JP2000021531A - Socket for electric parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket capable of obtaining an adequate reaction (contact pressure) by a fine contact pin, and actuating the contact pin by small actuating force. SOLUTION: A mounting surface part of a top plate to be mounted with an IC package is provided on a socket body 13, plural contact pins 15 touchable to and separable from a solder ball are placed in the socket body 13, a sliding plate is movably provided against the socket body 13, a contact part 15d is opened and closed by moving the sliding plate, so as to bring it into contact with or separate it from the solder ball 12b. In this case, the contact pin 15 has a pair of elastic pieces 15h, 15i, and the contact part 15d is formed at their tip parts, on the other hand, a preliminary pressing plate 16 functioning as a preliminary pressing means to elastically deform both contact parts 15d in a direction to narrow them by pressing an intermediate part between both elastic pieces 15h, 15i is provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket for an electric component for detachably holding an electric component such as a semiconductor device (hereinafter referred to as an "IC package"), and more particularly, to a contact pin which is separated from and connected to the electric component. The present invention relates to an electrical component socket to which (preload) can be given.

[0002]

2. Description of the Related Art Conventionally, as this kind of "socket for electric parts", there is an IC socket for detachably holding an IC package as an "electric part".

[0003] This IC socket has an I
A top plate on which the C package is placed is provided, and contact pins which are separated from and connected to the terminals of the IC package are provided on the socket body, and slide horizontally between the top plate and the socket body. A slide plate is provided, and an upper operating member is further provided to be vertically movable with respect to the socket body.

By lowering the upper operating member, the slide plate is slid horizontally via a link mechanism to elastically deform the contact pins, and the contact portions formed at the upper ends of the contact pins are removed. I
Retreat from the insertion range of the C package terminal. afterwards,
By placing the IC package on the top plate and raising the upper operation member, the slide plate returns to the original position, and the pressing force on the contact pins is released. As a result, the contact pin returns to the initial position by the elastic force, so that the contact portion of the contact pin comes into contact with the terminal of the IC package and is electrically connected.

[0005] In this way, the IC package can be mounted and removed in a non-insertion / extraction manner by simply sliding the slide plate in the horizontal direction, so that the work efficiency can be remarkably improved.

[0006]

However, in such a conventional device, the I of the contact pin contact portion is not sufficient.
In order to secure the contact pressure to the C package terminal, the contact pins need to have relatively high rigidity, but if the interval between the contact pins must be reduced,
Since the contact pins must be thin and sufficient rigidity cannot be obtained, there is a possibility that an appropriate contact pressure cannot be obtained. Further, there is a problem that a large operating force is required to elastically deform a large number of contact pins having high rigidity.

Therefore, according to the present invention, an appropriate reaction force (contact pressure) can be obtained with a thin contact pin,
It is an object of the present invention to provide an electrical component socket that can operate a contact pin with a small operating force.

[0008]

According to a first aspect of the present invention, there is provided a socket body provided with a mounting surface for mounting an electrical component on a socket body, wherein the socket body has the electrical component. A plurality of contact pins that can be attached to and detached from the terminal are provided, and a moving plate is movably provided with respect to the socket body. By moving the moving plate, a contact portion of the contact pin is displaced. In a socket for an electric component to be separated from and brought into contact with a terminal of the electric component, the contact pin has an elastic piece, and a contact portion which is in contact with the terminal and is electrically connected to the terminal is formed at the tip end. In a state where the contact pins are disposed in the socket body, a socket for an electric component provided with preload means for pressing an intermediate portion of the elastic piece to elastically deform the contact portion in a direction in which the contact portion comes into contact with the terminal. And characterized in that a door.

According to a second aspect of the present invention, a mounting surface portion for mounting an electric component is provided on a socket main body, and a plurality of contact pins which can be separated from and connected to terminals of the electric component are provided on the socket main body. A moving plate is provided movably with respect to the socket body, and by moving the moving plate, a contact portion of the contact pin is opened and closed, and a socket for an electric component is separated from or connected to a terminal of the electric component. In the above, the contact pin has a pair of elastic pieces, a contact portion of which is electrically connected to the terminal by sandwiching the terminal, is formed at the tip of the pair of elastic pieces, and the contact pin is arranged on the socket body. In the installed state, in a direction in which the contact portions are narrowed,
An electrical component socket provided with a preload means for pressing an intermediate portion of the elastic pieces to elastically deform the elastic piece is provided.

[0010] According to a third aspect of the present invention, in addition to the configuration of the second aspect, the pair of elastic pieces of the contact pin include:
The width of the intermediate portion pressed by the preload means in a state where no external force is applied is formed wider than the width of the contact portions.

According to a fourth aspect of the present invention, in addition to the configuration of the third aspect, a pair of elastic pieces of the contact pin are provided.
The two intermediate portions are bent in a direction away from each other to form a bent portion, and a vertex of the bent portion is pressed by the preload means.

[0012] The invention according to claim 5 is the invention according to claims 2 to 4.
In addition to the configuration described in any one of the above, a pair of elastic pieces of the contact pin are configured to be opposed to each other by bending a base.

The invention according to claim 6 is the invention according to claims 2 to 5
In addition to the configuration according to any one of the above, the contact pin has a solder tail portion that is extended from a base of the pair of elastic pieces and is connected to a printed wiring board, and the solder tail portion is the base portion. And the center line of the pair of elastic pieces is aligned with the center line of the solder tail portion.

[0014] The invention according to claim 7 is the invention according to claims 1 to 6.
In addition to the configuration according to any one of the above, the preload means is a preload plate provided on the socket body, the preload plate has a preload hole into which an intermediate portion of the contact pin elastic piece is inserted. The intermediate portion is formed so as to be pressed and elastically deformed in a state where the intermediate portion is inserted into the preload hole.

[0015] The invention according to claim 8 is the invention according to claims 1 to 6.
In addition to the configuration described in any one of the above, the preload means is provided integrally with the socket body.

[0016]

Embodiments of the present invention will be described below.

[First Embodiment of the Invention] FIGS. 1 to 9 show a first embodiment of the present invention.

First, the structure will be described.
An IC socket as an “electric component socket”. The IC socket 11 is used for performing a performance test of the IC package 12 as an “electric component”.
The second is to electrically connect the solder ball 12b as a "terminal" of No. 2 to a printed wiring board (not shown) of a measuring instrument (tester).

The IC package 12 is a so-called BGA (Ball Grid Alley) type as shown in FIG. 4, for example, and has a square package body 1 for example.
A large number of substantially spherical solder balls 12b protrude from the lower surface of 2a and are arranged in a matrix.

On the other hand, the IC socket 11 is roughly
It has a socket body 13 mounted on a printed wiring board.
b, a contact pin 15 to be separated from and attached to the socket body 13 is provided, and on the upper side of the socket body 13, a preload plate 16 as a "preload means" through which the contact pin 15 is inserted, and a slide as a "moving plate" The plate 17 and the top plate 18 are disposed so as to be sequentially stacked. Further, an upper operation member 19 that slides the slide plate 17 in the lateral direction is disposed above the top plate 18.

The contact pin 15 is formed of a plate material having spring properties and excellent conductivity by press working into a shape as shown in FIGS.

More specifically, the contact pin 15 has a fixed-side elastic piece 15h and a movable-side elastic piece 15i (a pair of elastic pieces) formed on the upper side, and one solder tail portion 15b formed on the lower side. I have. Each of these elastic pieces 15h, 1
5i are formed so that the base 15c on the lower end side is bent in a substantially U-shape so as to face each other. In addition, contact portions 15d are formed at the upper end portions (tip portions) of the elastic pieces 15h and 15i so as to come into contact with and separate from the side surface portions of the solder balls 12b of the IC package 12.
, So that the solder ball 12b is sandwiched.

The elastic piece 15h of the contact pin 15
15i is formed by bending both intermediate portions in a direction away from each other to form a bent portion 15e.
The top of 5e is pressed by the preload plate 16. Then, when no external force is applied, as shown in FIG. 6A, the width H1 of the apex of the bent portion 15e is formed wider than the width H2 of the contact portions 15d.

As shown in FIG. 6, the contact pin 15 has a solder tail portion 15b having elastic pieces 15h and 15h.
i is bent at a portion 15g near the base portion 15c so that the center line O1 of the pair of elastic pieces 15h and 15i coincides with the center line O2 of the solder tail portion 15b.

The solder tail portion 15b and the base portion 15c of the contact pin 15 are
Is press-fitted into the press-fitting hole 13a formed at the bottom. And
The solder tail portion 15b projecting downward from the socket body 13 projects further downward via the locate board 21, and is inserted into each through hole of a printed wiring board (not shown) and soldered to be connected. It has become.

The preload plate 16 is removably disposed on the socket body 13. The preload plate 16 has a preload hole 16a into which the elastic pieces 15h and 15i of the contact pin 15 are inserted. This preload hole 16a
The diameter of the preload hole 16a is set so that the elastic pieces 15h and 15i are elastically deformed by pressing the elastic pieces 15h and 15i in the direction in which the contact portions 15d are narrowed in a state where the elastic pieces 15h and 15i are inserted into the elastic pieces 15h and 15i.

Here, as described above, the contact pin 1
5, a bent portion 15e is formed on the pair of elastic pieces 15h and 15i, and the apex of the bent portion 15e is
6a is pressed by the inner wall.

On the other hand, the slide plate 17 is slidably provided in the left-right direction (horizontal direction) in FIG. 2, and by sliding the slide plate 17, the contact pins 15 provided on the socket body 13 are movable. The side elastic pieces 15i are elastically deformed and displaced.

The slide plate 17 is slid via an X-shaped link 22 shown in FIGS. 2 and 9 by moving the upper operation member 19 up and down. Movable elastic piece 1
A pressing portion 17a for pressing and elastically deforming 5i is formed.

The X-shaped links 22 are provided corresponding to both side surfaces of the rectangular slide plate 17 along the sliding direction.

More specifically, as shown in FIGS. 2 and 9, the X-shaped link 22 has a first link member 2 of the same length.
3 and a second link member 25, which are rotatably connected by a center connecting pin 27.

The lower end 23a of the first link member 23 is rotatably connected to the socket body 13 by a lower end connecting pin 29, while the lower end 25a of the second link member 25 is Is rotatably connected to one end of the side surface along the sliding direction by a lower end connecting pin 30. In addition, these first and second link members 2
The upper end portions 23b, 25b of the third and 25 are rotatably connected to the upper operation member 19 by upper end connecting pins 33, 34. The upper end 23b of the first link member 23 has a long hole 2
3c is provided, and is connected to the upper operation member 17 by the upper end connecting pin 33 through the elongated hole 23c.

The top plate 18 has a mounting surface 18a on which the IC package 12 is mounted, and a guide portion 18b for positioning the IC package 12 at a predetermined position as shown in FIG. It is provided corresponding to each corner of the main body 12a. Further, a positioning portion 18c inserted between the pair of contact portions 15d of each contact pin 15 is formed on the top plate 18, and both elastic pieces 15h, 15h of the contact pin 15 are formed.
In the state where no external force acts on i (the state where both contact portions 15d are closed), the positioning portion 18c
h, 15i.

Further, as shown in FIGS. 1 and 2, the upper operating member 19 has an opening 19a large enough to insert the IC package 12, and the IC package 12 is inserted through the opening 19a. The top plate 18
At a predetermined position on the mounting surface portion 18a. The upper operating member 19 is vertically movable with respect to the socket body 13 as shown in FIG. 3, and is urged upward by a spring 36 to rotate the latch 38. 19b are formed.

The latch 38 is, as shown in FIG.
2 is mounted on the socket body 13 so as to be rotatable about a shaft 38a, is urged clockwise in FIG. 2 by a spring 39, and presses the peripheral edge of the IC package 12 by a pressing portion 38b provided at the tip end. Have been.

The latch 38 is formed with a pressed portion 38c which is pressed by the operation projection 19b of the upper operation member 19, and is pressed by the operation projection 19b when the upper operation member 19 is lowered. When the pressing portion 38c is pressed, the latch 38 is rotated counterclockwise in FIG. 2, and the pressing portion 38b is retracted from the position where the IC package 12 is provided.

Next, the operation will be described.

To set the IC package 12 in the IC socket 11, the upper operation member 19 is pushed down. Then, the slide plate 17 is slid rightward as indicated by a two-dot chain line in FIG. 9 via the X-shaped link 22, and the movable elastic piece 15i of the contact pin 15 is pressed by the pressing portion 17a of the slide plate 17. Is elastically deformed. The other fixed-side elastic piece 15h is held at a predetermined position by a positioning portion 18c of the top plate 18.

Thus, as shown in FIG. 7B, the pair of contact portions 15d of the contact pin 15 are opened.

At the same time, the pressed portion 38c of the latch 38 is pushed by the operating projection 19b of the upper operation member 19, and rotates counterclockwise in FIG. 2 against the urging force of the spring 39. Then, the holding portion 38b is displaced to the retracted position.

In this state, the IC package 12 is mounted on the mounting surface 18a of the top plate 18 at a predetermined position by being guided by the guide portion 18b.
Are inserted in a non-contact state between a pair of opened contact portions 15d of the contact pins 15.

Thereafter, when the downward pressing force of the upper operation member 19 is released, the upper operation member 19
6 by the urging force of 6, the slide plate 17 is slid leftward in FIG. 7 via the X-shaped link 22, and the latch 38 is turned clockwise in FIG. Be moved.

When the slide plate 17 is slid leftward in FIG. 7, the movable elastic piece 1 of the contact pin 15 is moved.
5i is released, and the movable elastic piece 15 is released.
i returns to the original position, and the movable side elastic piece 15i
The solder ball 12b is clamped by the contact portion 15d of the fixed elastic piece 15h and the contact portion 15d (FIG. 7C).
reference).

As a result, each of the solder balls 12b of the IC package 12 and the printed wiring board are
Are electrically connected to each other.

On the other hand, in order to remove the IC package 12 from the mounted state, the upper operation member 19 is similarly lowered to separate the pair of contact portions 15d from the solder ball 12b of the IC package 12, thereby obtaining the solder ball. The IC package 12 can be easily removed with a smaller force than when the IC package 12b is pulled out from a state where the IC package 12b is sandwiched between the pair of contact portions 15d.

In such a case, both elastic pieces 15
Since the preload plate 16 that presses the intermediate portion between the h and 15i in the direction in which the contact portions 15d and 15d are narrowed to elastically deform is provided, the amount of displacement (preload) for elastic deformation can be set to an arbitrary value. The contact pressure of the contact pin contact portion 15d with the solder ball 12b can be set to an appropriate value.

Further, by applying a preload to the contact pins 15 so as to secure the contact pressure against the solder balls 12b, a thin contact pin 15 is used without using a member having a large rigidity as in the related art. Therefore, the pitch between the contact pins 15 can be narrowed, and the operating force of the contact pins 15 by the slide plate 17 can be reduced.

Further, both elastic pieces 15h and 15i of the contact pin 15 are bent in a direction in which both middle portions are separated from each other to form a bent portion 15e, and a vertex of the bent portion 15e is formed as follows. Preload hole 16 of preload plate 16
Since the elastic pieces 15h and 15i are formed in parallel with each other because they are pressed by the inner wall of a.
It is possible to set a large preload at the contact portion 15d.

Furthermore, since the preload plate 16 can be replaced separately from the socket body 13,
The preload can be easily changed simply by replacing the preload plate 16 with a different size or the like of the preload hole 16a.

The positioning portion 18c formed on the top plate 18 is provided with both elastic pieces 15 of the contact pin 15.
h and 15i, the contact portions 15d of the contact pin 15 can be positioned at predetermined positions. That is, since the IC package 12 is placed at a predetermined position on the top plate 18, the IC package 12 and the top plate 18 are set in a predetermined positional relationship. Therefore, by setting the top plate 18 and the contact portions 15d of the contact pins 15 in a predetermined positional relationship by the positioning portion 18c, the contact portions 15d and the IC package 1 are set.
The two solder balls 12b can be set in a predetermined positional relationship. Moreover, the positioning portion 1 is formed by the two elastic pieces 15h and 15i.
By pinching 8c, both contact portions 15d can be centered, and positioning can be performed accurately.

Further, the pair of elastic pieces 15h and 15i of the contact pin 15 are configured to be opposed to each other by bending the base portion 15c. Contact pin 1
5 can be easily formed.

Further, the contact pin 15 is
As shown in the figure, the solder tail portion 15b is bent at a portion 15g near the base portion 15c, and the two elastic pieces 15h and 15i are bent.
Center line O1 and the center line O2 of the solder tail portion 15b.
This is convenient when, for example, the IC package 12 is transported by an automatic machine and the IC package 12 is set in a plurality of IC sockets 11 arranged on a printed wiring board. .

That is, the coincidence of the center lines O1 and O2 means that the solder balls 12b
Is aligned with the position of the through hole of the printed wiring board. Therefore, when the IC package 12 is set to be conveyed by an automatic machine with reference to an arbitrary position of the printed wiring board, if the positional relationship between the reference position of the printed wiring board and the through hole is grasped, The IC package 12 can be accurately set at a predetermined position of the IC socket 11 without having to consider the positional relationship between the printed wiring board and the IC socket 11.

Such an advantage is not particularly claimed if the contact pin 15 is linear.
The contact pin 15 here is a pair of elastic pieces 15h,
The base 15c is bent so that the bases 15i face each other,
Since the solder tail portion 15b extends downward from the base portion 15c, the solder tail portion 15b
Simply extending downward cannot match the center lines O1 and O2. Therefore, here, in particular, by bending the portion 15g in the vicinity of the base portion 15c, both center lines O
1 and O2 are made to coincide with each other, so that the above advantage can be obtained.

[Second Embodiment of the Invention] FIG. 10 shows a second embodiment of the present invention.

The second embodiment of the present invention is different from the first embodiment in the shape of the contact pin 15.

That is, the contact pin 15 of the second embodiment is formed so that the distance between the elastic pieces 15h and 15i becomes narrower upward, and the contact portions 15d at the upper ends of the elastic pieces 15h and 15i approach each other. Is set to The pair of elastic pieces 15h and 15i of the contact pin 15 are formed such that the width H1 of the intermediate portion pressed by the preload plate 16 is wider than the width H2 of both contact portions 15d in a state where no external force is applied. Have been.

The preload plate 16 has a preload hole 16.
a protruding portion 16b is formed to protrude into the
Thereby, the intermediate portion between the two elastic pieces 15h and 15i is pressed and elastically deformed, so that both contact portions 15d are displaced in a narrowing direction.

Other structures and operations are the same as those of the first embodiment.

In the first embodiment and the like, the present invention is applied to the IC socket 11 as an “electric component socket”, but it is needless to say that the present invention is not limited to this and can be applied to other devices. Further, the present invention is applied to an IC socket for a BGA type IC package. However, the present invention is not limited to this, and may be applied to an IC socket for a PGA (Pin Grid Alley) type IC package. Further, in the first and second embodiments, the “preload means” is the preload plate 16 that is separate from the socket body 13, but is not limited thereto, and may be formed integrally with the socket body 13. Furthermore, in the above-described embodiment, the moving plate is configured to move in the horizontal direction. However, by moving the moving plate in the vertical direction, the contact portion of the contact pin may be displaced. In addition, in the above embodiment, the fixed pin elastic piece 15h and the movable elastic piece 15i are provided on the contact pin 15, but the present invention can be applied to a case where only the movable elastic piece 15i is provided.

[0061]

As described above, according to the first or second aspect of the present invention, when the contact pin is provided, the intermediate portion of the elastic piece is pressed in the direction in which the contact portion contacts the terminal. Since the preload means for elastically deforming the terminal is provided, the amount of displacement (preload) for elastic deformation can be set to an arbitrary value, and the contact pressure of the contact pin contact portion with the terminal can be set to an appropriate value. In addition, since it is not necessary to use a rigid contact pin, it is possible to cope with a narrow pitch between the contact pins and to reduce the operating force of the contact pin by the moving plate.

According to the third aspect of the present invention, in addition to the above-described effects, the pair of elastic pieces of the contact pin have a width of the intermediate portion pressed by the preload means when no external force is applied. Since the contact portions are formed wider than the widths of the contact portions, the preload at the contact portions can be set to be larger than that in which the elastic pieces are formed in parallel.

According to the fourth aspect of the present invention, in addition to the above effects, the pair of elastic pieces of the contact pin are bent in a direction in which both intermediate portions are separated from each other and separated from each other to form a bent portion. Since the apex of the bent portion is pressed by the preload means, it is possible to set a larger preload at the contact portion than when the elastic pieces are formed in parallel.

According to the fifth aspect of the present invention, in addition to the above effects, the pair of elastic pieces of the contact pin are configured to be opposed to each other by bending the base, so that one piece is provided. The contact pin can be easily formed by pressing the plate material.

According to the sixth aspect of the present invention, in addition to the above-described effects, the contact pin is formed such that the solder tail portion is bent at a portion near the base of the elastic piece, and the center line of the pair of elastic pieces, Since the solder tail portion is formed so as to coincide with the center line thereof, the IC package is conveyed by, for example, an automatic machine and a plurality of ICs arranged on a printed wiring board are transferred.
This is convenient when the IC package is set in the C socket.

According to the seventh aspect of the present invention, in addition to the above effects, the preload means is a preload plate provided on the socket body, and the preload plate into which the intermediate portion of the contact pin is inserted. A hole is formed, and in a state in which the intermediate portion is inserted into the preload hole, the intermediate portion is configured to be elastically deformed by pressing the intermediate portion in a direction in which both contact portions are narrowed. Just replace,
The preload can be easily changed.

According to the eighth aspect of the present invention, in addition to the above effects, the preload means is provided integrally with the socket body, so that the preload can be applied to the contact pin without increasing the number of parts. .

[Brief description of the drawings]

FIG. 1 is a plan view of an IC socket according to Embodiment 1 of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG. 1 according to the first embodiment.

FIG. 3 is a sectional view taken along the line BB in FIG. 1 according to the first embodiment.

4A and 4B are views showing the IC package according to the first embodiment, wherein FIG. 4A is a front view and FIG. 4B is a bottom view.

FIG. 5 is a perspective view of a contact pin according to the first embodiment.

FIGS. 6A and 6B are diagrams showing a contact pin according to the first embodiment, in which FIG. 6A is a front view showing a state before arrangement, and FIG. 6B is a cross-sectional view showing an arrangement state of the contact pin.

FIG. 7 is a sectional view showing an operation according to the first embodiment,
(A) is a state in which a pair of contact portions of a contact pin is closed,
(B) is a state where a pair of contact portions of the contact pin is opened,
(C) is a sectional view of a state in which a solder ball is held between a pair of contact portions of a contact pin.

8A and 8B are enlarged plan views of a portion X in FIG. 1 according to the first embodiment, in which FIG. 8A shows a state in which a pair of contact portions of a contact pin is closed, and FIG. It is a top view of an opened state.

FIG. 9 is an explanatory diagram showing an operation of the X-shaped link according to the first embodiment.

FIG. 10 is a view corresponding to FIG. 6 according to the second embodiment of the present invention, in which (a) is a front view showing a state before contact pins are arranged, and (b) is a state showing arrangement of contact pins. It is sectional drawing.

[Explanation of symbols]

 11 IC socket (socket for electric parts) 12 IC package (electric parts) 12a Package body 12b Solder ball (terminal) 13 Socket body 15 Contact pin 15b Solder tail part 15c Base part 15d Contact part 15e Bend part 15g Neighboring part 15h Fixed side Elastic piece 15i Movable elastic piece 16 Preload plate (preload means) 16a Preload hole 17 Slide plate (moving plate) 18 Top plate 18a Placement surface 18c Positioning section 19 Upper operating member O1 Center line of elastic piece O2 Center of solder tail line

Claims (8)

[Claims] 1. A mounting surface portion for mounting an electric component on a socket main body, a plurality of contact pins detachable from terminals of the electric component are disposed on the socket main body, and a plurality of contact pins are provided on the socket main body. The movable plate is provided movably,
By moving the moving plate, the contact portion of the contact pin is displaced to displace the contact of the electric component from / to the terminal of the electric component.The contact pin has an elastic piece. While a contact portion that is electrically connected to the terminal is formed, while the contact pin is disposed in the socket body,
A socket for an electrical component, comprising: a preload means for pressing an intermediate portion of the elastic piece to elastically deform the elastic piece in a direction in which the contact portion contacts the terminal. 2. A mounting surface portion on which an electric component is mounted on a socket body, a plurality of contact pins detachable from a terminal of the electric component are provided on the socket body, and a plurality of contact pins are provided on the socket body. The movable plate is provided movably,
By moving the moving plate to open and close the contact portion of the contact pin to separate and contact the terminal of the electrical component, the contact pin has a pair of elastic pieces, While a contact portion which is electrically connected to the terminal by sandwiching the terminal is formed at the distal end portion, while the contact pin is disposed in the socket body,
A socket for an electric component, comprising: a preload means for pressing an intermediate portion of the two elastic pieces to elastically deform the two elastic pieces in a direction in which the two contact portions are narrowed. 3. A pair of elastic pieces of the contact pin,
The electrical component socket according to claim 2, wherein a width of the intermediate portion pressed by the preload means is formed to be wider than a width of the contact portions when no external force is applied. 4. A pair of elastic pieces of the contact pin,
4. The electric device according to claim 3, wherein both intermediate portions are bent in a direction away from each other to form a bent portion, and a vertex of the bent portion is pressed by the preload means. Socket for parts. 5. A pair of elastic pieces of the contact pin,
The electrical component socket according to any one of claims 2 to 4, wherein the base portions are bent so as to face each other. 6. The contact pin has a solder tail extending from a base of the pair of elastic pieces and connected to a printed wiring board, wherein the solder tail is bent near the base. A center line of the pair of elastic pieces;
The electrical component socket according to any one of claims 2 to 5, wherein the socket is formed so that a center line of the solder tail portion coincides with the center line. 7. The preload means is a preload plate provided on the socket body, wherein the preload plate has a preload hole into which an intermediate portion of the contact pin elastic piece is inserted. The electrical component socket according to any one of claims 1 to 6, wherein the intermediate portion is configured to be elastically deformed by being pressed while the intermediate portion is inserted. 8. The electrical component socket according to claim 1, wherein the preload means is provided integrally with the socket body.