JP2000027942A - Vibration isolating mechanism for electronic apparatus - Google Patents
Vibration isolating mechanism for electronic apparatusInfo
- Publication number
- JP2000027942A JP2000027942A JP10197687A JP19768798A JP2000027942A JP 2000027942 A JP2000027942 A JP 2000027942A JP 10197687 A JP10197687 A JP 10197687A JP 19768798 A JP19768798 A JP 19768798A JP 2000027942 A JP2000027942 A JP 2000027942A
- Authority
- JP
- Japan
- Prior art keywords
- vibration
- electronic device
- crystal oscillator
- proof
- acceleration sensitivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Vibration Prevention Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、電子機器に採用
される被防振物の防振機構に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vibration-proof mechanism for a vibration-proof object used in electronic equipment.
【０００２】[0002]
【従来の技術】図９は、例えば特開平５−３３２３９９
号に示された従来の水晶発振器の防振機構を表す図であ
り、また、図１０は、従来の水晶発振器を示す図であ
る。これらの図において、１は防振機構であり、この防
振機構１は、被防振物としての水晶発振器２を支持する
防振材としてのコイルスプリング３から構成される。上
記被防振物としての水晶発振器２は直方体状のケーシン
グ２ａと、その内部に設けられた一定の厚さを有する長
辺形状の水晶振動子取付基板２ｂと、水晶振動子取付基
板２ｂにリード線２ｃ等を介して実装される水晶振動子
２ｄとから構成される。上記コイルスプリング３は水晶
発振器２を電子機器内の被防振物支持部１０に取り付け
るもので、この水晶発振器２の防振機構１を内部に有す
る電子機器は、例えば、図外の自動車，船舶，飛行機あ
るいはヘリコプター等の移動体の通信機器とか光学精密
機器，切削加工機等に搭載して使用されるものである。2. Description of the Related Art FIG.
FIG. 10 is a diagram showing a vibration isolating mechanism of a conventional crystal oscillator shown in FIG. 1, and FIG. 10 is a diagram showing a conventional crystal oscillator. In these figures, reference numeral 1 denotes an anti-vibration mechanism, and the anti-vibration mechanism 1 includes a coil spring 3 as an anti-vibration material that supports a crystal oscillator 2 as an anti-vibration object. The crystal oscillator 2 as the vibration-proof object is connected to a rectangular parallelepiped casing 2a, a long-sided crystal resonator mounting board 2b having a constant thickness provided inside the casing 2a, and a lead connected to the crystal resonator mounting board 2b. And a crystal oscillator 2d mounted via a line 2c or the like. The coil spring 3 attaches the crystal oscillator 2 to the vibration-proof object supporting portion 10 in the electronic device. The electronic device having the vibration isolating mechanism 1 of the crystal oscillator 2 inside is, for example, an automobile or a ship (not shown). It is used by being mounted on mobile communication equipment such as airplanes or helicopters, optical precision equipment, cutting machines and the like.
【０００３】このように、水晶発振器２をコイルスプリ
ング３を含む防振機構１を介して電子機器の被防振物支
持部１０に取り付ける主な理由は、水晶発振器２の外部
の電子機器側からの振動が被防振物支持部１０を伝わっ
て水晶発振器２自体を揺らすことにもとづき、電気的性
能その他に悪影響を及ぼさないようにするものである。As described above, the main reason for attaching the crystal oscillator 2 to the vibration-proof object supporting portion 10 of the electronic device via the vibration isolation mechanism 1 including the coil spring 3 is that the crystal oscillator 2 is mounted on the electronic device outside the crystal oscillator 2. The vibration is transmitted through the vibration-proof object supporting portion 10 and shakes the crystal oscillator 2 itself, so that the electric performance and the like are not adversely affected.
【０００４】以上のように防振機構１は、電子機器側か
ら被防振物方向に振動が伝わらないようにする機能を有
している。そこで、従来は防振機構１を介して水晶発振
器２を支持することになる。[0004] As described above, the vibration isolating mechanism 1 has a function of preventing vibration from being transmitted from the electronic device side toward the vibration-proof object. Therefore, conventionally, the crystal oscillator 2 is supported via the vibration isolation mechanism 1.
【０００５】ここで、従来の水晶発振器２等の防振機構
１におけるコイルスプリング３は、図９に示すように、
被防振物である水晶発振器２に対して与えられる外部か
らの振動を吸収するため、一端が水晶発振器２のケーシ
ング２ａの各角部２ｅ付近に接続され、この角部２ｅか
ら、水晶発振器２の中心部より放射方向に延長した上
で、その他端が電子機器の被防振物支持部１０に接続さ
れ、水晶発振器２に対する全ての方向の振動に対し、防
振効果を与えていた。[0005] Here, the coil spring 3 in the conventional vibration isolating mechanism 1 such as the crystal oscillator 2 is, as shown in FIG.
One end is connected to each corner 2e of the casing 2a of the crystal oscillator 2 in order to absorb external vibration given to the crystal oscillator 2 which is a vibration-proof object. The other end is connected to the vibration-proof object supporting portion 10 of the electronic device after extending in the radial direction from the center portion of the electronic device, thereby providing a vibration-proof effect against vibrations of the crystal oscillator 2 in all directions.
【０００６】[0006]
【発明が解決しようとする課題】一方、水晶発振器２は
振動する上で外部からの振動の影響を受けてしまい、そ
してこの影響、すなわち、加速度感度に方向性を有して
いることが確かめられている。従来の防振機構１は、被
防振物としての水晶発振器２内の水晶振動子２ｄの加速
度感度の方向性やこの水晶発振器２の取り付けられる電
子機器の振動の方向を考慮せず、水晶発振器２の中心か
ら放射状の方向に、四方，八方に延長する如くコイルス
プリング３を配置することにより構成されているため、
防振機構１全体の構造が大きくなることから防振機構１
を備える電子機器の小型化，薄型化を図ることが困難で
あった。また、移動体通信機器等の電子機器の薄型化を
図る場合において、防振機構の実装上の整合性が良くな
いことからこの電子機器自体の小型化，薄型化を図るこ
とも困難であった。On the other hand, the crystal oscillator 2 is affected by external vibrations when vibrating, and it has been confirmed that this influence, that is, the acceleration sensitivity has directionality. ing. The conventional anti-vibration mechanism 1 does not consider the direction of acceleration sensitivity of the crystal oscillator 2d in the crystal oscillator 2 as a vibration-proof object or the direction of vibration of an electronic device to which the crystal oscillator 2 is attached. Since the coil spring 3 is arranged so as to extend in all directions in the radial direction from the center of the coil spring 3,
Since the entire structure of the vibration isolation mechanism 1 becomes large, the vibration isolation mechanism 1
It has been difficult to reduce the size and thickness of electronic devices provided with. Further, when electronic devices such as mobile communication devices are to be made thinner, it is difficult to reduce the size and thickness of the electronic devices themselves because the mounting consistency of the vibration isolation mechanism is not good. .
【０００７】この発明は上記のような問題点を解消する
ためになされたもので、防振機構の小型化を図ると共
に、被防振物を収容する電子機器との実装上の整合性を
良いものとすることにより電子機器全体の小型化を図る
ことを目的とする。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and has been made to reduce the size of the vibration isolating mechanism and to improve the mounting consistency with an electronic device accommodating the vibration-proof object. It is an object of the present invention to reduce the size of the entire electronic device.
【０００８】[0008]
【課題を解決するための手段】請求項１に記載の発明
は、被防振物を支持する防振材を、被防振物の加速度感
度の大きな方向に位置させたものである。According to the first aspect of the present invention, a vibration-proof material for supporting a vibration-proof object is positioned in a direction in which the acceleration sensitivity of the vibration-proof object is large.
【０００９】請求項２に記載の発明は、被防振物を支持
する防振材を、電子機器が搭載されるヘリコプター等の
機器の外部から受ける振動のうち、この振動がより大き
な方向に位置させたものである。According to a second aspect of the present invention, among the vibrations received from the outside of a device such as a helicopter on which an electronic device is mounted, the vibration-proof material supporting the vibration-proof object is positioned in a direction in which the vibration is larger. It was made.
【００１０】請求項３に記載の発明は、被防振物内部の
電子部品実装用の基板の厚み方向を、被防振物内部の振
動子の加速度感度の小さな方向に合わせたものである。According to a third aspect of the present invention, the thickness direction of the electronic component mounting substrate inside the vibration-proof object is adjusted to the direction in which the acceleration sensitivity of the vibrator inside the vibration-proof object is small.
【００１１】請求項４に記載の発明は、被防振物の加速
度感度の小さな方向に、電子機器内の電子部品実装用基
板の厚み方向を合わせたものである。According to a fourth aspect of the present invention, the thickness direction of the electronic component mounting substrate in the electronic device is aligned with the direction in which the acceleration sensitivity of the vibration-proof object is small.
【００１２】[0012]
【発明の実施の形態】以下、本発明の実施の形態を図面
に基づいて説明する。なお、従来と同じものは、同一の
符号により説明する。Embodiments of the present invention will be described below with reference to the drawings. The same components as those in the related art will be described using the same reference numerals.
【００１３】実施の形態１．図１は、この発明の一実施
の形態に係る電子機器用防振機構を示す図であり、図２
は、水晶発振器２に対するＸ方向，Ｙ方向，Ｚ方向の関
係を示す図である。また、図３は、水晶発振器２の振動
印加時のスプリアス特性を示すグラフである。この場
合、Ｘ方向を水晶発振器２内における長辺形の水晶振動
子２ｄの長辺に平行な方向、Ｙ方向を水晶振動子２ｄの
表面に対し直角な方向、Ｚ方向を水晶振動子２ｄの短辺
に平行な方向とし、図４ないし図８においても同様とす
る。本実施の形態に係る防振機構１は、水晶発振器２の
ケーシング２ａの各角部２ｅに一端が接続された左，右
四本ずつのコイルスプリング３をＹ方向と平行な方向に
延長して、その他端が電子機器の被防振物支持部１０に
接続して、電子機器にに取り付けられることにより構成
される。上記の構成により、Ｙ方向についての振動に対
して適切な防振効果を得ることができる。Embodiment 1 FIG. FIG. 1 is a diagram showing a vibration isolating mechanism for an electronic device according to an embodiment of the present invention.
FIG. 3 is a diagram showing a relationship between the X direction, the Y direction, and the Z direction with respect to the crystal oscillator 2. FIG. 3 is a graph showing spurious characteristics of the crystal oscillator 2 when a vibration is applied. In this case, the X direction is a direction parallel to the long side of the long-sided crystal unit 2d in the crystal oscillator 2, the Y direction is a direction perpendicular to the surface of the crystal unit 2d, and the Z direction is a direction of the crystal unit 2d. The direction is parallel to the short side, and the same applies to FIGS. 4 to 8. The anti-vibration mechanism 1 according to the present embodiment extends four left and right coil springs 3 each having one end connected to each corner 2 e of the casing 2 a of the crystal oscillator 2 in a direction parallel to the Y direction. The other end is connected to the vibration-proof object supporting portion 10 of the electronic device and is attached to the electronic device. With the above configuration, it is possible to obtain an appropriate anti-vibration effect against vibration in the Y direction.
【００１４】このような構成としたのは、水晶発振器２
の水晶振動子２ｄの加速度感度には方向性があり、本例
においては、図３のグラフに示すように、振動周波数の
低いときには、Ｘ方向，Ｚ方向の振動によるスプリアス
特性が、Ｙ方向のものと比較して良いことから、加速度
感度がＸ方向，Ｚ方向については小さく、Ｙ方向につい
ては大きい。このように、Ｙ方向に対し加速度感度が大
きいと、外部からのＸ，Ｙ，Ｚ方向の振動のうち、外部
からのＹ方向の振動のために感度が劣化して振動特性に
悪影響をきたす。このため、本実施の形態１では、Ｙ方
向に対してコイルスプリング３を延長させて位置させ
る。この場合、Ｘ，Ｚ方向については加速度感度が小さ
いので、Ｙ方向と同様の防振効果を必要としないため
Ｘ，Ｚ方向には延長しないようにして、Ｙ方向にのみコ
イルスプリング３を延長させたものである。なお、コイ
ルスプリング３の弾性の大きさは、水晶発振器２の重
量，固有振動数等を考慮して、水晶発振器２を水平方向
を保つように適切に支持し得るように設計してある。The reason why such a structure is adopted is that the crystal oscillator 2
In the present example, as shown in the graph of FIG. 3, when the vibration frequency is low, the spurious characteristics due to the vibrations in the X and Z directions are different from those in the Y direction. The acceleration sensitivity is small in the X direction and the Z direction, and large in the Y direction. As described above, when the acceleration sensitivity is large in the Y direction, of the external vibrations in the X, Y, and Z directions, the external vibration in the Y direction deteriorates the sensitivity and adversely affects the vibration characteristics. For this reason, in the first embodiment, the coil spring 3 is extended and positioned in the Y direction. In this case, since the acceleration sensitivity is small in the X and Z directions, the same vibration damping effect as in the Y direction is not required, so that the coil spring 3 is not extended in the X and Z directions, but is extended only in the Y direction. It is a thing. The elasticity of the coil spring 3 is designed in consideration of the weight, the natural frequency, and the like of the crystal oscillator 2 so that the crystal oscillator 2 can be appropriately supported so as to keep the horizontal direction.
【００１５】このように、被防振物としての水晶発振器
２内の水晶振動子２ｄの加速度感度の大きな方向に対し
平行な方向にコイルスプリング３を延長させて水晶発振
器２の防振機構１を構成したので、Ｙ方向の加速度感度
を有する水晶発振器２に対して適切な防振効果を得るこ
とができて、その振動の際に影響を受けにくくするとと
もに、コイルスプリング３がＸ，Ｚ方向には延長しない
ので、従来の如く、水晶発振器２の中心から放射状に四
方，八方に延長される場合に比べ、水晶振動子２ｄの加
速度感度の小さな方向に対する大きさが小さくなるた
め、水晶発振器２の防振機構１全体としての小型化，薄
型化を図ることができる。As described above, the vibration isolator 1 of the crystal oscillator 2 is extended by extending the coil spring 3 in a direction parallel to the direction in which the acceleration sensitivity of the crystal oscillator 2d in the crystal oscillator 2 as the vibration-proof object is large. With this configuration, it is possible to obtain an appropriate vibration damping effect for the crystal oscillator 2 having the acceleration sensitivity in the Y direction, to reduce the influence of the vibration, and to make the coil spring 3 move in the X and Z directions. Since the length of the crystal oscillator 2d in the direction in which the acceleration sensitivity is small is smaller than that of the conventional case where the crystal oscillator 2d is radially extended from the center of the crystal oscillator 2 in all directions and in all directions, It is possible to reduce the size and thickness of the vibration isolation mechanism 1 as a whole.
【００１６】なお、図１は、防振材としてコイルスプリ
ング３を用いているが、図４に示すように、防振材とし
てゲル，ゴム等の弾性体４あるいは空気バネ等を用いて
防振機構１を構成してもよく、この場合においても適切
な防振効果を得ることができ、また、防振機構１の小型
化，薄型化を図ることができる。In FIG. 1, a coil spring 3 is used as a vibration isolator, but as shown in FIG. 4, an elastic body 4 such as gel or rubber or an air spring is used as a vibration isolator. The mechanism 1 may be configured. In this case, an appropriate anti-vibration effect can be obtained, and the size and thickness of the anti-vibration mechanism 1 can be reduced.
【００１７】また、振動によるスプリアス特性は、水晶
発振器２内の水晶振動子２ｄの取付け方向，大きさと
か、あるいはリード線２ｃの長さや、水晶振動子２ｄの
水晶振動子取付基板２ｂへの接着の有無等により変化す
る場合があるため、図１の場合において、Ｘ方向又はＺ
方向における加速度感度が若干存在するような場合に
は、その方向にコイルスプリング３を若干傾斜させても
よい。この場合においても、水晶振動子２ｄの加速度感
度の小さな方向についてはコイルスプリング３を大きく
傾斜させることを必要としないため、加速度感度の小さ
な方向について水晶発振器２の防振機構１の小型化，薄
型化を図ることができる。The spurious characteristics due to vibration are determined by the mounting direction and size of the crystal unit 2d in the crystal oscillator 2, the length of the lead wire 2c, and the bonding of the crystal unit 2d to the crystal unit mounting board 2b. May vary depending on the presence or absence of the
If there is some acceleration sensitivity in the direction, the coil spring 3 may be slightly inclined in that direction. Also in this case, it is not necessary to incline the coil spring 3 greatly in the direction where the acceleration sensitivity of the crystal resonator 2d is small, so that the vibration isolator 1 of the crystal oscillator 2 is reduced in size and thickness in the direction where the acceleration sensitivity is small. Can be achieved.
【００１８】実施の形態２．図５は、この発明の他の実
施の形態に係る電子機器用防振機構を示すものであり、
一例として、被防振物としての水晶発振器２が、例え
ば、ヘリコプター等に搭載される電子機器の如く振動が
Ｘ方向及びＺ方向に対してのみ大きい電子機器被防振物
支持部２０に取り付けられる場合における防振機構の構
成を示すものである。本実施の形態に係る防振機構は、
水晶発振器２のケーシング２ａの各角部２ｅから、Ｘ，
Ｚ両方向に適度な角度を有して延長するようにコイルス
プリング３が配置され、このコイルスプリング３は、
Ｘ，Ｚ方向に延長し、Ｙ方向には延長していない。上記
の構成により、Ｘ方向及びＺ方向について与えられる電
子機器被防振物支持部２０からの振動に対して適切な防
振効果を得ることができるとともに、Ｙ方向には、コイ
ルスプリング３は延長していないので、Ｙ方向の防振機
構の大きさを小さくすることができ、防止機構全体の小
型化，薄型化を図ることができる。Embodiment 2 FIG. FIG. 5 shows a vibration damping mechanism for an electronic device according to another embodiment of the present invention.
As an example, the crystal oscillator 2 as a vibration-proof object is attached to an electronic-device vibration-proof-object support portion 20 whose vibration is large only in the X and Z directions, such as an electronic device mounted on a helicopter or the like. 3 shows a configuration of a vibration isolating mechanism in such a case. The anti-vibration mechanism according to the present embodiment
From each corner 2e of the casing 2a of the crystal oscillator 2, X,
The coil spring 3 is disposed so as to extend at an appropriate angle in both Z directions.
It extends in the X and Z directions and does not extend in the Y direction. With the above configuration, it is possible to obtain an appropriate vibration damping effect against the vibration from the electronic device vibration damped object support portion 20 given in the X direction and the Z direction, and the coil spring 3 is extended in the Y direction. Therefore, the size of the anti-vibration mechanism in the Y direction can be reduced, and the entire anti-vibration mechanism can be reduced in size and thickness.
【００１９】なお、本例では、電子機器の被防振物支持
部２０の振動がＸ方向及びＺ方向にのみ大きい場合を説
明したが、その振動がＹ方向にも若干振動するときは、
コイルスプリング３を、僅かだけＹ方向に傾斜しても防
振機構１の薄型化を図ることができる。In this embodiment, the case where the vibration of the vibration-proof object supporting portion 20 of the electronic device is large only in the X direction and the Z direction is described.
Even if the coil spring 3 is slightly inclined in the Y direction, the thickness of the vibration isolation mechanism 1 can be reduced.
【００２０】実施の形態３．図６は、この発明の他の実
施の形態に係る電子機器用防振機構の構造を示す図であ
り、一例として、振動に対するスプリアス特性の良い方
向（加速度感度の小さな方向）又は水晶発振器２を収容
する移動体通信機器が搭載される被防振物の振動の弱い
方向がＹ方向である場合における防振機構の構成を示す
ものである。水晶発振器２のケーシング２ａの内側にお
いて、水晶振動子取付基板２ｂを有し、この水晶振動子
取付基板２ｂにリード線２ｃ等を介して水晶振動子２ｄ
が実装されるものであるが、本例では、加速度感度が
Ｘ，Ｚ方向又は外部のヘリコプター等の移動体の振動方
向がＸ，Ｚ方向に対して大きい場合に、コイルスプリン
グ３をＸ，Ｚ方向に延長し、Ｙ方向には延長してはいな
いものである。本実施の形態に係る防振機構１を構成す
る水晶発振器２は、水晶発振器２内の水晶振動子取付基
板２ｂの実装において、水晶振動子取付基板２ｂの厚み
方向がＹ方向を向くように実装して構成したものであ
る。すなわち、水晶発振器２のケーシング２ａ内におい
て、水晶振動子２ｄが実装される面に対しＹ方向が垂直
になるように水晶振動子取付基板２ｂを配置したもので
ある。このため、基板２ｂの平面方向はＸ，Ｚ方向にな
る。Embodiment 3 FIG. 6 is a diagram showing a structure of an electronic apparatus vibration damping mechanism according to another embodiment of the present invention. As an example, a direction in which a spurious characteristic against vibration is good (a direction in which acceleration sensitivity is small) or a crystal oscillator 2 is used. 3 shows a configuration of an anti-vibration mechanism in a case where the direction of weak vibration of an anti-vibration object on which a mobile communication device to be accommodated is mounted is the Y direction. A quartz oscillator mounting board 2b is provided inside the casing 2a of the crystal oscillator 2, and the quartz oscillator 2d is connected to the quartz oscillator mounting board 2b via a lead wire 2c or the like.
In this example, when the acceleration sensitivity is large in the X and Z directions or the vibration direction of a moving body such as an external helicopter is large in the X and Z directions, the coil spring 3 is set in the X and Z directions. , But not in the Y direction. The crystal oscillator 2 constituting the anti-vibration mechanism 1 according to the present embodiment is mounted such that the thickness direction of the crystal oscillator mounting substrate 2b in the crystal oscillator mounting substrate 2b in the crystal oscillator 2 is oriented in the Y direction. It is configured as follows. That is, in the casing 2a of the crystal oscillator 2, the crystal oscillator mounting board 2b is arranged so that the Y direction is perpendicular to the surface on which the crystal oscillator 2d is mounted. Therefore, the plane direction of the substrate 2b is in the X and Z directions.
【００２１】このように、水晶発振器２内の水晶振動子
取付基板２ｂの厚み方向を、水晶発振器２の防振機構１
の厚さが薄くなる方向（Ｙ方向）に合わせるようにして
構成したので、コイルスプリング３を延長させない方向
は薄くでき、水晶発振器２の薄くなる方向と合わせて、
全体として薄くでき、水晶振動子取付基板２ｂの厚み方
向を合わせない場合に比べ、防振機構１全体の厚みを一
定の方向（本例では、Ｙ方向）についてさらに薄くする
ことができ、防振機構１全体の小型化，薄型化を図るこ
とができる。また、電子機器の小型化を図ることができ
るとともに、電子機器の薄型化を図る場合において電子
機器用防振機構の実装上の整合性を良いものとすること
ができる。As described above, the thickness direction of the crystal oscillator mounting substrate 2 b in the crystal oscillator 2 is
The thickness of the crystal oscillator 2 can be made thinner in the direction in which the coil spring 3 is not extended.
As a whole, the thickness of the whole anti-vibration mechanism 1 can be further reduced in a certain direction (the Y direction in this example) as compared with a case where the thickness direction of the crystal resonator mounting substrate 2b is not aligned. The entire mechanism 1 can be reduced in size and thickness. In addition, it is possible to reduce the size of the electronic device, and to improve the mounting consistency of the electronic device anti-vibration mechanism when reducing the thickness of the electronic device.
【００２２】実施の形態４．図７は、この発明の他の実
施の形態に係る電子機器の構造を示す図であり、一例と
して、上記実施の形態３に係る防振機構１の厚さが薄く
なる方向がＹ方向である場合における移動体通信機器等
の電子機器の構造を示すものである。また、図８は、一
般的な移動体通信機器等の電子機器の構造の一例を示す
図である。これらの図において、５は水晶発振器２の防
振機構１が収容される移動体通信機器等の電子機器であ
り、被防振物支持部としての直方体状のケーシング５ａ
と、その内側に取り付けられた一定の厚さを有する複数
の長辺形状の基板５ｂから構成される。水晶発振器２の
防振機構１が収容される電子機器５は、水晶発振器２の
防振機構１以外に複数の基板５ｂを有するが、図７に示
す本実施の形態に係る電子機器５は、上記実施の形態３
に係る防振機構１において厚さの薄くなるＹ方向と、電
子機器５の基板５ｂの厚み方向を一致させて内部に配置
したものである。すなわち、基板５ｂにおける部品等の
実装される面に対し、Ｙ方向が垂直になるように配置し
たものである。Embodiment 4 FIG. 7 is a diagram showing a structure of an electronic device according to another embodiment of the present invention. As an example, the direction in which the thickness of the vibration isolator 1 according to the third embodiment becomes thin is the Y direction. 3 shows a structure of an electronic device such as a mobile communication device in the case. FIG. 8 is a diagram illustrating an example of the structure of an electronic device such as a general mobile communication device. In these figures, reference numeral 5 denotes an electronic device such as a mobile communication device in which the vibration isolating mechanism 1 of the crystal oscillator 2 is accommodated, and a rectangular parallelepiped casing 5a as a vibration-proof object support portion.
And a plurality of long-sided substrates 5b having a certain thickness attached to the inside thereof. The electronic device 5 accommodating the vibration isolation mechanism 1 of the crystal oscillator 2 has a plurality of substrates 5b in addition to the vibration isolation mechanism 1 of the crystal oscillator 2, but the electronic device 5 according to the present embodiment shown in FIG. Embodiment 3
In the vibration damping mechanism 1 according to the above, the thickness direction of the substrate 5b of the electronic device 5 is matched with the Y direction in which the thickness is reduced, and is arranged inside. That is, they are arranged so that the Y direction is perpendicular to the surface of the substrate 5b on which components and the like are mounted.
【００２３】図８においては、一般的な移動体通信機器
等の電子機器６の構造の一例として、電子機器６のケー
シング６ａ内の基板６ｂの厚み方向と上記水晶発振器２
の防振機構１の厚さが薄くなる方向を合わせない場合の
電子機器６を示しているが、この場合と比較して、図７
に示す本実施の形態に係る電子機器５は、Ｙ方向におけ
る厚さが薄くなり、電子機器５全体の小型化が図れるこ
ととなる。In FIG. 8, as an example of the structure of an electronic device 6 such as a general mobile communication device, a thickness direction of a substrate 6b in a casing 6a of the electronic device 6 and the crystal oscillator 2 are shown.
FIG. 7 shows the electronic device 6 in a case where the direction in which the thickness of the anti-vibration mechanism 1 of FIG.
In the electronic device 5 according to the present embodiment, the thickness in the Y direction is reduced, and the size of the entire electronic device 5 can be reduced.
【００２４】図７のように、水晶発振器２の防振機構１
が収容される電子機器５において、その内部の基板５ｂ
の厚み方向を上記実施の形態３に係る防振機構１の厚さ
が薄くなる方向に合わせるように配置して構成したの
で、防振機構１の厚さが薄くなる方向において、水晶発
振器２の防振機構１が収容される電子機器５の厚さを薄
くすることができ、電子機器５の小型化，薄型化が図れ
ることとなる。As shown in FIG. 7, the vibration isolating mechanism 1 of the crystal oscillator 2
Is housed in the electronic device 5 in which
Is arranged so that the thickness direction of the vibration isolator 1 according to the third embodiment becomes thinner, so that the crystal oscillator 2 The thickness of the electronic device 5 in which the vibration isolation mechanism 1 is housed can be reduced, and the electronic device 5 can be reduced in size and thickness.
【００２５】なお、本発明では、移動体通信機器を例に
とって説明したが、この機器に限らず、本発明を光学精
密機器用の電子機器にも適用できる。また、被防振物と
しては、水晶発振器を例にとって説明したが、他の被防
振物についても本発明を適用できる。Although the present invention has been described by taking a mobile communication device as an example, the present invention is not limited to this device but can be applied to electronic devices for optical precision equipment. In addition, although the crystal oscillator has been described as an example of the vibration-proof object, the present invention can be applied to other vibration-proof objects.
【００２６】[0026]
【発明の効果】請求項１に記載の発明によれば、被防振
物を支持する防振材を被防振物の加速度感度の大きな方
向に位置させて防振機構を構成したので、一定方向の加
速度感度を有する被防振物に対して適切な防振効果を与
えることができるとともに、被防振物の防振機構全体の
小型化，薄型化を図ることができ、防振機構を収容する
電子機器の小型化，薄型化を図ることができる。According to the first aspect of the present invention, since the vibration-proof material supporting the vibration-proof object is positioned in the direction in which the acceleration sensitivity of the vibration-proof object is large, the vibration-proof mechanism is constituted. In addition to providing an appropriate vibration damping effect to the vibration-proof object having the acceleration sensitivity in the direction, it is possible to reduce the size and thickness of the vibration-proof mechanism of the vibration-proof object. Electronic devices to be housed can be reduced in size and thickness.
【００２７】請求項２に記載の発明によれば、被防振物
を支持する防振材を、電子機器が搭載されるヘリコプタ
ー等の機器の外部から受ける振動のうち、この振動がよ
り大きな方向に位置させることにより防振機構を構成し
たので、外部から被防振物に伝わる振動を抑えつつ、防
振機構全体の小型化，薄型化を図ることができ、防振機
構を収容する電子機器の小型化，薄型化を図ることがで
きる。According to the second aspect of the present invention, among the vibrations received from the outside of a device such as a helicopter on which the electronic device is mounted, the vibration-proof material supporting the vibration-proof object is directed in a direction in which the vibration is larger. The electronic device that accommodates the vibration-proof mechanism can be made smaller and thinner while suppressing vibration transmitted from the outside to the vibration-proof object. Can be reduced in size and thickness.
【００２８】請求項３に記載の発明によれば、被防振物
内部の電子部品実装用の基板の厚み方向を、被防振物内
部の振動子の加速度感度の小さい方向に合わせて防振機
構を構成したので、防振機構全体の薄型化を図ることが
でき、防振機構の収容される電子機器の薄型化を図る場
合において、防振機構の実装上の整合性を良いものとす
ることができる。According to the third aspect of the present invention, the thickness direction of the electronic component mounting substrate inside the vibration-proof object is matched with the direction in which the acceleration sensitivity of the vibrator inside the vibration-proof object is small. Since the mechanism is configured, it is possible to reduce the thickness of the entire vibration isolating mechanism, and to improve the mounting consistency of the vibration isolating mechanism when reducing the thickness of the electronic device in which the vibration isolating mechanism is housed. be able to.
【００２９】請求項４に記載の発明によれば、被防振物
の加速度感度の小さな方向に、電子機器内の電子部品実
装用基板の厚み方向を合わせて電子機器を構成したの
で、電子機器全体の薄型化を図ることができる。According to the fourth aspect of the present invention, the electronic device is configured such that the thickness direction of the electronic component mounting substrate in the electronic device is aligned with the direction in which the acceleration sensitivity of the vibration-proof object is small. The overall thickness can be reduced.
【図１】 この発明の一実施の形態に係る水晶発振器の
防振機構を示す斜視図である。FIG. 1 is a perspective view showing a vibration isolation mechanism of a crystal oscillator according to an embodiment of the present invention.
【図２】 この発明の実施の形態に係る水晶発振器と
Ｘ，Ｙ，Ｚの方向の関係を示す斜視図である。FIG. 2 is a perspective view showing a relationship between the crystal oscillator according to the embodiment of the present invention and X, Y, and Z directions.
【図３】 この発明の一実施の形態に係る水晶発振器に
対し、Ｘ，Ｙ，Ｚの方向に振動が印加されたときのスプ
リアス特性を示すグラフである。FIG. 3 is a graph showing spurious characteristics when vibration is applied in X, Y, and Z directions to the crystal oscillator according to one embodiment of the present invention.
【図４】 この発明の一実施の形態に係る水晶発振器の
防振機構を示す斜視図である。FIG. 4 is a perspective view showing a vibration isolating mechanism of the crystal oscillator according to one embodiment of the present invention.
【図５】 この発明の他の実施の形態に係る水晶発振器
の防振機構を示す斜視図である。FIG. 5 is a perspective view showing a vibration isolating mechanism of a crystal oscillator according to another embodiment of the present invention.
【図６】 この発明の他の実施の形態に係る水晶発振器
を示す断面図である。FIG. 6 is a cross-sectional view showing a crystal oscillator according to another embodiment of the present invention.
【図７】 この発明の他の実施の形態に係る水晶発振器
を収容する移動体通信機器の構造を示す断面図である。FIG. 7 is a cross-sectional view showing a structure of a mobile communication device accommodating a crystal oscillator according to another embodiment of the present invention.
【図８】 従来の移動体通信機器の構造を示す断面図で
ある。FIG. 8 is a cross-sectional view showing the structure of a conventional mobile communication device.
【図９】 従来の水晶発振器の防振機構を示す斜視図で
ある。FIG. 9 is a perspective view showing a vibration damping mechanism of a conventional crystal oscillator.
【図１０】 従来の水晶発振器の構造を示す斜視図であ
る。FIG. 10 is a perspective view showing the structure of a conventional crystal oscillator.
１ 防振機構、２ 水晶発振器、２ａ ケーシング、２
ｂ 水晶振動子取付基板、２ｃ リード線、２ｄ 水晶
振動子、２ｅ 角部、３ コイルスプリング、４ 弾性
体、５ 電子機器、５ａ ケーシング、５ｂ 基板、１
０，２０ 被防振物支持部。1 anti-vibration mechanism, 2 crystal oscillator, 2a casing, 2
b crystal oscillator mounting board, 2c lead wire, 2d crystal oscillator, 2e corner, 3 coil spring, 4 elastic body, 5 electronic equipment, 5a casing, 5b board, 1
0,20 Vibration-proof object support.
─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成１０年９月２５日（１９９８．９．２
５）[Submission date] September 25, 1998 (1998.9.2)
5)
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】発明の名称[Correction target item name] Name of invention
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【発明の名称】 電子機器用防振機構及び電子機器Anti-vibration mechanism 及 beauty electronic equipment [entitled] electronic devices
【手続補正書】[Procedure amendment]
【提出日】平成１１年６月３日（１９９９．６．３）[Submission date] June 3, 1999 (1999.6.3)
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】発明の名称[Correction target item name] Name of invention
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【発明の名称】 電子機器用防振機構 [Title of the Invention] electronic devices for anti-vibration Organization
【手続補正２】[Procedure amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】特許請求の範囲[Correction target item name] Claims
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【特許請求の範囲】[Claims]
【手続補正３】[Procedure amendment 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００８[Correction target item name] 0008
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【０００８】[0008]
【課題を解決するための手段】本願発明に係る、加速度
感度に方向性を有する被防振物を、防振材を介して電子
機器の被防振物支持部に取り付けるようにした電子機器
用防振機構は、上記被防振物における一対の互いに対向
するそれぞれの平面とほぼ同一平面上において延長し、
かつ、当該被防振物に対する２方向からの振動を吸収し
得るように、当該被防振物の各角部より上記防振材を配
置して成るものである。According to the present invention, an acceleration is provided.
An object to be shaken that has directionality in sensitivity is electronically
Electronic equipment that is attached to the vibration-proof object support part of the equipment
The anti-vibration mechanism comprises a pair of opposing objects in the above-mentioned
Extend on substantially the same plane as each plane
And absorbs vibrations of the vibration-proof object from two directions.
So as to obtain the vibration-proof material from each corner of the vibration-proof object.
It is made by placing .
【手続補正４】[Procedure amendment 4]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００９[Correction target item name] 0009
【補正方法】削除[Correction method] Deleted
【手続補正５】[Procedure amendment 5]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１０[Correction target item name] 0010
【補正方法】削除[Correction method] Deleted
【手続補正６】[Procedure amendment 6]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１１[Correction target item name] 0011
【補正方法】削除[Correction method] Deleted
【手続補正７】[Procedure amendment 7]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００２６[Correction target item name] 0026
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００２６】[0026]
【発明の効果】本願発明によれば、被防振物における一
対の互いに対向するそれぞれの平面とほぼ同一平面上に
おいて延長し、かつ、当該被防振物に対する２方向から
の振動を吸収し得るように、当該被防振物の各角部より
防振材を配置するようにしたので、一定方向の加速度感
度を有する被防振物に対して当該被防振物に対する２方
向からの振動を吸収することができて適切な防振効果を
与えることができるとともに、被防振物の防振機構全体
の小型化，薄型化を図ることができ、防振機構を収容す
る電子機器の小型化，薄型化を図ることができる。 According to the invention of the present application, one of the vibration-proof objects is
On the same plane as each of the opposing planes of the pair
And extend from two directions with respect to the vibration-proof object
From each corner of the vibration-isolated object to absorb the vibration of
Since the vibration-proof material is arranged, two-way movement for the vibration- proof object having acceleration sensitivity in a certain direction
In addition to being able to absorb vibrations from different directions, it is possible to provide an appropriate anti-vibration effect, and to reduce the size and thickness of the entire anti-vibration mechanism of the object to be anti-vibrated, to accommodate the anti-vibration mechanism Electronic devices can be reduced in size and thickness.
【手続補正８】[Procedure amendment 8]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００２７[Correction target item name] 0027
【補正方法】削除[Correction method] Deleted
【手続補正９】[Procedure amendment 9]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００２８[Correction target item name] 0028
【補正方法】削除[Correction method] Deleted
【手続補正１０】[Procedure amendment 10]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００２９[Correction target item name] 0029
【補正方法】削除[Correction method] Deleted
Claims (4)
を、防振材を介して電子機器の被防振物支持部に取り付
けるようにした電子機器用防振機構において、上記防振
材を上記被防振物の加速度感度の大きな方向に位置させ
たことを特徴とする電子機器用防振機構。1. A vibration isolator for an electronic device, wherein a vibration-proof object having directionality in acceleration sensitivity is attached to a vibration-proof object support portion of an electronic device via a vibration-proof material. In a direction in which the acceleration sensitivity of the vibration-proof object is large.
て電子機器の被防振物支持部に取り付けるようにした電
子機器用防振機構において、上記防振材を、上記電子機
器が搭載されるヘリコプター等の機器の外部から受ける
振動のうち、この振動がより大きな方向に向くように位
置させたことを特徴とする電子機器用防振機構。2. A vibration isolating mechanism for an electronic device, wherein the vibration-proof material is attached to a vibration-proof material supporting portion of the electronic device via an elastic vibration-proof material. A vibration isolating mechanism for an electronic device, characterized in that the vibration isolating mechanism is located such that, among vibrations received from the outside of a device such as a helicopter on which the device is mounted, the vibration is directed in a larger direction.
び電子部品実装用の基板を有するものから構成され、上
記基板の厚み方向を、上記振動子の加速度感度の小さな
方向に合わせた請求項１又は２に記載の電子機器用防振
機構。3. An object to be vibration-proofed having a vibrator and a substrate for mounting electronic components inside a casing, wherein a thickness direction of the substrate is adjusted to a direction in which acceleration sensitivity of the vibrator is small. Item 3. An electronic apparatus vibration damping mechanism according to item 1 or 2.
電子機器内の電子部品実装用基板の厚み方向を合わせた
請求項１、２又は３に記載の電子機器用防振機構を有す
る電子機器。4. In a direction in which the acceleration sensitivity of the vibration-proof object is small,
4. An electronic device having the electronic device vibration damping mechanism according to claim 1, wherein a thickness direction of an electronic component mounting substrate in the electronic device is matched.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10197687A JP2000027942A (en) | 1998-07-13 | 1998-07-13 | Vibration isolating mechanism for electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10197687A JP2000027942A (en) | 1998-07-13 | 1998-07-13 | Vibration isolating mechanism for electronic apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000027942A true JP2000027942A (en) | 2000-01-25 |
Family
ID=16378688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10197687A Pending JP2000027942A (en) | 1998-07-13 | 1998-07-13 | Vibration isolating mechanism for electronic apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000027942A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7142065B2 (en) | 2003-02-06 | 2006-11-28 | Murata Manufacturing Co., Ltd. | Crystal oscillator device and electronic apparatus using the same |
-
1998
- 1998-07-13 JP JP10197687A patent/JP2000027942A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7142065B2 (en) | 2003-02-06 | 2006-11-28 | Murata Manufacturing Co., Ltd. | Crystal oscillator device and electronic apparatus using the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7205570B2 (en) | Vibration devices, electronic equipment and moving bodies | |
| US5627425A (en) | Vibrating unit | |
| WO2009122704A1 (en) | Piezoelectric vibrating part | |
| JPH08128830A (en) | Tuning-fork vibrating gyro and sensor system using it | |
| JPH09269228A (en) | Tuning fork type vibrating gyroscope | |
| JP2000027942A (en) | Vibration isolating mechanism for electronic apparatus | |
| US20030101816A1 (en) | Vibrating gyroscope and electronic device including same | |
| US6056259A (en) | Tuned vibration noise reducer | |
| JP2007163248A (en) | Piezoelectric vibration gyro | |
| JPH116736A (en) | Angular speed sensor | |
| JP2014050067A (en) | Vibration device, electronic equipment, and mobile device | |
| JPS59128814A (en) | Piezoelectric oscillator | |
| JPH0989570A (en) | Vibrator protecting device | |
| JP5970699B2 (en) | Sensor unit, electronic equipment | |
| US7142065B2 (en) | Crystal oscillator device and electronic apparatus using the same | |
| JP5787059B2 (en) | Piezoelectric vibrator, piezoelectric vibrator, electronic device | |
| JPH0482314A (en) | Thickness-shear crystal vibrator | |
| US5450762A (en) | Reactionless single beam vibrating force sensor | |
| JPH01227515A (en) | Piezoelectric oscillator | |
| JP2007292470A (en) | Angular velocity sensor | |
| Andres et al. | Designing smaller SAW oscillators for low vibration sensitivity | |
| JP4282125B2 (en) | Vibration-resistant crystal oscillator | |
| JP2587038Y2 (en) | Anti-vibration structure of crystal unit | |
| JP2024042747A (en) | piezoelectric device | |
| JPH04326065A (en) | Vibration-proof apparatus of angular velocity sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |