JP2000040864A - Electronic appliance - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent chip parts provided on a narrow part in a cut-out part and a wide part adjacent to the narrow part from being bent in the longitudinal direction or easily broken or solder parts from being separated if a protrusion part is hit and bent during transportation. SOLUTION: In this electronic appliance, chip parts 4, 5 provided on a protrusion part 2b of a printed board 2 positioned in a cut-out part 1b of a frame body 1 are mounted on the protrusion part 2b so that chip parts 4, 5 are generally parallel with the side wall 1a. Therefore, damages of chip parts 4, 5 and separation of solder parts can be substantially reduced in the cut-out part 1b where the protrusion part 2b is largely bent, compared with conventional electronic appliances.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to electronic equipment such as a television tuner.

[0002]

2. Description of the Related Art Generally, there are various types of electronic devices such as television tuners and the like having functions of television, video, radio and the like. And since these various kinds of products have different circuit configurations, the size of the printed circuit board for forming the circuit is also different, the product with less functions has a smaller printed circuit board, and the product with more functions has a larger printed circuit board. . Therefore, in order to cope with such products, when the frame is common and the printed circuit board is small,
The entire printed circuit board is accommodated in the frame body, and when the printed circuit board is large, a part of the printed circuit board is protruded from the frame body to accommodate various kinds of products.

FIG. 4 illustrates a conventional electronic device in which a part of a printed circuit board protrudes from a frame. As shown in FIG. 4, a box-shaped frame 21 in the form of a metal square has a side wall 21a surrounding four sides. Notch 21 provided in side wall 21a
b, and a mounting leg 21 provided to protrude from the side wall 21a.
c. The printed circuit board 22 provided with a conductive pattern (not shown) includes a base 22a and a base 2a.
It has a protruding part 22b protruding from 2a and a drawer part 22e protruding from the base 22a. The protruding portion 22b includes a wide portion 22c, a wide portion 22c, and a base 22a.
And a narrow portion 22d having both sides cut off, and the terminal 23 is connected to the lead portion 2 of the printed circuit board 22.
2e.

The conductive pattern of the printed circuit board 22 includes various electrical components such as a chip component 4 such as a resistor and a capacitor as shown in FIG. 2 and a chip component 5 composed of a chip type transistor as shown in FIG. The components are connected by soldering to form a desired circuit. And a printed circuit board 22 to which electric components such as chip components 4 and 5 are attached.
Inserts the narrow width portion 22d and the drawer portion 22e into the notch portion 21b of the frame body 21 and attaches the base portion 22a to the frame body 21.
And the base 22 a is fixed to the frame 21 by appropriate means, and attached to the frame 21.

When the printed circuit board 22 is mounted on the frame 21, the narrow portions 22d and the wide portions 22c, which are the protruding portions 22b, protrude outside the frame 21.
As shown in FIG. 2, the chip component 4 is provided with electrode portions 4a at both ends in the longitudinal direction L, and the chip component 5 has terminal portions along the longitudinal direction L as shown in FIG. 5
a is formed, and such chip components 4 and 5
Attached to the base portion 22a and the protruding portion 22b of the printed circuit board 22, a desired circuit is configured.

[0006] Then, the narrow portion 22d as the protruding portion 22b is provided.
In order to increase the density, the chip components 4 and 5 located on the wide portion 22c are formed so that the longitudinal direction L of the chip components 4 and 5 is substantially perpendicular to the side wall 21a having the notch 21b for projecting the narrow portion 22d. It is attached to the protruding part 22b in a state where it is arranged in the direction. In the electronic device having such a configuration, when the protruding portion 22b is bumped by transportation or the like and bent, the inside of the notch portion 21b, on the narrow width portion 22d, and in the narrow width portion 22d.
The chip component 4 on the wide portion 22c located in the vicinity of
5 was bent in the longitudinal direction L, and the chip components 4 and 5 were broken and damaged, and the solder was easily peeled off.

[0007]

In a conventional electronic device, the chip components 4 and 5 located on the narrow portion 22d and the wide portion 22c, which are the protruding portions 22b of the printed circuit board 22, are arranged such that the longitudinal direction L of the chip components 4 and 5 is the side wall 21a. The projection 22b is attached to the projection 22b in a state substantially perpendicular to the projection 22b.
b, on the narrow portion 22d, and on the wide portion 22c located near the narrow portion 22d, the chip components 24 and 25 are bent in the longitudinal direction L, and the chip components 4 and 5 are broken or broken. There is a problem that the solder is easily peeled off.

[0008]

As a first means for solving the above problems, a box-shaped frame having a side wall provided with a notch, a printed board having a conductive pattern, and a conductive pattern are provided. A plurality of chip parts to be soldered to the printed circuit board, the printed board has a base housed in the frame, and a protruding portion that protrudes out of the frame through the notch, The chip component on the protrusion located in the notch is attached to the protrusion with the longitudinal direction of the chip component substantially parallel to the side wall. Further, as a second solving means, a configuration in which the chip component is attached to the protruding portion located outside the frame near the notch in a state in which a longitudinal direction of the chip component is substantially parallel to the side wall. And As a third solution, the projecting portion has a wide portion and a narrow portion connecting the wide portion and the base portion, and the narrow portion is located in the cutout portion, The chip component on the narrow portion is attached to the narrow portion with the longitudinal direction of the chip component substantially parallel to the side wall.
As a fourth solution, the chip component is attached to the wide portion located near the narrow portion with the longitudinal direction of the chip component substantially parallel to the side wall.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic device according to the present invention will be described with reference to FIGS. 1 to 3. FIG. 1 is a perspective view of a main part of the electronic device according to the present invention, and FIG. FIG. 3 is a perspective view of a chip component used in the electronic device of the present invention.

Next, a description will be given of an electronic apparatus according to the present invention with reference to FIGS. 1 to 3.
Has a side wall 1a surrounding four sides, a notch 1b provided in the side wall 1a, and a mounting leg 1c provided to protrude from the side wall 1a. The printed board 2 provided with a conductive pattern (not shown) has a base 2a, a protrusion 2b protruding from the base 2a, and a lead 2e protruding from the base 2a. And the protruding portion 2b
Is composed of a wide portion 2c, a narrow portion 2d connecting the wide portion 2c and the base portion 2a, and having both sides cut off to have a narrow width, and the terminal 3 being fixed to the lead portion 2e of the printed circuit board 2. Have been.

The conductive pattern of the printed circuit board 2 includes various electrical components such as a chip component 4 such as a resistor and a capacitor as shown in FIG. 2 and a chip component 5 composed of a chip type transistor as shown in FIG. The components are connected by soldering to form a desired circuit. Then, the printed circuit board 2 to which the electric parts such as the chip parts 4 and 5 are attached,
Notch 1b of frame 1 with narrow width 2d and drawer 2e
At the same time, the base 2a is inserted into the frame 1, and the base 2a is fixed to the frame 1 by appropriate means, and attached to the frame 1.

When the printed circuit board 2 is mounted on the frame 1, the narrow portions 2d and the wide portions 2c, which are the projecting portions 2b, are formed.
Are in a state of protruding outside the frame 1. As shown in FIG. 2, the chip component 4 is provided with electrode portions 4a at both ends in the longitudinal direction L.
As shown in FIG. 5, a terminal portion 5a is formed along the longitudinal direction L. Such chip components 4 and 5 are attached to the base 2a and the protruding portion 2b of the printed circuit board 2 to form a desired circuit. Make up.

The chip components 4 and 5 located on the narrow portion 2d and the wide portion 2c, which are the projecting portions 2b, are formed by cutting the chip component 4 and 5 in the longitudinal direction L with the notch for projecting the narrow portion 2d. In the state where it is arranged substantially parallel to the side wall 1a having 1b,
It is attached to the protrusion 2b. In particular, notch 1
b, on the protruding portion 2b located in the vicinity of the notch portion 1b,
At the protruding portion 2b located outside the frame 1, the narrow portion 2d, and the wide portion 2c located near the narrow portion 2d, the longitudinal direction L of the chip components 4, 5 is defined as the side wall 1b. Arranged substantially in parallel, the chip components 4 and 5 are attached to the protruding portions 2b,
This prevents the chip components 4 and 5 from being damaged or the like at locations where the bending of the protruding portion 2b is greatly affected.

Further, the protrusion 2b in the above embodiment is
Although the description has been made with the configuration including the wide portion 2c and the narrow portion 2d, the protruding portion 2b may have a straight shape with the width of the narrow portion 2d without the wide portion 2c.

[0015]

According to the electronic apparatus of the present invention, the chip components 4 and 5 on the protruding portion 2b of the printed circuit board 2 located in the notch portion 1b of the frame 1 can be changed in the longitudinal direction L of the chip components 4 and 5.
Is attached to the protruding portion 2b in a state substantially parallel to the side wall 1a. Therefore, in the notch portion 1b where the protruding portion 2b is largely bent, breakage of the chip components 4, 5 can be significantly reduced as compared with the conventional case, and solder An electronic device with less peeling can be provided. Further, in the vicinity of the notch portion 1b, the projecting portion 2b located outside the frame body 1 is provided with the chip component 4, 5 in the longitudinal direction L.
The chip components 4 and 5 are mounted in a state substantially parallel to the side wall 1a. Therefore, breakage of the chip components 4 and 5 can be significantly reduced in the vicinity of the notch 1b where the protrusion 2b is largely bent, as compared with the related art. At the same time, it is possible to provide an electronic device with less solder peeling.

The protruding portion 2b has a wide portion 2c and a narrow portion 2d connecting the wide portion 2c and the base 2a. The narrow portion 2d is located in the cutout portion 1b, and the narrow portion 2d is formed. 2d
Since the upper chip components 4 and 5 are attached to the narrow portion 2d in a state where the longitudinal direction L of the chip components 4 and 5 is substantially parallel to the side wall 1a, in the narrow portion 2d in which the protrusion 2b is largely bent, It is possible to provide an electronic device in which breakage of the chip components 4 and 5 can be significantly reduced as compared with the related art and solder peeling is small. Further, the longitudinal direction L of the chip components 4 and 5 corresponds to the side wall 1 at the position of the wide portion 2c located near the narrow portion 2d.
Since the chip components 4 and 5 are mounted in a state substantially parallel to the position a, breakage of the chip components 4 and 5 can be remarkably reduced in the vicinity of the narrow portion 2d where the bend of the protrusion 2b is relatively large, as compared with the related art. Thus, an electronic device with less solder peeling can be provided.

[Brief description of the drawings]

FIG. 1 is an exemplary perspective view of a main part of an electronic device according to an embodiment of the invention.

FIG. 2 is a perspective view of a chip component used in the electronic device of the present invention.

FIG. 3 is a perspective view of a chip component used in the electronic device of the present invention.

FIG. 4 is a perspective view of a main part of a conventional electronic device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Frame 1a Side wall 1b Notch 1c Mounting leg 2 Printed circuit board 2a Base 2b Projection 2c Wide width 2d Narrow width 2e Leader 3 Terminal 4 Chip part 4a Electrode part 5 Chip part 5a Terminal part

Claims (4)

[Claims] 1. A printed circuit board comprising: a box-shaped frame having a side wall provided with a cutout; a printed board having a conductive pattern; and a plurality of chip components soldered to the conductive pattern. A base that is housed in the frame, and a protrusion that protrudes out of the frame through the cutout, wherein the chip component on the protrusion located in the cutout is An electronic device, wherein the chip component is attached to the protruding portion in a state where a longitudinal direction of the chip component is substantially parallel to the side wall. 2. The chip component is attached to the protruding portion located outside the frame in the vicinity of the notch, with the longitudinal direction of the chip component being substantially parallel to the side wall. The electronic device according to claim 1. 3. The projecting portion has a wide portion and a narrow portion connecting the wide portion and the base. The narrow portion is located in the cutout portion, and the protrusion is located on the narrow portion. 2. The electronic device according to claim 1, wherein the chip component is mounted on the narrow portion with a longitudinal direction of the chip component substantially parallel to the side wall. 4. The chip component is attached to a position of the wide portion located near the narrow portion with the longitudinal direction of the chip component being substantially parallel to the side wall. Electronic device as described.