each other. If the distance between the pins at the upper end of each contact pin is poor, the work of inserting the contact pins is very difficult and time-consuming because the pins must be inserted into the through holes formed in the plate. Was. In particular, since the size of the IC package has been rapidly reduced and the pitch of each terminal has been narrowed, each contact pin also has a narrow pitch.

Accordingly, the present invention provides a socket for electrical components and a method of aligning the contact pins, which can improve the assemblability of the plate member by positioning and aligning the tip portions of the contact pins.

[0009]

In order to achieve the above object, according to the first aspect of the present invention, a plurality of contact pins are arranged in a matrix on a socket body, and a plate member is provided on the socket body. Is disposed, the contact pin is inserted into a plurality of insertion holes formed in the plate member, and the tip end of the contact pin can contact a terminal of an electric component mounted on the upper side of the plate member In the electrical component socket, a positioning member is disposed in the socket body so as to be movable along an extension direction of the contact pin, and a positioning hole through which the contact pin is inserted is formed in the positioning member. After press-fitting each of the contact pins into the socket body, the positioning member is moved toward the distal end of the contact pin, so that the socket inserted into the positioning hole is moved. Characterized in that the socket for electrical parts which enables positioning the leading end of Takutopin.

According to the second aspect of the present invention, the first aspect is provided.
In addition to the configuration described above, the contact pin has a pair of holding pieces, a contact portion formed at the tip of the two holding pieces,
The terminal of the electric component is sandwiched, and when pressed into the socket main body, the contact portion of the two sandwiching pieces is configured to open, and the positioning member is moved toward the distal end side of the contact pin. In this case, the contact portions of the contact pins are elastically deformed in the closing direction.

According to the invention described in claim 3, according to claim 2
In the method for assembling a socket for an electrical component according to the above aspect, a positioning member is provided in the socket body, the contact pin is inserted into a positioning hole of the positioning member, and press-fitted into the socket body. A pressing portion of a slide plate for opening and closing the two contact portions is inserted between the holding pieces, the slide plate is slidably disposed, and then the positioning member is moved toward the contact pin tip. Thereby, the two holding pieces are elastically deformed to hold the pressing portion and close the two contact portions. Thereafter, the closed two contact portions are inserted into the insertion holes of the top plate on which the electric components are mounted. A method for assembling a socket for an electric component in which a top plate is disposed by inserting a part.

[0012]

Embodiments of the present invention will be described below.

[First Embodiment of the Invention] FIGS. 1 to 10 show a first embodiment of the present invention.

First, the structure will be described.
An IC socket as an “electric component socket”. The IC socket 11 is connected to a solder ball as a “terminal” of the IC package in order to perform a performance test of an IC package (not shown) that is an “electric component”. , For electrically connecting a measuring instrument (tester) to a printed wiring board (not shown).

In this IC package, a number of solder balls protrude from the lower surface of the package body, and these solder balls are arranged in a matrix.

On the other hand, the IC socket 11 has a socket body 13 mounted on a printed wiring board, and a contact pin 14 is attached to the socket body 13 and a "positioning member" is provided on the socket body 13. , A slide plate 16 as a “plate member” and a top plate 17 are sequentially laminated.

The center plate 15 has a substantially U-shaped cross section as shown in FIG. 1, and includes a flat plate portion 15a and guide pieces 15b extending downward from both ends of the flat plate portion 15a.
It is composed of As shown in FIG. 7 and the like, a large number of positioning holes 15c into which the contact pins 14 are inserted and positioned are formed at a predetermined pitch in the flat plate portion 15a. In addition, the guide piece 15b is
By slidingly contacting the vertical wall 13a, the center plate 15 is disposed so as to be movable in the vertical direction (extending direction of the contact pin 14), and a locking hole 15d is formed at the lower end of both guide pieces 15b. ing. Then, as shown in FIGS. 1 and 4, at the position where the center plate 15 is raised, that is, at the position where the flat plate portion 15 a is close to the tip of the contact pin 14, the stopper shaft 19 is inserted into the locking hole 15 d. The center plate 1
5 is locked.

Further, the slide plate 16 is disposed so as to be able to move laterally in the left-right direction in FIG. 1, and the slide plate 16 is made to move laterally by a mechanism described later, so that a contact arranged on the socket body 13 is provided. The pin 14 is elastically deformed.

Further, a top plate 17 is disposed above the slide plate 16 in a state where the top plate 17 is fixed to the socket body 13.
Further, a quadrangular frame-shaped upper operation member 21 is provided so as to be vertically movable, and by moving the upper operation member 21 up and down, the sliding operation is performed via an X-shaped link 22 shown in FIGS. The plate 16 is moved sideways.

More specifically, the contact pins 14
Is formed of a long plate material having excellent spring properties and excellent conductivity, so that the solder ball is sandwiched between both contact portions 14c formed at the tip portions (upper end portions) of the pair of sandwiching pieces 14a, 14a. It has become.

The lower side of the contact pin 14 is press-fitted into the press-fitting hole 13b of the socket body 13, and the lower part of the lead portion 1 as shown in FIG.
4b is projected, and the lead portion 14b is electrically connected to the printed wiring board.

The holding pins 14a, 14 of the contact pins 14 projecting from the upper surface of the socket body 13.
a is a positioning hole 15 c of the center plate 15, an insertion hole 16 of the slide plate 16 and the top plate 17.
a, 17a.

The one holding piece 14a of the contact pin 14 has a slide plate 1 (details are omitted).
By being elastically deformed by being pressed by the pressing portion 6, the solder ball is separated from the side of the solder ball. Further, the other holding piece 14a is
6, it is not pressed but elastically comes into contact with the solder ball. And both holding pieces 1
Reference numerals 4a and 14a are in contact with both sides of the solder ball so as to sandwich the solder ball.

Further, the top plate 17 has a quadrangular shape, on which an IC package is mounted, and an insertion hole 17 of the top plate 17.
The solder ball of the IC package is inserted into a.

Further, the top plate 17 has a structure shown in FIG.
As shown in the figures, guide portions 17b for positioning when mounting the IC package are provided at four locations corresponding to each corner of the IC package.

On the other hand, the upper operating member 21 corresponds to FIGS.
As shown in the figure, the opening 21a has a rectangular frame shape having an opening 21a large enough to insert an IC package.
IC package is inserted through the top plate 1
The upper operating member 21 is disposed on the socket body 13 so as to be vertically movable. Then, as shown in FIG.
Is a spring 24 disposed between the socket body 13
Urged upward by

Further, the X-shaped links 22 are provided corresponding to both side surfaces of the rectangular slide plate 16 along the lateral movement direction.

More specifically, as shown in FIGS. 4 and 6, this X-shaped link 22 has a first link member 2 of the same length.
3 and a second link member 25, which are rotatably connected by a center connecting pin 27.

The lower end 23a of the first link member 23 is rotatably connected to the socket body 13 by a lower end connecting pin 29, while the lower end 25a of the second link member 25 is Is rotatably connected to one end of a side surface along the lateral movement direction by a lower end connecting pin 30. In addition, these first and second link members 23,
The upper end portions 23b, 25b of the 25 are rotatably connected to the upper operation member 21 by upper end connecting pins 33, 34. An elongated hole 23c is provided in an upper end portion 23b of the first link member 23, and an upper end connecting pin 33 is formed through the elongated hole 23c.
, And is connected to the upper operation member 17.

A pair of latches 36 are provided on the socket body 13 so as to be rotatable about a shaft at a lower end thereof, so as to engage and disengage with a side edge of the IC package set at a predetermined position. The spring 3 is set as shown in FIG.
7 is urged in the locking direction. The upper operation member 21 is formed with a protrusion 21b that slides on the latch 36 and rotates in the detaching direction when descending.
reference).

Next, a method of assembling the IC socket 11 will be described.

First, the center plate 15 is fitted in the socket body 13 and the center plate 15 is set at a lowered position (see FIG. 7).

In this state, the contact pins 14 are
Is inserted into the positioning hole 15c of the center plate 15 and pressed into the press-fit hole 13b of the socket body 13. Thus, a large number of contact pins 14 are provided. In this state, there is a possibility that the position of the upper end portion of both holding pieces 14a of each contact pin 14 is shifted from a predetermined position (see FIG. 8).

Next, the center plate 15 is raised as shown in FIG. 9 and is moved toward the tip of the contact pin 14, so that both contact portions 14c of the both holding pieces 14a are positioned in the positioning holes of the center plate 15. It is positioned at a predetermined position at 15c.

Thereafter, the two holding pieces 14a are inserted into the insertion holes 16a of the slide plate 16, and the slide plate 16 is disposed so as to be able to move laterally, and the contact portions 14c projecting upward from the slide plate 16 are provided. Into the insertion hole 17a of the top plate 17,
The top plate 17 is provided (see FIG. 10).

As described above, when the contact pins 14 are press-fitted, the center plate 15 is set at the lower position, and the positioning holes 15c of the center plate 15 are brought closer to the press-fit holes 13b of the socket body 13, so that the contact pins 14
Can be substantially simultaneously inserted into the positioning holes 15c and press-fitted into the press-fit holes 13b, so that the workability of disposing the contact pins 14 can be improved. Also, when assembling the slide plate 16 and the top plate 17,
Raise the center plate 15 and contact pins 14
By approaching the tip, the contact portion 14c can be accurately positioned.

Accordingly, since the contact portion 14c of the holding piece 14a is positioned as described above, the insertion holes 16a, 17 of the slide plate 16 and the top plate 17 are provided.
a, and can be easily inserted into each plate 16, 17
Can be improved in assembling workability.

[Second Embodiment of the Invention] FIGS. 11 to 19
Shows a second embodiment of the present invention.

In the second embodiment, a socket body 43 is composed of a base member 44 and a press-fitting plate 45, and a press-fitting hole 45a for press-fitting a contact pin 46 is formed in the press-fitting plate 45. 4
5 is fixed to the base member 44 by bolts 47.

The contact pin 46 has a pair of holding pieces 46a, and a contact portion 46b formed at the tip of both holding pieces 46a holds the solder ball of the IC package. When no external force is applied to the two holding pieces 46a at the time of press-fitting into the socket body 43, the two contact portions 46b of the two holding pieces 46a are configured to open.

Further, a center plate 48 as a "positioning member" is provided on the press-fitting plate 45 so as to be vertically movable. The center plate 48 includes a flat plate portion 48a and a guide piece 48b as in the first embodiment.
The flat plate portion 48a has a substantially U-shaped cross section.
A positioning hole 48c into which the contact pin 46 is inserted is formed, and a locking hole 48d is formed in the guide piece 48b.

By moving the center plate 48 toward the tip of the contact pin 46, the holding piece 46a is elastically deformed in a direction to close both contact portions 46b of the contact pin 46.

A slide plate 49 is disposed above the center plate 48 so that a pressing portion 49a formed on the slide plate 49 is inserted between the two holding pieces 46a of the contact pin 46. It has become.

The slide plate 49 is slid rightward in the figure from the state shown in FIG. 11 to the state shown in FIG. 12 via the X-shaped link 22 by lowering the upper operation member 21. The pressing portion 49a of the slide plate 49 is
, One holding piece 46a is elastically deformed, and both contact portions 46b are opened.

The illustration of the top plate is omitted.

Next, the IC socket 1 of the second embodiment
The method of assembling No. 1 will be described.

First, the center plate 48 is fitted to the press-fitting plate 45, and the center plate 48 is set at a lowered position (see FIG. 13).

In this state, the contact pins 46 are
Is inserted into the positioning hole 48c of the center plate 48 and pressed into the press-fit hole 45a of the press-fit plate 45. Thus, a large number of contact pins 46 are provided. In this state, the space between both holding pieces 46a of each contact pin 46 is widened (see FIG. 14).

Next, as shown in FIG. 15, the pressing portion 49a of the slide plate 49 is
The slide plate 49 is slidably disposed on the press-fitting plate 45 (see FIG. 17).
As described above, since both holding pieces 46a are in the opened state,
The pressing portion 49a of the slide plate 49 can be easily inserted between the two holding pieces 46a, and the assembling work of the slide plate 49 can be easily performed.

Thereafter, as shown in FIG. 16, by raising the center plate 48 and moving it toward the tip of the contact pin 46, the two holding pieces 46a are elastically deformed in the closing direction (see FIGS. 18 and 19). . Thus, the slide plate pressing portion 49a is held between the two holding pieces 46a. Thereby, both contact portions 46b of both holding pieces 46a are positioned at predetermined positions in a closed state.

Then, the two contact portions 46b are inserted into the insertion holes of the top plate (not shown) to dispose the top plate. With this configuration, since the two contact portions 46b are positioned as described above, the contact portions 46b can be easily inserted into the insertion holes of the top plate, and the workability of assembling the top plate can be improved.

Also, by prestressing the contact pins 46 by raising the center plate 48 and elastically deforming the holding pieces 46a in the closing direction, the contact pressure against the solder balls of the IC package is secured. In addition, the holding piece 46a itself can be made of a material having low rigidity. If the holding piece 46a having low rigidity, for example, a thin holding piece 46a, can be used, the entire contact pin 46 can be made thinner and smaller, and accordingly, it is possible to cope with a narrower pitch.

The other configuration and operation are the same as those of the first embodiment, and the description is omitted.

In each of the first and second embodiments,
Although the present invention has been applied to a so-called open-top type IC socket, the present invention is not limited to this, and can be applied to a so-called clamshell type IC socket.

In this IC socket, a cover is disposed on the socket body so as to be openable and closable, and a floating plate as a “plate member” on which the IC package is mounted is vertically moved via a spring on the socket body. A pressing member for pressing the IC package from above is provided on the cover side.

A plurality of contact pins are press-fitted into the socket body, and the contact portions at the upper ends of the contact pins are inserted into the through holes of the floating plate.

Even in such a case, when the floating plate is provided, it is necessary to insert the upper end of the contact pin into each of the through holes of the floating plate. By positioning the contact portions, the assemblability of the floating plate can be improved.

Further, in each of the above embodiments, the present invention is applied to the IC socket 11 as a "socket for electric parts", but it is needless to say that the present invention is not limited to this and can be applied to other devices. In addition, a BGA type IC package is applied as the “electric component”, but the present invention is not limited to this, and any other IC package may be used as long as a plurality of terminals are arranged in a matrix. But it is good. Further, in the above-described embodiment, the center plates 15 and 48 are lifted and stopped in a state where the contact pins 14 and 46 are positioned. However, the slide plates 16 and 49 are assembled after positioning. After that, it can be lowered.

[0059]

As described above, according to the present invention, the positioning member is disposed movably with respect to the socket body, and when the contact pin is press-fitted,
By positioning the positioning member at a position where it is easy to press-fit, and by moving the positioning member toward the front end of the contact pin after press-fitting, the tip of the contact pin can be positioned. Therefore, it is possible to easily perform the work of arranging the contact pins and to improve the accuracy of the interval between the contact pin tips, so that the plate member can be easily assembled and the contact pin tips can be easily assembled. The pitch of the portion can be reduced.

According to the second aspect of the present invention, in addition to the above-described effects, by moving the positioning member toward the tip end of the contact pin, both contact portions of the contact pin are elastically deformed in the closing direction. As a result, a preload can be applied to the contact pins, the contact pressure to the electric component terminals can be ensured, and the rigidity of the contact pins can be reduced. As a result, the pitch of the contact pins can be reduced.

According to the third aspect of the present invention, in addition to the above effects, when the contact pin is press-fitted into the socket body, since both holding pieces are open, the pressing portion of the slide plate is inserted between them. Therefore, the present invention has a practically useful effect that the workability of assembling the slide plate can be improved.

[Brief description of the drawings]

FIG. 1 is a sectional view taken along a vertical plane of an IC socket according to a first embodiment of the present invention.

FIG. 2 is a plan view of the IC socket according to the first embodiment.

FIG. 3 is a partially cutaway front view of the IC socket according to the first embodiment;

FIG. 4 is a cross-sectional view showing a different cross-sectional position with respect to a center line of the IC socket according to the first embodiment;

FIG. 5 is a right side view of the IC socket according to the first embodiment.

FIG. 6 is a schematic diagram showing an X-shaped link and the like of the IC socket according to the first embodiment;

FIG. 7 is a perspective view showing a state where the contact pin according to the first embodiment is inserted into a center plate positioning hole.

FIG. 8 is a cross-sectional view showing a state where the contact pin according to the first embodiment is pressed into a socket body.

FIG. 9 is a cross-sectional view corresponding to FIG. 8, illustrating a state in which the center plate according to the first embodiment is raised and contact pins are positioned.

FIG. 10 is a cross-sectional view corresponding to FIG. 8, showing a state where a top plate and the like according to the first embodiment are provided.

FIG. 11 is a sectional view of an IC socket according to a second embodiment of the present invention.

FIG. 12 is a cross-sectional view corresponding to FIG. 11, showing a state where the upper operation member according to the second embodiment is lowered.

FIG. 13 is a cross-sectional view showing a state at the time of press-fitting the contact pin according to the second embodiment.

FIG. 14 is a cross-sectional view showing a state where the contact pin according to the second embodiment is press-fitted.

FIG. 15 is a cross-sectional view showing a state when the slide plate according to the second embodiment is provided.

FIG. 16 is a cross-sectional view showing a state where the center plate according to the second embodiment is raised and contact pins are positioned.

FIG. 17 is an enlarged view of a portion A in FIG. 15 according to the second embodiment.

FIG. 18 is an enlarged view of a portion B in FIG. 15 according to the second embodiment.

FIG. 19 is an enlarged view of a portion C in FIG. 16 according to the second embodiment.

[Explanation of symbols]

 11 IC socket (socket for electrical parts) 13 Socket body 13a Press-fit hole 14 Contact pin 14a Nipping piece 14c Contact part 15 Center plate (positioning member) 15a Flat plate part 15b Guide piece 15c Positioning hole 16 Slide plate (plate member) 16a Insertion hole 17 Top plate 17a Insertion hole 21 Upper operation member 22 X-shaped link 43 Socket body 45 Press-fit plate 45a Press-fit hole 46 Contact pin 46a Nipping piece 46b Contact part 48 Center plate (positioning member) 48a Flat plate part 48c Positioning hole 49 Slide plate (plate) Member) 49a Pressing part

Claims (3)

[Claims] 1. A plurality of contact pins are arranged in a matrix on a socket body, and a plate member is arranged on the socket body, and the contact pins are inserted into a plurality of insertion holes formed in the plate member. Is inserted, and the tip of the contact pin is made to be able to contact the terminal of the electrical component placed on the mounting portion. In the socket for the electrical component, the positioning member is attached to the socket body in the extending direction of the contact pin. Along with the positioning member, the positioning member is formed with a positioning hole through which the contact pins are inserted. After the contact pins are pressed into the socket body,
A socket for an electrical component, wherein the tip of the contact pin inserted into the positioning hole can be positioned by moving the positioning member toward the tip of the contact pin. 2. The socket body according to claim 1, wherein the contact pin has a pair of holding pieces, and a contact portion formed at a tip portion of each of the holding pieces holds the terminal of the electric component. At the time of press-fitting, the contact portions of the two holding pieces are configured to open, and the positioning member is moved toward the tip side of the contact pin, thereby elastically deforming the contact portions of the contact pin in the closing direction. 2. The electrical component socket according to claim 1, wherein the electrical component socket is configured to be connected to the socket. 3. The method for assembling a socket for an electrical component according to claim 2, wherein a positioning member is disposed in the socket body, the contact pin is inserted through a positioning hole of the positioning member, and press-fitted into the socket body. Thereafter, a pressing portion of a slide plate for opening and closing the two contact portions is inserted between the pair of holding pieces of the contact pin, and the slide plate is slidably disposed. By moving toward the pin tip side, the two holding pieces are elastically deformed to hold the pressing portion and close the two contact portions, and thereafter, the insertion hole of the top plate on which the electric component is placed Wherein the closed contact portions are inserted and the top plate is disposed.