JP2000007896A - Epoxy resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for semiconductor sealing used as a sealing agent for semiconductors and excellent in adhesiveness to lead frame and resistance to crack due to soldering in surface mounting by including an epoxy resin, a hardener, a hardening accelerator and an inorganic filler as an essential component. SOLUTION: This resin composition is obtained by including (A) an epoxy resin, (B) a hardener in an amount of preferably 0.5-1.3 equivalent based on epoxy group of the component A, as necessary, (C) a hardening accelerator, preferably in an amount of 0.2-4.0 pts.wt. based on 100 pts.wt. component A and (D) preferably 78-92 wt.% inorganic filer as an essential component. In the composition, adhesive strength in pulling method to lead frame whose surface is plated with palladium is >=250 g/mm2 when the content of the component D is 75%. It is preferable that softening points or melting points of the component A and the component B are each >=45 deg.C. The lead frame used for sealing of semiconductor is preferably a copper frame having plated palladium on the outermost layer.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition which is used as an encapsulant for semiconductors and has excellent adhesion to a lead frame and excellent solder crack resistance during surface mounting.

[0002]

2. Description of the Related Art Epoxy resins are used for various electric and electronic parts because of their excellent heat resistance, electric properties, mechanical properties and the like. In particular, transistors, ICs, LSIs
As a sealing material for semiconductor elements such as the above, epoxy resin is mostly used. In recent years, with the expansion of the surface mounting method for semiconductor devices, when a molded surface is mounted on a molded product, cracks occur in the molded product during mounting, so a resin composition with excellent crack resistance during mounting is required. Have been. In recent years, there has been an increasing demand for avoiding the use of lead due to environmental problems. Accordingly, there is a movement to change from a lead frame plated with solder using lead to a lead frame whose surface is plated with palladium. For this reason, a resin composition having excellent adhesion to a lead frame having a palladium-plated surface and excellent solder crack resistance has been particularly demanded.
Further, as in the past, it is desired to enhance the adhesiveness also in the moisture resistance reliability and the heat cycle reliability.

[0003]

However, the adhesion between a palladium-plated lead frame and a composition using a cresol novolak epoxy resin which is widely used for semiconductor encapsulation is low, and the solder crack resistance is also low. Low.

[0004]

Means for Solving the Problems The present inventors have studied various epoxy resins and found that the content of the inorganic filler in the composition was 75% by weight in a lead frame having a surface coated with palladium. 250g / m adhesive strength
By using the epoxy resin composition is m ² or more, in addition to the epoxy resin composition excellent in soldering crack resistance is obtained, leading to finding the present invention that is excellent in various reliability as described above.

That is, the present invention relates to an epoxy resin composition comprising (1) 1) an epoxy resin, 2) a curing agent, 3) a curing accelerator if necessary, and 4) an inorganic filler. Strength by pull-out method with the lead frame which has been subjected to the treatment, the content of the inorganic filler is 75% by weight
(2) The epoxy resin composition according to the above (1), wherein the epoxy resin composition for semiconductor encapsulation is 250 g / mm ² or more, and (2) the epoxy resin and the curing agent have a softening point or a melting point of 45 ° C. or more. And (3) the content ratio of the inorganic filler is 7
The epoxy resin composition according to the above (1) or (2), which is 8 to 92% by weight, (4) a lead frame used for sealing a semiconductor is nickel, and a copper frame plated with palladium thereon. The epoxy resin composition according to any one of (1) to (3), (5) the (1).
A semiconductor device encapsulated with the epoxy resin composition according to any one of (4) to (4).

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION The epoxy resin used in the present invention may be any one usually used for electric / electronic parts, and specifically, tetrabromobisphenol A,
Tetrabromobisphenol F, bisphenol A, tetramethylbisphenol F, bisphenol F, bisphenol S, bisphenol K, biphenol, tetramethylbiphenol, hydroquinone, methylhydroquinone, dimethylhydroquinone, trimethylhydroquinone, di-ter. Butyl hydroquinone, resorcinol, methyl resorcinol, catechol, methyl catechol, dihydroxynaphthalene, dihydroxymethylnaphthalene, glycidylated compounds such as dihydroxydimethylnaphthalene, phenols, or condensates of naphthols with aldehydes, phenols or naphthols and xylylene Glycidylated products of condensates with glycols, condensates of phenols with isopropenyl acetophenone, reactants of phenols with dicyclopentadiene, and condensates of bismethoxymethyl biphenyl with naphthols or phenols, and the like are included. These can be obtained commercially or by a known method.

The above-mentioned phenols include phenol, cresol, xylenol, butylphenol, amylphenol, nonylphenol, catechol, resorcinol, methylresorcinol, hydroquinone,
Examples thereof include phenylphenol, bisphenol A, bisphenol F, bisphenol K, bisphenol S, biphenol, and tetramethylbiphenol.

Examples of naphthols include 1-naphthol, 2-naphthol, dihydroxynaphthalene, dihydroxymethylnaphthalene, dihydroxydimethylnaphthalene, trihydroxynaphthalene and the like.

Further, aldehydes include formaldehyde, acetaldehyde, propylaldehyde, butyraldehyde, valeraldehyde, caproaldehyde, benzaldehyde, chlorbenzaldehyde, bromobenzaldehyde, glyoxal, malonaldehyde, succinaldehyde, glutaraldehyde, adipine aldehyde, Melinaldehyde, sebacinaldehyde, acrolein, crotonaldehyde, salicylaldehyde, phthalaldehyde, hydroxybenzaldehyde, furfural, 3-furaldehyde, 3-methylfurfural, 5-methylfurfural, 5-ethylfurfural, 2-ethylfurfural, 2-thiophenecarboxaldehyde, 3-
Thiophenecarboxaldehyde, 3-methyl-2-thiophencarboxaldehyde and the like are exemplified. The epoxy resin used in the present invention is exemplified above, but is not limited thereto, and may be any resin used for electric / electronic parts, and may be used alone or in combination of several kinds. .

Further, since it is used for electricity and electronics,
It is preferable that the concentration of hydrolyzable chlorine is low. For example, when the epoxy resin is dissolved in dioxane and treated with 1N KOH under reflux for 30 minutes, the amount of hydrolyzable chlorine specified by desorbed chlorine is 0.2% by weight. The following are preferable, and 0.15
More preferably, the amount is not more than weight%.

The curing agent may be any one used for electric / electronic parts, and specifically, tetrabromobisphenol A, tetrabromobisphenol F, bisphenol A, tetramethylbisphenol F, bisphenol F, bisphenol S, bisphenol K, biphenol, tetramethylbiphenol, hydroquinone, methylhydroquinone, dimethylhydroquinone, trimethylhydroquinone, di-ter. Butyl hydroquinone, resorcinol, methyl resorcinol, catechol, methyl catechol, dihydroxynaphthalene, dihydroxymethylnaphthalene, glycidylated compounds such as dihydroxydimethylnaphthalene, phenols, or condensates of naphthols with aldehydes, phenols or naphthols and xylylene Examples include condensates with glycols, condensates of phenols with isopropenyl acetophenone, and reaction products of phenols with dicyclopentadiene. These curing agents are used alone or in combination of several kinds. Further, it may be used in combination with another curing agent such as an amine type or an acid anhydride type.

Examples of the phenols used as a raw material of the curing agent include phenol, cresol, xylenol, butylphenol, amylphenol, nonylphenol, catechol, resorcinol, methylresorcinol, hydroquinone, phenylphenol, bisphenol A, bisphenol F, and bisphenol. K,
Bisphenol S, biphenol, tetramethylbiphenol and the like are exemplified.

Examples of naphthols also used as a raw material of the curing agent include 1-naphthol, 2-naphthol, dihydroxynaphthalene, dihydroxymethylnaphthalene, dihydroxydimethylnaphthalene, trihydroxynaphthalene and the like.

Further, the aldehydes also used as raw materials for the curing agent include formaldehyde, acetaldehyde, propylaldehyde, butyraldehyde, valeraldehyde, capronaldehyde, benzaldehyde, chlorbenzaldehyde, bromobenzaldehyde, glyoxal, malonaldehyde, and succinaldehyde. , Glutaraldehyde, adipaldehyde, pimeraldehyde, sebacaldehyde, acrolein, crotonaldehyde, salicylaldehyde, phthalaldehyde, hydroxybenzaldehyde, furfural, 3-furaldehyde, 3-methylfurfural, 5
-Methylfurfural, 5-ethylfurfural, 2-
Thiophenecarboxaldehyde, 3-thiophencarboxaldehyde, 3-methyl-2-thiophencarboxaldehyde and the like are exemplified.

[0015] The amount of the curing agent used is 0.1 to the epoxy group.
3 to 1.5 equivalents are preferred, more preferably 0.5 to
1.3 equivalents. If it is 0.3 equivalent or less, unreacted epoxy groups increase, and if it is 1.5 equivalents or more, the amount of unreacted curing agent increases, and thermal and mechanical properties deteriorate, which is not preferable.

Examples of the curing accelerator used if necessary include phosphines such as triphenylphosphine and bis (methoxyphenyl) phenylphosphine; imidazoles such as 2-methylimidazole and 2-ethyl-4-methylimidazole; trisdimethylaminomethylphenol; Tertiary amines such as diazabicycloundecene are exemplified.

The amount of the curing accelerator used is 10
The amount is preferably 0.2 to 5.0 parts by weight, more preferably 0.2 to 4.0 parts by weight, per 0 parts by weight.

The inorganic filler may be any one used in an epoxy resin composition for electric / electronic parts, such as calcium carbonate, clay, talc, diatomaceous earth, silica, aluminum nitride, silicon nitride, alumina, Magnesia, carborundum, diamond and the like are exemplified. When a large amount of such a hard inorganic filler is blended in the epoxy resin composition, kneading and mixing are performed with a roll, a kneader or the like in order to uniformly disperse the blended composition. Further, the epoxy resin composition of the present invention may contain a pigment, a release agent, a flame retardant, a silane coupling agent, and the like, if necessary.

The epoxy resin composition of the present invention can be drawn
Adhesion strength by the method is 250g / mm ²No more than
The type and / or amount of each of the above components other than the filler
Can be obtained. Inorganic filling by drawing method
The adhesive strength of an epoxy resin composition containing an agent
If the amount of inorganic filler is less than 75% by weight,
If the dispersion of the resin is large and exceeds 75% by weight,
The difference in measurement results due to
Not easy. Measurement variations and differences in resin properties
Due to the balance of ease, the measurement of adhesive strength is based on inorganic filler
It is preferably carried out at a content of around 75% by weight. More solder resistant
In view of the correlation with the cracking property, the inorganic filler content is 75
Most preferably it is measured in% by volume. Specifically,
The most preferred example of a composition for conducting an
24.2 wt. Of a mixture obtained by mixing an equivalent amount of a xy resin and a curing agent
%, Mold release agent (fine powder carnauba, Toa Kasei Co., Ltd.) 0.3 weight
%, Spherical silica as an inorganic filler (average particle size 30μ)
m) 52.5% by weight and crushed silica (average particle size 5 μm)
22.5% by weight, coupling agent (KBM-303,
Oe Chemical Co., Ltd.) 0.3% by weight, Trif as a curing accelerator
Phenylphosphine at a rate of 0.2% by weight.
You.

As described above, the epoxy resin composition of the present invention is sealed with an inorganic filler content of 75% by weight with respect to a lead frame having an outermost layer plated with palladium as in the examples described later. And then the adhesive strength as measured by the pull-out method is 250 g / mm ²
As described above, the composition is preferably 270 g / mm ² or more, and the content ratio of each component of the epoxy resin composition of the present invention as long as the composition exhibits a specific range of adhesive strength under such specific conditions. Is not particularly limited. That is, in the epoxy resin composition of the present invention, the content of the inorganic filler is optional, but if it is less than 78% by weight, the solder crack resistance is significantly reduced, and if it is more than 92% by weight, the viscosity of the composition is too high. Sharply increases, so that the molding characteristics are significantly reduced. Therefore, the content of the inorganic filler in the resin composition for semiconductor encapsulation is preferably 78 to 92% by weight. Further, it is desirable that the epoxy resin and the curing agent used in the epoxy resin composition of the present invention have a softening point or a melting point of 45 ° C. or more. When the softening point or melting point is less than 45 ° C., the composition is formed into tablets or granules in order to be molded by transfer or the like. However, blocking or the like of the tablets or granules occurs, which is not preferable because of difficulty in handling.

The epoxy resin composition of the present invention can be obtained by uniformly mixing the components at a predetermined ratio. The epoxy resin composition of the present invention can be easily made into a cured product by a method similar to a conventionally known method. For example, an epoxy resin and a curing agent are previously set to 100 to 20.
At 0 ° C., at least the epoxy resin or the curing agent is melted and mutually melted in this melt, and then extruder, roll,
It can be obtained by adding and mixing a filler, a pigment, a release agent, a flame retardant, a silane coupling agent and the like and a curing accelerator with a kneader or the like. Also, an epoxy resin, a curing agent, an inorganic filler, and if necessary, a curing accelerator, a pigment,
Extruder for release agent, flame retardant, silane coupling agent, etc.
It can be obtained by mixing with a roll, kneader or the like. The obtained epoxy resin composition is molded using a casting machine or a transfer molding machine, and further molded at 80 to 200 ° C.
A cured product can be obtained by curing after 10 to 10 hours.

[0022]

EXAMPLES The present invention will be described in more detail with reference to Production Examples and Examples. Note that the present invention is not limited to these examples. In the examples, unless otherwise specified, parts are parts by weight. Further, in the production examples, the epoxy equivalent, melt viscosity, softening point, hydrolyzable chlorine concentration, and melting point were measured under the following conditions. 1) Epoxy equivalent It measured by the method according to JISK-7236. 2) Melt viscosity Melt viscosity in cone plate method at 150 ° C. Measurement machine: cone plate (ICI) high temperature viscometer (RE
SERCH EQUIPMENT (LONDON) LT
D. Made by Corn No. : 3 (measurement range: 0 to 20 poise) Sample amount: 0.15 ± 0.005 (g) 3) Softening point Measured by a method according to JIS K-7234 4) Hydrolyzable chlorine concentration 1N in dioxane solution of sample The amount of chlorine liberated by adding a -KOH ethanol solution and refluxing for 30 minutes was measured by a silver nitrate titration method and divided by the weight of the sample. 5) Melting point The melting point was measured by a DSC method. Heating rate: 10 ° C / min

Production Example 1 In a flask equipped with a stirrer, a reflux condenser, and a stirrer,
2,5-xylenol 244 parts by weight, methanol 122
Parts by weight and 7 parts by weight of sodium hydroxide were charged, stirred, dissolved, heated and brought to a reflux state, and 96 parts by weight of furfural was dropped in 2 hours. Then at reflux temperature 15
After reacting for an hour, the mixture was neutralized with 140 parts by weight of a 20% aqueous solution of sodium dihydrogen phosphate, and 500 parts by weight of water was added. Then, the precipitated crystals were collected by filtration, and methanol: water = 1: 1.
After washing with the solution of No. 1, it was dried with a vacuum dryer. As a result, 4,4 ′-(2-furyl-methylene) bis [2,5
-Dimethylphenol] (polycondensate (P1)) 304 parts by weight was obtained. Melting point: 147 ° C

Preparation Example 2 The same operation as in Preparation Example 1 was carried out except that sodium hydroxide was changed to 5 parts by weight of lithium hydroxide, furfural was changed to 112 parts by weight of 2-thiophenecarboxaldehyde, and the reaction time was changed to 25 hours. Then, 4,4 '-(2-
307 parts by weight of (thienyl-methylene) bis [2,5-dimethylphenol] (polycondensate (P2)) were obtained. Melting point:
167 ° C

Production Example 3 500 parts by weight of epichlorohydrin (ECH, the same applies hereinafter) and dimethyl sulfoxide (DMSO, the same applies hereinafter) 1 based on 161 parts by weight of the polycondensate (P1) obtained in Production Example 1
After charging into a reaction vessel, heating, stirring, and dissolving,
While maintaining the temperature at 45 ° C., the inside of the reaction system was 45 Torr.
, 100 parts by weight of a 40% by weight aqueous sodium hydroxide solution was continuously added dropwise over 4 hours. At this time, after cooling and separating the ECH and water distilled off by azeotropic distillation, the reaction was performed while returning only the organic layer, ECH, into the reaction system. After the completion of the aqueous sodium hydroxide solution, the reaction was further performed at 45 ° C. for 3 hours and at 70 ° C. for 30 minutes. Then, washing with water was repeated to remove by-product salts and dimethyl sulfoxide.
Excess epichlorohydrin was distilled off from the oil layer under heating and reduced pressure, and 500 parts by weight of methyl isobutyl ketone was added to the residue and dissolved. The methyl isobutyl ketone solution was heated to 70 ° C., 4 parts by weight of a 30% aqueous sodium hydroxide solution was added, and the mixture was reacted for 1 hour. After that, the reaction solution was repeatedly washed with water until the washing solution became neutral. Subsequently, 221 parts by weight of an epoxy resin (E1) was obtained by distilling off methyl isobutyl ketone from the oil layer under heating and reduced pressure. The epoxy resin (E1) had an epoxy equivalent of 232 g / eq, a softening point of 66 ° C., a melt viscosity of 0.5 poise, and a hydrolyzable chlorine concentration of 380 ppm.

Production Example 4 The same operation as in Production Example 3 was carried out except that 161 parts by weight of the polycondensate (P1) was changed to 169 parts by weight of the polycondensate (P2). As a result, the epoxy resin (E2) 2
16 parts by weight were obtained. The epoxy resin (E2) has an epoxy equivalent of 239 g / eq, a softening point of 71 ° C., and a melt viscosity of 0.
The concentration of 6 poises and hydrolyzable chlorine was 390 ppm.

Production Example 5 192 parts by weight of a reaction product of o-cresol and dicyclopentadiene having a softening point of 94 ° C., epichlorohydrin (ECH,
555 parts by weight of dimethyl sulfoxide (DM)
SO, the same shall apply hereinafter) 140 parts by weight in a reaction vessel, and after heating, stirring and dissolving, while maintaining the temperature at 45 ° C., maintaining the inside of the reaction system at 45 Torr, adding 100 parts by weight of a 40% aqueous sodium hydroxide solution to 4 parts by weight. It was dropped continuously over time.
At this time, after cooling and separating the ECH and water distilled off by azeotropic distillation, the reaction was carried out while returning only the organic layer, ECH, into the reaction system. After completion of the aqueous sodium hydroxide solution,
The reaction was performed at 45 ° C. for 2 hours and at 70 ° C. for 1 hour. Subsequently, washing with water was repeated to remove by-product salts and dimethyl sulfoxide. Then, excess epichlorohydrin was distilled off from the oil layer under heating and reduced pressure, and 500 parts by weight of methyl isobutyl ketone was added to the residue to dissolve the residue. This solution of methyl isobutyl ketone was heated to 70 ° C., 12 parts by weight of a 30% aqueous sodium hydroxide solution was added, and the mixture was reacted for 1 hour. Then, the reaction solution was repeatedly washed with water until the washing solution became neutral. Then, methyl isobutyl ketone was distilled off from the oil layer under heating and reduced pressure to obtain an epoxy resin (E3) 2
40 parts by weight were obtained. The epoxy resin (E3) obtained had an epoxy equivalent of 258, a total chlorine concentration of 560 ppm, a melt viscosity of 1.5 poise and a softening point of 65 ° C.

Examples 1 to 4 The compositions shown in the composition column of Table 1 were uniformly mixed with a mixing roll (90 ° C before / 100 ° C after) to obtain an epoxy resin composition. This composition was crushed and tablets were obtained on a tablet machine. The obtained tablet was molded (175 ° C. × 60 seconds) with a transfer molding machine, and was post-cured under the conditions of 160 ° C. × 2 hours + 180 ° C. × 6 hours to obtain a test specimen for measurement. As a lead frame for evaluation of adhesion, a test lead frame was prepared by plating a copper lead frame as shown in FIG. 1 in the order of nickel and palladium.

For the measurement of the adhesive strength, the obtained test piece was molded as shown in FIG. 2, the resin sealing portion was fixed, and the pulled-out portion was measured with a universal tensile tester at a crosshead speed of 3 m.
The adhesion strength was measured by pulling at m / min. The bonding area at this time is 74.25 mm ²

[0030]

Table 1 Example 1 Example 1 Example 2 Example 3 Example 4 Composition of formulation Resin A (parts) 17.5 Resin B (parts) 16.7 Resin C (parts) 16.8 Resin D (parts) ) 17.2 PN (parts) 6.7 7.5 7.4 7.0 TPP (parts) 0.2 0.2 0.2 0.2 FB-74 (parts) 52.5 52.5 52. 5 52.5 ZA-30 (parts) 22.5 22.5 22.5 22.5 Release agent (parts) 0.3 0.3 0.3 0.3 KBM-303 (parts) 0.30 0.3 0.3 0.3 Evaluation result Adhesive strength 290 430 350 340 (g / mm ² )

In Table 1 and the following Tables 2, 3 and 4, abbreviations indicate the following. Resin A: NC-3000PL (glycidylated product of condensate of phenol and bismethoxymethylbiphenyl, epoxy equivalent 274 g / eq., Nippon Kayaku Co., Ltd.) Resin B: epoxy resin (E1) obtained in Production Example 3 Resin C: Epoxy resin (E2) obtained in Production Example 4 Resin D: Epoxy resin (E3) obtained in Production Example 5 EOCN-1020: o-cresol type epoxy resin (Nippon Kayaku Co., Ltd. Epoxy equivalent: 200 g / eq., Softening point: 55 ° C.) PN: phenol novolak (hydroxyl equivalent: 103 g / e)
q, Nippon Kayaku Co., Ltd.) TPP: Triphenylphosphine (Junsei Chemical Co., Ltd.) FB-74: Spherical silica (Asahi Denka Co., Ltd.) ZA-30: Crushed silica (Tatsumori Co., Ltd.) Release Agent: fine powder carnauba (Toa Kasei Co., Ltd.) KBM-303: Silane coupling agent (Shin-Etsu Chemical Co., Ltd.)

Examples 5 to 12 In Examples 1 to 4, the combination of the resins A to D (epoxy resin) with PN (curing agent) and TPP (curing accelerator) is based on the condition that the adhesive strength is 250 g / mm ² or more. Since it was found that these combinations were satisfied, the solder crack resistance of these combinations was examined by changing the content of the inorganic filler. Table 2
And the composition shown in the column of composition of the composition in Table 3 were uniformly mixed with a mixing roll (90 ° C before / 100 ° C after) to obtain an epoxy resin composition of the present invention. This composition was crushed and tablets were obtained on a tablet machine. The obtained tablet was molded (175 ° C. × 60 seconds) with a transfer molding machine on a lead frame described below, and further molded at 160 ° C. ×
It was post-cured under the conditions of 2 hours + 180 ° C. × 6 hours to obtain a test piece for measurement. As a lead frame for evaluating solder crack resistance, a copper 96-pin QFP (14 × 14 × 1.35 mm thick, chip size: 7 × 7 × 0.4 m thick) was used.
m) A lead frame plated with nickel and palladium in the same order as the lead frame for evaluation of adhesion was used.

Test for Solder Crack Resistance A test piece obtained as described above was subjected to a test at 85 ° C./85% RH.
Was left in a thermostat set at a relative humidity of predetermined for a predetermined time (12 hours) to absorb moisture, and then immersed in a 220 ° C. solder bath for 10 minutes to perform heat treatment. Regarding the package cracks generated by the thermal shock at this time, those in which cracks were visually observed were rated as ×, and no cracks were visually observed, but cracks were observed in the ultrasonic flaw detector. The results are shown in Table 2, and the evaluation results in Tables 2 and 3 are shown as △, and those in which cracks were not observed by visual inspection or ultrasonic flaw detection were indicated by ○.

[0034]

Table 2 Example 5 Example 6 Example 7 Example 8 Composition of Formulation Resin A (parts) 14.0 Resin B (parts) 13.3 Resin C (parts) 13.4 Resin D (parts) ) 13.7 PN (parts) 5.3 6.0 5.9 5.6 TPP (parts) 0.1 0.1 0.1 0.1 FB-74 (parts) 56.0 56.0 56. 0 56.0 ZA-30 (parts) 24.0 24.0 24.0 24.0 Release agent (parts) 0.3 0.3 0.3 0.3 KBM-303 (parts) 0.30 0.3 0.3 0.3 Evaluation result Solder crack resistance ○ ○ ○ ○

[0035]

Table 3 Example 9 Example 10 Example 11 Example 12 Composition of the formulation Resin A (parts) 11.8 10.4 8.2 17.5 PN (parts) 4.5 3.9 3 .1 6.7 TPP (parts) 0.1 0.1 0.1 0.2 FB-74 (parts) 58.1 59.5 61.6 52.5 ZA-30 (parts) 24.9 25. 526.4 22.5 Release agent (part) 0.3 0.3 0.3 0.3 KBM-303 (part) 0.3 0.3 0.3 0.3 Evaluation result Solder crack resistance ○ ○ ○ △

Comparative Examples 1 to 3 Cured products were prepared in the same manner as in Examples 1 to 12, except that the compounds having the compositions shown in the column of the composition of the compounds in Table 4 were used.
Its physical properties were measured. Table 4 shows the results.

[0037]

Table 4 Comparative Example 1 Comparative Example 2 Comparative Example 3 Composition of Formulation EOCN-1020 (parts) 15.8 12.6 9.3 PN (parts) 8.4 6.7 5.0 TPP (parts) ) 0.2 0.1 0.1 FB-74 (parts) 52.5 56.0 59.5 ZA-30 (parts) 22.5 24.0 25.5 Release agent (parts) 0.30 0.3 0.3 KBM-303 (parts) 0.3 0.3 0.3 Evaluation result Adhesive strength 240 (g / mm ² ) Solder crack resistance × ×

As apparent from Tables 1 to 4, Examples 1 to 4
12 and Comparative Examples 1 to 3, the solder crack resistance of the epoxy composition of the present invention using a resin (epoxy resin or the like) having an adhesive strength of 250 g / mm ² or more in each of Examples 1 to 4 was found. On the other hand, the composition using a resin having an adhesive strength of 240 g / mm ² in Comparative Example 1 was poor in solder crack resistance, whereas the composition was good. (Comparative Examples 2 and 3) From this, it is clear that the solder crack resistance is good when the adhesive strength of the lead frame whose surface is plated with palladium is 250 g / mm ² or more.

[0039]

The epoxy resin composition of the present invention having a lead frame whose surface is plated with palladium and having an adhesive strength of 250 g / mm ² or more has good solder crack resistance,
The reliability of a semiconductor device sealed using this epoxy resin composition can be improved.

[Brief description of the drawings]

FIG. 1 is a lead frame used in Examples 1 to 4.

FIG. 2 is a schematic diagram of a method of measuring an adhesive strength by a drawing method.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4J002 CC032 CD031 CD041 CD051 CD071 CD121 DA017 DE077 DE147 DE237 DF017 DJ007 DJ017 DJ037 DJ047 EN106 EU096 EU116 EW016 FD017 FD142 FD156 GQ05 4M109 EA03 EB03 EB04 EB10 EB07 EB07 EB07 EB07 EB07 EB07

Claims (5)

[Claims] 1. An epoxy resin composition comprising 1) an epoxy resin, 2) a curing agent, 3) a curing accelerator if necessary, and 4) an inorganic filler, and a lead frame having a palladium-plated surface. When the content of the inorganic filler is 75% by weight, the adhesive strength by the pull-out method is 250 g / mm.
² or more epoxy resin compositions for semiconductor encapsulation. 2. The epoxy resin composition according to claim 1, wherein the epoxy resin and the curing agent have a softening point or a melting point of 45 ° C. or higher. 3. The content of the inorganic filler is 78 to 92% by weight.
The epoxy resin composition according to claim 1, wherein 4. The epoxy resin composition according to claim 1, wherein the lead frame used for sealing the semiconductor is a copper frame having an outermost layer plated with palladium. 5. A semiconductor device encapsulated with the epoxy resin composition according to claim 1.