JP2000012303A - Resistor, manufacture of it, and electron gun - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resistor of high division-ratio and an electron gun incorporating the resistor without having adverse effect on the operation of the electron tube. SOLUTION: The resistor comprises an insulating substrate 21, a resistor layer 23 formed on the surface of the insulating substrate 21, an electrode layer 22 comprising an electrode part formed on the surface of the insulating substrate 21 and jointed to the resistor layer 23 for, at least, grounding and an electrode part to which a high voltage is applied, an insulating coat layer 24 formed on the insulating substrate 21 by covering the resistor layer 23, and a terminal 26 fitted to the insulating substrate 21 while connected to the electrode part of the electrode layer 22. Here, a resistance value setting part for setting a selected resistance value of the resistor layer 23 is formed at least at either the electrode part of the electrode layer 22 which is grounded or the electrode part to which a high voltage is applied, while the electron gun incorporates the resistor.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resistor provided inside an envelope of an electron tube, a method of manufacturing the resistor, and an electron gun using the resistor.

[0002]

2. Description of the Related Art Conventionally, there is a color cathode ray tube used in an electron tube, for example, a color television receiver, which requires a high voltage supplied to a convergence electrode, a focus electrode and the like in addition to an anode voltage. in this case,
When a high voltage is supplied from the stem of a color CRT,
Since a problem arises in terms of withstand voltage, a voltage-dividing resistor is built into the color cathode-ray tube together with the electron gun as a resistor for the built-in electron tube, and the anode voltage is divided by this resistor to supply a high voltage to each electrode. Is adopted.

FIG. 6 shows an example of a color cathode-ray tube in which such an electron tube built-in resistor is incorporated. In FIG. 6, reference numeral 101 denotes an envelope made of glass, which is composed of a panel 102 and a funnel 103. The funnel 103 has a neck 104. Envelope 1
01 that emits blue, green, and red light on the inner surface of the panel 102
A phosphor screen 105 made of a color phosphor layer is formed, and a shadow mask 106 having a large number of electron beam passage holes is arranged inside the phosphor screen 105 so as to face the phosphor screen 105. Further, an electron gun 108 for emitting an electron beam is disposed inside the neck portion 104 of the funnel 103 of the envelope 101. Then, the three electron beams R, G, and B emitted from the electron gun 108 are deflected by a magnetic field generated by a deflection yoke 107 mounted outside the funnel 103 to scan the phosphor screen 105 horizontally and vertically. Thus, a structure for displaying a color image is formed.

FIGS. 7 and 8 show a neck portion 1 of a funnel 103 in an envelope 101 of this color CRT.
4 shows an electron gun 108 to be incorporated in the electronic gun 04. The electron gun 108 has a common first electrode for three cathode structures K.
Grid electrode G1, second grid electrode G2, third grid electrode G3, fourth grid electrode G4, fifth grid electrode G5, sixth grid electrode G6, seventh grid electrode G7,
The eighth grid electrodes G8 are sequentially arranged coaxially.
The convergence electrode 1 is provided after the grid electrode G8.
Is arranged. Each grid electrode G1, G2, G3,
G4, G5, G6, G7, and G8 are mechanically held by the bead glass 2 while maintaining a predetermined positional relationship with each other. Further, the third grid electrode G3 and the fifth grid electrode G5 are electrically connected by the conducting wire 3, and the convergence electrode 1 is electrically connected to the eighth grid electrode G8 by welding.

The electron gun 108 is provided with the electron tube built-in resistor 4. This resistor 4 is provided with terminals 5a, 5b, 5c for taking out high-voltage electrodes, and these terminals 5a, 5b, 5c are connected to the seventh grid electrode G7, the sixth grid electrode G6, and the fifth grid electrode G5. Have been.

Further, an extraction terminal 6 provided on the resistor 4
Is connected to the convergence electrode 1 and the resistor 4
Is connected to the ground electrode pin 8. On the inner wall of the funnel 103, a graphite conductive film 9 extending to the inner wall of the neck portion 104 is attached, and a high voltage supply button (anode button, not shown in the drawing) provided on the funnel 103 is provided.
The anode voltage is supplied through the switch.

The convergence electrode 1 is provided with a conductive spring 10. When the conductive spring 10 comes into contact with the graphite conductive film 9, the convergence electrode 1, the eighth grid electrode G 8, and the resistor 4 are taken out. The anode voltage is supplied to the terminal 6, and the high voltage terminals 5a, 5a
b, 5c is applied to the seventh grid electrode G
7, sixth grid electrode G6, and fifth grid electrode G
5 is supplied.

The electron tube built-in resistor 4 built in the color cathode ray tube is configured as shown in FIGS. 9 is a plan view showing the resistor 4, FIG. 10 is a sectional view taken along line YY of FIG. 9, and FIG.

That is, an electrode material made of, for example, a metal oxide containing ruthenium oxide and lead borosilicate glass is formed on the surface 21a of the insulating substrate 21 containing aluminum oxide as a main component by drying, drying and firing. Five terminal electrode layers 22A to 22E are formed at intervals.

The surface of the insulating substrate 21 between the terminal electrode layers 22 is made of a resistance material made of a metal oxide containing ruthenium oxide and lead borosilicate glass so as to have a predetermined resistance value. Printed, dried and fired in the resistor layer 23
Are formed, and the resistor layer 23 is connected to each of the terminal electrode layers 22A to 22E. The resistor layer 23 is covered with an insulating coating layer 24.

Each terminal electrode layer 22 on the insulating substrate 21
Through holes 25 penetrating through the front surface 21a and the back surface 21b are formed in portions where A to 22E are formed. Terminals 26A and 26B (corresponding to terminals 6 and 7 in FIG. 4) are disposed in contact with the two terminal electrode layers 22A and 22B located at both ends of the insulating substrate 21. The three terminal electrode layers 22C to 22E sandwiched between the terminals 26A and 26B on the insulating substrate 21 have the terminal 26
C to 26E (corresponding to the terminals 5a to 5c in FIG. 7) are arranged in contact with each other.

As shown in FIG. 11, each terminal 26A to 26E
Has a cylindrical portion 26a and a flange portion 26b, each flange portion 26b is in contact with the terminal electrode layers 22C to 22E, and each cylindrical portion 26a is inserted into the through-hole 25 to form the insulating substrate 21. It protrudes to the back side and is caulked to the back side 21b. As a result, the terminals 26A to 26E are connected to the insulating substrate 21.
It is fixed to. Further, in order to stabilize the potential distribution inside the neck portion 104, a metal ring 27 is provided so as to surround the bead glass 2 and the resistor 4 from an intermediate portion of the third grid electrode G3. The metal ring 27 is for heating and evaporating the metal ring by, for example, high-frequency heating, and for evaporating the vapor on the inner wall surface of the neck portion 104 to form an evaporation film (not shown).

The function of such an electron tube built-in resistor is as follows.
That is, a predetermined voltage is supplied to each electrode of the electron gun by dividing the anode voltage. If this voltage deviates from a predetermined value, characteristic deterioration such as deterioration of the focus state of the electron beam on the phosphor screen occurs. Therefore, the accuracy of the divided voltage by the resistor is required, and in recent years, the demand for a large-screen TV display tube, a high-resolution personal computer monitor, and the like has become increasingly severe. The accuracy of the divided voltage is determined by the ratio of the resistance values between the terminals of the resistor 4 (hereinafter referred to as a division ratio). Therefore, the division ratio of the resistor has a strict numerical tolerance. The division ratio tolerance in must be within the standard. Therefore, each terminal electrode layer 22 in the resistor 4
A trimming portion 23a is formed for each of the resistor layers 23 formed between C and 22E for setting a division ratio. Then, before forming the insulating coating layer 24, the trimming portion 23a of each resistor layer 23 is cut by sandblasting to set the division ratio. However, in the sandblasting method, a measurement error due to dust or a device failure occurs, and a stable split ratio cannot be set. In addition, although the resistance value changes in the subsequent heating step of forming the insulating coating layer 24, each of the terminals 26A to 26A
Variation in the resistance value change rate between 26E causes a shift in the division ratio. That is, it is not possible to obtain the electron tube built-in resistor 4 having a high division ratio accuracy.

Therefore, in a method for manufacturing a hybrid IC,
After forming the insulating coating layer 24 covering each resistor layer 23,
There is a method of setting the resistance value by cutting the resistance with a laser beam transmitted through the insulating coating layer 24. However,
In this method, it is difficult to increase the shaving width. In the electron tube built-in resistor 4 to which a high voltage is applied, short-circuiting occurs easily at the shaved resistance portion, and the resistance during the initial operation and long-time operation of the electron tube is increased. It is not practical because it may cause a change in the value and affects the operation of the tube. In addition, the trimming margin portion of each conventional resistor layer 23 is exposed without insulating coating, and the other portion is insulated and coated, and a trimming portion 23a of each resistor layer 23 is formed in a later step by a method such as sandblasting. There is also a method of setting a division ratio by cutting off. However, in this method, the exposed portions of the resistor layer and the insulating substrate are located between the high-voltage portion and the intermediate-pressure portion or between the intermediate-pressure portion and the ground portion of the electron tube. If the resistor layer 23 and the insulating substrate 21 are exposed in a portion having a potential gradient in such an operation state of the electron tube, discharge occurs between the bead glass 2 and the inner wall of the neck portion 104 of the envelope 101. Not only is it not easy to use, and there is a possibility that not only the operation failure of the electron tube will be caused, but also the set circuit may be destroyed by sparks, etc., which is not practical.

[0015]

As described above, in the electron tube, the resistor 4 is arranged along the electron gun 108 provided inside the envelope 101, and the anode voltage is divided by the resistor 4. In some cases, a predetermined divided voltage is supplied to the electrodes of the electron gun 108. And the conventional resistor 4 is
An electrode layer made of an electrode material and a resistor layer made of a resistance material having a trimming portion for setting a resistance value are formed on the surface of the green substrate 21. The resistor layer and the insulating substrate on which the resistor layer is formed are formed. It has a structure in which the surface of the portion is covered with an insulating coating layer. However, such a conventional resistor 4
In the configuration (1), there is a problem that a resistor for a built-in electron tube with a high division ratio accuracy cannot be obtained because the resistance value varies in the resistor layer forming step and the insulating coating forming step.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a built-in electron tube resistor having a high division ratio accuracy without adversely affecting the operation of the electron tube, and a method of manufacturing the resistor. Another object of the present invention is to provide an electron gun including the resistor.

[0017]

According to a first aspect of the present invention, there is provided a resistor comprising: an insulating substrate; a resistor layer formed on the insulating substrate; and a resistor layer formed on the insulating substrate and joined to the resistor layer. An electrode layer having an electrode portion to be grounded and an electrode portion to which a high voltage is applied, an insulating coating layer formed on the insulating substrate by covering the resistor layer, and connected to an electrode portion of the electrode layer. And a terminal attached to the insulating substrate, wherein at least one of the electrode part to be grounded and the electrode part to which the high voltage is applied in the electrode layer, the resistor layer is selected. And a resistance value setting unit for setting the resistance value.

According to a second aspect of the present invention, there is provided a method of manufacturing a resistor, comprising the steps of: forming a resistor layer on an insulating substrate; Forming an electrode layer having a resistance value setting portion on at least one of these electrode portions, and covering the resistor layer with an insulating coating layer; and forming an electrode portion on the electrode layer. And setting a resistance value of a resistance value setting section formed on the electrode layer in accordance with the resistance value of the resistor layer.

According to the first and second aspects of the present invention, it is possible to obtain a resistor having a high division ratio accuracy without adversely affecting the operation of the electron tube. Claim 3
In the resistor according to the invention, an insulating substrate, a resistor layer formed on the insulating substrate, an electrode portion formed on the insulating substrate, joined to the resistor layer, and at least grounded, and a high voltage are applied. An electrode layer having an electrode portion, an insulating coating layer formed on the insulating substrate by covering the resistor layer, and a terminal connected to the electrode portion of the electrode layer and attached to the insulating substrate. A terminal connecting portion and at least one of the electrode portion to which the high voltage is applied to the electrode layer, the terminal connecting portion and the terminal portion being branched from the electrode connecting portion and connected to the resistor layer. And a resistance value setting section including a plurality of thin line portions.

According to a fourth aspect of the invention, there is provided a method of manufacturing a resistor, comprising the steps of: forming a resistor layer on an insulating substrate; applying an electrode portion and a high voltage which are joined to at least the resistor layer and grounded on the insulating substrate. And an electrode having at least one of these electrode portions, a terminal connection portion and a resistance value setting portion including a plurality of thin wire portions branched from the terminal connection portion and connected to the resistor layer. Forming a layer, covering the resistor layer with an insulating coating layer, connecting a terminal to a terminal connection portion of a resistance value setting portion formed on the electrode portion, and forming the thin wire of the resistance value setting portion. Setting the number of portions in accordance with the resistance value of the resistor layer.

According to a fifth aspect of the present invention, there is provided a resistor, comprising: an insulating substrate;
A resistor layer formed on the insulating substrate, an electrode layer having an electrode portion formed on the insulating substrate and joined to the resistor layer and connected to at least a ground, and an electrode portion to which a high voltage is applied; A resistor covering the body layer and formed on the insulating substrate; and a terminal connected to the electrode portion of the electrode layer and attached to the insulating substrate, wherein the resistor is provided on the electrode layer. At least one of the electrode unit to be connected and the electrode unit to which the high voltage is applied, a resistance value setting unit including a plurality of thin wire portions connected in parallel to the resistor layer is formed, and the terminal is connected to the front. It is characterized in that it has a shape that is selectively connected to a plurality of thin line portions in the resistance value setting section.

According to a sixth aspect of the present invention, there is provided a method of manufacturing a resistor, comprising the steps of: forming a resistor layer on an insulating substrate; applying an electrode portion which is joined to at least the resistor layer and grounded to the insulating substrate; And an electrode having at least one of these electrode portions, a terminal connection portion and a resistance value setting portion including a plurality of thin wire portions branched from the terminal connection portion and connected to the resistor layer. A step of forming a layer, a step of covering the resistor layer with an insulating coating layer, and selecting a terminal having a shape to be connected to a thin wire portion required in the resistance value setting unit, and insulating the selected terminal by the insulating. Attaching to the substrate and connecting to a necessary thin wire portion in the resistance value setting section.

According to a seventh aspect of the present invention, there is provided a resistor, comprising: an insulating substrate;
A resistor layer formed on the insulating substrate, an electrode layer having an electrode portion formed on the insulating substrate and joined to the resistor layer and connected to at least a ground, and an electrode portion to which a high voltage is applied; A resistor covering the body layer and formed on the insulating substrate; and a terminal connected to the electrode portion of the electrode layer and attached to the insulating substrate, wherein the resistor is provided on the electrode layer. At least one of the connected electrode portion and the electrode portion to which the high voltage is applied is provided with a resistance value setting portion formed of a plurality of thin wire portions connected in parallel to the resistor layer, and the terminal is connected to the resistor portion. It is characterized in that it is selectively connected to any one of the plurality of thin line portions in the resistance value setting section.

According to a eighth aspect of the invention, there is provided a method of manufacturing a resistor, comprising the steps of: forming a resistor layer on an insulating substrate; applying an electrode portion and a high voltage to the insulating substrate which are joined to at least the resistor layer and grounded. And an electrode having at least one of these electrode portions, a terminal connection portion and a resistance value setting portion including a plurality of thin wire portions branched from the terminal connection portion and connected to the resistor layer. Forming a layer, covering the resistor layer with an insulating coating layer, and selectively connecting a terminal to any one of the plurality of thin wire portions in the resistance value setting section. It is characterized by.

According to the third, fifth and seventh aspects of the present invention, a resistor having a high division ratio accuracy can be provided with a specific configuration without adversely affecting the operation of the electron tube.
According to the configurations of the inventions of 6 and 8, the resistor can be easily manufactured.

According to a ninth aspect of the present invention, there is provided an electron gun including the resistor according to the first aspect. According to the ninth aspect of the present invention, it is possible to obtain an electron gun provided with an excellent resistor having high division ratio accuracy.

[0027]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIGS. 1 and 2
FIG. 3 is a plan view showing a resistor, and FIG. 3 is a cross-sectional view taken along line ZZ in FIG. This embodiment is described with reference to FIGS.
The resistors shown in FIG. 1 are the same as those in FIGS. 1 to 3 and the same parts as those in FIGS. 9 and 10 are denoted by the same reference numerals.

That is, in the figure, reference numeral 21 denotes an insulating substrate,
22E is a terminal electrode layer formed on the insulating substrate 21;
Is located between the electrode layers 22A to 22E.
The electrode layers 22A to 22E have a relatively low resistance, and the resistor layer 23 has a relatively high resistance. However, the trimming portion 23a is not formed on the resistor layer 23 unlike the conventional resistor described above.
24 is an insulating coating layer formed on the insulating substrate 21 to cover the resistor layer 23; 25 is a through hole formed in the insulating substrate 21 at each of the electrode layers 22A to 22E;
E is a terminal having a tubular portion 26a and a flange portion 26b.
The terminals 26A and 26B are attached by inserting the cylindrical portions 26a into the through holes 25 in the electrode layers 22A and 22B,
The flange 26b is in contact with the surfaces of the electrode layers 22A and 22B. The terminals 26C to 26E are attached by inserting the cylindrical portions 26a into the through holes 25 in the electrode layers 22C to 22E, and the flange portions 26b are in contact with the electrode layers 22C to 22E.

A terminal 26A connected to the electrode layer 22A formed at one end of the insulating substrate 21 is connected to the final accelerating electrode of the electron gun and a terminal connected to the electrode layer 22B provided at the other end. 26B is grounded directly or via a variable resistor. Terminals 26C to 26E connected to the electrode layers 22C to 22E in the intermediate portion of the insulating substrate 21 are applied with a voltage lower than the high voltage applied to the final accelerating electrodes such as the focusing electrode and the two intermediate electrodes of the electron gun, respectively. Connected to medium voltage electrode.

Next, a configuration which is a feature of the present invention will be described. The electrode portions 22A, which are electrode portions to which a high voltage is applied at both ends of the insulating substrate 21, and the electrode portion electrode layers 22B, which are electrode portions connected to the ground, are resistance values for setting the resistance value of the resistor layer 23, respectively. It has a shape in which a setting portion is formed. That is, the resistance value setting portions of the electrode layers 22A and 22B include the terminal connection portion 31a and the plurality of fine wire portions 31b branched from the terminal connection portion 31a. The cylindrical portions 26a of the terminals 26A and 26B are inserted into the through holes 25 formed in common with the insulating substrate 21 in the terminal connection portion 31a, and the terminal 26 is provided on the surface of the terminal connection portion 31a.
The flanges 26b of A and 26B are in contact. The plurality of fine wire portions 31b are arranged in parallel in a comb-tooth shape from the terminal connection portion 31a, and their respective tips are commonly connected to the ends of the resistor layer 23. The insulating coating layer 24 covers the resistor layer 23, the surface 21a of the insulating substrate 21 on which the resistor layer 23 is formed, and the connection between the resistor layer 23 and the electrode layers 221C to 22E. , 22B, which cover the connection portions between the plurality of fine wire portions 31b, which are the resistance value setting portions, and the resistor layer 23. That is, the electrode layer 22
The plurality of thin wire portions 31b, which are the resistance setting portions in A and 22B, are not covered with the insulating coating layer 24 but are covered with the insulating coating layer 24.
It is exposed from.

The terminal 26A. Is connected to a terminal connection portion 31 which is a resistance value setting portion in the electrode layers 22A and 22B. 26
After connecting B, the resistance value of each portion of the resistor layer 23 formed between the electrode layers 22A to 22E is measured, and when a predetermined resistance value division ratio is obtained, FIG.
As shown in the figure, a plurality of thin line portions 31b which are resistance value setting units
Is left as it is without reducing the number. That is, the number of the thin line portions 31b is set on the assumption that a predetermined resistance value division ratio of each portion of the resistor layer 23 can be obtained. Also,
The resistance value of each part of the resistor layer 23 is measured, and if a predetermined resistance value division ratio cannot be obtained and the resistance value needs to be set, the state of the resistance value of each part of the resistor layer 23 is determined. Electrode layer 22A, so that a predetermined resistance value division ratio is obtained in accordance with
Plural thin line portions 31 which are resistance setting portions in 22B
b is cut and deleted by a necessary number to reduce the number of thin line portions 31b. As a method of cutting and removing the thin line portion 31b,
The method according to C0 ₂ laser, and a method by mechanical cutting such as grinding. FIG. 2 shows an example of a state in which a part of the thin line portion 31b is cut to reduce the number. In other words, the electrode layers 22A, 22A, 22B, 22C, and 22B are provided so that a predetermined resistance value division ratio is obtained according to the state of the resistance value of each portion of the resistor layer 23.
Plural thin line portions 31 which are resistance setting portions in 22B
By cutting and removing a necessary number of b, the resistor layer 2
The resistance value is divided at a predetermined division ratio in each part of FIG. As a result, the variation of the division ratio of the resistance value of each portion of the resistor layer 23 can be suppressed to, for example, about 1/3 to 1/4 of the conventional one, and the accuracy of the division ratio can be improved.

A method for manufacturing this resistor will be described. This manufacturing method includes a step of forming a resistor layer 26 on the surface of the insulating substrate 21, a step of forming an electrode layer 22 </ b> B, which is an electrode portion joined to at least the resistor layer and grounded, and applying a high voltage to the surface of the insulating substrate 21. Each of the electrode layers 22A, 22A,
22B, the terminal connection portion 31a and the terminal connection portion 31
A step of forming an electrode layer having a resistance value setting portion composed of a plurality of thin wire portions 31 b branched from A and connected to the resistor layer 23, a step of covering the resistor layer 23 with the insulating coating layer 24, The terminals 26A, 26B are connected to the terminal connection portions 31a of the resistance value setting portions formed on the layers 22A, 22B, and the number of the thin wire portions 31b of the resistance value setting portions is determined by the resistance layer 23.
And setting the resistance value according to the resistance value. According to this manufacturing method, a resistor with high division ratio accuracy can be manufactured with high productivity.

The resistance value for setting the resistance value of the resistor layer 23 to the electrode layer 22A, which is an electrode part to which a high voltage exposed from the insulating coating layer is applied and to the electrode part 22B, which is an electrode part connected to the ground, is applied. When the setting portion is formed, the surrounding electric potential of each of the electrode layers 22A and 22B is substantially constant in a state where the electrode layers are incorporated in an electron tube such as a cathode ray tube, so that the discharge due to the exposure of the insulating substrate 21 does not occur. Further, after the heating step for forming the insulating coating layer 24 or the like is completed, the resistance value setting section can be processed to set the division ratio of the resistance value of the resistor layer 23. 23 does not change. Accordingly, it is possible to obtain a resistor having a high division ratio accuracy without adversely affecting the operation of the electron tube.

The form of the resistance value setting sections formed on the electrode layers 22A and 22B is not limited to the above-described embodiment, and can be implemented with various modifications. For example, FIG. 4 shows a different form of the resistance value setting unit. 4, the same parts as those in FIG. 1 are denoted by the same reference numerals. In this embodiment, a plurality of thin wire portions 32 connected to the end of the resistor layer 23 and arranged in parallel are formed as resistance value setting portions formed on the electrode layers 22A and 22B. The ends of the plurality of fine wire portions 32 are formed side by side so as to form an arc-shaped row like a fixed contact of a movable resistor, for example. The terminal 26A has a circular flange portion 26b, and is formed with a protruding piece 26c for selecting and connecting any one of the plurality of thin wire portions 32 from the flange portion 26b toward the outside in the radial direction. In FIG. 4, one protruding piece 26c is formed, but a plurality may be provided. Protruding piece 2
6c is set to a number and a position necessary for obtaining a predetermined resistance value division ratio according to the state of the resistance value of each portion of the resistor layer 23. That is, a plurality of thin line portions 3
The connection position and the number of connections for
A plurality of types of terminals 26A having different shapes in which c is formed are prepared. Then, the resistance value of each portion of the resistor layer 23 is measured, and the measurement result is a number and a number necessary for obtaining a predetermined resistance value division ratio in accordance with the state of the resistance value of each portion of the resistor layer 23. The terminal 26A on which the protruding piece 26c is formed is selected, the selected terminal 26A is attached to the insulating substrate 21, and the protruding piece 26c formed on the terminal 26A is connected to a plurality of thin wire portions 32 that require it. Thereby, the resistance value of each portion of the resistor layer 23 can be set so as to obtain a predetermined division ratio.

Even in the resistor of this embodiment, the division ratio of the resistance value of each portion of the resistor layer 23 can be set with high accuracy without adversely affecting the operation of the electron tube, and the resistor can be easily manufactured. Further, it is not necessary to cut the plurality of thin line portions 32 which are the resistance value setting portions when setting the division ratio of the resistance value of each portion of the resistor layer 23.

FIG. 5 shows a different form of the resistance value setting section taking the electrode layer 22A as an example. 5, the same parts as those in FIG. 1 are denoted by the same reference numerals. In this embodiment, a plurality of thin wire portions 33 connected to the end of the resistor layer 23 and arranged in parallel as a resistance value setting portion formed on the electrode layer 22A.
Are formed. The terminals 26A1 and 26B1 are selectively connected to any one of the plurality of thin wire portions 33. The terminals 26A1 and 26B1 have a clip shape, and are connected to the thin wire portion 33 by attaching to the insulating substrate 21 by a conventionally known appropriate method.

Even with this type of resistor, the division ratio of the resistance value of each portion of the resistor layer 23 can be set with high precision without adversely affecting the operation of the electron tube, and the resistor can be easily manufactured. In addition, it is not necessary to cut the plurality of thin line portions 33 that are the resistance value setting portions when setting the division ratio of the resistance value of each portion of the resistor layer 23.

Then, an electron gun was manufactured by incorporating the resistor obtained in each of these embodiments. This color gun was assembled in an envelope and subjected to exhaust and withstand voltage treatment in the same manner as the conventional manufacturing method to produce a color picture tube. The value change was equivalent to that of the conventional resistor without any problem. In addition, the discharge starting voltage due to the application of the forced voltage between the bead glass and the inner wall of the neck portion was equivalent to that of the related art and had no problem.

In these embodiments, each of the electrode layer 22A, which is an electrode portion to which a high voltage exposed from the insulating coating layer is applied, and the electrode layer 22B, which is an electrode portion connected to the ground, have their respective resistance values set. Although the portion is formed, the invention is not limited to this, and the resistance value setting portion may be formed on at least one of the portions.

[0040]

According to the resistor according to the first and second aspects of the present invention, the resistor layer is connected to the electrode portion to which the high voltage exposed from the insulating coating layer in the electrode layer is applied and to the electrode portion connected to the ground. Forming a resistance value setting part in at least one,
Since the selected resistance value of the resistor layer is set by combining the resistance value setting section and the terminal, the potential around each of these electrode sections is substantially constant when the resistance layer is incorporated in an electron tube such as a cathode ray tube and the insulating substrate is Without causing discharge due to exposure,
In addition, since the resistance value setting section is processed after the heating step for forming the insulating coating layer and the like to set the division ratio of the resistance value of the resistor layer, the resistance value of the body antibody layer can be set in a later step. Does not change. Therefore, it is possible to obtain an excellent resistor for a built-in electron tube having a high division ratio without adversely affecting the operation of the electron tube.

According to the third, fifth and seventh aspects of the present invention, it is possible to provide a resistor having a high division ratio accuracy without adversely affecting the operation of the electron tube. According to the configurations of the inventions of (8) and (9), the above-described resistor can be easily manufactured. Further, according to the ninth aspect of the present invention, it is possible to obtain an electron gun provided with an excellent resistor having a high division ratio accuracy.

[Brief description of the drawings]

FIG. 1 is a plan view showing a resistor according to a first embodiment of the present invention.

FIG. 2 is a plan view showing the resistor according to the embodiment.

FIG. 3 is an exemplary sectional view showing the resistor according to the embodiment;

FIG. 4 is a plan view showing a resistor according to a second embodiment.

FIG. 5 is a plan view showing a resistor according to a third embodiment.

FIG. 6 is a sectional view showing a color CRT.

FIG. 7 is an enlarged cross-sectional view showing a portion provided with an electron gun having a built-in resistor in a color cathode ray tube.

FIG. 8 is an enlarged perspective view showing a portion provided with an electron gun having a built-in resistor in the color cathode ray tube.

FIG. 9 is a plan view showing a conventional resistor.

FIG. 10 is a sectional view showing a conventional resistor.

FIG. 11 is an enlarged cross-sectional view showing a terminal mounting portion in a conventional resistor.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 21 ... Insulating board, 22A-22E ... Electrode layer, 23 ... Resistor layer, 24 ... Insulation coating layer, 25 ... Through-hole, 26A-26E ... Terminal, 26c ... Projection piece, 31 ... Thin wire part (resistance value setting part) , 32: Thin line portion (resistance value setting section) 33: Thin line portion (resistance value setting section)

Claims (9)

[Claims] 1. An insulating substrate, a resistor layer formed on the insulating substrate, an electrode portion formed on the insulating substrate, joined to the resistor layer and connected at least to ground, and an electrode to which a high voltage is applied. A resistor comprising: an electrode layer having a portion; an insulating coating layer formed on the insulating substrate by covering the resistor layer; and a terminal connected to the electrode portion of the electrode layer and attached to the insulating substrate. In the device, a resistance value setting unit for setting a selected resistance value of the resistor layer is formed on at least one of the electrode unit connected to the ground and the electrode unit to which the high voltage is applied in the electrode layer. A resistor. 2. A step of forming a resistor layer on an insulating substrate;
A step of forming an electrode layer having an electrode portion joined to at least the resistor layer and connected to ground on an insulating substrate and an electrode portion to which a high voltage is applied, and having a resistance value setting portion on at least one of these electrode portions; Covering the resistor layer with an insulating coating layer, connecting a terminal to an electrode portion of the electrode layer, and changing a resistance value of a resistance value setting section formed on the electrode layer to a resistance value of the resistor layer. And a step of setting them together. 3. An insulating substrate, a resistor layer formed on the insulating substrate, an electrode portion formed on the insulating substrate, joined to the resistor layer and connected at least to ground, and an electrode to which a high voltage is applied. A resistor comprising: an electrode layer having a portion; an insulating coating layer formed on the insulating substrate by covering the resistor layer; and a terminal connected to the electrode portion of the electrode layer and attached to the insulating substrate. A terminal connecting portion and a plurality of terminals branched from the terminal connecting portion and connected to the resistor layer in at least one of the electrode portion connected to the ground and the electrode portion to which the high voltage is applied in the electrode layer. Wherein a resistance value setting section comprising a thin line portion is formed. 4. A step of forming a resistor layer on an insulating substrate;
The insulating substrate has at least an electrode portion joined to the resistor layer and grounded and an electrode portion to which a high voltage is applied. At least one of these electrode portions has a terminal connection portion and a branch from the terminal connection portion. Forming an electrode layer having a resistance value setting portion composed of a plurality of thin wire portions connected to the resistor layer, covering the resistor layer with an insulating coating layer, and forming the electrode layer on the electrode portion. Connecting a terminal to a terminal connection portion of the resistance value setting section and setting the number of the thin wire portions of the resistance value setting section in accordance with the resistance value of the resistor layer. Manufacturing method. 5. An insulating substrate, a resistor layer formed on the insulating substrate, an electrode portion formed on the insulating substrate, joined to the resistor layer and connected at least to ground, and an electrode to which a high voltage is applied. A resistor comprising: an electrode layer having a portion; an insulating coating layer formed on the insulating substrate by covering the resistor layer; and a terminal connected to the electrode portion of the electrode layer and attached to the insulating substrate. A resistance value setting unit including a plurality of thin wire portions connected to the resistor layer and arranged in parallel with at least one of the electrode portion connected to the ground and the electrode portion to which the high voltage is applied in the electrode layer; And the terminal has a shape selectively connected to a plurality of thin wire portions in the resistance value setting section. 6. A step of forming a resistor layer on an insulating substrate;
The insulating substrate has at least an electrode portion joined to the resistor layer and grounded and an electrode portion to which a high voltage is applied. At least one of these electrode portions has a terminal connection portion and a branch from the terminal connection portion. Forming an electrode layer having a resistance value setting portion composed of a plurality of thin wire portions connected to the resistor layer, and covering the resistor layer with an insulating coating layer. Select the terminal that is shaped to connect to the required thin wire part,
Attaching the selected terminal to the insulating substrate and connecting the terminal to a required thin wire portion in the resistance value setting unit. 7. An insulating substrate, a resistor layer formed on the insulating substrate, an electrode portion formed on the insulating substrate, joined to the resistor layer and connected at least to ground, and an electrode to which a high voltage is applied. A resistor comprising: an electrode layer having a portion; an insulating coating layer formed on the insulating substrate by covering the resistor layer; and a terminal connected to the electrode portion of the electrode layer and attached to the insulating substrate. A resistance value setting unit including a plurality of thin wire portions connected to the resistor layer and arranged in parallel with at least one of the electrode portion connected to the ground and the electrode portion to which the high voltage is applied in the electrode layer; And the terminal is selectively connected to any one of the plurality of thin wire portions in the resistance value setting section. 8. A step of forming a resistor layer on an insulating substrate;
The insulating substrate has at least an electrode portion joined to the resistor layer and grounded and an electrode portion to which a high voltage is applied. At least one of these electrode portions has a terminal connection portion and a branch from the terminal connection portion. Forming an electrode layer having a resistance value setting portion composed of a plurality of thin wire portions connected to the resistor layer, covering the resistor layer with an insulating coating layer, and connecting a terminal to the resistance value setting portion. Selectively superimposing and connecting to any one of the plurality of fine wire portions in the above. 9. An electron gun comprising the resistor according to claim 1.