JP2000026631A - Plasma surface treatment apparatus - Google Patents
Plasma surface treatment apparatusInfo
- Publication number
- JP2000026631A JP2000026631A JP10195241A JP19524198A JP2000026631A JP 2000026631 A JP2000026631 A JP 2000026631A JP 10195241 A JP10195241 A JP 10195241A JP 19524198 A JP19524198 A JP 19524198A JP 2000026631 A JP2000026631 A JP 2000026631A
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- processing chamber
- processed
- walls
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Plasma Technology (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は例えばシート状、フ
ィルム状、箔状、帯状或いは板状の被処理物を大気圧又
は減圧下のプラズマ放電により表面改質等の表面処理に
用いられるプラズマ表面処理装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma surface used for surface treatment such as surface modification of a sheet-like, film-like, foil-like, band-like or plate-like material by plasma discharge under atmospheric pressure or reduced pressure. The present invention relates to a processing device.
【0002】[0002]
【従来の技術】このプラズマ表面処理とは、例えば、シ
ート状、フィルム状、箔状、帯状、板状等の被処理物の
表面の活性化により接着性、印刷性或いは親水性の向上
等の表面改質処理等に用いられる。2. Description of the Related Art The term "plasma surface treatment" means, for example, activation of the surface of an object to be processed such as a sheet, film, foil, band, plate or the like to improve adhesion, printability or hydrophilicity. Used for surface modification treatment and the like.
【0003】従来、この種のプラズマ表面処理装置とし
て、図5、6に示す如く、上下に二分割可能な上下の壁
体a・bにより処理室cを形成すると共に各壁体a・b
に被処理物Wの通過間隙路Rを存して対向配置される電
極d・eを配設し、処理室c内にガス供給口fからガス
排出口gへとヘリウムガスやヘリウムガスを主成分とす
る混合ガス、その他のプラズマ励起用の不活性ガス又は
酸素等の活性ガスを通過させて置換し、処理室c内の電
極d・e間を不活性ガス又は活性ガスが満たされた雰囲
気とし、この雰囲気下において対向する電極d・e間に
電圧を印加し、被処理物Wを水平方向に延びる通過間隙
路Rを連続的に通過移送させ、この通過間隙路Rでの被
処理物Wの通過移送により電極d・e間に発生したプラ
ズマによって、被処理物Wの表面改質を行う構造のもの
が知られている。Conventionally, as a plasma surface treatment apparatus of this type, as shown in FIGS. 5 and 6, a processing chamber c is formed by upper and lower walls a and b which can be divided into upper and lower parts, and each wall a and b is formed.
The electrodes d and e are disposed opposite to each other with the passage gap R of the object W to be processed, and helium gas or helium gas is mainly supplied from the gas supply port f to the gas discharge port g in the processing chamber c. Atmosphere filled with an inert gas or an active gas between the electrodes d and e in the processing chamber c by displacing the mixed gas as a component, another inert gas for plasma excitation, or an active gas such as oxygen to pass therethrough. In this atmosphere, a voltage is applied between the electrodes d and e facing each other, and the workpiece W is continuously transferred through a passage gap R extending in a horizontal direction. There is known a structure in which the surface of an object to be processed W is modified by plasma generated between the electrodes d and e due to the passage and transfer of W.
【0004】[0004]
【発明が解決しようとする課題】しかしながら上記従来
構造の場合、上下の壁体a・bからなる二分離構造によ
りにより処理室cを形成すると共に各電極は上下に対向
配置され、通過間隙路を上下方向に延びて形成し、上下
の各電極間を被処理物が水平に通過する構造となってい
るので、被処理物の通過移送時での不可避的な自重撓み
現象による下側の電極への接触によって損傷が発生する
ことがあり、又、各電極及び処理室内の周囲の掃除等の
保守や内部点検に際しては、クレーン機構等を用いて上
側の壁体を分離して持ち上げなければならず、上下の各
壁体相互の位置決め作業及び配線配管作業の切り離しも
相俟って長時間を要することになって保守点検の作業性
が低下し、又、被処理物の通過間隙路が水平方向となっ
ている、いわゆる横型構造であるから、装置を設置する
ための全体の設置スペースが大きくなり、それだけ設置
の融通性を低下させることがあるという不都合を有して
いる。However, in the case of the above-mentioned conventional structure, the processing chamber c is formed by a two-separated structure consisting of upper and lower walls a and b, and the respective electrodes are vertically arranged opposite to each other, so that a passage gap is formed. It is formed so as to extend in the vertical direction, and the object to be processed passes horizontally between the upper and lower electrodes, so that the inevitable self-weight bending phenomenon during the transfer of the object to be processed leads to the lower electrode. May cause damage due to contact with the equipment, and the upper wall must be separated and lifted using a crane mechanism for maintenance and internal inspection such as cleaning of each electrode and the surroundings of the processing chamber. In addition, the positioning work between the upper and lower walls and the disconnection of the wiring and piping work take a long time, which reduces the workability of maintenance and inspection. So-called Since a mold structure, the overall installation space for installing the apparatus is increased, it has a disadvantage that it is possible to correspondingly reduce the flexibility of the installation.
【0005】[0005]
【課題を解決するための手段】本発明はこのような課題
を解決することを目的とするもので、本発明のうちで、
請求項1記載の発明は、相互に分離可能な二つの壁体に
より処理室を形成すると共に各壁体に被処理物の通過間
隙路を存して対向配置される電極をそれぞれ配設し、該
処理室内をプラズマ励起用のガスで置換された雰囲気と
し、該雰囲気下において対向する電極間に電圧を印加
し、該被処理物を通過間隙路に連続的に通過移送させ、
該通過間隙路での被処理物の通過移送により電極間に発
生したプラズマによって被処理物の表面処理を行う装置
において、上記相互に分離可能な二つの壁体を水平方向
に分離可能な構造に形成して上記通過間隙路を上下方向
に延びて配設すると共に該水平方向に分離可能な各壁体
に被処理物の上下方向に延びる通過間隙路を存して対向
配置される電極をそれぞれ配設して構成したことを特徴
とするプラズマ表面処理装置にある。The object of the present invention is to solve such a problem.
According to the first aspect of the present invention, a processing chamber is formed by two walls that can be separated from each other, and electrodes are disposed on each of the walls so as to be opposed to each other with a passage gap for an object to be processed. The atmosphere inside the processing chamber is replaced with a gas for plasma excitation, a voltage is applied between the electrodes facing each other under the atmosphere, and the processing object is continuously passed and transferred to a passage gap path.
In an apparatus for performing a surface treatment of an object to be processed by plasma generated between the electrodes due to the passage and transfer of the object through the passage gap, the two walls that can be separated from each other have a structure that can be horizontally separated. The above-described electrodes are disposed so as to extend in the up-down direction, and are disposed on the respective walls that can be separated in the horizontal direction. A plasma surface treatment apparatus characterized by being arranged and configured.
【0006】又、請求項2記載の発明は、上記二つの壁
体のうちの一方の壁体を装置機体に固定配置すると共に
他方の壁体を装置機体に設けた直線軸受構造により一方
の壁体に対向する水平方向に移動案内可能に設けてなる
ことを特徴とするものであり、又、請求項3記載の発明
は、上記処理室を複数個水平方向横並び状に並列配置
し、該各処理室の上部に被処理物の入口部又は出口部を
形成すると共に各処理室の下部に被処理物の入口部又は
出口部を形成し、上記被処理物を隣る処理室の上部間又
は下部間で橋絡させて被処理物が上下位置で迂回移送さ
れる移送経路に形成してなることを特徴とするものであ
る。According to a second aspect of the present invention, one of the two walls is fixedly arranged on the apparatus body and the other wall is provided by a linear bearing structure provided on the apparatus body. The invention is characterized in that the processing chambers are provided so as to be able to guide movement in the horizontal direction facing the body, and the invention according to claim 3 comprises a plurality of the processing chambers arranged side by side in a horizontal direction. Forming the inlet or outlet of the processing object at the upper part of the processing chamber and forming the inlet or outlet of the processing object at the lower part of each processing chamber, and placing the processing object between the upper part of the adjacent processing chamber or It is characterized in that the object to be processed is bridged between the lower portions to form a transfer path in which the object to be processed is transferred by detour at the vertical position.
【0007】[0007]
【発明の実施の形態】図1乃至図4は本発明の実施の形
態例を示し、図1乃至図3は第一形態例、図4は第二形
態例である。1 to 4 show an embodiment of the present invention. FIGS. 1 to 3 show a first embodiment and FIG. 4 shows a second embodiment.
【0008】図1乃至図3の第一形態例において、1は
装置機体であって、この場合、装置機体1上に一方の壁
体2aと他方の壁体2bからなる処理室2を配設し、一
方の壁体2aは装置機体1に固定配置し、他方の壁体2
bを装置機体1に設けた直線軸受構造3により一方の壁
体2aに対向する水平方向に移動案内可能に設けて構成
している。In the first embodiment shown in FIGS. 1 to 3, reference numeral 1 denotes an apparatus body. In this case, a processing chamber 2 comprising one wall 2a and the other wall 2b is arranged on the apparatus body 1. The one wall 2a is fixedly arranged on the apparatus body 1, and the other wall 2a
b is provided by a linear bearing structure 3 provided on the apparatus body 1 so as to be movable and guided in a horizontal direction facing one wall 2a.
【0009】この場合、直線軸受構造3として、装置機
体1上に固定されたガイドレール3aと、他方の壁体2
bの底面に固定された軸受部分3bとからなり、ガイド
レール3aと軸受部分3bとの摺動嵌合により他方の壁
体2bを一方の壁体2aに対向する水平方向左右に移動
案内可能に設け、かつ、一方の壁体2aと他方の壁体2
bとを着脱連結可能な密閉クランプ機構4を配設してい
る。In this case, as the linear bearing structure 3, a guide rail 3a fixed on the apparatus body 1 and the other wall 2
and a bearing portion 3b fixed to the bottom surface of the second wall 2b, and the other wall 2b can be moved and guided to the left and right in the horizontal direction facing the one wall 2a by sliding engagement between the guide rail 3a and the bearing portion 3b. And one wall 2a and the other wall 2
and a hermetic clamp mechanism 4 that can be detachably connected to b.
【0010】又、上記処理室2は、上記水平方向に二分
割可能な左右の壁体2a・2bにより密閉状に形成さ
れ、各壁体2a・2bに被処理物Wの通過間隙路Rを存
して対向配置される電極5a・5bを配設し、これによ
り通過間隙路Rを上下に延びて形成し、この電極5a・
5bは管状に形成され、電極5a・5bは棒状に形成す
ることもあり、この管状の電極5a・5b内に冷却液を
通過させ、処理室2内にガス供給口6からガス排出口7
へとヘリウムガスやヘリウムガスを主成分とする混合ガ
ス、その他のプラズマ励起用の不活性ガス又は酸素等の
活性ガスを通過させて置換し、処理室2内の電極5a・
5b間を不活性ガス又は活性ガスが満たされた雰囲気と
し、この雰囲気下において対向する電極5a・5b間に
図外の電源により電圧を印加するように構成している。The processing chamber 2 is hermetically formed by the left and right walls 2a and 2b which can be divided into two parts in the horizontal direction, and each of the walls 2a and 2b is provided with a passage gap R for the object W to be processed. The electrodes 5a and 5b are disposed so as to face each other, thereby forming the passage gap R extending vertically.
5b is formed in a tubular shape, and the electrodes 5a and 5b may be formed in a rod shape. The coolant is passed through the tubular electrodes 5a and 5b, and the gas supply port 6 and the gas discharge port 7 enter the processing chamber 2.
Helium gas, a mixed gas containing helium gas as a main component, or another inert gas for plasma excitation or an active gas such as oxygen is passed therethrough to replace the gas.
An atmosphere filled with an inert gas or an active gas is provided between the electrodes 5a and 5b, and a voltage is applied between the opposing electrodes 5a and 5b by a power source (not shown) under this atmosphere.
【0011】又、この場合、上記処理室2の上部に被処
理物Wの入口部8を形成すると共に下部に被処理物の出
口部9を形成し、被処理物Wを上方から下方へと処理室
2内の上下に延びた通過間隙路Rを介して連続移送させ
るように構成している。尚、上記処理室2の上部に被処
理物Wの出口部9を形成すると共に下部に被処理物の入
口部8を形成し、被処理物Wを下方から上方へと処理室
2内の上下に延びた通過間隙路Rを介して連続移送させ
るように構成することもある。In this case, an inlet 8 for the workpiece W is formed in the upper part of the processing chamber 2 and an outlet 9 for the workpiece is formed in the lower part, so that the workpiece W is moved downward from above. It is configured to be continuously transferred through a passage gap R extending vertically in the processing chamber 2. An outlet 9 for the workpiece W is formed in the upper part of the processing chamber 2 and an inlet 8 for the workpiece is formed in the lower part, so that the workpiece W is moved upward and downward in the processing chamber 2. May be configured to be continuously transported through a passage gap R extending to the side.
【0012】この実施の第一形態例は上記構成であるか
ら、被処理物Wは処理室2の上部の入口部8から処理室
2内に入り、処理室2内を介して、処理室2の下部の出
口部9から出て、連続的に上方から下方へと移送される
ことになり、処理室2内において、ガス供給口6からガ
ス排出口7へとヘリウムガスやヘリウムガスを主成分と
する混合ガス、その他のプラズマ励起用の不活性ガス又
は酸素等の活性ガスを通過させて置換され、処理室2内
の電極5a・5b間を不活性ガス又は活性ガスが満たさ
れた雰囲気とされ、この雰囲気下において対向する電極
5a・5b間に図外の電源により電圧を印加され、この
通過間隙路Rでの被処理物Wの通過移送により電極5a
・5b間に発生したプラズマによって被処理物Wの表面
改質処理が行われることになる。Since the first embodiment has the above configuration, the workpiece W enters the processing chamber 2 from the inlet 8 at the upper part of the processing chamber 2 and passes through the processing chamber 2 to the processing chamber 2. Helium gas or helium gas from the gas supply port 6 to the gas discharge port 7 in the processing chamber 2. And a gas filled with an inert gas or an active gas between the electrodes 5a and 5b in the processing chamber 2 is replaced by passing an active gas such as an inert gas for plasma excitation or oxygen or the like. In this atmosphere, a voltage is applied between the opposing electrodes 5a and 5b by a power source (not shown), and the workpiece 5 is moved by passing through the gap R to pass through the electrodes 5a and 5b.
The surface modification of the workpiece W is performed by the plasma generated between 5b.
【0013】この際、上記相互に分離可能な二つの壁体
2a・2bを水平方向に分離可能な構造に形成して上記
通過間隙路Rを上下方向に延びて配設すると共に水平方
向に分離可能な各壁体2a・2bに被処理物Wの上下方
向に延びる通過間隙路Rを存して対向配置される電極5
a・5bをそれぞれ配設しているから、被処理物Wは上
下方向に延びた通過間隙路R内を通過して移送され、こ
のため、通過移送時の自重撓み現象による電極への接触
によって生ずる被処理物Wの損傷を抑制することがで
き、又、各電極5a・5b及び処理室2内の周囲の掃除
等の保守や内部点検に際しては、他方の壁体2bを水平
方向に分離移動するので、保守点検の作業性を高めるこ
とができ、かつ、被処理物Wの通過間隙路Rが上下方向
となっている、いわゆる縦型構造であるから、装置を設
置するための全体の設置スペースを少なくでき、それだ
け設置の融通性を高めることができる。At this time, the two walls 2a and 2b which can be separated from each other are formed in a structure which can be separated in the horizontal direction, and the passing gap path R is disposed extending in the vertical direction and separated in the horizontal direction. Electrodes 5 which are disposed to face each other with possible gaps R extending in the vertical direction of the workpiece W on each of the possible walls 2a and 2b.
Since the workpieces a and 5b are provided, the workpiece W is transported through the passage gap R extending in the vertical direction. The resulting damage to the workpiece W can be suppressed, and the other wall 2b is separated and moved in the horizontal direction during maintenance and internal inspection such as cleaning of the electrodes 5a and 5b and the surroundings of the processing chamber 2. Therefore, the workability of the maintenance and inspection can be improved, and the so-called vertical structure in which the passage gap R of the workpiece W is in a vertical direction, so that the entire installation for installing the apparatus is performed. Space can be reduced, and the flexibility of installation can be increased accordingly.
【0014】又、この場合、上記二つの壁体2a・2b
のうちの一方の壁体2aを装置機体1に固定配置すると
共に他方の壁体2bを装置機体1に設けた直線軸受構造
3により一方の壁体2aに対向する水平方向に移動案内
可能に設けているから、各電極5a・5b及び処理室2
内の周囲の掃除等の保守や内部点検に際しては、直線軸
受構造3の存在により、各壁体2a・2bの位置決め作
業及び配線配管の切り離し作業が不要となり、容易に他
方の壁体2bを移動させることができ、一層保守点検の
作業性を向上することができる。In this case, the two walls 2a and 2b
Is fixedly disposed on the apparatus body 1 and the other wall 2b is provided by a linear bearing structure 3 provided on the apparatus body 1 so as to be movable and guideable in the horizontal direction facing the one wall body 2a. The electrodes 5a and 5b and the processing chamber 2
For maintenance such as cleaning of the inside of the inside and inspection of the inside, the linear bearing structure 3 eliminates the need for the work of positioning each of the walls 2a and 2b and the work of separating the wiring pipe, and easily moves the other wall 2b. The workability of maintenance and inspection can be further improved.
【0015】図4の第二形態例は別例構造を示し、この
場合、上記処理室2を装置機体1上に複数個水平方向横
並び状に並列配置し、各処理室2の上部に被処理物Wの
入口部8又は出口部9を形成すると共に各処理室2の下
部に被処理物Wの入口部8又は出口部9を形成し、被処
理物Wを隣る処理室2の上部間又は下部間で橋絡させて
被処理物Wが上下位置で迂回移送される移送経路に形成
している。The second embodiment shown in FIG. 4 shows an alternative structure. In this case, a plurality of the processing chambers 2 are arranged side by side in a horizontal direction on the apparatus body 1, and the processing chambers 2 are disposed above the processing chambers 2. An inlet portion 8 or an outlet portion 9 of the workpiece W is formed, and an inlet portion 8 or an outlet portion 9 of the workpiece W is formed at a lower portion of each of the processing chambers 2. Alternatively, the workpiece W is bridged between the lower portions to form a transfer path in which the workpiece W is transferred by detour at the vertical position.
【0016】この第二形態例にあっては、処理内容の相
違する表面処理を各処理室2において、順次連続的に処
理することができ、かつ、各処理室2内の被処理物Wの
通過間隙路Rが上下方向となっていると共に被処理物W
を隣る処理室2の上部間又は下部間で橋絡させて被処理
物Wが上下位置で迂回移送される移送経路としているの
で、いわゆる縦型配置及び上下の折り返し移送経路によ
り、装置全体の設置スペースを小さくでき、それだけ設
置の融通性を高めることができる。In the second embodiment, surface treatments having different treatment contents can be sequentially and successively processed in each processing chamber 2, and an object W to be processed in each processing chamber 2 can be processed. The passage gap R is vertical and the workpiece W
Is bridged between the upper part or the lower part of the adjacent processing chamber 2 to form a transfer path for the workpiece W to be detour-transferred at the upper and lower positions. The installation space can be reduced, and the flexibility of installation can be increased accordingly.
【0017】尚、本発明は上記実施の形態例に限られる
ものではなく、処理室2、電極5a・5b、その他の構
造についても適宜変更して設計されるものであり、又、
本発明は表面改質処理に限らず、例えば集積回路基板表
面のエッチング後のレジストパターン除去、表面コーテ
ィング等の他の減圧又は大気圧下のプラズマ処理技術を
用いる表面処理にも適用される。It should be noted that the present invention is not limited to the above-described embodiment, but is designed by appropriately changing the processing chamber 2, the electrodes 5a and 5b, and other structures.
The present invention is not limited to the surface modification treatment, and may be applied to other surface treatments using a plasma treatment technique under reduced pressure or atmospheric pressure, such as removal of a resist pattern after etching of the surface of an integrated circuit substrate and surface coating.
【0018】[0018]
【発明の効果】本発明は上述の如く、請求項1記載の発
明にあっては、被処理物は処理室内のプラズマ励起用の
ガス雰囲気で通過間隙路を通過移送され、この通過移送
時に電極間に発生したプラズマにより表面処理がなされ
ることになり、この際、上記相互に分離可能な二つの壁
体を水平方向に分離可能な構造に形成して上記通過間隙
路を上下方向に延びて配設すると共にこの水平方向に分
離可能な各壁体に被処理物の上下方向に延びる通過間隙
路を存して対向配置される電極をそれぞれ配設している
から、被処理物は上下方向に延びた通過間隙路内を通過
して移送され、このため、通過移送時の自重撓み現象に
よる電極への接触によって生ずる被処理物の損傷を抑制
することができ、又、各電極及び処理室内の周囲の掃除
等の保守や内部点検に際しては、他方の壁体を水平方向
に分離移動するので、保守点検の作業性を高めることが
でき、かつ、被処理物の通過間隙路が上下方向となって
いる、いわゆる縦型構造であるから、装置を設置するた
めの全体の設置スペースを少なくでき、それだけ設置の
融通性を高めることができる。As described above, according to the first aspect of the present invention, an object to be processed is transported through a passage gap in a gas atmosphere for plasma excitation in a processing chamber. Surface treatment will be performed by the plasma generated in between, and at this time, the two mutually separable walls are formed in a horizontally separable structure, and the passing gap path extends vertically. The electrodes to be disposed are disposed on the respective walls that can be separated in the horizontal direction, and the electrodes that are disposed to face each other with a passage gap extending in the vertical direction of the object to be processed. Is transferred through the passage gap path extending to the workpiece, and therefore, it is possible to suppress damage to the processing object caused by contact with the electrode due to its own weight bending phenomenon at the time of passing transfer, and furthermore, each electrode and the processing chamber Maintenance such as cleaning around the interior and internal points In this case, since the other wall is separated and moved in the horizontal direction, the workability of maintenance and inspection can be enhanced, and the so-called vertical structure in which the passage of the object to be processed is vertical. Thus, the entire installation space for installing the apparatus can be reduced, and the flexibility of installation can be increased accordingly.
【0019】又、請求項2記載の発明にあっては、上記
二つの壁体のうちの一方の壁体を装置機体に固定配置す
ると共に他方の壁体を装置機体に設けた直線軸受構造に
より一方の壁体に対向する水平方向に移動案内可能に設
けているから、各電極及び処理室内の周囲の掃除等の保
守や内部点検に際しては、直線軸受構造の存在により、
容易に他方の壁体を移動させることができ、一層保守点
検の作業性を向上することができ、又、請求項3記載の
発明にあっては、処理内容の相違する表面処理を各処理
室において、順次連続的に処理することができ、かつ、
各処理室内の被処理物の通過間隙路が上下方向となって
いると共に被処理物を隣る処理室の上部間又は下部間で
橋絡させて被処理物が上下位置で迂回移送される移送経
路としているので、いわゆる縦型配置及び上下の折り返
し移送経路により、装置全体の設置スペースを小さくで
き、それだけ設置の融通性を高めることができる。Further, according to the present invention, a linear bearing structure in which one of the two walls is fixedly arranged on the apparatus body and the other wall is provided on the apparatus body. Because it is provided so as to be able to move and guide in the horizontal direction facing one wall body, during maintenance and internal inspection such as cleaning of the surroundings of each electrode and the processing chamber, due to the presence of the linear bearing structure,
The other wall can be easily moved, the workability of maintenance and inspection can be further improved, and in the invention according to the third aspect, the surface treatment having different processing contents can be performed in each processing chamber. In, can be processed sequentially and sequentially, and
The transfer passage in which the passage of the processing object in each processing chamber is in the vertical direction, and the processing object is bridged between the upper part or the lower part of the adjacent processing chamber, so that the processing object is detour-transferred at the vertical position. Since it is a path, the so-called vertical arrangement and the vertical turn-back transfer path can reduce the installation space of the entire apparatus, thereby increasing the flexibility of installation.
【0020】以上、所期の目的を充分達成することがで
きる。As described above, the intended purpose can be sufficiently achieved.
【図1】本発明の実施の第一形態例の正面図である。FIG. 1 is a front view of a first embodiment of the present invention.
【図2】本発明の実施の第一形態例の部分拡大断面図で
ある。FIG. 2 is a partially enlarged cross-sectional view of the first embodiment of the present invention.
【図3】本発明の実施の第一形態例の説明断面図であ
る。FIG. 3 is an explanatory sectional view of the first embodiment of the present invention.
【図4】本発明の実施の第二形態例の正面図である。FIG. 4 is a front view of a second embodiment of the present invention.
【図5】従来構造の正面図である。FIG. 5 is a front view of a conventional structure.
【図6】従来構造の説明断面図である。FIG. 6 is an explanatory sectional view of a conventional structure.
W 被処理物 R 通過間隙路 1 装置機体 2 処理室 2a 壁体 2b 壁体 3 直線軸受構造 5a 電極 5b 電極 W Workpiece R Passing gap 1 Equipment body 2 Processing chamber 2a Wall 2b Wall 3 Linear bearing structure 5a Electrode 5b Electrode
───────────────────────────────────────────────────── フロントページの続き (72)発明者 可児 賢一 新潟県中頸城郡柿崎町大字柿崎7396番地10 ウエノテックス株式会社内 Fターム(参考) 4F073 AA01 BB01 CA01 CA04 CA09 4K029 AA24 AA25 DA01 FA05 GA02 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Kenichi Kani 7396-10, Kakizaki, Kakizaki-cho, Nakakubiki-jo-gun, Niigata F-term in Unotex Co., Ltd. (reference) 4F073 AA01 BB01 CA01 CA04 CA09 4K029 AA24 AA25 DA01 FA05 GA02
Claims (3)
室を形成すると共に各壁体に被処理物の通過間隙路を存
して対向配置される電極をそれぞれ配設し、該処理室内
をプラズマ励起用のガスで置換された雰囲気とし、該雰
囲気下において対向する電極間に電圧を印加し、該被処
理物を通過間隙路に連続的に通過移送させ、該通過間隙
路での被処理物の通過移送により電極間に発生したプラ
ズマによって被処理物の表面処理を行う装置において、
上記相互に分離可能な二つの壁体を水平方向に分離可能
な構造に形成して上記通過間隙路を上下方向に延びて配
設すると共に該水平方向に分離可能な各壁体に被処理物
の上下方向に延びる通過間隙路を存して対向配置される
電極をそれぞれ配設して構成したことを特徴とするプラ
ズマ表面処理装置。1. A processing chamber is formed by two walls that can be separated from each other, and electrodes are disposed on each of the walls so as to be opposed to each other with a clearance passage for an object to be processed. The atmosphere is replaced with a gas for plasma excitation, a voltage is applied between the electrodes facing each other under the atmosphere, and the object to be processed is continuously passed through and transferred to the passage gap. In an apparatus for performing a surface treatment of an object to be processed by plasma generated between the electrodes due to the passage transfer of the object,
The two mutually separable walls are formed in a horizontally separable structure, and the passage gap is vertically extended and disposed. A plasma surface treatment apparatus characterized in that electrodes are disposed so as to face each other with a passage gap extending in the vertical direction.
置機体に固定配置すると共に他方の壁体を装置機体に設
けた直線軸受構造により一方の壁体に対向する水平方向
に移動案内可能に設けてなることを特徴とする請求項1
記載のプラズマ表面処理装置。2. One of the two walls is fixedly disposed on the apparatus body and the other wall is moved in a horizontal direction facing the one wall by a linear bearing structure provided on the apparatus body. 2. The method according to claim 1, wherein the guide is provided.
The plasma surface treatment apparatus as described in the above.
並列配置し、該各処理室の上部に被処理物の入口部又は
出口部を形成すると共に各処理室の下部に被処理物の入
口部又は出口部を形成し、上記被処理物を隣る処理室の
上部間又は下部間で橋絡させて被処理物が上下位置で迂
回移送される移送経路に形成してなることを特徴とする
請求項1又は2記載のプラズマ表面処理装置。3. A plurality of the processing chambers are arranged side by side in a horizontal direction, an inlet portion or an outlet portion of the processing object is formed at an upper portion of each processing chamber, and the processing object is formed at a lower portion of each processing chamber. An inlet portion or an outlet portion is formed, and the object to be processed is bridged between an upper portion or a lower portion of an adjacent processing chamber, so that the object to be processed is formed in a transfer path in which the object to be processed is bypassed at a vertical position. The plasma surface treatment apparatus according to claim 1 or 2, wherein
Priority Applications (1)
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---|---|---|---|
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Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP19524198A JP3247986B2 (en) | 1998-07-10 | 1998-07-10 | Plasma surface treatment equipment |
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JP2000026631A true JP2000026631A (en) | 2000-01-25 |
JP3247986B2 JP3247986B2 (en) | 2002-01-21 |
Family
ID=16337847
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JP19524198A Expired - Fee Related JP3247986B2 (en) | 1998-07-10 | 1998-07-10 | Plasma surface treatment equipment |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001288569A (en) * | 2000-03-31 | 2001-10-19 | Dainippon Printing Co Ltd | Apparatus and method for plasma treatment |
-
1998
- 1998-07-10 JP JP19524198A patent/JP3247986B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001288569A (en) * | 2000-03-31 | 2001-10-19 | Dainippon Printing Co Ltd | Apparatus and method for plasma treatment |
JP4580496B2 (en) * | 2000-03-31 | 2010-11-10 | 大日本印刷株式会社 | Plasma processing apparatus and plasma processing method |
Also Published As
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JP3247986B2 (en) | 2002-01-21 |
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