JP2000031202A - Packaging body and method of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the connecting precision as well as the yield by discriminating the acceptability of bump abutting status on wiring terminals in the packaging time of a semiconductor device following the chip on glass mode. SOLUTION: The dummy bumps 16 abutting on a main body substrate 10 are formed in the case of abutting the bumps 13 on the wiring terminals made of the same material as that of the bumps 13 against a liquid crystal driver chip 12 and then the abutting status of the bumps 13 is detected from the backside of the main body substrate so as to discriminate the acceptability of the abutting status of the bumps 13. Finally, corresponding to the discrimination results, the connection requirements of COG(chip on glass) bonder is adjusted to improve the connecting precision of the abutting status of the bumps 13 on the wiring terminals.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly, to a semiconductor device mounting method and a semiconductor device mounting method in which a bare chip of the semiconductor device is directly mounted face down on a substrate.

[0002]

2. Description of the Related Art In recent years, in an electronic device such as an active matrix type liquid crystal display device, an electronic circuit such as a thin film transistor (hereinafter abbreviated as TFT) arranged on a main substrate made of glass or the like is driven or controlled. A mounting method called a chip-on-glass (hereinafter abbreviated as COG) for mounting a semiconductor device directly on a main body substrate has been developed. Among the COG mounting methods, the face-down method, in which mounting at a particularly narrow pitch is possible and which can be applied to a large-sized liquid crystal display device, uses anisotropic bumps in a semiconductor device. It is connected to the wiring terminal of the electronic device on the substrate via the conductive film, or is connected to the wiring terminal with an adhesive resin such as photo-curing. At this connection, the conduction state between the bump and the wiring terminal is detected or There is no means for detecting the displacement between the bump and the wiring terminal, the inclination of the semiconductor device with respect to the substrate, and the like.

However, conventionally, Tape Carrier P
Japanese Patent Application Laid-Open No. 4-287,023 discloses a technique for detecting the connectivity when an package (hereinafter abbreviated as TCP) and a terminal on a glass substrate are connected by an anisotropic conductive film. It is disclosed that a dummy terminal made of a transparent conductive film is provided, and the connection state is detected by observing the degree of collapse of the conductive particles in the anisotropic conductive film at the position of the dummy terminal.

[0004]

However, the above TC
When an observation method of a connection state between P and a terminal on a glass substrate is adapted to COG mounting of a semiconductor device that performs drive control of an active matrix liquid crystal display device,
Since the terminals on the glass substrate are not limited to the transparent conductive film, if the terminals are made of an opaque conductive film, it is impossible to observe the connection state. Inspection cannot be performed. Therefore, after connecting the semiconductor device to the glass substrate, an electrical connection test such as probing is performed, and a conduction failure is found only for the first time. Further, a shift or inclination of the semiconductor device which causes the failure is found, and the connection accuracy is reduced. There is a problem that the yield is remarkably reduced and the yield is deteriorated.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problem, and it is possible to immediately detect the state of contact of a bump with a wiring terminal regardless of the material of the wiring terminal formed on the substrate, and to determine whether the bump of the bump with respect to the wiring terminal is present. The conductive state can be detected, and furthermore, the displacement and inclination of the bump with respect to the wiring terminal can be detected, and the connection conditions of the bump and the wiring terminal can be adjusted based on the detection result, thereby enabling the COG of the semiconductor device. It is an object of the present invention to provide a semiconductor device mounting body and a method for mounting a semiconductor device, which have improved connection accuracy to a substrate and have good characteristics.

[0006]

According to the present invention, as a means for solving the above-mentioned problems, there is provided a main substrate having wiring terminals of an electronic device, and a protruding electrode which is in contact with the wiring terminals and is electrically connected to the electronic device. Wherein the semiconductor device is made of the same material as the protruding electrode and is in contact with the main body substrate when the protruding electrode abuts on the connection terminal. It has a non-conductive protrusion, and enables the main substrate to detect a contact surface with the protrusion from an opposite surface.

According to another aspect of the present invention, there is provided a semiconductor device having a main body substrate having wiring terminals of an electronic device, and a semiconductor device having a protruding electrode which is in contact with the wiring terminals and is electrically connected to the electronic device. In the method for mounting a semiconductor device, the semiconductor device further comprises a protrusion which is made of the same material as the protruding electrode and which is in contact with the main body substrate when the protruding electrode is in contact with the wiring terminal, and which is not conductive with the electronic device. A step of contacting the projection with the main body substrate face down, and a step of detecting the projection contacted with the main body substrate from a surface opposite to the abutting surface.

According to the present invention, the state of contact of the bump with the wiring terminal is detected by detecting the contact surface between the main substrate and the projection from the opposite surface of the main substrate by the above means, and the connection accuracy by COG is detected. To improve the characteristics of the semiconductor device.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. A liquid crystal display element 11, which is an electronic device and holds a liquid crystal composition (not shown), is provided between electrode substrates (not shown) on a main substrate 10 made of transparent glass. Are connected to bumps 13 which are projection electrodes of a liquid crystal driver chip 12 which is a semiconductor device, and are provided with wiring terminals 14 for inputting control signals to the liquid crystal display element 11.

On the other hand, the liquid crystal driver chip 12 has an ascending area equal to the ascending area of the bump 13.
And a dummy bump 16 which is a projection made of the same material as that of the first embodiment. And such a liquid crystal driver chip 12
Is connected to the main substrate 10 by COG via an anisotropic conductive film obtained by dispersing metal particles 17 as a conductive material in a thermoplastic adhesive as a transparent adhesive.

FIG. 3 shows a schematic configuration of the COG bonder 18. Reference numeral 20 denotes a heating / pressing tool for fixedly supporting the liquid crystal driver chip 12, reference numeral 21 denotes a transparent stage on which the main body substrate 10 is set, and reference numeral 22 denotes an upper and lower simultaneous or shutter. , An alignment camera optical system for separately detecting the positions of the liquid crystal driver chip 12 and the main body substrate 10, a monitor 23 for displaying an image from the alignment camera optical system 22,
Reference numeral denotes a lower camera optical system for observing the main body substrate 10 from below the stage 21, and reference numeral 26 denotes a lower monitor for displaying an image from the lower camera optical system 24.

Next, the main substrate 10 is moved by the COG bonder 18.
The process of connecting the liquid crystal driver chip 12 to the LCD will be described with reference to the flowchart shown in FIG. First, the main body substrate 10 having the liquid crystal driver chip 12 and the wiring terminals 14 is attached to the heating / pressing tool 20 and the stage 21, respectively. Then, as shown in step 27, the alignment camera optical system 22 is connected to the main body substrate 10 and the liquid crystal driver chip. 12, the positions of the wiring terminals 14 and the bumps 13 are detected and displayed on the monitor 23, and the process proceeds to step 28. In step 28, the coordinates of the wiring terminals 14 and the bumps 13 are output by a control device (not shown) from the detection result, and the heating / pressing tool 20 or the stage 21 is moved by a driving means (not shown) to move the wiring terminals 14 and the bumps 13. 13 coordinates are superimposed,
In step 30, the positioning camera optical system 22 is retracted.

Next, at step 31, the heating and pressing tool 2
0, the bump 13 is brought into contact with the wiring terminal 14, and is heated and pressurized to thermally cure the anisotropic conductive film.
3 is bonded. At this time, the dummy bumps 16
It is brought into contact with the main body substrate 10 and is bonded with an anisotropic conductive film. Then, in step 32, the lower camera optical system 24 allows the dummy bump 16
The number of metal particles 17 sandwiched between the two is detected, and step 3
At 3, it is compared whether or not the number of particles has reached an allowable range.
When it is determined that good conduction can be obtained between the bump 13 and the wiring terminal 14 because the number of particles between the wiring terminals 14 is the same, the bonding operation is terminated while the number of metal particles 17 at the position of the dummy bump 13 is determined. If the number of particles is less than the allowable range, the number of particles between the bump 13 and the wiring terminal 14 is also small, so that it is determined that the continuity is defective. Becomes

However, the number of the metal particles 17 is detected based on the specular reflection image of the metal particles 17 between the dummy bump 16 and the main substrate 10 detected by the lower camera optical system 24. Is calculated from the area per one of the normally crushed metal particles 17.

With this configuration, the dummy bumps 16 are detected from below the transparent main body substrate 10 and the number of the metal particles 17 at the positions of the dummy bumps 16 is recognized, even though the wiring terminals 14 are not transparent. By recognizing that the number of particles between the bump 13 and the wiring terminal 14 is equivalent, the conduction state can be detected, and it is possible to determine whether the liquid crystal driver chip 12 is mounted or not.

Next, a second embodiment of the present invention will be described with reference to FIG. Note that the second embodiment is different from the first embodiment in that the liquid crystal driver chip has a plurality of types of bumps having different ascending areas, and is otherwise the same as the first embodiment. The same parts are denoted by the same reference numerals, and description thereof will be omitted.

That is, the liquid crystal driver chip 3 of the present embodiment
In FIG. 6, a first bump 37 having a large ascending area and a second bump 38 having a small ascending area are protruded, and a dummy bump 40 having the same ascending area as the second bump 38 is formed. The COG bonder 18 is connected to a wiring terminal (not shown) having the same area as the top area of the first and second bumps 37 and 38 on the main substrate 10 and the first and second bumps 37 and 38, respectively. Bonding is performed. After bonding, the number of the metal bumps 17 between the dummy bumps 40 and the main body substrate is detected from the back surface of the main body substrate 10 by the lower camera optical system 24, and the second bumps 38 having a small area and wiring terminals (shown in FIG. If it is determined that the conduction between them is good, it is assumed that the conduction state of the first bump 37 having a large area is also good, and a wiring terminal (not shown) and both bumps 37,
This is to determine the quality of conduction between the 38.

According to this structure, the first and second bumps 37 and 38 having different ascending areas are formed on the main substrate 10 by COG.
The second bump 38 having a small area is
Metal particles 1 in the dummy bump 40 having the same ascending area
By recognizing the number of particles 7, the second bump 38, which has a smaller area where conduction failure is more likely to occur than the first bump 37.
Only by judging the quality of the conduction state between the wiring terminals (not shown), it is possible to cover the judgment of the quality of the conduction state of the first bump 37 having a large area, without judging the quality of each size. Pass / fail judgment at the time of mounting becomes possible.

Next, a third embodiment of the present invention will be described with reference to FIGS. Note that this third embodiment is
Since two dummy bumps 16 according to the first embodiment are provided on the liquid crystal driver chip 12 and the other components are the same as those of the first embodiment, the same portions are denoted by the same reference numerals and description thereof is omitted. I do.

In the present embodiment, the second bumps 41b having a small area are provided at two positions on the diagonal of the liquid crystal driver chip 42 having the first and second bumps 41a and 41b.
First and second dummy bumps 43 and 44 made of the same material and having the same ascending area are provided, and the metal particles (not shown) at the positions of the dummy bumps 43 and 44 at the time of contact with the main body substrate (not shown) are provided. The inclination of the liquid crystal driver chip 42 is detected based on the degree of the collapse.

That is, the step of connecting the liquid crystal driver chip 42 to the main body substrate (not shown) by the COG bonder 18 includes:
Steps 27 to 31 are the same as the flowchart described in FIG. 6 of the first embodiment,
Thereafter, as shown in the flowchart of FIG. 9, in step 46, the lower camera optical system 24 removes two metal particles from the back side of the main body substrate (not shown) where the first and second dummy bumps 43 and 44 come into contact. The degree of crushing or the deviation of the metal particles is detected, and in step 47, it is compared whether the degree of crushing of the metal particles is uniform or whether the metal particles are deviated, and the crushing at the positions of the dummy bumps 43 and 44 is performed. If the condition is uniform or there is no deviation of the metal particles, the bonding operation is terminated,
If the degree of crushing of the metal particles in the dummy bumps 43 and 44 is not uniform or uneven, and the heating / pressing tool 20 or the liquid crystal driver chip 42 is inclined, the process proceeds to step 48 to calculate the amount of inclination. After converting to the offset amount and automatically performing the offset setting of the inclined state of the heating and pressing tool 20 for the next connection step, the bonding operation is completed.

The state of the metal particles being crushed can be detected by the size of the regular reflection diameter detected by the lower camera optical system 24, and the detection of the deviation of the metal particles can also be detected by the lower camera optical system 24. Can be known from the amount of specular reflection detected.

With such a configuration, the two dummy bumps 43 and 44 are detected from below the transparent main body substrate, the inclination of the liquid crystal driver chip 42 is detected, and the offset setting of the COG bonder 18 is determined from the detection result. The automatic connection enables the liquid crystal driver chip 42 to be connected well without tilting, thereby improving the reliability at the time of mounting.

Next, a fourth embodiment of the present invention will be described with reference to FIGS. In the fourth embodiment, a hollow pattern for positioning is formed on the main body substrate 10 facing the dummy bumps 16 of the first embodiment, and the others are the same as those of the first embodiment. Since the configuration is the same as that of the embodiment, the same reference numerals are given to the same components, and the description thereof will be omitted.

In the present embodiment, a rectangular alignment pattern 51 formed at the same time as the formation of the wiring terminals 14 is provided at a position where the main substrate 10 abuts on the dummy bump 16. Hollow portion 5 of this alignment pattern 51
1a has a shape that fits with the top of the dummy bump 16 and detects a displacement between the bump 13 and the wiring terminal 14 by detecting a displacement between the hollow portion 51a and the dummy bump 16 at the time of contact. Becomes

That is, the main substrate 10 is provided by the COG bonder 18.
The process of connecting the liquid crystal driver chip 12 to the step is the same as the flowchart described in FIG. 6 of the first embodiment from step 27 to step 31, but thereafter, as shown in the flowchart of FIG. Step 52
The lower camera optical system 24 detects a displacement between the alignment pattern 51 and the dummy bump 16 from the back side of the main body substrate 10 at a position where the dummy bump 16 abuts,
In step 53, it is determined whether or not there is a shift, and the hollow portion 51a of the alignment pattern 51 and the dummy bump 1 are compared.
If there is no gap between the dummy bump 16 and the hollow bump 51, the bonding operation is terminated, as shown in FIG.
1, when the gap of D2 is detected, or as shown in FIG.
In the case where a misalignment or a misalignment has occurred such as when the inclination α between the hollow portion 51a and the dummy bump 16 is detected as in the misalignment shown in FIG. After that, the position of the heating / pressing tool 20 or the stage 21 is automatically set for the next connection step, and the bonding operation is completed.

The position deviation and the axis deviation are detected by detecting the positions of two or more points on the alignment pattern 51 by the lower camera optical system 24 and calculating the coordinate values of the alignment pattern 51, while detecting the position of the dummy bump 16. Also, the positions corresponding to the positions of the two or more points are detected, the coordinate values of the dummy bumps are calculated, and the deviation amounts (x, y,
θ) is calculated.

With this configuration, the displacement between the bump 13 and the wiring terminal 14 due to COG is detected by detecting the displacement amount by detecting the alignment pattern 51 and the dummy bump 16 from below the transparent main body substrate. By automatically setting the offset of the displacement of the COG bonder 18 based on the detection result, the liquid crystal driver chip 12 can be connected well without causing the displacement, and the reliability at the time of mounting is improved.

Next, a fifth embodiment of the present invention will be described with reference to FIG. In the fifth embodiment, before the lower camera optical system 24 detects the contact state between the main substrate and the dummy bumps in the fourth embodiment, the anisotropic conductive film is not cured. When the position of the dummy bump is detected by the lower camera optical system 24 while the bump and the wiring terminal are kept in contact with each other, and if the position shift or the axis shift occurs according to the detection result, the anisotropic conductive film is removed. The liquid crystal driver chip 12 is removed without being cured.
Since the present embodiment is the same as the above-described embodiment, the same portions are denoted by the same reference numerals and description thereof will be omitted.

That is, the step of connecting the liquid crystal driver chip 12 to the main body substrate (not shown) by the COG bonder 18 includes:
Steps 27 to 30 are the same as the flowchart described in FIG. 6 of the first embodiment,
Thereafter, as shown in the flowchart of FIG. 13, the heating / pressing tool 20 is lowered in step 57 to abut and press the bump 13 against the wiring terminal 14, and the process proceeds to step 58. At this time, the dummy bump 16 is brought into contact with the main body substrate 10 at the position of the alignment pattern 51, and
At step 60, the lower camera optical system 24 detects the misalignment between the alignment pattern 51 and the dummy bumps 16 from the back side of the main body substrate 10 and compares whether or not the misalignment has occurred at step 60. Hollow part 5
If the dummy bump 1a and the dummy bump 16 are fitted without any gap and there is no displacement, the process proceeds to step 61, while the hollow portion 5
1a and the gap between the dummy bump 16 and the inclination are detected,
If a position shift or axis shift has occurred, step 6
Proceed to 2.

In step 61, the anisotropic conductive film is thermally cured by heating and pressing with the heating and pressing tool 20, and the bonding of the wiring terminals 14 and the bumps 13 is completed. Step 6
In step 2, the amount of positional deviation or the amount of axial deviation is calculated and converted into an offset amount.
Alternatively, after the offset of the position of the stage 21 is automatically set, the liquid crystal drive chip 12 is removed from the main body substrate 10 in step 63, and the operation is terminated. At this point, the anisotropic conductive film is not cured, and the liquid crystal driver chip 12 can be easily removed.

With such a configuration, if misalignment has occurred, the liquid crystal drive chip 12 is immediately removed without being bonded, so that the production of defective products can be prevented beforehand, and the reliability during mounting can be reduced. Can be further improved.

The present invention is not limited to the above-described embodiment, but can be changed without departing from the spirit of the invention. For example, the bonding agent between the protruding electrode and the wiring terminal may be any one as long as it is transparent. Yes, a photo-curable resin may be used.
Also, the size of the projection is not limited, but if the peak area of the various projection electrodes formed in the semiconductor device is smaller than the minimum projection electrode, it is possible to cover the determination of the good or bad conduction of all the projection electrodes. In addition, the process of connecting the protruding electrode and the wiring terminal is optional, and before the process of detecting the protruding abutting surface by the detecting means, the anisotropic conductive film is not cured, and if a good abutment is detected, it is anisotropic. Although the connection is made by curing the conductive film, as described in the fifth embodiment, when the positional deviation or the axis deviation is detected, the semiconductor device is removed without curing the anisotropic conductive film. Similarly to the above, the semiconductor device may be removed immediately without connecting the protruding electrode and the wiring terminal even when a conduction failure or a tilt of the semiconductor device is detected.

[0034]

As described above, according to the present invention, C
In the face down method of the OG, by detecting the contact surface of the protrusion with the main body substrate from the back surface of the main body substrate, even if the wiring terminal formed on the main body substrate is made of an opaque material,
The contact state of the electrode substrate with respect to the wiring terminal can be determined. Therefore, it is possible to inspect the continuity of the continuity before conducting the continuity inspection by probing or the like, and further adjust the connection condition of the semiconductor device immediately according to the detected displacement of the electrode substrate or the inclination of the semiconductor device, or Since the semiconductor device having poor connection can be removed, the connection accuracy of the semiconductor device to the substrate can be improved, and the yield at the time of connection can be improved.

[Brief description of the drawings]

FIG. 1 is a partially omitted perspective view showing a main body substrate according to a first embodiment of the present invention.

FIG. 2 is a perspective view of the liquid crystal driver chip according to the first embodiment of the present invention as viewed from an electrode substrate side.

FIG. 3 is a schematic configuration diagram illustrating a COG bonder according to the first embodiment of the present invention.

FIG. 4 is a schematic explanatory view showing a state in which the liquid crystal driver chip according to the first embodiment of the present invention is mounted on a main body substrate.

FIG. 5 is a partial plan view of the dummy bumps according to the first embodiment of the present invention, which is detected from the back surface of the main body substrate.

FIG. 6 is a flowchart showing a connection process of the liquid crystal driver chip according to the first embodiment of the present invention.

FIG. 7 is a plan view of a liquid crystal driver chip according to a second embodiment of the present invention as viewed from an electrode terminal side.

FIG. 8 is a plan view of a liquid crystal driver chip according to a third embodiment of the present invention as viewed from an electrode terminal side.

FIG. 9 is a flowchart illustrating a connection process of a liquid crystal driver chip according to a third embodiment of the present invention.

FIG. 10 is a partial plan view illustrating a dummy bump according to a fourth embodiment of the present invention, which is detected from the back side of a main body substrate.

FIGS. 11A and 11B are schematic explanatory views showing a displacement between a dummy bump and an alignment pattern according to a fourth embodiment of the present invention, wherein FIG. 11A is a schematic explanatory view showing the positional displacement, and FIG. is there.

FIG. 12 is a flowchart illustrating a connection process of a liquid crystal driver chip according to a fourth embodiment of the present invention.

FIG. 13 is a flowchart illustrating a connection process of a liquid crystal driver chip according to a fifth embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Main body board 11 ... Liquid crystal display element 12 ... Liquid crystal driver chip 13 ... Bump 14 ... Wiring terminal 16 ... Dummy bump 17 ... Metal particle 18 ... COG bonder 20 ... Heating and pressing tool 21 ... Stage 22 ... Positioning camera optical system 24 ... Lower camera optics

Claims (16)

[Claims] 1. A semiconductor device package comprising: a main body substrate having a wiring terminal of an electronic device; and a semiconductor device having a protruding electrode which is opposed to the wiring terminal and is in conduction with the electronic device. The device has a protrusion made of the same material as the protruding electrode and being in contact with the main body substrate when the protruding electrode is in contact with the connection terminal and being non-conductive with the electronic device. A semiconductor device package comprising a material whose contact surface can be detected from an opposite surface. 2. A semiconductor device package comprising: a transparent main body substrate having a wiring terminal of an electronic device; and a semiconductor device having a protruding electrode which is opposed to the wiring terminal and is electrically connected to the electronic device. The semiconductor device has a protrusion which is made of the same material as the protruding electrode and which is in contact with the main body substrate when the protruding electrode is in contact with the wiring terminal, and which is not electrically connected to the electronic device. Wherein the light-shielding body is not provided on the contact surface of the semiconductor device. 3. The semiconductor device package according to claim 1, wherein the area of the top of the protrusion is smaller than the area of the top of the smallest protrusion electrode. . 4. A method of mounting a semiconductor device, comprising: a main body substrate having wiring terminals of an electronic device; and a semiconductor device having a protruding electrode which is opposed to the wiring terminals and is electrically connected to the electronic device. The device is further provided with a projection which is made of the same material as the protruding electrode and which is in contact with the main body substrate when the protruding electrode abuts on the wiring terminal and is non-conductive with the electronic device. And a step of detecting the protrusion contacted with the main body substrate from a surface opposite to the contact surface. 5. The method according to claim 4, wherein a contact surface of the projection is detected after the projection electrode is in contact with the wiring terminal and before bonding. 6. A method of mounting a semiconductor device, comprising: a transparent main body substrate having wiring terminals of an electronic device; and a semiconductor device having a protruding electrode which is in contact with the wiring terminals and is electrically connected to the electronic device. The semiconductor device is further provided with a projection which is made of the same material as the protruding electrode and which is in contact with the main substrate when the protruding electrode abuts on the wiring terminal and which is non-conductive with the electronic device, and which includes a transparent material containing a conductive material. Contacting the protrusion with the body substrate face down via an agent, and detecting an amount of the conductive material interposed between the body substrate and the protrusion from a surface opposite to a contact surface of the body substrate. And
Detecting a conductive state of the bump electrode with the electronic device. 7. A method of mounting a semiconductor device, comprising: a transparent main body substrate having wiring terminals of an electronic device; and a semiconductor device having a protruding electrode which is in contact with the wiring terminals and is electrically connected to the electronic device. The semiconductor device is further provided with a projection which is made of the same material as the protruding electrode and which is in contact with the main substrate when the protruding electrode abuts on the wiring terminal and which is non-conductive with the electronic device, and which includes a transparent material containing a conductive material. Contacting the protrusion with the body substrate face down via an agent, and detecting an amount of the conductive material interposed between the body substrate and the protrusion from a surface opposite to a contact surface of the body substrate. And
Detecting a conduction state of the protruding electrode with the electronic device; and adjusting a contact position by the face-down process if a conduction failure between the protruding electrode and the electronic device is detected in the detecting step. A method of mounting a semiconductor device. 8. The semiconductor device according to claim 1, wherein after the protruding electrode is brought into contact with the wiring terminal and before the bonding, the conductive state of the protruding electrode is detected, and if a conduction failure is detected, the semiconductor device is removed. A method for mounting the semiconductor device according to claim 6. 9. A method for mounting a semiconductor device, comprising: a transparent main body substrate having wiring terminals of an electronic device; and a semiconductor device having a protruding electrode which is in contact with the wiring terminals and is electrically connected to the electronic device. The semiconductor device is further provided with a plurality of protrusions made of the same material as the protruding electrodes and abutting on the main body substrate when the protruding electrodes are in contact with the wiring terminals and being non-conductive with the electronic device, and face-down on the main body substrate. And a step of detecting a pressing state of the plurality of protrusions against the main body substrate from a surface opposite to a contact surface of the main body substrate, and detecting an inclination of the semiconductor device with respect to the main body substrate. A method of mounting a semiconductor device, comprising: 10. A method for mounting a semiconductor device, comprising: a transparent main body substrate having wiring terminals of an electronic device; and a semiconductor device having a protruding electrode which is in contact with the wiring terminals and is electrically connected to the electronic device. The semiconductor device is further provided with a plurality of protrusions made of the same material as the protruding electrodes and abutting on the main body substrate when the protruding electrodes are in contact with the wiring terminals and being non-conductive with the electronic device, and face-down on the main body substrate. And a step of detecting a pressing state of the plurality of protrusions against the main body substrate from a surface opposite to a contact surface of the main body substrate, and detecting an inclination of the semiconductor device with respect to the main body substrate. When the inclination of the semiconductor device is detected in the detection step, the inclination amount is calculated, and the inclination at the time of contact in the face-down step is adjusted according to the inclination amount. And a mounting method for a semiconductor device. 11. A semiconductor device is brought into contact with a main body substrate via a transparent adhesive containing a conductive material, and a state of pressure contact is detected by detecting a degree of crushing of the conductive material on a contact surface of a plurality of projections. Claim 9 or Claim 10
The method for mounting a semiconductor device according to any one of the above. 12. The semiconductor device according to claim 1, wherein the semiconductor device is removed when the pressure contact state of the projection electrode is detected and the inclination of the semiconductor device is detected after the projection electrode is brought into contact with the wiring terminal and before bonding. The method of mounting a semiconductor device according to claim 9. 13. A method for mounting a semiconductor device, comprising: a transparent main body substrate having wiring terminals of an electronic device; and a semiconductor device having a protruding electrode which is in contact with the wiring terminals and is electrically connected to the electronic device. The semiconductor device is further provided with a projection which is made of the same material as that of the protruding electrode and which is in contact with the main body substrate when the protruding electrode comes into contact with the wiring terminal and which is not electrically connected to the electronic device, and the main body substrate is face down. Contacting, and detecting a contact deviation of the protrusion with respect to the main substrate from a surface opposite to a contact surface of the main substrate, and detecting a contact deviation between the projecting electrode and the wiring terminal. A method of mounting a semiconductor device. 14. A method for mounting a semiconductor device, comprising: a transparent main body substrate having wiring terminals of an electronic device; and a semiconductor device having a protruding electrode which is in contact with the wiring terminals and is electrically connected to the electronic device. The semiconductor device is further provided with a projection which is made of the same material as that of the protruding electrode and which is in contact with the main body substrate when the protruding electrode comes into contact with the wiring terminal and which is not electrically connected to the electronic device, and the main body substrate is face-down. Contacting, detecting a contact deviation of the projection with respect to the main substrate from a surface opposite to a contact surface of the main substrate, and detecting a contact deviation between the projecting electrode and the wiring terminal; If a contact displacement between the protruding electrode and the wiring terminal is detected in the detecting step, the contact displacement is calculated and the contact position in the face-down step is adjusted according to the contact displacement. A method of mounting a semiconductor device. 15. When a contact shift of the projecting electrode is detected after the projecting electrode has been brought into contact with the wiring terminal and before bonding,
The method for mounting a semiconductor device according to claim 13, wherein the semiconductor device is removed. 16. The main body substrate has a hollow pattern fitted to the tip of the projection at a contact position with the projection, and detecting the misalignment between the tip of the projection and the hollow pattern to detect the projection. The mounting method of a semiconductor device according to claim 13, wherein a contact shift of the semiconductor device is detected.