JP2005123344A - Card for wireless lan - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a card for wireless LAN which is stabilized in connection without disconnection in a semiconductor integrated circuit component. <P>SOLUTION: In the card for wireless LAN, a circuit substrate 1 received in a cover member 6 is provided with shield plates 5 so as to surround the outer peripheral parts of at least three side surfaces of the semiconductor integrated circuit component 3a. The twisting of the shield plates 5 is precluded in the part of the circuit substrate 1, whereat the semiconductor integrated circuit component 3a mounted on the surface thereof when the twisting in the lengthwise direction is generated by a twisting test, and the semiconductor integrated circuit component 3a without disconnection in the connection thereof and stabilized in connection can be obtained, thereby permitting to prevent the twisting by the shield plates 5 and obtain the circuit component 3a, inexpensive and excellent in productivity. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a wireless LAN card that can be inserted into and removed from a wireless LAN device incorporated in a personal computer or the like.

  FIG. 5 is an exploded perspective view of a conventional wireless LAN card. The configuration of the conventional wireless LAN card will be described with reference to FIG. 5. A circuit board 51 made of an insulating substrate has an elongated rectangular shape. Although not shown here, a wiring pattern is provided on the upper surface, and various electronic components including a semiconductor integrated circuit component are surface-mounted to form a desired electric circuit.

  On one short side 51 a side of the circuit board 51, a connector 52 that can be inserted into and removed from the wireless LAN device is disposed, and the terminal 52 a is soldered to the wiring pattern of the circuit board 51. Three sides excluding the connector 52 side are supported by a U-shaped frame 53 of an insulating material.

  The rectangular parallelepiped cover member 54 made of a metal plate is composed of upper and lower cover portions 54a and 54b. The cover member 54 has a circuit board 51 and a frame in the cover member 54 with a part of the connector 52 exposed. 53 is stored. (For example, see Patent Document 1)

  When a conventional wireless LAN card having such a configuration is twisted in the longitudinal direction by a twist test, the circuit board 51 portion on which the surface-mounted semiconductor integrated circuit component is located is twisted. The connection of the integrated circuit component becomes unstable or the connection of the semiconductor integrated circuit component is peeled off.

JP-A-8-203233

  When a conventional wireless LAN card is twisted in the longitudinal direction by a twist test, the circuit board 51 where the surface-mounted semiconductor integrated circuit component is located is twisted, and the connection of the semiconductor integrated circuit component is made. There is a problem that it becomes unstable or the connection of semiconductor integrated circuit components is peeled off.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a wireless LAN card in which the connection of semiconductor integrated circuit components is not peeled off and the connection is stable.

  As a first means for solving the above problems, a circuit board having a wiring pattern and having at least a semiconductor integrated circuit component mounted thereon and a cover member storing the circuit board together with the semiconductor integrated circuit component are provided. The circuit board is provided with a shield plate so as to surround outer peripheral portions of at least three side surfaces of the semiconductor integrated circuit component.

As a second solution, the circuit board has a rectangular shape, and the shield plate has a first plate portion extending in the short side direction of the circuit board and a second plate extending in the long side direction of the circuit board. The board part.
As a third solution, the shield plate is formed in a U shape or a square shape so as to surround a side surface of the semiconductor integrated circuit component.

  Further, as a fourth solving means, the cover member has a rectangular shape, a connector is attached to one short side of the cover member, and the cover member is located on the one short side of the cover member. The circuit board is configured to have the semiconductor integrated circuit component attached thereto.

  As a fifth solution, the semiconductor integrated circuit component includes first and second semiconductor integrated circuit components surface-mounted on the circuit board, and the first semiconductor surrounded by the shield plate. An integrated circuit component is used for a baseband circuit, the second semiconductor integrated circuit component is used for a high frequency circuit, and the shield plate is disposed between the first and second semiconductor integrated circuit components. did.

The wireless LAN card of the present invention includes a circuit board having a wiring pattern and at least a semiconductor integrated circuit component being surface-mounted, and a cover member storing the circuit board together with the semiconductor integrated circuit component. A shield plate is provided so as to surround the outer periphery of at least three side surfaces of the semiconductor integrated circuit component.
As described above, when the shield plate is provided on the circuit board so as to surround the outer peripheral portions of at least three side surfaces of the semiconductor integrated circuit component, the circuit board is surface-mounted when twisted in the longitudinal direction by the twist test. The circuit board part on which the semiconductor integrated circuit component is located is prevented from being twisted by the shield plate, so that the connection of the semiconductor integrated circuit component is not peeled off and a stable connection can be obtained, and the shield plate prevents twisting. It is possible to obtain an inexpensive product with good productivity.

  Further, the circuit board has a rectangular shape, and the shield plate is composed of a first plate part extending in the short side direction of the circuit board and a second plate part extending in the long side direction of the circuit board. The twist of the circuit board portion on which the semiconductor integrated circuit component is located is further prevented by the shield plate, so that the connection of the semiconductor integrated circuit component is not peeled off and a stable connection can be obtained.

  In addition, since the shield plate is formed in a U shape or a square shape so as to surround the side surface of the semiconductor integrated circuit component, the configuration of the shield plate is simple, inexpensive, and highly productive. .

  The cover member has a solid shape, and a connector is attached to one short side of the cover member, and a semiconductor integrated circuit component is attached to the circuit board located on one short side of the cover member. Therefore, in particular, the twist can be prevented at the short side of the highly twisted rectangular circuit board, and the connection of the semiconductor integrated circuit component is not peeled off, and a stable connection can be obtained.

  The semiconductor integrated circuit component includes first and second semiconductor integrated circuit components surface-mounted on a circuit board, and the first semiconductor integrated circuit component surrounded by a shield plate is used for a baseband circuit. In addition, since the second semiconductor integrated circuit component is used for the high frequency circuit and the shield plate is disposed between the first and second semiconductor integrated circuit components, the shield between the baseband circuit and the high frequency circuit is reliable, A baseband circuit can be obtained that is less susceptible to unwanted radiation.

  FIG. 1 is a plan view of a wireless LAN card of the present invention, FIG. 2 is a cross-sectional plan view of an essential part of the wireless LAN card of the present invention, and FIG. FIG. 4 is a perspective view of a circuit board according to the wireless LAN card of the present invention.

  Next, the configuration of the wireless LAN card according to the present invention will be described with reference to FIGS. 1 to 4. The circuit board 1 made of an insulating substrate has an elongated rectangular shape, and a wiring pattern 2 is provided on the upper surface thereof. In addition, the rectangular first and second semiconductor integrated circuit components 3a and 3b and various electronic components (not shown) are surface-mounted to form a desired electric circuit.

  The first semiconductor integrated circuit component 3a is disposed in the vicinity of one short side 1a side of the circuit board 1, and the second semiconductor integrated circuit component 3b is disposed on the back side thereof. Each of the second semiconductor integrated circuit components 3a and 3b is provided with an electrode 3c on the lower surface, and the electrode 3c is connected to the wiring pattern 2 by crimping (phase down) or the like.

  The first semiconductor integrated circuit component 3a is used for a baseband circuit, and the second semiconductor integrated circuit component 3b is used for a high frequency circuit.

  A connector 4 that can be inserted into and removed from the wireless LAN device is disposed on one short side 1 a of the circuit board 1, and the terminal 4 a is soldered to the wiring pattern 2 of the circuit board 1.

  The U-shaped shield plate 5 made of a metal plate is bent from one first plate portion 5a extending in the short side direction of the circuit board 1 and both end portions of the first plate portion 5a. Two second plate portions 5b extending in the long side direction, and a mounting portion 5c provided below the first and second plate portions 5a and 5b.

The shield plate 5 has a first plate portion 5a located between the first and second semiconductor integrated components 3a and 3b, and the first and second plate portions 3a and 3b. Are arranged so as to surround the outer peripheral portions of the three side surfaces, and the attaching portion 5c is soldered to the wiring pattern 2 and attached.
At this time, the first and second plate portions 3a and 3b are in an upright state from the circuit board 1, and the first plate portion 5a shields between the first and second semiconductor integrated components 3a and 3b. Is done.

  The shield plate 5 has been described as being composed of one first plate portion 5a and two second plate portions 5b. However, the shield plate 5 has two first plate portions 5a and one The first semiconductor integrated component is composed of the second plate portion 5b, the two first plate portions 5a are arranged in the short side direction, and the one second plate portion 5b is arranged in the longitudinal direction. You may make it surround the outer peripheral part of three side surfaces of 3a.

  In the above embodiment, the shield plate 5 is described as being U-shaped. However, the shield plate 5 may be formed in a U-shape, and it is a matter of course that various shapes of the shield plate 5 can be applied. .

  The rectangular parallelepiped cover member 6 made of a metal plate is composed of upper and lower cover portions 6a and 6b. The cover member 6 projects the connector 6 from the open portion of the cover member 6 to expose a part of the connector 4. In this state, the circuit board 11, the first and second semiconductor integrated components 3 a and 3 b, and the shield plate 5 are housed in the cover member 6.

  When the wireless LAN card of the present invention having such a configuration is twisted in the longitudinal direction by a twist test, the circuit board 1 portion where the surface-mounted first semiconductor integrated circuit component 3a is located is: It is reinforced by the shield plate 5 to prevent twisting, so that the connection of the first semiconductor integrated circuit component 3a does not become unstable or the connection of the first semiconductor integrated circuit component 3a does not peel off.

The top view of the card | curd for wireless LAN of this invention. FIG. 2 is a cross-sectional plan view of the main part of the wireless LAN card of the present invention. FIG. 3 is a cross-sectional front view of the main part of the wireless LAN card of the present invention. 1 is a perspective view of a circuit board according to a wireless LAN card of the present invention. The exploded perspective view of the conventional wireless LAN card.

Explanation of symbols

1: Circuit board 1a: One short side 2: Wiring pattern 3a: First semiconductor integrated circuit component 3b: Second semiconductor integrated circuit component 3c: Electrode 4: Connector 4a: Terminal 5: Shield plate 5a: First Plate portion 5b: second plate portion 5c: mounting portion 6: cover member 6a: upper cover portion 6b: lower cover portion

Claims (5)

A circuit board having a wiring pattern, on which at least a semiconductor integrated circuit component is surface-mounted, and a cover member storing the circuit board together with the semiconductor integrated circuit component, the circuit board having the semiconductor integrated circuit component A wireless LAN card, wherein a shield plate is provided so as to surround the outer peripheral portions of at least three side surfaces. The circuit board has a rectangular shape, and the shield plate is composed of a first plate part extending in the short side direction of the circuit board and a second plate part extending in the long side direction of the circuit board. The wireless LAN card according to claim 1. 3. The wireless LAN card according to claim 1, wherein the shield plate is formed in a U shape or a square shape so as to surround a side surface of the semiconductor integrated circuit component. The cover member has a solid shape, a connector is attached to one short side of the cover member, and the circuit board located on the one short side of the cover member includes the semiconductor integrated circuit. The wireless LAN card according to any one of claims 1 to 3, wherein a component is attached. The semiconductor integrated circuit component includes first and second semiconductor integrated circuit components surface-mounted on the circuit board, and the first semiconductor integrated circuit component surrounded by the shield plate is used for a baseband circuit. The second semiconductor integrated circuit component is used in a high-frequency circuit, and the shield plate is disposed between the first and second semiconductor integrated circuit components. The wireless LAN card according to any one of the above.

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