JP3786342B2 - Contact pin and IC socket - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a contact pin that is in contact with and electrically connected to a terminal of an IC package, and more particularly to a contact pin that suppresses deformation of the terminal and an IC socket provided with the contact pin.
[0002]
[Prior art]
Conventionally, there is an IC socket that accommodates an IC package and performs a burn-in test or the like.
[0003]
In the IC package, solder balls as terminals protrude from the package body, and these solder balls are arranged in a grid pattern in columns and rows.
[0004]
On the other hand, in the IC socket, a contact pin that comes into contact with the solder ball of the IC package is disposed on the socket body that accommodates the IC package, and the contact pin is elastically deformed to be separated from and attached to the IC package solder ball. A moving member to be moved is movably disposed, and an operation member for moving the moving member is disposed on the socket body to be movable up and down.
[0005]
These contact pins are provided with a pair of elastic pieces. When these elastic pieces are elastically deformed by a moving member, both contact portions provided at the upper ends of both elastic pieces are opened and closed, and the solder balls are held between them. I try to release it.
[0006]
[Problems to be solved by the invention]
However, in such a conventional IC socket, the elastic force of the elastic piece is ensured so that the elastic piece of the contact pin contacts the solder ball with a predetermined contact pressure. However, when the temperature of the solder ball is increased and softened, the solder ball may be deformed.
[0007]
Therefore, an object of the present invention is to provide a contact pin that suppresses deformation of a terminal and an IC socket provided with the contact pin.
[0008]
[Means for Solving the Problems]
To solve such problems, the invention according to claim 1, the elastic piece is provided that is electrically connected me by to be in contact with the substantially spherical terminal molded with the solder provided on the IC package was the contact pins, the IC socket is arranged in the socket body, the elastic piece is closed is provided a pair so as to sandwich the substantially spherical terminal molded with the solder has an elastic force in a direction, the socket The main body is provided with a top plate on which an electrical component is placed, and the top plate is inserted between each contact portion on the upper side of each of the pair of elastic pieces, Positioning ribs that stop moving toward the substantially spherical terminal formed by solder are provided, and the elastic piece is in contact with the substantially spherical terminal formed by the solder, and the elastic piece is Molded Stopper means is provided to stop the movement of the spherical terminal side, the stopper means is at least one of the positioning rib than the upper portion of the pair of elastic pieces is bent in shape of substantially V in a plan view Before the deformation of the substantially spherical terminal formed by the solder, the at least one substantially V-shaped end of the elastic piece is formed on the other end of the pair of elastic pieces. After the substantially spherical terminal formed of the solder is separated from the elastic piece, the substantially U-shaped end portion of the elastic piece comes into contact with the other elastic piece, whereby the both elastic The IC socket is characterized in that the movement of the piece toward the substantially spherical terminal formed with the solder is stopped to prevent the deformation of the substantially spherical terminal formed with the solder.
[0009]
According to a second aspect of the invention, the contact pins elastic piece that is electrically connected me by to be in contact with the substantially spherical terminal molded with the solder provided on the IC package is provided, the socket body In the IC socket disposed in the socket , a pair of the elastic pieces are provided so as to sandwich the substantially spherical terminals formed of the solder with an elastic force in the closing direction, and an electrical component is mounted on the socket body. A substantially spherical terminal that is inserted between each contact portion on the upper side of each of the pair of elastic pieces and is molded with the solder of the elastic piece. Positioning ribs are provided to stop the movement to the side, and the elastic piece is in contact with the substantially spherical terminal molded with the solder, toward the substantially spherical terminal side molded with the solder of the elastic piece. Stop moving Stopper means is provided, said stopper means has a stopper piece extending toward the elastic piece horizontally counterpart from above cut and raised the positioning rib from one of the elastic pieces, molded the by soldering Before the substantially spherical terminal is deformed, the end of the stopper piece is separated from the other elastic piece, and after the substantially spherical terminal formed by the solder is deformed, the stopper piece is moved to the other elastic piece. The IC socket is configured to stop the movement of the two elastic pieces toward the substantially spherical terminal formed of the solder and to prevent the deformation of the substantially spherical terminal formed of the solder by contacting the elastic piece. It is characterized by.
[0010]
According to a third aspect of the present invention, the contact pin according to the first or second aspect is disposed in a socket body that accommodates the IC package, and a moving member that elastically deforms an elastic piece of the contact pin moves. The operation member that is freely arranged and moves the moving member is an IC socket provided on the socket body so as to be movable up and down .
[0011]
According to a fourth aspect of the present invention, in the contact pin according to the first or second aspect, the elastic piece is provided so as to contact a terminal provided on a lower surface of the IC package, and the elastic piece is in contact with the contact pin. The terminal has a substantially spherical shape .
[0012]
According to a fifth aspect of the present invention, in the IC socket according to the third aspect, the elastic piece is provided such that the elastic piece contacts a terminal provided on a lower surface of the IC package, and the elastic piece contacts the terminal. The shape of is substantially spherical .
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below.
[0014]
Embodiment 1 of the Invention
1 to 7 show a first embodiment of the present invention.
[0015]
First, the configuration will be described. Reference numeral 11 in the figure denotes an IC socket. The IC socket 11 is used to perform a performance test of the IC package 12, and a solder ball 12b as a “ terminal ” of the IC package 12 and a measuring instrument ( The tester is intended to be electrically connected to a printed wiring board (not shown).
[0016]
As shown in FIG. 7, the IC package 12 is a so-called BGA (Ball Grid Array) type, and a large number of substantially spherical solder balls 12b protrude from the lower surface of a rectangular package body 12a. They are arranged in rows and columns.
[0017]
On the other hand, the IC socket 11 generally has a socket body 13 made of synthetic resin that is mounted on a printed wiring board (not shown). The socket body 13 has contact pins that are separated from and connected to the solder balls 12b. 15, a moving member 17 for displacing the contact pin 15 is disposed, and a top plate 19 is fixed to the socket main body 13 on the upper side of the moving member 17. . The top plate 19 is provided with a guide portion 20 that guides the IC package 12 and places it at a predetermined position when the IC package 12 is accommodated. Further, an operation member 21 for moving the moving member 17 in the lateral direction is arranged to be movable up and down with respect to the socket body 13.
[0018]
The contact pin 15 has a spring property, and a plate material excellent in conductivity is formed into a shape as shown in FIGS. 2 and 4 by press working.
[0019]
Specifically, the contact pin 15 has a pair of movable elastic pieces 15a and fixed elastic pieces 15b formed on the upper side, and a single solder tail portion 15c formed on the lower side. The pair of elastic pieces 15a and 15b are formed to face each other when the base portion 15d on the lower end side is bent into a substantially U shape. Further, contact portions 15e and 15f that come into and out of contact with the side surfaces of the solder balls 12b of the IC package 12 are formed at the upper end portions (tip portions) of the elastic pieces 15a and 15b. 12b is sandwiched and electrically connected.
[0020]
A "stopper means" that suppresses the deformation of the solder ball 12b by stopping the movement of the both elastic pieces 15a and 15b toward the solder ball 12b while holding the solder ball 12b between the elastic pieces 15a and 15b. Is provided.
[0021]
As shown in the enlarged view of FIG. 6, the “stopper means” has both contact portions 15e and 15f bent in a substantially square shape in plan view, and the substantially square-shaped end portions 15g and 15h are , The movement of both elastic pieces 15a, 15b toward the solder ball 12b is stopped, and the deformation of the solder ball 12b is prevented.
[0022]
The moving member 17 is slidably disposed in the left-right direction (horizontal direction) in FIGS. 3 to 5, and by sliding the moving member 17, the movable side of the contact pin 15 disposed on the socket body 13 is arranged. The elastic piece 15a is elastically deformed and displaced.
[0023]
The moving member 17 is slid through the X-shaped link 22 shown in FIGS. 2 and 3 by moving the operating member 21 up and down. The moving member 17 includes a movable elastic piece. A pressing portion 17a that presses 15a and elastically deforms is formed.
[0024]
The X-shaped link 22 is disposed corresponding to both side surfaces along the sliding direction of the rectangular moving member 17 when viewed from above.
[0025]
Specifically, the X-shaped link 22 has a first link member 23 and a second link member 25 having the same length as shown in FIGS. It is pivotally connected.
[0026]
The lower end portion 23a of the first link member 23 is rotatably connected to the socket body 13 by the lower end connecting pin 29, while the lower end portion 25a of the second link member 25 is in the sliding direction of the moving member 17. Is connected to one end portion of the side surface portion along the lower end connecting pin 30 so as to be freely rotatable. Further, upper end portions 23b and 25b of the first and second link members 23 and 25 are rotatably connected to the operation member 21 by upper end connection pins 33 and 34. The upper end portion 23b of the first link member 23 is provided with a long hole 23c, and is connected to the operation member 21 by an upper end connecting pin 33 through the long hole 23c.
[0027]
Accordingly, when the operation member 21 is lowered, the X-shaped link 22 is displaced as shown by a two-dot chain line in FIG. 3, so that the moving member 17 is moved via the X-shaped link 22 in the two-dot chain line in FIG. 3. The movable side elastic piece 15a of the contact pin 15 is pressed and elastically deformed by the pressing portion 17a of the moving member 17, and the movable side contact portion 15e is displaced in the opening direction.
[0028]
Then, as shown in FIG. 2 and the like, the base portion 15d of the contact pin 15 is press-fitted into a press-fitting hole 13a formed in the socket body 13, and a retaining portion (not shown) formed in the base portion 15d is a socket. By biting into the main body 13, the contact pin 15 is prevented from coming off upward. Then, as shown in FIG. 2, the solder tail portion 15c protruding downward from the socket body 13 protrudes further downward through the locate board 26 and is inserted into each through hole of a printed wiring board (not shown) and soldered. It is designed to be connected by being attached.
[0029]
As shown in FIG. 1, such contact pins 15 are arranged in a lattice form in columns and rows at the same pitch as the solder balls 12 b of the IC package 12.
[0030]
Further, as shown in FIGS. 1, 2, 4 and 5, the top plate 19 has a placement surface portion 19a on which the IC package 12 is placed on the upper side, and as shown in FIGS. A positioning rib 19c inserted between the pair of contact portions 15e and 15f of each contact pin 15 is formed, and no external force is applied to both elastic pieces 15a and 15b of the contact pin 15 (both contact portions 15e and 15f). In a state where 15f is closed), the positioning rib 19c is sandwiched between the elastic pieces 15a and 15b.
[0031]
Further, as shown in FIG. 1, the operation member 21 has a rectangular frame shape and has an opening 21b of a size that allows the IC package 12 to be inserted. The IC package 12 is inserted through the opening 21b. The top plate 19 is placed at a predetermined position on the placement surface portion 19a. The operation member 21 is disposed so as to be movable up and down with respect to the socket main body 13 and is urged upward by a spring (not shown). The operation member 21 is prevented from coming off by being locked to the locked portion.
[0032]
Further, the operating member 21 is formed with an operating portion 21a for rotating the latch 36 shown in FIG.
[0033]
Although not described in detail, the latch 36 is attached to the socket body 13 so as to be rotatable about a shaft 37 and is urged in a closing direction by a spring 38 to be provided at the tip portion. The holding portion 36a is configured to hold the peripheral edge of the package body 12a of the IC package 12.
[0034]
In addition, the latch 36 is formed with a pressed portion 36b with which the operating portion 21a of the operating member 21 abuts. When the operating member 21 is lowered, the operating portion 21a presses the pressed portion 36b. The latch 36 is rotated in the opening direction so that the pressing portion 36a is retracted from the position where the IC package 12 is provided.
[0035]
Next, a method for using the IC socket 11 will be described.
[0036]
In order to set the IC package 12 in the IC socket 11, first, the operation member 21 is pushed downward. Then, the upper end portions 23b and 25b of the link members 23 and 25 of the X-shaped link 22 are pressed downward by the operating member 21, and the moving member 17 is moved to a two-dot chain line in FIG. As shown, it is slid rightward in the figure.
[0037]
Due to the sliding of the moving member 17, the movable side elastic piece 15a of the contact pin 15 is elastically deformed by the pressing portion 17a, and both the contact portions 15e and 15f are opened from the state shown in FIG. 4 to the state shown in FIG.
[0038]
At the same time, the pressed portion 36b of the latch 36 is pushed by the operating portion 21a of the operating member 21 and rotated in the opening direction against the urging force of the spring 38, so that the holding portion 36a is displaced to the retracted position. .
[0039]
In this state, the IC package 12 is released from the automatic machine and guided to a predetermined position by the guide unit 20, whereby the IC package 12 is set at a predetermined position.
[0040]
Thereby, each solder ball 12b of the IC package 12 is inserted between the pair of contact portions 15e and 15f in which each contact pin 15 is opened in a non-contact state.
[0041]
Thereafter, when the downward pressing force of the operating member 21 is released, the operating member 21 is raised by a biasing force such as a spring (not shown), so that the moving member 17 is also returned to the original position and is latched. 36 is rotated in the closing direction by the biasing force of the spring 38.
[0042]
When the moving member 17 is moved, the pressing force applied to the movable elastic piece 15a of the contact pin 15 by the pressing portion 17a is released, and the pair of contact portions 15e and 15f move in the direction of closing (narrowing) to each other. The solder balls 12b are held between the portions 15e and 15f (see (a) of FIG. 6).
[0043]
When a burn-in test is performed in this state, the temperature in the burn-in tank in which the IC socket 11 is stored rises, for example, to about 125 ° C., so that the solder balls 12b are softened and easily deformed. In the state where the solder ball 12b is slightly deformed from the state shown in FIG. 6A to the state shown in FIG. 6B, the end portions 15g and 15h of both contact portions 15e and 15f of the contact pin 15 are Abut. Accordingly, the movement of both elastic pieces 15a and 15b toward the solder ball 12b is stopped in a state where the solder ball 12b is held, so that the deformation of the solder ball 12b is suppressed.
[0044]
On the other hand, in order to remove the IC package 12 from the mounted state, the pair of contact portions 15e and 15f of the contact pin 15 are separated from the solder ball 12b by similarly lowering the operation member 21, and the IC package 12 is removed. Can be removed.
[0045]
[Embodiment 2 of the Invention]
FIG. 8 shows a second embodiment of the present invention.
[0046]
In the second embodiment, one contact portion 15f is formed in a substantially square shape, and an end portion 15h of the contact portion 15f is configured to abut against the other contact portion 15e.
[0047]
According to this, as shown in FIG. 8A, when the solder ball 12b is softened and slightly deformed in a state where the solder ball 12b is sandwiched between the contact portions 15f and 15e, FIG. As shown in (b), the deformation of the solder ball 12b is suppressed by the end portion 15h of one contact portion 15f coming into contact with the other contact portion 15e.
[0048]
In addition, here, since only one of the contact portions 15f needs to be bent in a substantially U-shape, both contact portions 15e and 15f are bent in a substantially U-shape as in the first embodiment. The contact pin 15 can be formed more easily than in the case.
[0049]
Since other configurations and operations are the same as those of the first embodiment, description thereof is omitted.
[0050]
Embodiment 3 of the Invention
FIG. 9 shows a third embodiment of the present invention.
[0051]
The “stopper means” in the third embodiment is formed by cutting and raising a stopper piece 15p extending from one movable elastic piece 15a toward the fixed elastic piece 15b on the other side.
[0052]
When the distal end side of the stopper piece 15p comes into contact with the other fixed-side elastic piece 15b, the movement of both elastic pieces 15a and 15b toward the solder ball 12b is stopped to suppress deformation of the solder ball 12b. Yes.
[0053]
Since other configurations and operations are the same as those of the first embodiment, description thereof is omitted.
[0054]
[Embodiment 4 of the Invention]
FIG. 10 shows a fourth embodiment of the present invention.
[0055]
In the “stopper means” in the fourth embodiment, a stopper piece 15p extending in a substantially C shape is formed from one movable elastic piece 15a to the other fixed side elastic piece 15b.
[0056]
When the distal end side of the stopper piece 15p comes into contact with the other fixed-side elastic piece 15b, the movement of both elastic pieces 15a and 15b toward the solder ball 12b is stopped to suppress deformation of the solder ball 12b. Yes.
[0057]
Since other configurations and operations are the same as those of the first embodiment, description thereof is omitted.
[0058]
[Embodiment 5 of the Invention]
In the fifth embodiment, the “stopper portion” is formed by setting the positioning rib 19c of the top plate 19 provided in the socket main body 13 of the first embodiment to a predetermined thickness. Then, with the positioning rib 19c serving as the “stopper portion”, the movement of the elastic pieces 15a, 15b toward the solder ball 12b is stopped in a state where the solder balls 12b are held between the elastic pieces 15a, 15b. The deformation of 12b is suppressed.
[0059]
Since other configurations and operations are the same as those of the first embodiment, description thereof is omitted.
[0060]
In the above embodiment, the contact pin 15 is provided with a pair of elastic pieces 15a and 15b. However, the present invention is not limited to this, and the contact pin 15 may be provided with an elastic piece only on one side.
[0061]
【The invention's effect】
As described above, according to the invention described in any one of claims 1 to 3 , since the stopper means is provided on the elastic piece of the contact pin, the terminal is softened and easily deformed by a burn-in test or the like. Even if the elastic piece is in contact with the terminal, the deformation of the terminal can be suppressed by stopping the movement of the elastic piece to the terminal side.
[Brief description of the drawings]
FIG. 1 is a plan view of an IC socket according to a first embodiment of the present invention.
2 is a cross-sectional view taken along line AA in FIG. 1 according to the first embodiment. FIG.
FIG. 3 is a schematic diagram showing an X-shaped link, a moving member, and the like according to the first embodiment.
4 is an enlarged cross-sectional view of a main part showing a state in which the contact pin according to Embodiment 1 is closed. FIG.
5 is an enlarged cross-sectional view of a main part showing a state where the contact pin according to the first embodiment is opened. FIG.
6A and 6B are plan views showing a contact pin contact portion and a solder ball according to the first embodiment, where FIG. 6A is a state in which the solder ball is sandwiched between both contact portions, and FIG. The contact state is shown.
7A and 7B are diagrams showing the IC package according to the first embodiment, where FIG. 7A is a bottom view of the IC package, and FIG. 7B is a left side view of FIG. 7A;
FIGS. 8A and 8B are plan views corresponding to FIG. 5 according to Embodiment 2 of the present invention, in which FIG. 8A shows a state in which a solder ball is held between both contact portions, and FIG. 8B shows a state in which both contact portions are in contact with each other; Indicates.
FIG. 9 is a perspective view of a contact pin contact portion side according to Embodiment 3 of the present invention.
FIG. 10 is a perspective view of a contact pin contact portion side according to Embodiment 4 of the present invention.
[Explanation of symbols]
11 IC socket
12 IC package
12a Package body
12b Solder ball (terminal)
13 Socket body
15 Contact pin
15a Movable elastic piece
15b Fixed elastic piece
15e, 15f contact area
15p stopper piece
17 Moving member
19 Top plate
21 Operation parts

Claims (3)

Contact pins elastic pieces which are electrically connected is provided I'm to be in contact with the substantially spherical terminal molded with the solder provided on the IC package, the IC socket is disposed in the socket body,
The elastic pieces are provided in a pair so as to sandwich a substantially spherical terminal formed of the solder with an elastic force in a closing direction,
The socket body is provided with a top plate on which electrical components are placed,
A positioning rib inserted into the top plate between each contact portion on the upper side of each of the pair of elastic pieces, and stops the movement of the elastic pieces to the substantially spherical terminal side formed by the solder. Is provided,
The elastic piece is provided with stopper means for stopping the elastic piece from moving toward the substantially spherical terminal formed by the solder while being in contact with the substantially spherical terminal formed by the solder. The means is formed such that at least one of the pair of elastic pieces above the positioning rib is bent in a substantially U shape in plan view and extends toward the other of the pair of elastic pieces,
Before the substantially spherical terminal molded with the solder is deformed, at least one of the substantially square-shaped end portions of the elastic piece is separated from the other elastic piece, and the substantially spherical terminal molded with the solder. After the deformation, the end of the elastic piece is in contact with the other elastic piece so that the elastic pieces move toward the substantially spherical terminal formed by the solder. An IC socket characterized in that it stops and suppresses deformation of a substantially spherical terminal formed of the solder. Contact pins elastic pieces which are electrically connected is provided I'm to be in contact with the substantially spherical terminal molded with the solder provided on the IC package, the IC socket is disposed in the socket body,
The elastic pieces are provided in a pair so as to sandwich a substantially spherical terminal formed of the solder with an elastic force in a closing direction,
The socket body is provided with a top plate on which electrical components are placed,
A positioning rib inserted into the top plate between each contact portion on the upper side of each of the pair of elastic pieces, and stops the movement of the elastic pieces to the substantially spherical terminal side formed by the solder. Is provided,
The elastic piece is provided with stopper means for stopping the elastic piece from moving toward the substantially spherical terminal formed by the solder while being in contact with the substantially spherical terminal formed by the solder. The means has a stopper piece that is cut and raised from one of the elastic pieces and extends horizontally above the positioning rib toward the elastic piece on the other side , before the substantially spherical terminal formed by the solder is deformed. After the end of the stopper piece is separated from the other elastic piece and the substantially spherical terminal formed of the solder is deformed, the stopper piece comes into contact with the other elastic piece, thereby An IC socket characterized in that the movement of the elastic piece toward the substantially spherical terminal formed by the solder is stopped to suppress deformation of the substantially spherical terminal formed by the solder.   The contact pin according to claim 1 or 2 is disposed in a socket body that accommodates the IC package, and a moving member that elastically deforms an elastic piece of the contact pin is movably disposed. An IC socket characterized in that an operation member for moving the socket is provided on the socket body so as to be movable up and down.

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