JP2000044773A - One pack moisture-curable composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a one pack moisture-curable composition hardly generating layer separation and thickening during storage. SOLUTION: This composition comprises (a) a modified silicone resin, (b) a curing agent for the modified silicone resin, (c) an epoxy resin, (d) a hydrophilic ketimine as a curing agent for the epoxy resin and (e) hydrophobic silica fine powder. The amount of each component compounded based on 100 pts.wt. of (c) the epoxy resin is, preferably, 5-300 pts.wt. for (d) the hydrophilic ketimine, 10-1,000 pts.wt. for (a) the modified silicone resin, 1-25 pts.wt. for (b) the curing agent for the modified silicone resin and 1-30 pts.wt. for (e) the hydrophobic silica fine powder. This one pack moisture-curable composition is used as an adhesive, a sealing material, a paint or the like and is suitably employed, in particular, as a primer for sticking a cement-containing article to various grounds.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a one-part moisture-curable composition containing an epoxy resin, and more particularly to a one-part moisture-curable composition which hardly thickens and undergoes phase separation during storage.
In particular, cement-containing products such as mortar and concrete,
The present invention relates to a one-component moisture-curable composition suitable for bonding to various base surfaces.

[0002]

2. Description of the Related Art In recent years, one-part moisture-curable compositions containing epoxy resins have been used as adhesives or sealing materials or as coatings in the fields of civil engineering and construction and electronic equipment. This one-part moisture-curable composition is composed of a composition containing an epoxy resin, a ketimine, a modified silicone resin, and a curing agent for the modified silicone resin. In this method, ketimine reacts with moisture in the air to form an active amine, which cures an epoxy resin. Therefore, compared to a two-part curable composition in which a curing agent is mixed with an epoxy resin before use,
It is excellent in workability and is preferable.

[0003] However, this one-part moisture-curable composition has a drawback that it is easily cured by water in the composition even when stored while being shielded from moisture in the air, resulting in poor storage stability. In order to solve such drawbacks, it has been proposed to incorporate a silane compound as a dehydrating agent in the composition and to use a specific hydrophilic ketimine having a polyoxyalkylene structure as a basic skeleton as ketimine. (JP-A-5-271389).

[0004] Certainly, the one-pack moisture-curable composition containing a hydrophilic ketimine has excellent storage stability and can prevent the curing of the epoxy resin during storage. However, during storage, the one-part moisture-curable composition may undergo layer separation, and the hydrophilic ketimine may ooze out as a supernatant liquid. Therefore, such compositions must be mixed and stirred again before use,
If used without mixing and stirring, the desired hardening characteristics would not be exhibited. That is, the fact that mixing and agitation are involved before use has not changed in the workability at all from the two-part curable composition. Rather, such a one-component moisture-curable composition may not require mixing and stirring when the storage period is short, and it is difficult to determine a working standard such that mixing and stirring is required when the storage period is long. The liquid-curable composition is superior in that a reliable working standard can be determined. In particular, when repairing the outer walls of buildings and condominiums, when using an adhesive containing this epoxy resin for joining the ground surface and mortar, or when using it for other civil engineering construction work, the work standard is It is safer for workers because the fixed work is less likely to cause defective work.

[0005]

Therefore, the present inventors have thought that if a thickener is added to a conventional one-part moisture-curable composition, layer separation can be prevented, and various types of thickening agents have been proposed. The experiment was conducted by mixing the agents. However, when a thickener is added, layer separation can be prevented, but the viscosity during storage is sharply increased, and a new disadvantage that it becomes difficult to apply the one-component moisture-curable composition as an adhesive or a sealing material. occured. That is, the thickener binds each component in the composition with a relatively weak bond such as a hydrogen bond to prevent layer separation, but when stored for a long time, this bond becomes excessive. It is thought that it forms and causes an increase in viscosity.

However, as a result of repeated experiments by the present inventors, it has been found that when a specific substance is incorporated into a one-part moisture-curable composition, no layer separation occurs and no extreme increase in viscosity occurs. . The present invention has been made based on such a finding.

[0007]

That is, the present invention provides (a)
One-component moisture-curing type containing a modified silicone resin, (b) a curing agent for a modified silicone resin, (c) an epoxy resin, (d) a hydrophilic ketimine as a curing agent for an epoxy resin, and (e) a fine powder of hydrophobic silica. It relates to a composition.

The modified silicone resin as the component (a) used in the present invention is a polyether copolymer having a hydrolyzable silicon functional group at the terminal represented by the following formula 1. This modified silicone resin is for giving flexibility to the cured one-part moisture-curable composition. This is because if the cured composition is flexible, peeling due to various impacts can be prevented. The skeleton portion other than the terminal is not particularly limited as long as it has an ether bond, but is generally a polyoxyalkylene ether.

Embedded image (Wherein, R ₃₁ represents an alkyl group having 1 to 12 carbon atoms;
₃₂ represents an alkyl group having 1 to 6 carbon atoms, and n is an integer of 0 to 2. As specific examples of such modified silicone resins, poly (methyldimethoxysilyl ether) and the like are exemplified, and any commercially available modified silicone resins can be used. it can. Only one modified silicone resin may be used, or two or more modified silicone resins may be used in combination.

The modified silicone resin curing agent (also referred to as a modified silicone resin catalyst) used in the present invention can be used as long as it is a catalyst for curing the modified silicone resin and has this action. Specific examples thereof include tin octylate, tin stearate, iron naphthenate,
Metal organic carboxylate such as lead octylate, di-n-butyltin-dilaurate, di-n-butyltin-dilaurate, organic tin such as di-n-butyltin-diphthalate, alkyl titanate alone or Can be mixed and used.

The epoxy resin used in the present invention includes, for example, a biphenyl type epoxy resin, a bisphenol A type epoxy resin obtained by reacting biphenyl, bisphenol A, bisphenol F, bisphenol AD, bisphenol S or the like with epichlorohydrin, Bisphenol F-type epoxy resin, bisphenol AD-type epoxy resin, bisphenol S-type epoxy resin, and the like, epoxy resin obtained by hydrogenating or brominating them, glycidyl ester-type epoxy resin, novolak-type epoxy resin, urethane-modified epoxy having urethane bond resin,
Nitrogen-containing epoxy resin obtained by epoxidizing meta-xylene diamine, hydantoin, etc., polybutadiene or NB
R-containing rubber-modified epoxy resin and the like,
The material is not limited to these as long as it cures and shows good adhesiveness.

The hydrophilic ketimine which is a curing agent for an epoxy resin used in the present invention refers to a compound containing an oxyalkylene structure among ketimines formed by dehydration condensation of a primary amine or a secondary amine with a carbonyl compound. . Specifically, a compound formed by dehydration-condensation of a primary amine or a secondary amine having an oxyalkylene structure and an alkyl ketone is used as a hydrophilic ketimine. For example,
And a monoalkyl ketone [RH
It is preferable to use a hydrophilic ketimine represented by Chemical Formula 3, which is obtained by dehydration-condensation with [CO] or a dialkyl ketone [(R) ₂ CO].

Embedded image (In the formula, R ₅ and R ₆ represent an alkylene group having 1 to 4 carbon atoms, and n represents an arbitrary integer of 1 to 20.) The diamine represented by Chemical formula 2 is ethylenediamine or propylene. For alkylene diamines such as diamines,
It is obtained by adding 1 to 20 mol of an alkylene oxide such as ethylene oxide or propylene oxide.

Embedded image (Wherein, R ₁ , R ₂ , R ₃ , and R ₄ represent a hydrogen atom or a carbon atom
It represents 6 alkyl group, R _5, R ₆ represents an alkylene group having 1 to 4 carbon atoms, n represents represents any integer from 1 to 20. )

As a typical example of the hydrophilic ketimine represented by the chemical formula 3, 2 mol of dialkyl ketone such as methyl isobutyl ketone is dehydrated and condensed with 1 mol of oxypropylene diamine obtained by adding 1 to 6 mol of propylene oxide to propylene diamine. Ketimine obtained by the above method. Further, the weight average molecular weight of the hydrophilic ketimine represented by Chemical Formula 3 is preferably about 100 to 1,000, and particularly preferably 300 to 7
About 00 is good.

Further, a triamine represented by the following formula (4):
It is also preferable to use a hydrophilic ketimine represented by Chemical Formula 5, which is obtained by dehydration-condensation of a monoalkyl ketone [RHCO] or a dialkyl ketone [(R) ₂ CO].

Embedded image (Wherein, R ₁₀ represents a hydrocarbon residue having 1 to 6 carbon atoms;
R ₁₁ , R ₁₂ , R ₁₃ , R ₁₄ , R ₁₅ , and R ₁₆ represent an alkylene group having 1 to 4 carbon atoms, x, y, and z are 0 or any integer, and x + y + z = 1 to 20. . The triamine represented by Chemical Formula 4 is obtained by adding 1 to 20 mol of an alkylene oxide such as ethylene oxide or propylene oxide to a triaminoisoalkane such as triaminoisohexane.

Embedded image(Where R_TenRepresents a hydrocarbon residue having 1 to 6 carbon atoms,
R₁₁, R₁₂, R₁₃, R₁₄, R_Fifteen, R₁₆Is carbon
Represents an alkylene group of Formulas 1 to 4,₁₇, R₁₈ ,
R₁₉, R₂₀, R_{twenty one}, R_{twenty two}Is a hydrogen atom or carbon number
Represents an alkyl group of 1 to 6, wherein x, y and z are 0 or optional
Where x + y + z = 1 to 20. )

As a typical example of the hydrophilic ketimine represented by Chemical Formula 5, 1 mol of oxypropylene triamine obtained by adding about 6 mol of propylene oxide to 1-amino-2- (diaminomethylene) butane is added to methyl propyl ketone or the like. Ketimines obtained by dehydrating and condensing 3 moles of a dialkyl ketone are exemplified. The weight average molecular weight of the hydrophilic ketimine represented by Chemical Formula 2 is preferably about 200 to 1500, and particularly preferably about 400 to 900. In the narrow sense, ketimine means a compound in which an oxygen atom of a carbonyl group of a ketone is substituted with an imino group.In the present invention, ketimine is used in such a narrow sense. A compound obtained by the dehydration condensation of a primary amine or a secondary amine with a carbonyl compound is widely referred to as a ketimine.

The hydrophobic silica fine powder used in the present invention is:
A fine powder of silicon dioxide having a hydrophobic group bonded to its surface. That is, the surface of the silicon dioxide fine powder generally has a silanol group (—SiOH). By reacting the silanol group with an organic silicon halide, alcohol, or the like, a (—SiO—hydrophobic group) is formed. Is generated. Specifically, dimethylsiloxane, hexamethyldisilazane, dimethyldichlorosilane, trimethoxyoctylsilane, trimethylsilane, and the like are reacted and bonded to silanol groups present on the surface of silicon dioxide fine powder. The average primary particle size of the hydrophobic silica fine powder is preferably about 10 to 20 nm. The specific surface area (BET specific surface area) is 50 to 40.
It is preferably about 0 m ² / g. The silicon dioxide fine powder whose surface is formed of silanol groups (-SiOH) is called hydrophilic silica fine powder, and is distinguished from the hydrophobic silica fine powder of the present invention.

In the present invention, the amounts of the components (a), (b), (c), (d) and (e) are preferably as follows. That is, the hydrophilic ketimine as the component (d) is preferably 5 to 300 parts by weight, more preferably 20 to 200 parts by weight, based on 100 parts by weight of the epoxy resin as the component (c). preferable. If the amount of the hydrophilic ketimine is less than 5 parts by weight, the curing rate of the one-part moisture-curable composition tends to be slow. Further, when the hydrophilic ketimine exceeds 300 parts by weight, the one-part moisture-curable composition is easily cured even during storage, resulting in reduced storage stability or the use of one-part moisture-curable composition. The time tends to be shorter.

The modified silicone resin as the component (a) is
With respect to 100 parts by weight of the epoxy resin as the component (c),
It is preferably from 10 to 1000 parts by weight, especially from 50 to 1000 parts by weight.
More preferably, it is 500 parts by weight. If the modified silicone resin is less than 10 parts by weight, the flexibility of the cured one-part moisture-curable composition tends to decrease. On the other hand, if the modified silicone resin exceeds 1000 parts by weight, the adhesiveness tends to decrease.

The curing agent for the modified silicone resin as the component (b) is preferably 1 to 25 parts by weight, more preferably 3 to 25 parts by weight, based on 100 parts by weight of the epoxy resin as the component (c).
More preferably, it is 10 parts by weight. If the amount of the modified silicone resin curing agent is less than 1 part by weight, the curing rate of the one-part moisture-curable composition tends to be slow. Further, even if the amount of the curing agent for the modified silicone resin exceeds 25 parts by weight, further improvement in the curing rate of the one-part moisture-curable composition cannot be expected.

The hydrophobic silica fine powder as the component (e) is
With respect to 100 parts by weight of the epoxy resin as the component (c),
It is preferably from 1 to 30 parts by weight, more preferably from 3 to 15 parts by weight. When the amount of the hydrophobic silica fine powder is less than 1 part by weight, the one-part moisture-curable composition tends to undergo layer separation during storage. On the other hand, when the amount of the hydrophobic silica fine powder exceeds 30 parts by weight, further improvement of prevention of layer separation and prevention of thickening cannot be expected.

In the one-pack moisture-curable composition according to the present invention, in addition to the above-mentioned components (a), (b), (c), (d) and (e), a known inorganic filler, Various modifiers or additives such as a viscosity improver, an organic solvent and a plasticizer may be blended in desired amounts. In addition, since this composition is a one-component moisture-curing type, it is preferable to minimize the mixing of water. For example, when moisture is contained in a modifier or an additive such as an inorganic filler, it is preferable to dehydrate by means such as heating or decompression.

The compounding method of the one-part moisture-curable composition according to the present invention is as follows. Using a closed processing kettle equipped with a stirrer, a condenser, a heating device, a vacuum dehydrator, and a nitrogen gas flow device, the modified silicone resin and the epoxy resin are charged into the kettle. Hydrophobic silica fine powder and a modifier or an additive as required are blended and homogenously mixed under nitrogen reflux using a nitrogen gas flow device. Thereafter, the curing agent for the modified silicone resin and the hydrophilic ketimine are finally blended and homogeneously mixed to obtain a one-part moisture-curable composition. Then, when the one-part moisture-curable composition is stored in a sealed container subjected to nitrogen substitution, the final product is obtained. When water is contained in the modifier or the additive, the water may be dehydrated in advance before blending, or may be heated or decompressed after blending with the modified silicone resin and epoxy resin. May be used for dehydration.

The one-part moisture-curable composition according to the present invention is suitably used as an adhesive or as a sealing material in civil engineering and construction work or in assembling electronic equipment. In particular, it is suitably used as a primer (a type of adhesive used for the ground surface) when the mortar for adjusting unevenness is applied to the ground surface during repair of the outer wall. In addition, it is suitably used when applying a cement-containing product such as mortar or concrete to various equipments and materials. For example, the mortar or concrete is preferably used when applied to a joint surface of a building or a cracked surface or a joint surface of a drain pipe to perform waterproofing. Further, when mortar or concrete is used as a floor material, a lining material, a paint, a pouring material, or the like, it is also used to improve the adhesion between the mortar or the like and various materials. Further, it is also suitably used as a conventionally used paint.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on embodiments, but the present invention is not limited to the embodiments. The scope of the present invention is that if a specific one-pack moisture-curable composition containing hydrophilic ketimine is blended with hydrophobic silica fine powder, layer separation and thickening of the composition during storage can be prevented well. Should be construed as being based on the discovery that it is possible.

Example 1 100 parts by weight of a modified silicone resin (manufactured by Kaneka Chemical Industries, trade name: MS Polymer 303), 100 parts by weight of an epoxy resin (manufactured by Yuka Shell Epoxy, trade name: Epicoat 828),
270 parts by weight of heat-dehydrated calcium carbonate, 30 parts by weight of titanium oxide (that is, 300 parts by weight of an inorganic filler), and 40 parts by weight of a hydrophobic silica fine powder (1) were mixed with 100 parts by weight.
Decompression and heating at 15 Torr and 2 hours at ℃
Stir and mix until uniform. When the mixture becomes uniform, the mixture is cooled to room temperature, to which 40 parts by weight of a hydrophilic ketimine (1) and a dibutyltin compound (manufactured by Sankyoki Seisakusho, trade name Stan No.) as a curing agent for modified silicone resin (catalyst for modified silicone resin). 918) 2 parts by weight were added, and the mixture was stirred under reduced pressure to produce a one-pack moisture-curable composition. Table 1 shows the mixing ratio of the one-part moisture-curable composition. It goes without saying that all the mixing ratios in Table 1 are expressed in parts by weight.

Examples 2 to 5 In Example 2, the same procedure as in Example 1 was carried out except that the amount of the hydrophilic ketimine was changed to 80 parts by weight, as shown in Table 1. A composition was obtained. In Example 3, a one-part moisture-curable composition was obtained in the same manner as in Example 1, except that the type of hydrophilic ketimine was changed to hydrophilic ketimine (2) as shown in Table 1. In Example 4, as shown in Table 1, the type and amount of hydrophilic ketimine were changed to hydrophilic ketimine (2) and the amount was changed to 8.
One-part moisture curing in the same manner as in Example 1 except that the amount was changed to 0 parts by weight and the type of hydrophobic silica fine powder was changed to hydrophobic silica fine powder (2) as shown in Table 1. A mold composition was obtained. In Example 5, a one-part moisture-curable composition was obtained in the same manner as in Example 1, except that the amount of the hydrophobic silica fine powder was changed to 10 parts by weight as shown in Table 1.

Comparative Examples 1-3 As shown in Table 2, Comparative Example 1 was carried out in the same manner as in Example 1 except that hydrophilic silica fine powder was used instead of hydrophobic silica fine powder (1). A one-part moisture-curable composition was obtained. For Comparative Example 2, as shown in Table 2, a one-part moisture-curable composition was obtained in the same manner as in Example 1, except that no silica fine powder was used. For Comparative Example 3, as shown in Table 1, a one-part moisture-curable composition was obtained in the same manner as in Example 1, except that hydrophobic ketimine was used instead of hydrophilic ketimine (1). .

The hydrophilic ketimine (1) and the hydrophilic ketimine (2) used in each of Examples and Comparative Examples are hydrophilic ketimines having the following structural formula. [Hydrophilic ketimine (1)] (However, n is in the range of 1 to 6.) [Hydrophilic ketimine (2)] (However, x + y + z is about 5.3.)

The hydrophobic ketimine used in Comparative Example 3 has the following structural formula. (Hydrophobic ketimine) (In the formula, R is a styrene oxide group.) The hydrophobic ketimine is composed of 1 mol of 2,4,12,14-tetramethyl-5,8,11-triaza-4,11-pentadecane and 1 mol of styrene. 1 mole of oxide to 150
It was obtained by heating and reacting at 2 ° C. for 2 hours.

The hydrophobic silica fine powder (1), the hydrophobic silica fine powder (2) and the hydrophilic silica fine powder used in each of Examples and Comparative Examples are as follows. [Hydrophobic silica fine powder (1)] Nippon Aerosil Co., Ltd. of "AEROSIL RY200S": are those subjected to dimethylsiloxane treatment hydrophilic silica powder is the specific surface area of 100 m ² / g with an average primary particle diameter 12nm . [Hydrophobic silica fine powder (2)] "AEROSIL EPR811" manufactured by Nippon Aerosil Co., Ltd .: A hydrophilic silica powder which has been treated with hexamethyldisilane.
It has an average primary particle size of 12 nm and a specific surface area of 150 m ² / g. [Hydrophilic silica fine powder] "AEROSIL 200" manufactured by Nippon Aerosil Co., Ltd .: The average primary particle diameter is 12 nm and the specific surface area is 200 m ² / g.

The viscosity of the one-part moisture-curable compositions obtained in Examples 1 to 5 and Comparative Examples 1 to 3 immediately after production was 3% at 50 ° C.
The viscosity after storage for 0 days was measured, and the results are shown in Tables 1 and 2. The viscosity of the composition was measured by measuring 500 g of the composition in 2 parts.
After adjusting the temperature to 5 ° C., the mixture was placed in a 500 cc beaker and measured with a B-type viscometer at a rotation speed of 10 r / min.
・ S) After storage at 50 ° C. for 30 days, the composition was filled in a 1-liter metal can under a nitrogen stream immediately after production, covered, and stored in a 50 ° C. constant temperature bath for 30 days.
After cooling in a room at 5 ° C. for 24 hours, the lid was opened and the viscosity was measured by the above method. The numerical values in parentheses in Tables 1 and 2 represent the ratio when the viscosity immediately after production is set to 100.

In order to evaluate the adhesive strength with the mortar, the joint strength (kgf / cm) was determined by the following method.
² ) was measured. That is, Examples 1 to 5 and Comparative Examples 1 to
0.3 kg / m of the one-part moisture-curable composition obtained in
^After applying for ² hours, after a certain period of time (1 hour, 6 hours, 24 hours, 72 hours), mix mortar shown below in 6k
It was joined at a rate of g / m ² to obtain a test body. After this specimen was cured in a room at 20 ° C. for 28 days, the joint strength was measured by a plane tensile test method using a Kenken-type adhesion tester, and the results were shown in Tables 1 and 2. It was shown to. In addition,
The numerical values in parentheses in Tables 1 and 2 represent the ratio when the bonding strength at the time of the jointing time of 1 hour is 100. [Mortar mix] Portland cement 100 parts by weight No. 4 silica sand 125 parts by weight No. 6 silica sand 125 parts by weight Bond CAT202 35 parts by weight (SBR latex manufactured by Konishi Co., Ltd.) Water 23 parts by weight

[0032]

[Table 1]

[0033]

[Table 2]

As is clear from the results in Tables 1 and 2,
The one-part moisture-curable compositions according to Examples 1 to 4 are comparative examples 1
It can be seen that, after storage at 50 ° C. for 30 days, the composition has a small change in viscosity and is less likely to increase in viscosity and is less likely to undergo layer separation, as compared with the compositions according to Examples 2 and 3. Further, Examples 1 to
As is clear from the comparison between the one-pack moisture-curable composition according to Comparative Example 4 and the composition according to Comparative Example 3, the composition according to Comparative Example 3 does not use a hydrophilic ketimine. Although it is difficult to separate or thicken, the one-part moisture-curable compositions according to Examples 1 to 4 have good jointability with mortar, whereas the jointability with mortar is poor. It is.

[0035]

It is not clear why the one-part moisture-curable composition according to the present invention hardly undergoes layer separation and thickening during storage. The present inventors speculate that the hydrophobic silica fine powder binds the oxyalkylene structural unit in the modified silicone resin and the oxyalkylene structural unit of the hydrophilic ketimine with a moderately loose bond. Therefore, if the silica fine powder is not present, the denatured silicone resin and the hydrophilic ketimine undergo layer separation, and if the hydrophilic silica fine powder is used as the silica fine powder, the modified silicone resin and the hydrophilic ketimine are excessively bonded. It is speculated that it will increase the viscosity.

[0036]

Thus, the one-pack moisture-curable composition according to the present invention is less likely to separate or thicken even after being stored for a long period of time. It has the effect that it can be used.

In the case where the one-part moisture-curable composition according to the present invention is used as an adhesive or a sealing material, a cement-containing product such as mortar or concrete is transferred or applied to various base surfaces or various materials. As is clear from the comparison between Comparative Examples 1 to 4 and Comparative Example 3, even if the cement-containing product is not immediately transferred or the joint is left after being left for a while, the cement-containing product and the base surface can be sufficiently separated. A good adhesive strength can be maintained. Therefore, the effect of giving flexibility to the operation of applying the cement-containing product and reducing the burden on the operator is exerted.

Further, when the one-part moisture-curable composition according to the present invention is applied as an adhesive (primer) to the ground surface during repair of an outer wall, the mortar for adjusting unevenness is not immediately transferred. Also adhere with good adhesion strength between the finishing material layer and the underlying surface. Therefore, depending on the method of execution, the adhesive strength is hardly fluctuated, the possibility of occurrence of the peeling off of the finishing material layer is reduced, and the effect of giving reliability to the outer wall repair is exhibited.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme court ゛ (Reference) C09J 183/04 C09J 183/04 // C08G 59/40 C08G 59/40 (72) Inventor Hisaichi Horii Osaka 7-7, Tsurumi, Tsurumi-ku, Osaka-shi, Konishi Co., Ltd., Osaka Research Laboratory (72) Inventor Yasuo Ito 4-7-9, Tsurumi-ku, Tsurumi-ku, Osaka-shi, Osaka Konishi Co., Ltd. Osaka Research Laboratory F-term (reference) 4J002 CD05X CD06X CD08X CD11X CD12X CD13X CD20X CH05W CH053 DJ018 EG046 EG086 EN037 ER007 EZ006 EZ046 FD146 GJ01 4J036 AA01 AA02 DA01 DC28 FA13 FB16 JA01 JA06 4J040 EC061 EC062 EC071 EC07 EC02 EC091 EC072 EC092 EC091 EC092 EC091 EC092 EC092 EC091 EC091 EC092 EC091 EC092 EC091 EC021 HD42 JB04 JB11 KA16 LA05 MA06 NA12

Claims (3)

[Claims] 1. A modified silicone resin, (b) a curing agent for a modified silicone resin, (c) an epoxy resin, (d)
A one-pack moisture-curable composition containing a hydrophilic ketimine as a curing agent for an epoxy resin and (e) hydrophobic silica fine powder. 2. (c) 5-300 parts by weight of a hydrophilic ketimine, (a) 10-1000 parts by weight of a modified silicone resin, and (b) curing agent for a modified silicone resin with respect to 100 parts by weight of an epoxy resin. The one-part moisture-curable composition according to claim 1, wherein the composition is 1 to 25 parts by weight, and (e) 1 to 30 parts by weight of a hydrophobic silica fine powder. 3. An adhesive for cement-containing articles comprising the one-part moisture-curable composition according to claim 1.