JP2000036046A - Method and device for evaluating thixo-molding state - Google Patents

Method and device for evaluating thixo-molding state

Info

Publication number
JP2000036046A
JP2000036046A JP10202138A JP20213898A JP2000036046A JP 2000036046 A JP2000036046 A JP 2000036046A JP 10202138 A JP10202138 A JP 10202138A JP 20213898 A JP20213898 A JP 20213898A JP 2000036046 A JP2000036046 A JP 2000036046A
Authority
JP
Japan
Prior art keywords
solid phase
area
phase region
section
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10202138A
Other languages
Japanese (ja)
Inventor
Akira Kobayashi
彰 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP10202138A priority Critical patent/JP2000036046A/en
Publication of JP2000036046A publication Critical patent/JP2000036046A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To quantitatively evaluate a molding state at a high speed and to effectively utilize it for molding process research and development and process adjustment by detecting a solid phase area by picking up the image of the cross section of a thixo- molding article and calculating a feature amount expressing the state of each solid phase. SOLUTION: A cross section 3 for observation of a molding article 2 is illuminated, the image is picked up by a video camera 6 and the image signal is inputted to an A/D converting circuit 9 of an image processing part 7. Image data outputted from the A/D converting circuit 9 are inputted to a processing area setting circuit 11 and a range to be processed is set as a processing area. In a solid phase candidate area detecting circuit 12, image data higher than prescribed luminance are detected as a solid phase candidate area out of the image data inside the processing area. The areas of the respective solid phase areas are added and the total area of the solid phase areas is measured. Then, the ratio of the total area of the solid phase areas and the area of the processing area is calculated by a solid phase rate calculating circuit 14 and the solid phase rate is obtained. Further, the size of each solid phase area and the distribution of number of the solid phase area are calculated by a solid phase area distribution detecting circuit 15 and the distribution data are obtained.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明はチクソモールド成形品の
成形状態を評価するチクソモールド成形状態評価方法及
びその装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thixomold molding state evaluation method and apparatus for evaluating the molding state of a thixomold molded article.

【0002】[0002]

【従来の技術】近年、成形品の小型軽量化や強度の向上
あるいはリサイクル性の観点からチクソモールド成形法
(チクソトロピー(Thixotropy)の性質を用
いてモールドをすること)が注目を集めている。チクソ
モールド成形法では、温度を所定値に保って固相と液相
が混在する状態にした合金材料(例えばアルミニウムと
マグネシウムの合金)を射出成形機により金型内に注入
する。これによって作られたチクソモールド成形品は、
注入時に液体であった溶融金属中に、固体であった金属
粒が混入した状態となる。チクソモールド成形品は、同
じ合金材料を用いてダイキャスト法等で成形した成形品
に比べて、高い強度を有することから、比重の小さい金
属、例えばアルミニウムやマグネシウムを用いて、軽量
かつ高強度の成形品を得ることができる。チクソモール
ド成形法は発展途上にあり研究開発が活発に行われてい
る。このような状況においてチクソモールド成形品の成
形状態の評価が重要であるがその評価方法はまだ確立さ
れておらず、定量的に迅速に評価する装置の開発が望ま
れている。以下図面を参照しながら、従来の成形状態の
評価方法の一例について説明する。
2. Description of the Related Art In recent years, attention has been paid to a thixomolding method (molding using the properties of thixotropy) from the viewpoint of reducing the size and weight of a molded article, improving strength, or recycling. In the thixomolding method, an alloy material (for example, an alloy of aluminum and magnesium) in which a solid phase and a liquid phase are mixed at a predetermined temperature is injected into a mold by an injection molding machine. The thixomolded product made by this is
Solid metal particles are mixed in the molten metal that was liquid at the time of injection. Thixomolded products are higher in strength than molded products formed by the die casting method or the like using the same alloy material.Thus, by using a metal having a small specific gravity, for example, aluminum or magnesium, a lightweight and high-strength product is used. A molded article can be obtained. The thixomolding method is under development and research and development are being actively conducted. In such a situation, it is important to evaluate the molding state of the thixomolded article, but the evaluation method has not been established yet, and the development of an apparatus for quantitatively and quickly evaluating the molded article is desired. Hereinafter, an example of a conventional method for evaluating a molding state will be described with reference to the drawings.

【0003】図6は従来の目視観察による成形状態評価
装置の構成図である。図6の(a)の位置決めテーブル
21の上に置かれた評価すべき対象物22の表面を一部
削って観察すべき断面23を形成する。断面23を観察
するために顕微鏡24と照明装置25が設置され、断面
を写真撮影するためにカメラ26が顕微鏡24に取り付
けられている。図6の(b)に示す撮影された顕微鏡写
真27を模式的に示す図について説明する。先ず写真2
の全体の重量を測定する。次に写真27の白または黒領
域として撮影された、成形時に固体であった部分すなわ
ち固相領域28の部分をはさみ又はナイフで切り取る。
そして図6の(c)に示す切り取った多数の小片の合計
重量を測定する。最後に写真27の重量と小片の合計重
量との比を求め、重量比により、全領域に占める固相領
域の比率である固相率を算出する。
FIG. 6 is a configuration diagram of a conventional molding state evaluation apparatus by visual observation. The cross section 23 to be observed is formed by partially shaving the surface of the object 22 to be evaluated placed on the positioning table 21 shown in FIG. A microscope 24 and an illuminating device 25 are installed to observe the cross section 23, and a camera 26 is attached to the microscope 24 to take a photograph of the cross section. A diagram schematically showing the photographed micrograph 27 shown in FIG. 6B will be described. First, Photo 2
Measure the overall weight of the. Next, a portion that was solid at the time of molding, that is, a portion of the solid-phase region 28, which was photographed as a white or black region in the photograph 27, is cut out with scissors or a knife.
Then, the total weight of a large number of cut small pieces shown in FIG. 6C is measured. Finally, the ratio of the weight of the photograph 27 to the total weight of the small pieces is determined, and the solid phase ratio, which is the ratio of the solid phase region to the entire region, is calculated from the weight ratio.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、前記の
ようにして固相率を求める成形状態の評価方法では、手
作業による切りぬき作業を用いるため評価の正確さに欠
け、また評価作業に時間がかかるという問題があった。
本発明は、上記従来の問題点を解決するもので、成形状
態の評価を、ビデオ画像処理を用いて定量的にかつ高速
に行い、成形工法の研究開発及び工程の調整に役立てる
ことのできるチクソモールド成形状態評価装置を提供す
ることを目的とする。
However, in the method for evaluating the molding state for obtaining the solid fraction as described above, since the manual cutting operation is used, the accuracy of the evaluation is lacking, and the evaluation operation takes time. There was a problem.
SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems, and performs a thixotropic evaluation of a molding state quantitatively and quickly using video image processing, which can be used for research and development of a molding method and adjustment of a process. An object of the present invention is to provide a molding state evaluation device.

【0005】[0005]

【課題を解決するための手段】この目的を達成するため
に、本発明のチクソモールド成形状態評価方法及びその
装置は、チクソモールド成形品(以下、成形品と略記す
る)の断面を画像入力手段で撮像し、画像入力手段と、
画像入力手段による入力画像から成形品の固相領域を抽
出する。個々の固相領域に基づいて成形状態を定量的に
表す固相率などの特徴量を算出することを特徴とする。
入力画像の映像における固相領域と、その他の領域とは
明るさが異なる。この明るさの差に基づいて固相領域の
合計面積を求め、全面積と、固相領域の合計面積との比
から固相率を求める。
In order to achieve this object, a method and an apparatus for evaluating the state of thixomold molding according to the present invention use an image input means for simulating a cross section of a thixomold molded article (hereinafter abbreviated as molded article). And image input means;
The solid phase region of the molded article is extracted from the image input by the image input means. It is characterized in that a characteristic quantity such as a solid phase ratio that quantitatively represents a molding state is calculated based on each solid phase region.
The solid phase region in the video of the input image and the other regions have different brightness. The total area of the solid phase region is determined based on the difference in brightness, and the solid phase ratio is determined from the ratio of the total area to the total area of the solid phase region.

【0006】本発明のチクソモールド成形状態評価装置
は、さらに個々の固相領域の大きさ及び分布を計測する
手段を備えることを特徴とする。入力画像の映像におけ
る固相領域と他の領域との明るさの差に基づいて、固相
領域の大きさ及び分布を計測する。これにより成形状態
のより詳細な評価ができる。
The thixomolding state evaluation apparatus of the present invention is characterized by further comprising means for measuring the size and distribution of each solid phase region. The size and distribution of the solid phase region are measured based on the difference in brightness between the solid phase region and the other regions in the image of the input image. This allows a more detailed evaluation of the molding state.

【0007】本発明のチクソモールド成形状態評価装置
は、成形品の観察用の断面を射出成形時の射出部に近い
所、遠い所等複数箇所作成し、複数箇所の観察結果を総
合して評価する。これによって、成形品の一部分に偏ら
ない総合的な成形状態の評価を行うことができる。
[0007] The thixomold molding state evaluation apparatus of the present invention creates a cross section for observation of a molded article at a plurality of places such as a place near or far from the injection part at the time of injection molding, and comprehensively evaluates observation results at a plurality of places. I do. As a result, it is possible to evaluate the overall molding state without bias to a part of the molded article.

【0008】[0008]

【発明の実施の形態】以下本発明の好適な実施例につい
て図1ないし図5を用いて説明する。図1は本発明の実
施例のチクソモールド成形状態評価装置の構成を示すブ
ロック図である。位置決めテーブル1の上に置かれた評
価すべき対象物の成形品2は表面を部分的に切削した観
察用断面3を有する。成形品2の上方には、観察用断面
3を照明するために照明装置4が設置されている。照明
装置4は、光源として、例えば白熱電灯を用い、観察用
断面3に略垂直に光を照射する。固相領域は他の部分に
比べて光の反射率が高いので、固相領域の反射光の光度
は他の部分より高い。観察用断面3に対向して、可動支
持部5によって支持された顕微鏡レンズを有するテレビ
カメラ6が設けられており、これにより、観察用断面3
を撮像する。テレビカメラ6はテレビカメラ制御回路8
により制御される。テレビカメラ6から出力された映像
信号は、テレビカメラ制御回路8を介して接続された画
像処理部7のアナログディジタル変換(以後、A/D変
換という)回路9に入力され、画像の明るさに応じて、
例えば0〜255(256階調)の画像データに変換さ
れ数値化される。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to FIGS. FIG. 1 is a block diagram showing a configuration of a thixomolded state evaluation apparatus according to an embodiment of the present invention. The molding 2 of the object to be evaluated, which is placed on a positioning table 1, has an observation section 3 with a partially cut surface. An illumination device 4 is provided above the molded product 2 to illuminate the observation section 3. The illuminating device 4 irradiates light substantially perpendicularly to the observation section 3 by using, for example, an incandescent lamp as a light source. Since the solid phase region has a higher light reflectance than the other portions, the luminous intensity of the reflected light in the solid phase region is higher than the other portions. A television camera 6 having a microscope lens supported by a movable support 5 is provided opposite to the observation section 3, whereby the observation section 3 is provided.
Is imaged. The TV camera 6 is a TV camera control circuit 8
Is controlled by The video signal output from the television camera 6 is input to an analog / digital conversion (hereinafter, referred to as A / D conversion) circuit 9 of an image processing unit 7 connected via a television camera control circuit 8 to reduce the brightness of the image. Depending on,
For example, the image data is converted into image data of 0 to 255 (256 gradations) and is digitized.

【0009】画像処理部7はさらに、図示を省略した外
部の主コントローラあるいは操作盤からこの評価装置の
動作開始などの指令信号30、31が与えられる判定制
御手段としてのCPU10を備えている。CPU10に
は、画像処理の処理エリアを指定する処理エリア設定回
路11、しきい値を決定し固相候補領域を検出する固相
候補領域検出回路12、検出された固相候補領域の面積
の大きさ等の特徴量を用いて固相領域を判定する固相領
域判定回路13、固相率(=固相領域総面積/処理エリ
ア面積)を算出する固相率算出回路14、及び固相率の
大きさによる分布状態を検出する固相領域分布検出回路
15が接続されている。
The image processing unit 7 further includes a CPU 10 as judgment control means to which command signals 30 and 31 for starting the operation of the evaluation device and the like are given from an external main controller or an operation panel (not shown). The CPU 10 includes a processing area setting circuit 11 for specifying a processing area for image processing, a solid phase candidate area detecting circuit 12 for determining a threshold value and detecting a solid phase candidate area, and a size of the area of the detected solid phase candidate area. A solid phase region determination circuit 13 for determining a solid phase region using feature amounts such as a solid phase ratio; a solid phase ratio calculation circuit 14 for calculating a solid phase ratio (= total solid phase region area / processing area area); Is connected to a solid-phase region distribution detecting circuit 15 for detecting a distribution state according to the size of the solid-phase region.

【0010】以上のように構成されたチクソモールド成
形状態評価装置の動作について図2のフローチャートを
参照しつつ説明する。位置決めテーブル1の上に置かれ
た検査すべき成形品2の観察用断面3を照明装置4によ
り照明して、テレビカメラ6で撮像し、出力の画像信号
をテレビカメラ制御回路8を経て画像処理部7のA/D
変換回路9に入力する(図2のフローチャートのステッ
プ1)。固相領域の光の反射率は他の部分より高いの
で、画像信号における固相領域の輝度は他の部分の輝度
より高い。A/D変換回路9の出力の画像データは、A
/D変換回路9の出力端に接続された処理エリア設定回
路11に入力され、処理する範囲が処理エリアとして設
定される(ステップ2)。
The operation of the thixomolded state evaluation apparatus constructed as described above will be described with reference to the flowchart of FIG. The observation section 3 of the molded article 2 to be inspected placed on the positioning table 1 is illuminated by the illuminating device 4, imaged by the television camera 6, and the output image signal is processed through the television camera control circuit 8 for image processing. A / D of part 7
The data is input to the conversion circuit 9 (step 1 in the flowchart of FIG. 2). Since the light reflectance of the solid phase region is higher than that of the other portions, the brightness of the solid phase region in the image signal is higher than the brightness of the other portions. The image data output from the A / D conversion circuit 9 is A
The data is input to the processing area setting circuit 11 connected to the output terminal of the / D conversion circuit 9, and the processing range is set as the processing area (step 2).

【0011】処理エリア設定回路11で設定された処理
エリア内の画像データは、固相候補領域検出回路12に
入力される。固相候補領域検出回路12において、処理
エリア内の画像データのうち、所定の輝度より高いもの
が固相候補領域として検出される(ステップ3)。図3
の(a)に固相候補領域19A、19B、19Cを示
す。固相候補領域は輝度の閾値に基づいて検出している
ので、輝度の高いものであればすべて検出される。例え
ば、観察用断面3上の小さな傷や付着したちり等が固相
候補領域19Aとして検出される場合がある。また、観
察用断面3を切削によって形成したとき、切削の状態に
よっては反射率の高い広い面が形成され、それらが固相
候補領域19Bとして検出される場合がある。そこで上
記の固相候補領域19A、19B、19Cから真の固相
領域のみを選ぶために、所定の面積の範囲を設定し、固
相候補領域19A、19B、19Cの内の所定の面積の
範囲にあるものを真の固相領域と判定する。図3の
(a)の例では、固相候補領域19Aと19Bは除外さ
れるように面積の範囲を設定する。その結果固相候補領
域19Cが固相領域と判定される(ステップ4)。
The image data in the processing area set by the processing area setting circuit 11 is input to a solid phase candidate area detection circuit 12. The solid-phase candidate area detection circuit 12 detects an image data in the processing area having a luminance higher than a predetermined luminance as a solid-phase candidate area (step 3). FIG.
(A) shows the solid-phase candidate regions 19A, 19B, and 19C. Since the solid-phase candidate regions are detected based on the threshold value of luminance, all solid-phase candidate regions are detected if they have high luminance. For example, a small flaw or adherence on the observation section 3 may be detected as the solid phase candidate region 19A. Further, when the observation section 3 is formed by cutting, a wide surface having a high reflectivity is formed depending on the cutting state, and these may be detected as the solid phase candidate region 19B. Therefore, in order to select only a true solid phase region from the solid phase candidate regions 19A, 19B, and 19C, a predetermined area range is set, and a predetermined area range within the solid phase candidate regions 19A, 19B, and 19C is set. Is determined to be a true solid phase region. In the example of FIG. 3A, the area range is set so that the solid-phase candidate regions 19A and 19B are excluded. As a result, the solid phase candidate region 19C is determined as a solid phase region (step 4).

【0012】ステップ4の具体的な処理方法の例を以下
に説明する。高い輝度を有する固相候補領域の画像デー
タが連続して生じるときの継続時間を測定し、所定の上
限時間以上であれば、その固相候補領域は、所定の上限
の面積以上であると判定する。同様にして、継続時間が
所定の下限時間以下であればその固相候補領域は所定の
下限の面積以下であると判定する。上記の処理により選
出された固相領域20のみが存在する処理エリア19の
例を図3の(b)に示す。次に個々の固相領域の面積を
加算して固相領域の合計面積を計測する(ステップ
5)。ステップ5の面積の計測は、高い輝度を有する画
像データの生じる時間を、処理エリア19の処理時間中
累積することにより、行うことができる。固相領域の合
計面積と処理エリアの面積との比を固相率算出回路14
で計算し、固相率が得られる(ステップ6)。また、個
々の固相領域の大きさと固相領域数の分布を固相領域分
布検出回路15により算出することにより図4のグラフ
に示す分布データが得られる(ステップ7)。
An example of a specific processing method of step 4 will be described below. The duration when image data of the solid phase candidate region having high brightness continuously occurs is measured, and if it is equal to or longer than a predetermined upper limit time, the solid phase candidate region is determined to be equal to or larger than the predetermined upper limit area. I do. Similarly, if the duration is equal to or shorter than the predetermined lower limit time, it is determined that the solid phase candidate region is equal to or smaller than the predetermined lower limit area. FIG. 3B shows an example of the processing area 19 in which only the solid phase region 20 selected by the above processing exists. Next, the total area of the solid phase regions is measured by adding the areas of the individual solid phase regions (step 5). The measurement of the area in step 5 can be performed by accumulating the time during which image data having high luminance occurs during the processing time of the processing area 19. The ratio of the total area of the solid phase region to the area of the processing area is calculated by a solid phase ratio calculation circuit 14
Is calculated to obtain the solid fraction (step 6). Further, the distribution of the size of each solid phase region and the number of the solid phase regions is calculated by the solid phase region distribution detection circuit 15 to obtain distribution data shown in the graph of FIG. 4 (step 7).

【0013】図5に示すように、成形品2に観察用の断
面35、36を複数個設けてもよい。この場合、金型へ
成形材料を注入するときの注入孔により形成された突起
34に近い部分の成形品の断面35、突起34から遠い
部分の断面36など複数の部分を削って複数の観察用断
面を設けるとよい。複数の各観察用断面に前記のステッ
プ1から7の処理をすることによって、成形品の全体の
固相率、固相領域の分布を検出することができ、より正
しい評価をすることができる。
As shown in FIG. 5, the molded article 2 may be provided with a plurality of cross sections 35 and 36 for observation. In this case, a plurality of portions such as a cross section 35 of the molded product near the protrusion 34 formed by the injection hole and a cross section 36 far from the protrusion 34 formed by the injection hole when the molding material is injected into the mold are cut to obtain a plurality of observation objects. A cross section may be provided. By performing the above-described steps 1 to 7 on each of a plurality of observation sections, the solid phase ratio and distribution of the solid phase region of the entire molded article can be detected, and more accurate evaluation can be performed.

【0014】このチクソモールド成形状態評価装置を射
出成形機に接続し、前記固相率の検出結果をオンライン
で射出成形機に入力し、制御することもできる。例えば
固相率が低いときは射出時の温度を下げるなど、射出成
形機の自動調整及び制御を行うことができる。
The thixomolding state evaluation device can be connected to an injection molding machine, and the detection result of the solid phase ratio can be input to the injection molding machine online for control. For example, when the solid fraction is low, automatic adjustment and control of the injection molding machine can be performed, such as lowering the temperature at the time of injection.

【0015】[0015]

【発明の効果】本発明によれば、成形品の観察用断面を
テレビカメラにより撮像し、得られた映像信号に基づい
て固相領域を検出するので、きわめて短時間で検出され
るとともに誤差も少なく、成形状態を正確に評価するこ
とができる。
According to the present invention, the cross section for observation of the molded article is imaged by the television camera, and the solid phase region is detected based on the obtained video signal. It is possible to accurately evaluate the molding state with a small amount.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施例のチクソモールド成形状態評価
装置のブロック図である。
FIG. 1 is a block diagram of a thixomold forming state evaluation apparatus according to an embodiment of the present invention.

【図2】前記実施例の動作のフローチャートである。FIG. 2 is a flowchart of the operation of the embodiment.

【図3】(a)は処理エリア内の固相候補領域の例を示
す図である。(b)は処理エリア内の固相領域の例を示
す図である。
FIG. 3A is a diagram showing an example of a solid-phase candidate region in a processing area. (B) is a diagram showing an example of a solid phase region in a processing area.

【図4】固相領域の大きさと、個数を示すグラフであ
る。
FIG. 4 is a graph showing the size and the number of solid phase regions.

【図5】成形品の観察用断面の配置図である。FIG. 5 is a layout view of a cross section for observation of a molded product.

【図6】(a)ないし(c)は従来のチクソモールド成
形状態評価装置の構成図である。
FIGS. 6A to 6C are configuration diagrams of a conventional thixomolded state evaluation apparatus.

【符号の説明】[Explanation of symbols]

1 テーブル 2 成形品 3 観察用断面 4 照明装置 5 可動支持部 6 テレビカメラ 7 画像処理部 8 テレビカメラ制御回路 9 アナログディジタル変換回路 10 CPU 11 処理エリア設定回路 12 固相候補領域検出回路 13 固相領域判定回路 14 固相率算出回路 15 固相領域分布検出回路 Reference Signs List 1 Table 2 Molded product 3 Observation section 4 Illumination device 5 Movable support unit 6 TV camera 7 Image processing unit 8 TV camera control circuit 9 Analog / digital conversion circuit 10 CPU 11 Processing area setting circuit 12 Solid phase candidate area detection circuit 13 Solid phase Area determination circuit 14 Solid phase ratio calculation circuit 15 Solid phase area distribution detection circuit

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 2G051 AA90 AB20 BA20 CA03 CA04 CB01 DA07 EA12 EB01 EB02 2G059 AA03 AA05 BB08 BB15 CC20 EE02 FF01 GG10 JJ11 KK04 MM01 MM09 5B057 AA17 CC03 CE09 DA01 DB02 DC04  ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2G051 AA90 AB20 BA20 CA03 CA04 CB01 DA07 EA12 EB01 EB02 2G059 AA03 AA05 BB08 BB15 CC20 EE02 FF01 GG10 JJ11 KK04 MM01 MM09 5B057 AA17 CC03 CE09 DA01 DB02 DC04

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 チクソモールド成形品の成形状態を解析
しかつ評価を行う装置であって、 チクソモールド成形品の断面を撮像する画像撮像手段
と、 画像撮像手段から出力された画像信号に基づき前記断面
の固相領域を検出する手段と、 個々の固相領域の固相の状態を表す特徴量を算出する手
段と、 を備えることを特徴とするチクソモールド成形状態評価
装置。
1. An apparatus for analyzing and evaluating a molding state of a thixomold molded product, comprising: an image capturing means for capturing a cross section of the thixomold molded product; and an image signal output from the image capturing means. A thixomolding state evaluation device, comprising: means for detecting a solid phase region in a cross section; and means for calculating a characteristic quantity representing a state of a solid phase in each solid phase region.
【請求項2】 個々の固相領域の大きさ及び分布を計測
する手段をさらに備えることを特徴とする請求項1記載
のチクソモールド成形状態評価装置。
2. The thixomold forming state evaluation apparatus according to claim 1, further comprising means for measuring the size and distribution of each solid phase region.
【請求項3】 前記固相領域を検出する手段は、固相領
域を、前記画像信号に含まれる輝度信号の、固相領域と
他の領域との差に基づいて検出することを特徴とする請
求項1記載のチクソモールド成形状態評価装置。
3. The solid-phase region detecting means detects the solid-phase region based on a difference between a solid-phase region and another region of a luminance signal included in the image signal. The thixomold forming state evaluation device according to claim 1.
【請求項4】 前記特徴量を算出する手段は、チクソモ
ールド成形品の成形装置の射出部に近い位置の断面及び
射出部から離れた位置の断面の計測結果を総合すること
を特徴とする請求項1記載のチクソモールド成形状態評
価装置。
4. The apparatus according to claim 1, wherein the means for calculating the characteristic amount synthesizes a measurement result of a cross section at a position close to the injection unit and a cross section at a position away from the injection unit of the molding apparatus for a thixomolded product. Item 3. The thixomold molding state evaluation device according to Item 1.
【請求項5】 チクソモールド成形品の成形状態を解析
しかつ評価を行う方法であって、 チクソモールド成形品の断面を画像撮像手段により撮像
するステップと、 画像撮像手段から出力された画像信号に基づき前記断面
の固相領域を検出するステップと、 個々の固相領域の固相の状態を表す特徴量を算出するス
テップと、 を備えることを特徴とするチクソモールド成形状態評価
方法。
5. A method for analyzing and evaluating a molding state of a thixomold molded product, comprising: a step of imaging a cross section of the thixomold molded product by image capturing means; A step of detecting a solid phase region of the cross section on the basis of the solid phase region, and a step of calculating a characteristic amount representing a state of a solid phase in each solid phase region.
JP10202138A 1998-07-16 1998-07-16 Method and device for evaluating thixo-molding state Pending JP2000036046A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10202138A JP2000036046A (en) 1998-07-16 1998-07-16 Method and device for evaluating thixo-molding state

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10202138A JP2000036046A (en) 1998-07-16 1998-07-16 Method and device for evaluating thixo-molding state

Publications (1)

Publication Number Publication Date
JP2000036046A true JP2000036046A (en) 2000-02-02

Family

ID=16452598

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10202138A Pending JP2000036046A (en) 1998-07-16 1998-07-16 Method and device for evaluating thixo-molding state

Country Status (1)

Country Link
JP (1) JP2000036046A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2394283A (en) * 2002-10-18 2004-04-21 Beta Lasermike Ltd Optical imaging, and monitoring of exposed cut ends of a product

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2394283A (en) * 2002-10-18 2004-04-21 Beta Lasermike Ltd Optical imaging, and monitoring of exposed cut ends of a product

Similar Documents

Publication Publication Date Title
JP4139743B2 (en) Apparatus for measuring non-metallic inclusions in aluminum
US6531707B1 (en) Machine vision method for the inspection of a material for defects
JP2021510226A (en) Methods and equipment for determining the state of metal powder
CN102147402A (en) Machine vision technology based method for rapidly detecting egg freshness
JP2021509716A (en) Systems and methods for setting up production line inspections
TW200301817A (en) A surface conduction examination method and a subtrate examination device
US6765224B1 (en) Machine vision method and system for the inspection of a material
CN101207834A (en) Method for checking digital camera articulation
JPH04158238A (en) Inspecting method of liquid crystal panel
CN107633508A (en) One kind metering product printed substrate outward appearance verification method and system
JP2000036046A (en) Method and device for evaluating thixo-molding state
JP2010185820A (en) Device and method for surface inspection
JP3220455U (en) Leather detector
JP2009002669A (en) Visual inspection device
JP2001050921A (en) Method and device for automatically detecting internal defect of object
JP2002195958A (en) Surface inspecting method
JP3296513B2 (en) Micro diameter measuring device
JPH04343047A (en) Method for inspecting foreign object
JP2011179987A (en) Method and device for measurement of residue
JP3745075B2 (en) Film thickness measuring device
JP2003216930A (en) Method and apparatus for inspecting discoloration
EP4010873B1 (en) Use of an hdr image in a visual inspection process
US20220335587A1 (en) Image inspection apparatus and image inspection method
JPS63220375A (en) Binarization processing method for image
JP2002310940A (en) Product inspection method