JP2000031339A - Lightning-resistant transmitting body and terminal network controller mounted with the same - Google Patents

Lightning-resistant transmitting body and terminal network controller mounted with the same

Info

Publication number
JP2000031339A
JP2000031339A JP20156398A JP20156398A JP2000031339A JP 2000031339 A JP2000031339 A JP 2000031339A JP 20156398 A JP20156398 A JP 20156398A JP 20156398 A JP20156398 A JP 20156398A JP 2000031339 A JP2000031339 A JP 2000031339A
Authority
JP
Japan
Prior art keywords
optical communication
circuit board
printed circuit
communication circuit
viscosity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20156398A
Other languages
Japanese (ja)
Inventor
Satoru Morita
森田  哲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP20156398A priority Critical patent/JP2000031339A/en
Publication of JP2000031339A publication Critical patent/JP2000031339A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To prevent leach of a sealing agent and, at the same time, to prevent bubbles in the gap between optical communication circuit components and a printed board and the deterioration of the adhesion between the components and board by using two kinds of insulating sealing agents having different viscosities. SOLUTION: An optical communication circuit section composed of optical communication circuit components 2 mounted on and soldered to a printed board 1 requiring a dielectric strength and copper foil 4 provided on the substrate 1 is covered by attaching a molded frame 5 made of an electrically insulating material to the board 1 and the gap between the frame 5 and substrate 1 is filled up with a sealing agent 6 having a high viscosity and high electric insulating property. Then a lightning resistant transmitting body is formed by filling up the inside of the frame 5 with another sealing agent 7 having a low viscosity and a low electric insulating property to such a height that the agent 7 can completely cover the component 2 and curing both sealing agents 6 and 7. Therefore, the deterioration of the insulating property of the transmitting body due to bubbles produced in the gaps between optical communication circuit components or between the components and the printed board 1 can be prevented.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は電話回線に接続され
る機器に利用する耐雷型伝送体に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lightning-resistant transmission body used for equipment connected to a telephone line.

【0002】[0002]

【従来の技術】従来、端末網制御装置の様な高い耐雷性
能を要求される電話回線に接続される機器に使用される
耐雷型伝送体は、図10及び図11の様に耐雷性能を必
要とする機器のプリント基板上に電気的絶縁の為の光通
信回路部品を実装・半田付けし回路形成した後、光通信
回路部品やプリント基板上の銅箔からなる光通信回路部
を囲む様に、四方が必要十分な高さの絶縁性材料で出来
た成形枠をプリント基板に固定し、この枠内に電気絶縁
性を有するシール剤を塗布・硬化する事により枠内を絶
縁構造となる様に構成されていた。
2. Description of the Related Art Conventionally, lightning-resistant transmission bodies used in equipment connected to telephone lines requiring high lightning resistance, such as terminal network controllers, require lightning resistance as shown in FIGS. After mounting and soldering optical communication circuit components for electrical insulation on the printed circuit board of the device to be formed, and surrounding the optical communication circuit part consisting of the optical communication circuit components and copper foil on the printed circuit board , A molded frame made of an insulating material with a necessary and sufficient height on all sides is fixed to a printed circuit board, and a sealant with electrical insulation is applied and cured in this frame so that the inside of the frame has an insulating structure. Was configured to.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、この様
な従来の耐雷型伝送体では前記成形枠とプリント基板の
隙間から前記シール剤がはみ出さない様に粘度の高いシ
ール剤を塗布していた。
However, in such a conventional lightning-resistant transmission body, a high-viscosity sealant is applied so that the sealant does not protrude from a gap between the molding frame and the printed circuit board.

【0004】この為、光通信回路部品同士の隙間や光通
信回路部品とプリント基板の隙間等には高粘度のシール
剤が浸透せず、且つ気泡が溜まり易い。この気泡による
隙間や、気泡が温度変化など長時間の環境ストレスによ
り膨張や収縮を繰り返す事によりプリント基板や光通信
回路部品とシール剤との密着性が劣化し、光通信入出力
間の絶縁性が低下すると言う課題を有していた。
For this reason, the high-viscosity sealant does not penetrate into the gap between the optical communication circuit components and the gap between the optical communication circuit component and the printed circuit board, and air bubbles easily accumulate. Repeated expansion and contraction due to long-term environmental stress such as temperature changes due to air gaps and air bubbles deteriorate the adhesion between the printed circuit board and optical communication circuit components and the sealant, and the insulation between the optical communication input and output Had a problem of decreasing.

【0005】また、前記シール剤にて光通信回路部品を
完全に覆う為に、絶縁性材料で出来た四方が必要十分な
高さの枠をプリント基板に固定する必要があった。
Further, in order to completely cover the optical communication circuit component with the sealant, it is necessary to fix a frame made of an insulating material having a necessary and sufficient height to a printed circuit board.

【0006】[0006]

【課題を解決するための手段】本発明は上記課題を解決
するために、始めに前記成形枠とプリント基板の隙間に
粘度の高い電気絶縁性のシール剤を塗布し、隙間を塞い
だ後、前記成形枠内全体に粘度の低い電気絶縁性のシー
ル剤を光通信回路部が覆われる様に塗布・乾燥させ、前
記電気絶縁性材料で出来た成形枠内部が絶縁構造となる
様構成する。
In order to solve the above-mentioned problems, the present invention first applies a high-viscosity electrically insulating sealant to a gap between the molding frame and a printed circuit board and closes the gap. A low-viscosity electrically insulating sealing agent is applied and dried so as to cover the entire optical communication circuit portion in the molding frame, so that the interior of the molding frame made of the electrically insulating material has an insulating structure.

【0007】上記発明によれば、前記成形枠や型と前記
プリント基板の隙間から粘度の低い電気絶縁性のシール
剤が流出することなく、前記成形枠内全体に浸透性が高
く、気泡発生の少ない粘度の低い電気絶縁性のシール剤
を塗布・硬化させ、ユニット化出来るため、前記光通信
回路部品同士の隙間や前記光通信回路部品とプリント基
板の隙間に気泡が溜まり絶縁性が劣化すると言う課題を
解決する事ができる。
According to the above invention, the low-viscosity electrically insulating sealing agent does not flow out of the gap between the molding frame or the mold and the printed circuit board, has high permeability throughout the molding frame, and generates bubbles. It is possible to apply and cure a low-viscosity, low-electricity insulating sealant to form a unit, so that air bubbles accumulate in gaps between the optical communication circuit components and in gaps between the optical communication circuit components and the printed circuit board, resulting in deterioration of insulation. The problem can be solved.

【0008】また、前記成形枠の再利用や型の利用によ
りコストダウンを図る事が可能となる。
Further, it is possible to reduce the cost by reusing the molding frame and using the mold.

【0009】[0009]

【発明の実施の形態】本発明の耐雷型伝送体は、絶縁耐
圧が必要な前記プリント基板上に構成された受光素子と
発光素子の組み合わせによる前記光通信回路部品を囲む
様に、前記の四方が必要十分な高さの電気絶縁性材料で
出来た成形枠を前記プリント基板に固定し、前記成形枠
と前記プリント基板の隙間に前記隙間を埋める様に粘度
の高い電気絶縁性のシール剤を塗布し、次に前記成形枠
内全体に粘度の低い電気絶縁性のシール剤を前記光通信
回路部品が覆われる様に塗布・乾燥させユニット化した
ものである。
BEST MODE FOR CARRYING OUT THE INVENTION The lightning-resistant transmission body of the present invention includes the above-described four-sided optical communication circuit component formed by a combination of a light receiving element and a light emitting element formed on the printed circuit board requiring dielectric strength. A molded frame made of an electrically insulating material having a necessary and sufficient height is fixed to the printed circuit board, and a high-viscosity electrically insulating sealing agent is filled in a gap between the molded frame and the printed circuit board. It is applied, and then a low-viscosity electrically insulating sealing agent is applied and dried so as to cover the entire optical communication circuit component in the molding frame to form a unit.

【0010】これにより、前記成形枠とプリント基板の
隙間からシール剤がはみ出すことを防止し、且つ光通信
回路部品の隙間へのシール剤の浸透性を良くし気泡の発
生など絶縁耐圧劣化の要因を無くすことが出来る。
This prevents the sealant from protruding from the gap between the molding frame and the printed circuit board, improves the permeability of the sealant into the gap between the optical communication circuit components, and causes factors such as generation of bubbles and deterioration of dielectric strength. Can be eliminated.

【0011】また、前記電気絶縁性材料で出来た成形枠
を前記2種類のシール剤との離型性を有する材質とし、
前記シール剤硬化後容易に取り外し再利用するものであ
り、取り外した状態で耐雷型伝送体を構成出来るため、
前記成形枠の材質が電気絶縁性を必要としない幅広い材
質で可能となる。更に、前記成形枠の再利用によりコス
トダウンを図る事が出来る。
[0011] Further, a molding frame made of the above-mentioned electrically insulating material is made of a material having a releasability from the above-mentioned two kinds of sealing agents,
It is easy to remove and reuse after curing the sealant, and it is possible to configure a lightning-resistant transmission body in the removed state,
The molding frame can be made of a wide range of materials that do not require electrical insulation. Further, the cost can be reduced by reusing the molding frame.

【0012】また、前記絶縁性材料で出来た成形枠及び
再利用可能な電気絶縁性を必要としない前記成形枠の代
わりに囲いを樹脂や金属の離型処理された分離型の型で
構成し、前記シール剤を塗布・硬化後に前記型を取り外
し、前記耐雷型伝送体を構成する。
Further, instead of the molding frame made of the above-mentioned insulating material and the above-mentioned molding frame which does not require reusable electric insulation, the enclosure is constituted by a separated mold which is subjected to a release treatment of resin or metal. After applying and curing the sealant, the mold is removed to form the lightning-resistant transmission body.

【0013】これのより、前記の様に成形枠を必要とせ
ず経済的に有利であるばかりでなく機械化や自動化を可
能としコストダウンと合わせて品質安定化を図ることが
できる。
Accordingly, as described above, a molding frame is not required, which is not only economically advantageous, but also enables mechanization and automation, and can stabilize quality together with cost reduction.

【0014】また、前記成形枠及び型の代わりに前記粘
度の高い電気絶縁性のシール剤を更に高粘度・非流動性
とし、前記成形枠や型と同等の高さとなる様囲い状に塗
布し、次に前記シール剤で出来た囲い内部に前記粘度の
低い電気絶縁性のシール剤を塗布・硬化させ耐雷型伝送
体を構成する。
In addition, instead of the molding frame and the mold, the high-viscosity electrically insulating sealing agent is further made highly viscous and non-flowable, and is applied in an enclosing shape so as to have the same height as the molding frame and the mold. Next, the low-viscosity electrically insulating sealing agent is applied and cured inside the enclosure made of the sealing agent to form a lightning-resistant transmission body.

【0015】この為、前記成形枠や型を必要とせず2種
類の粘度の違うシール剤のみで絶縁耐圧劣化要因を無く
した耐雷型伝送体を構成する事が可能となりコストや設
備など経済的に有利となる。
For this reason, it is possible to construct a lightning-resistant transmission body which eliminates the cause of deterioration in dielectric strength with only two types of sealants having different viscosities without the need for the molding frame or the mold, and is economical in terms of cost and equipment. This is advantageous.

【0016】また、前記耐雷型伝送体のいずれかを前記
端末網制御装置の、前記検針用メータと伝送線により接
続し通信制御する通信回路部に搭載し、前記通信回路部
の絶縁距離を拡大することにより、少ない変更とコスト
により大幅に耐雷性能を向上した端末網制御装置を実現
するものである。
Further, any one of the lightning-resistant type transmission bodies is mounted on a communication circuit section of the terminal network control device which is connected to the meter reading meter by a transmission line and controls communication, thereby increasing an insulation distance of the communication circuit section. By doing so, it is possible to realize a terminal network control device that has significantly improved lightning resistance with a small change and cost.

【0017】[0017]

【実施例】以下、本発明の耐雷型伝送体及びそれを搭載
した端末網制御装置の実施例について、図面を用いて説
明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a lightning-resistant transmission body and a terminal network control device equipped with the same according to the present invention will be described below with reference to the drawings.

【0018】(実施例1)図1は本発明の実施例1の耐
雷型伝送体のプリント基板上に実装された受光素子と発
光素子の組み合わせにより構成された光通信回路部品及
び接続された前記プリント基板の銅箔からなる光通信回
路部を必要とされる絶縁距離となるような範囲で囲み、
更に四方の壁が前記光通信回路部の部品より十分に高い
絶縁性材料を成形した枠を固定する前の上面側から見た
外観図、図2は実施例1の前記成形枠と前記プリント基
板の隙間部分に粘度の高い電気絶縁性のシリコンやウレ
タン等のシール剤を塗布し隙間を塞いだ所を側面から見
た断面図、また、図3は実施例1の図2の状態に粘度の
低い電気絶縁性のシール剤7を前記光通信回路部品2を
完全に覆う高さとなる様に塗布・硬化させた側面から見
た断面図である。
(Embodiment 1) FIG. 1 shows an optical communication circuit component composed of a combination of a light receiving element and a light emitting element mounted on a printed circuit board of a lightning-resistant transmission body according to Embodiment 1 of the present invention, Surround the optical communication circuit section made of copper foil on the printed circuit board with the required insulation distance,
FIG. 2 is an external view of the frame formed of an insulating material whose four sides are sufficiently higher than the components of the optical communication circuit section as viewed from above before fixing the frame. FIG. 3 is a cross-sectional view of a portion in which a sealing agent such as silicon or urethane having high viscosity is applied to the gap portion to close the gap, as viewed from the side. FIG. FIG. 5 is a cross-sectional view as seen from a side surface where a low electrical insulating sealant 7 is applied and cured so as to have a height completely covering the optical communication circuit component 2.

【0019】図において、1は、光通信回路部品2を他
の電子部品3と共に実装・半田付けし、銅箔4にて回路
構成されたプリント基板、5は、前記プリント基板1上
に実装された前記光通信回路部品2と接続された銅箔4
からなる光通信回路部を囲む様に前記プリント基板1に
挿入・固定される電気絶縁性材料で出来た成形枠であ
る。6は、前記プリント基板1と挿入・固定された前記
成形枠5の隙間を埋めるため、前記プリント基板1と接
触する前記成形枠5の隅に塗布された粘度の高い電気絶
縁性のシリコンやウレタン等のシール剤であり7は、そ
の後前記光通信回路部品2とそれに接続された前記銅箔
4を完全に覆う様に前記成形枠5内部に塗布・乾燥され
た粘度の低い電気絶縁性のシリコンやウレタン等のシー
ル剤である。
In FIG. 1, reference numeral 1 denotes an optical communication circuit component 2 mounted and soldered together with other electronic components 3, and a printed circuit board 5 composed of a copper foil 4, and 5 mounted on the printed circuit board 1. Copper foil 4 connected to said optical communication circuit component 2
This is a molded frame made of an electrically insulating material which is inserted into and fixed to the printed circuit board 1 so as to surround the optical communication circuit portion made of. 6 is a high-viscosity, electrically insulating silicon or urethane applied to the corners of the molding frame 5 that comes into contact with the printing substrate 1 so as to fill gaps between the molding frame 5 inserted and fixed to the printed circuit board 1. And 7 is a low-viscosity electrically insulating silicon applied and dried inside the molding frame 5 so as to completely cover the optical communication circuit component 2 and the copper foil 4 connected thereto thereafter. And a sealant such as urethane.

【0020】次に作用について説明する。前述のように
電気絶縁耐圧が必要とされるプリント基板1上に実装・
半田付けにて構成された光通信回路部品2と前記プリン
ト基板1上の銅箔4からなる光通信回路部を前記電気絶
縁性材料で出来た成形枠5をプリント基板1上に取付け
て覆い、次に前記成形枠5とプリント基板1の隙間に前
記粘度の高い電気絶縁性のシール剤6を塗布し隙間をう
める。
Next, the operation will be described. As described above, mounting on the printed circuit board 1 that requires electrical
An optical communication circuit part composed of an optical communication circuit component 2 formed by soldering and a copper foil 4 on the printed circuit board 1 is covered by mounting a molded frame 5 made of the electrically insulating material on the printed circuit board 1, Next, the high-viscosity electrically insulating sealing agent 6 is applied to the gap between the molding frame 5 and the printed circuit board 1 to fill the gap.

【0021】次に、前記成形枠5内部に前記光通信回路
部品2を完全に覆う高さまで前記粘度の低い電気絶縁性
のシール剤7を塗布し前記粘度の高い電気絶縁性のシー
ル剤6と共に硬化させ耐雷型伝送体を構成する。
Next, the low-viscosity electrically-insulating sealing agent 7 is applied to the inside of the molding frame 5 to a level that completely covers the optical communication circuit component 2, and is applied together with the high-viscosity electrically-insulating sealing agent 6. It is cured to form a lightning-resistant transmission body.

【0022】(実施例2)また、図4は実施例2の耐雷
型伝送体であり、実施例1同様に前記プリント基板11
上に構成した耐雷型伝送体であり、前記粘度の異なる2
種類のシリコンやウレタン等のシール剤16及び17硬
化後、前記成形枠を取り外した時の側面から見た断面図
である。
(Embodiment 2) FIG. 4 shows a lightning-resistant transmission body according to Embodiment 2, and the printed circuit board 11 is similar to Embodiment 1.
The lightning-resistant transmission body configured above, wherein the viscosity is different.
FIG. 7 is a cross-sectional view of the molding frame after the sealing agents 16 and 17 such as silicon and urethane have been cured and the molding frame is removed.

【0023】図において、15は前記電気絶縁性材料で
出来た成形枠5を電気絶縁性を必要としない前記粘度の
異なる2種類のシリコンやウレタン等のシール剤16及
び17との離型性を有するジュラコン等の材質とした成
形枠である。
In the figure, reference numeral 15 denotes the mold releasability of the molding frame 5 made of the above-mentioned electrically insulating material from the two types of sealing agents 16 and 17 of silicon or urethane having different viscosities which do not require electrical insulation. It is a molding frame made of a material such as Duracon.

【0024】次に作用について説明する。前述のように
電気絶縁性を必要としない前記粘度の異なる2種類のシ
ール剤16及び17との離型性を有するジュラコン等を
型により成形した枠15を前記実施例1同様に前記プリ
ント基板11上に取り付け、前記成形枠15と前記プリ
ント基板11の隙間に前記実施例1同様粘度の高い電気
絶縁性のシール剤16を塗布し隙間を埋め、次に前記成
形枠15内部に前記実施例1同様粘度の低い電気絶縁性
のシール剤17を前記光通信回路部品2を覆う高さまで
塗布し、前記粘度の高い電気絶縁性のシール剤16と共
に硬化させる。
Next, the operation will be described. As described above, the frame 15 formed by molding a Duracon or the like having a releasability from the two kinds of sealing agents 16 and 17 having different viscosities which does not require the electric insulation is formed by the mold in the same manner as in the first embodiment. A high-viscosity electrically insulating sealing agent 16 is applied to the gap between the molding frame 15 and the printed circuit board 11 as in the first embodiment to fill the gap. Similarly, a low-viscosity electrically insulating sealing agent 17 is applied to a level covering the optical communication circuit component 2 and is cured together with the high-viscosity electrically insulating sealing agent 16.

【0025】次に、前記電気絶縁性を必要としない前記
粘度の異なる2種類のシール剤16及び17との離型性
を有する成形枠15をその特性を生かし前記プリント基
板11及び前記粘度の異なる2種類のシール剤16及び
17から取り外し耐雷型伝送体を構成すると共に前記成
形枠15を再利用する。
Next, a molding frame 15 having a releasability from the two kinds of sealing agents 16 and 17 having different viscosities which does not require the electric insulating property is used to make use of its characteristics to make the printed circuit board 11 and the viscosities different in viscosity. It is removed from the two types of sealants 16 and 17 to form a lightning-resistant transmission body, and the molded frame 15 is reused.

【0026】(実施例3)また、図5は実施例3の耐雷
型伝送体であり、実施例2の再利用が可能な電気絶縁性
を必要としないジュラコン等で出来た前記成形枠15の
代わりに離型処理された金属や樹脂で出来た分離型の型
を使用した場合の粘度の異なる2種類のシリコンやウレ
タン等のシール剤26及び27を塗布する前の側面から
見た断面図、図6は前記実施例3の前記粘度の異なる2
種類のシール剤26及び27を塗布・硬化後に前記型を
取り外した後の側面から見た断面図である。
(Embodiment 3) FIG. 5 shows a lightning-resistant transmission body of Embodiment 3 of the present invention, in which the molded frame 15 made of a reusable Duracon or the like which does not require electrical insulation is used. A cross-sectional view as viewed from the side before applying two types of sealants 26 and 27 such as silicon and urethane having different viscosities when using a separated mold made of a metal or resin subjected to mold release processing instead. FIG. 6 is a graph showing the results obtained in Example 3 having different viscosities.
It is sectional drawing seen from the side surface after the type | mold was removed after apply | coating and hardening the kind of sealing agents 26 and 27.

【0027】図において、8は前記再利用が可能な電気
絶縁性を必要としない金属や樹脂で出来た分離型の型で
あり、前記粘度の異なる2種類のシリコンやウレタン等
のシール剤26及び27と分離し取り外し可能と成るよ
う離型処理をしたものである。
In the figure, reference numeral 8 denotes a separate mold made of a reusable metal or resin which does not require electrical insulation. The sealant 26 is made of two kinds of silicone and urethane having different viscosities. The mold is subjected to a release treatment so as to be detachable from the device 27.

【0028】次に作用について説明する。前述の様に金
属や樹脂で出来、離型処理をした分離型の型8を前記実
施例1及び2同様に前記プリント基板21上に取り付
け、前記型8とプリント基板21の隙間に前記実施例1
及び2同様粘度の高い電気絶縁性のシール剤26を塗布
し隙間を埋め、次に前記型8内部に前記実施例1及び2
同様粘度の低い電気絶縁性のシール剤27を前記光通信
回路部品2を覆う高さまで塗布し、前記粘度の高い電気
絶縁性のシール剤26と共に硬化させる。
Next, the operation will be described. As described above, the separation mold 8 made of metal or resin and subjected to the release treatment is mounted on the printed circuit board 21 in the same manner as in the first and second embodiments. 1
2 and 3, a high-viscosity electrically insulating sealing agent 26 is applied to fill the gaps, and then the molds 8 are filled in the first and second embodiments.
Similarly, a low-viscosity electrically insulating sealing agent 27 is applied to a level covering the optical communication circuit component 2 and is cured together with the high-viscosity electrically insulating sealing agent 26.

【0029】次に、前記金属や樹脂で出来、離型処理を
した分離型の型8を取り外し耐雷型伝送体を構成する。
Next, the separation mold 8 made of the above-mentioned metal or resin and subjected to a release treatment is removed to form a lightning-resistant transmission body.

【0030】(実施例4)また、図7は実施例4の耐雷
型伝送体であり、実施例1〜3の前記成形枠5、15及
び前記型8の代わりに前記実施例1〜3の粘度の高い電
気絶縁性のシリコンやウレタン等のシール剤6、16、
26を更に高粘度で非流動性とし、前記成形枠5、15
や前記型8の壁と同様となるよう塗布した上面側から見
た外観図、図8は前記高粘度・非流動の電気絶縁性のシ
リコンやシール剤を塗布後、内部に前記実施例1〜3同
様前記粘度の低い電気絶縁性のシール剤37を塗布し硬
化させた側面から見た断面図である。
(Embodiment 4) FIG. 7 shows a lightning-resistant transmission body of Embodiment 4, in which the molding frames 5, 15 and the mold 8 of Embodiments 1 to 3 are replaced with those of Embodiments 1 to 3. Sealing agents 6 and 16, such as silicon and urethane, which are highly viscous and electrically insulating.
26 are made more viscous and non-fluid, and the molding frames 5, 15
FIG. 8 is an external view seen from the top side, which is applied so as to be similar to the wall of the mold 8, and FIG. FIG. 3 is a cross-sectional view as seen from the side where an electrically insulating sealing agent 37 having a low viscosity is applied and cured as in the case of FIG.

【0031】図において、9は前記実施例1〜3の粘度
の高い電気絶縁性のシリコンやウレタン等のシール剤
6、16、26を更に高粘度で非流動性としたものであ
る。
Referring to FIG. 9, reference numeral 9 denotes a high viscosity non-flowable sealant 6, 16 or 26 made of high-viscosity electrically insulating silicon or urethane of the first to third embodiments.

【0032】次に作用について説明する。前述の様に高
粘度で非流動性のシール剤9を位置や高さが前記実施例
1〜3の成形枠5、15や型8と同じとなる様に塗布す
る。
Next, the operation will be described. As described above, the high-viscosity, non-flowable sealant 9 is applied so that the position and the height are the same as those of the molding frames 5 and 15 and the mold 8 of the first to third embodiments.

【0033】次に、前記実施例1〜3同様に粘度の低い
電気絶縁性のシール剤37を前記同様光通信回路部品2
を覆う高さまで塗布し、前記高粘度で非流動性の電気絶
縁性シール剤9と共に硬化させ耐雷型伝送体を構成す
る。
Next, as in the first to third embodiments, an electrically insulating sealing agent 37 having a low viscosity is applied to the optical communication circuit component 2 in the same manner as described above.
Is applied to a height that covers it, and is cured together with the high-viscosity, non-fluid, electrically insulating sealant 9 to form a lightning-resistant transmission body.

【0034】(実施例5)また、図9は実施例1の耐雷
型伝送体を搭載した端末網制御装置の上面側から見た外
観図である。
(Embodiment 5) FIG. 9 is an external view of a terminal network control device equipped with a lightning-resistant transmission body of Embodiment 1 as viewed from above.

【0035】図において、40は前記実施例1の耐雷型
伝送体であり、41はそれを搭載した端末網制御装置の
プリント基板である。43は前記端末網制御装置のプリ
ント基板41に実装・半田付けにより接続され、伝送線
を介して検針用メータや電話回線を介してセンタ自動検
針装置などの外部機器と接続するための端子台、44は
前記端末網制御装置のプリント基板41を収納・固定し
前記端末網制御装置を構成するケースであり、45は前
記ケース44に取付け、前記端子台43に接続線により
外部機器と接続後、前記端子台43部分をカバーする為
のケース蓋である。
In the figure, reference numeral 40 denotes a lightning-resistant transmission body according to the first embodiment, and reference numeral 41 denotes a printed circuit board of a terminal network control device on which it is mounted. 43 is a terminal block connected to the printed circuit board 41 of the terminal network control device by mounting and soldering, and connecting to an external device such as a center automatic meter reading device via a transmission line via a meter reading meter or a telephone line; Reference numeral 44 denotes a case that accommodates and fixes the printed circuit board 41 of the terminal network control device and constitutes the terminal network control device. Reference numeral 45 denotes a case that is attached to the case 44 and connected to an external device via a connection line to the terminal block 43. It is a case lid for covering the terminal block 43 part.

【0036】次に作用について説明する。前述の様に端
末網制御装置のプリント基板41上に他の部品と同時に
前記端子台43や光通信回路部品42を実装半田付けす
る。
Next, the operation will be described. As described above, the terminal block 43 and the optical communication circuit component 42 are mounted and soldered on the printed circuit board 41 of the terminal network control device simultaneously with other components.

【0037】次に、前記プリント基板41上の光通信回
路部品42からなる光通信回路部を前記実施例1の様に
電気絶縁性の成形枠46で囲み粘度の異なる2種類の絶
縁性のシール剤を塗布・硬化させることにより耐雷型伝
送体40を構成する。次に、この前記耐雷型伝送体40
を搭載した端末網制御装置のプリント基板41を前記ケ
ース44に収納・固定する。
Next, the optical communication circuit section composed of the optical communication circuit components 42 on the printed circuit board 41 is surrounded by an electrically insulating molding frame 46 as in the first embodiment, and two types of insulating seals having different viscosities are used. The lightning-resistant transmission body 40 is formed by applying and curing the agent. Next, the lightning-resistant transmission body 40
The printed circuit board 41 of the terminal network control device equipped with is stored and fixed in the case 44.

【0038】更に、前記端子台43に接続線により外部
機器と接続後前記ケース蓋45を前記ケース44に取り
付け・固定する。
After connecting the terminal block 43 to an external device by a connection wire, the case cover 45 is attached and fixed to the case 44.

【0039】[0039]

【発明の効果】以上のように本発明の耐雷型伝送体によ
れば、前記電気絶縁性の材料で出来た成形枠5やそうで
ない材料で出来た離型性を有する成形枠8、更には前記
離型処理をされ金属や樹脂で出来た分離型の型9と前記
プリント基板1の隙間を粘度の高い電気絶縁性のシール
剤6にて埋め、次に内部の光通信回路部品2を完全に覆
う高さまで粘度の低い電気絶縁性のシール剤7を塗布
し、前記粘度の高い電気絶縁性のシール剤6と共に硬化
させると言う2種類のシール剤を使う事により、従来の
前記成形枠5及び8や型9とプリント基板1の隙間から
はみ出さないようにするためシール剤の粘度をさげる事
が出来ず、光通信回路部品2とプリント基板1の間に気
泡が発生したり、密着性が悪い為に環境変化などにより
空間ができ絶縁性が落ちると言う問題点を対策すること
が出来る。
As described above, according to the lightning-resistant transmission body of the present invention, the molded frame 5 made of the above-mentioned electrically insulating material, the molded frame 8 made of a material other than the above-mentioned material, and the molded frame 8 having the releasability. The gap between the separated mold 9 made of metal or resin and the printed board 1 is filled with a highly viscous electrically insulating sealant 6 and then the internal optical communication circuit component 2 is completely filled. By applying two kinds of sealants, that is, applying a low-viscosity electrically-insulating sealant 7 to a height to cover the same and curing together with the high-viscosity electrically-insulating sealant 6, the conventional molding frame 5 is used. In order not to protrude from the gap between the printed circuit board 8 and the mold 9 and the printed circuit board 1, the viscosity of the sealant cannot be reduced, so that air bubbles are generated between the optical communication circuit component 2 and the printed circuit board 1, Is poor and space is created due to environmental changes, etc. It is possible to measure the problem that the chill.

【0040】更に、前記の様に成形枠5を前記シール剤
6及び7との離型性を有する材料で出来た成形枠8にす
る事により前記シール剤6及び7が硬化後取り外し再利
用することができ経済的である。
Further, as described above, the molding frame 5 is formed into a molding frame 8 made of a material having releasability from the sealing agents 6 and 7, so that the sealing agents 6 and 7 are removed after being cured and reused. Can be economical.

【0041】更に、前記成形枠5及び8の代わりに離型
処理された金属や樹脂で出来た分離型の型9を使い、前
記シール剤6及び7硬化後に取り外すことにより、機械
化や自動化が可能となり品質の向上が図れると共に前記
成形枠5及び8を必要としないため経済的にも有利とな
る。
Further, a separate mold 9 made of a metal or resin subjected to a mold release treatment is used in place of the molding frames 5 and 8, and is removed after the sealing agents 6 and 7 are cured, thereby enabling mechanization and automation. Therefore, the quality can be improved and the molding frames 5 and 8 are not required, which is economically advantageous.

【0042】また、前記成形枠5及び8や型9の代わり
に前記隙間を埋める為の粘度の高い電気絶縁性のシール
剤6を更に高粘度で且つ非流動性とし、前記プリント基
板1上に前記成形枠5や8同様の高さと位置となる様塗
布し、前記光通信回路部品2を完全に覆う様に前記粘度
の低い電気絶縁性のシール剤7を塗布・硬化し前記同様
耐雷型伝送体を構成する事により、前記成形枠5や8及
び型9を必要とせず設備や工数を低減できる。
Further, instead of the molding frames 5 and 8 and the mold 9, a high-viscosity electrically insulating sealing agent 6 for filling the gap is made to have a higher viscosity and non-flowability, and It is applied so as to have the same height and position as the molding frames 5 and 8, and the low-viscosity electrically insulating sealing agent 7 is applied and cured so as to completely cover the optical communication circuit component 2. By configuring the body, the equipment and man-hours can be reduced without the need for the molding frames 5 and 8 and the mold 9.

【0043】また、前記実施例1〜4のどれかの方法に
より構成した耐雷型伝送体11を前記の様に端末網制御
装置のプリント基板12上に実装された光通信回路部に
採用する事により、高耐雷性能を有する端末網制御装置
を比較的大規模な変更を必要とせず、且つ安価に実現す
る事が出来る。
Further, the lightning-resistant type transmission body 11 constructed by any of the above-described embodiments 1 to 4 is employed in the optical communication circuit unit mounted on the printed circuit board 12 of the terminal network control device as described above. Accordingly, a terminal network control device having high lightning resistance can be realized at a low cost without requiring a relatively large-scale change.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施例1の耐雷型伝送体の絶縁性材料
で出来た成形枠をプリント基板上に固定する前の分解斜
視図
FIG. 1 is an exploded perspective view of a lightning-resistant transmission body according to a first embodiment of the present invention before a molded frame made of an insulating material is fixed on a printed circuit board.

【図2】同伝送体の粘度の高い電気絶縁性のシール剤を
塗布した場合の断面図
FIG. 2 is a cross-sectional view of the transmission body when a high-viscosity electrically insulating sealing agent is applied.

【図3】同伝送体の粘度の低い電気絶縁性のシール剤を
塗布した場合の断面図
FIG. 3 is a cross-sectional view of the transmission body when a low-viscosity electrically insulating sealing agent is applied.

【図4】本発明の実施例2の耐雷型伝送体においてシー
ル剤硬化後、成形枠を取り外した時の断面図
FIG. 4 is a cross-sectional view of a lightning-resistant transmission body according to a second embodiment of the present invention when a molding frame is removed after a sealant is cured.

【図5】本発明の実施例3の耐雷型伝送体においてであ
り、成形枠の代わりに型を使用した場合の断面図
FIG. 5 is a sectional view of a lightning-resistant transmission body according to a third embodiment of the present invention, in which a mold is used instead of a molding frame.

【図6】同伝送体の型を取り外した後の断面図FIG. 6 is a cross-sectional view after removing the mold of the transmission body.

【図7】本発明の実施例4の耐雷型伝送体において高粘
度のシール剤を囲いとなるよう塗布した状態の断面図
FIG. 7 is a cross-sectional view of a lightning-resistant transmission body according to a fourth embodiment of the present invention, in which a high-viscosity sealant is applied so as to surround it.

【図8】同伝送体において粘度の低いシール剤を塗布し
硬化させた状態の断面図
FIG. 8 is a cross-sectional view showing a state where a low-viscosity sealant is applied and cured in the transmission body.

【図9】本発明の実施例5の耐雷型伝送体を搭載した端
末網制御装置の外観斜視図
FIG. 9 is an external perspective view of a terminal network control device equipped with a lightning-resistant transmission body according to a fifth embodiment of the present invention.

【図10】従来の耐雷型伝送体のシール剤を塗布する前
の断面図
FIG. 10 is a cross-sectional view of a conventional lightning-resistant transmission body before a sealant is applied.

【図11】同伝送体のシール剤を塗布・硬化させた後の
断面図
FIG. 11 is a cross-sectional view of the transmission body after applying and curing a sealant.

【符号の説明】[Explanation of symbols]

1 プリント基板 2 光通信回路部品 3 その他の電子部品 4 銅箔 5 電気絶縁性材料の成形枠 6 粘度の低い電気絶縁性のシール剤 7 粘度の高い電気絶縁性のシール剤 8 シール剤との離型性を有する成形枠 9 離型処理された分離型の型 10 高粘度・非流動のシール剤 11 耐雷型伝送体 12 端末網制御装置のプリント基板 13 端子台 14 ケース 15 ケース蓋 DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Optical communication circuit component 3 Other electronic components 4 Copper foil 5 Molding frame of an electrically insulating material 6 Low-viscosity electrically insulating sealing agent 7 High-viscosity electrically insulating sealing agent 8 Separation from a sealing agent Molding frame having moldability 9 Separation mold that has been subjected to release processing 10 High-viscosity, non-flowable sealant 11 Lightning-resistant transmission body 12 Terminal board controller printed circuit board 13 Terminal block 14 Case 15 Case lid

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】プリント基板上に構成された受光素子と発
光素子の組み合わせによる光通信回路部を囲むように、
四方が必要十分な高さの電気絶縁性材料で出来た成形枠
をプリント基板に固定し、この成形枠とプリント基板の
隙間に粘度の高い電気絶縁性のシール剤を塗布し、次に
成形枠内全体に粘度の低い電気絶縁性のシール剤を光通
信回路部が覆われるように塗布・硬化させユニット化し
た耐雷型伝送体。
1. An optical communication circuit section comprising a combination of a light receiving element and a light emitting element formed on a printed circuit board.
A molded frame made of an electrically insulating material with a necessary and sufficient height on all sides is fixed to a printed circuit board, and a high-viscosity electrically insulating sealant is applied to the gap between the molded frame and the printed circuit board. A lightning-resistant transmission unit that is made into a unit by applying and curing a low-viscosity electrically insulating sealant on the entire inside so that the optical communication circuit unit is covered.
【請求項2】プリント基板上に構成された受光素子と発
光素子の組み合わせによる光通信回路部を囲むように、
四方が必要十分な高さの電気絶縁性を有しない離型性の
材料で出来た成形枠をプリント基板に固定し、この成形
枠とプリント基板の隙間に粘度の高い電気絶縁性のシー
ル剤を塗布し、次に成形枠内全体に粘度の低い電気絶縁
性のシール剤を光通信回路部が覆われるように塗布し、
前記2種類のシール剤が硬化後に前記成形枠を取り外
し、再利用する様に構成された耐雷型伝送体。
2. An optical communication circuit section formed by a combination of a light receiving element and a light emitting element formed on a printed circuit board.
A molding frame made of a releasable material that does not have electrical insulation with sufficient height on all sides is fixed to the printed circuit board, and a high-viscosity electrically insulating sealant is inserted into the gap between this molding frame and the printed circuit board. Apply, then apply a low-viscosity electrically insulating sealant over the entire molding frame so that the optical communication circuit section is covered,
A lightning-resistant transmission body configured to remove and reuse the molded frame after the two types of sealants have hardened.
【請求項3】プリント基板上に構成された受光素子と発
光素子の組み合わせによる光通信回路部を囲むように、
四方が必要十分な高さの離型処理された分離型の型をプ
リント基板に固定し、この型とプリント基板の隙間に粘
度の高い電気絶縁性のシール剤を塗布し、次に前記型内
全体に粘度の低い電気絶縁性のシール剤を光通信回路部
が覆われるように塗布し、前記2種類のシール剤が硬化
後に前記型を分離・取り外すように構成された耐雷型伝
送体。
3. An optical communication circuit formed by a combination of a light receiving element and a light emitting element formed on a printed circuit board.
A mold of a separation mold having a mold release treatment with a necessary and sufficient height on all sides is fixed to a printed circuit board, and a high-viscosity electrically insulating sealant is applied to a gap between the mold and the printed circuit board. A lightning-resistant transmission body configured to apply an electrically insulating sealing material having a low viscosity so as to cover the optical communication circuit portion as a whole, and to separate and remove the mold after the two types of sealing materials cure.
【請求項4】プリント基板上に構成された受光素子と発
光素子の組み合わせによる光通信回路部を囲むように、
前記請求項1〜3の粘度の高い電気絶縁性のシール剤を
更に高粘度・非流動性としたシール剤を四方が必要十分
な高さになるよう塗布し、次に前記高粘度・非流動性の
シール剤で出来た囲み内部全体に粘度の低い電気絶縁性
のシール剤を光通信回路部が覆われるように塗布し、前
記2種類のシール剤を硬化させユニット化した耐雷型伝
送体。
4. An optical communication circuit portion formed by a combination of a light receiving element and a light emitting element formed on a printed circuit board.
Applying the high-viscosity, non-flowable sealant of the above-mentioned high-viscosity, non-flowable sealant so that all sides have a necessary and sufficient height. A lightning-resistant transmission body in which a low-viscosity electrically insulating sealant is applied to the entire interior of the enclosure made of a conductive sealant so as to cover the optical communication circuit portion, and the two types of sealants are cured to form a unit.
【請求項5】請求項1〜4のいずれかの耐雷型伝送体を
搭載し、検針用メータと伝送線を介して接続され、電話
回線を介してセンタ自動検針装置と接続される端末網制
御装置。
5. A terminal network control comprising the lightning-resistant transmission body according to claim 1, connected to a meter reading meter via a transmission line, and connected to a center automatic meter reading device via a telephone line. apparatus.
JP20156398A 1998-07-16 1998-07-16 Lightning-resistant transmitting body and terminal network controller mounted with the same Pending JP2000031339A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20156398A JP2000031339A (en) 1998-07-16 1998-07-16 Lightning-resistant transmitting body and terminal network controller mounted with the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20156398A JP2000031339A (en) 1998-07-16 1998-07-16 Lightning-resistant transmitting body and terminal network controller mounted with the same

Publications (1)

Publication Number Publication Date
JP2000031339A true JP2000031339A (en) 2000-01-28

Family

ID=16443137

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20156398A Pending JP2000031339A (en) 1998-07-16 1998-07-16 Lightning-resistant transmitting body and terminal network controller mounted with the same

Country Status (1)

Country Link
JP (1) JP2000031339A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6773966B2 (en) 2002-03-25 2004-08-10 Oki Electric Industry Co., Ltd. Method of manufacturing semiconductor device
CN113528838A (en) * 2021-07-26 2021-10-22 中南大学 Acid-base combined step-by-step impurity removal method for waste circuit board copper powder

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6773966B2 (en) 2002-03-25 2004-08-10 Oki Electric Industry Co., Ltd. Method of manufacturing semiconductor device
CN113528838A (en) * 2021-07-26 2021-10-22 中南大学 Acid-base combined step-by-step impurity removal method for waste circuit board copper powder

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