JP2000006076A - Semiconductor chip transfer device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a chip attracted to an attracting nozzle from being damaged as a result of the chip sliding on the front end of the attracting nozzle when the position of the chip is regulated. SOLUTION: This transfer device is provided with an attracting nozzle 1 attractively-attracting a semiconductor chip at its front end, a pair of position regulating claws 19a, 19b which sandwich the semiconductor chip attracted to the attracted nozzle 1 to regulate the position of the semiconductor chip. The pair of position regulating claws 19a, 19b (not illustrated) which have an equivalent structure to that of each other respectively are mounted in the orthogonal direction to the position regulating claws 19a, 19b. After the attracting nozzle 1 attracts and holds the semiconductor chip, attractive is lowered when the two pairs of position regulating claws sandwich the semiconductor chip from the orthogonal direction. The semiconductor chip, while being attracted by the attracting nozzle 1, is slid against the adsorbing nozzle 1 by the two pairs of position regulating claws, thus it is possible to regulate the position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip transfer apparatus for holding a semiconductor chip and transferring it to a predetermined position on a circuit board or the like in order to manufacture an electronic component or the like having the semiconductor chip mounted thereon.

[0002]

2. Description of the Related Art Conventionally, a semiconductor chip transfer device having a vacuum suction nozzle has been used to transfer a semiconductor chip (hereinafter, appropriately referred to as "chip") as a microelectronic component to a predetermined position in an electronic circuit or the like. Have been. According to this semiconductor chip transfer device, the chip is sucked and held at the tip of the suction nozzle. However, there is a possibility that the chip holding position of the suction nozzle is shifted and the chip is not accurately transferred to a predetermined position.

Therefore, there has been known a semiconductor chip transfer apparatus having two pairs of position determining claws for sandwiching a chip from a direction orthogonal to the suction nozzle (for example, Japanese Patent Publication No. 62-107).
No. 93, Japanese Patent Publication No. 3-15359). According to this semiconductor chip transfer device, when the holding position of the chip by the suction nozzle is shifted, the chip is sandwiched from two orthogonal directions by two pairs of position adjusting claws and the position is adjusted. Therefore, the chip can be accurately transferred to a predetermined position. However, the chip is sucked by the suction nozzle with a strong suction force so as not to fall, and if the position of the chip is fixed as it is, the chip slides against the tip of the suction nozzle against a large frictional force May be damaged.

[0004]

SUMMARY OF THE INVENTION In view of this background, the present invention prevents a chip sucked by a suction nozzle from sliding and damaging the tip of the suction nozzle when its position is regulated. It is an object of the present invention to provide a semiconductor chip transfer device capable of performing the above.

[0005]

According to a first aspect of the present invention, there is provided a semiconductor chip transfer apparatus for sucking a semiconductor chip at a tip thereof with a variable suction force, and a suction nozzle attached to the suction nozzle. A semiconductor chip transfer device having two pairs of position setting claws for setting the position of the semiconductor chip by sandwiching the set semiconductor chip from a direction orthogonal to the semiconductor chip,
The suction nozzle sucks and holds the semiconductor chip, and then slides with respect to the suction nozzle while sucking the semiconductor chip by reducing the suction force when the two pairs of position determining claws sandwich the semiconductor chip. Is characterized.

[0006] According to the semiconductor chip transfer device of the first aspect, the chip is first suction-held by the suction nozzle, and subsequently, the suction force of the suction nozzle is reduced, and then the chip is sandwiched by two pairs of position determining claws. When the holding position of the chip by the suction nozzle is deviated, the chip is pushed by one of the two pairs of positioning claw while being sucked by the suction nozzle. Then, the tip gradually slides against the tip of the suction nozzle,
When the position is fixed, the pair of position setting claws are sandwiched from directions orthogonal to each other. As described above, the chip suction force of the suction nozzle is reduced, and the chip position is determined after the frictional force between the chip and the tip of the suction nozzle is reduced by the suction force. Therefore, it is possible to prevent the chip from sliding and being damaged against the suction nozzle against a large frictional force due to the strong suction force. It should be noted that even if the suction force is reduced, the suction force is sufficient to be able to suck the chip, and the chip is prevented from dropping from the tip of the suction nozzle.

According to a second aspect of the present invention, there is provided a semiconductor chip transfer device for sucking a semiconductor chip at a tip thereof with a variable suction force, and orthogonally intersecting the semiconductor chip sucked by the suction nozzle. A semiconductor chip transfer device having two pairs of position adjusting claws for adjusting the position of the semiconductor chip sandwiched from the direction in which the semiconductor chip is to be held. Until the semiconductor chip is sandwiched, the semiconductor chip sucks the semiconductor chip with a suction force capable of stopping with respect to the suction nozzle, and the two pairs of position determining claws stop sucking the semiconductor chip after sandwiching the semiconductor chip. And the position is regulated.

According to the semiconductor chip transfer device of the second aspect, the chip is first suction-held by the suction nozzle, and is then sandwiched by two pairs of position determining claws from a direction perpendicular to the chip.
When the chip is sandwiched between the two pairs of positioning claw, even if the holding position of the chip by the suction nozzle is shifted, the chip is sucked by the suction nozzle and is stationary with respect to the suction nozzle. Then, the suction of the suction nozzle is stopped after the chip is caught by the positioning claw, and the chip is gradually slid with respect to the tip of the suction nozzle to correct its position. As described above, the suction of the chip by the suction nozzle is stopped, and the position of the chip is determined after the frictional force between the chip and the tip of the suction nozzle due to the suction force is reduced. Therefore, it is possible to prevent the tip from being damaged by sliding against the tip of the suction nozzle against the large frictional force due to the strong suction force when the position of the tip is corrected. Since the suction is stopped after the chip is sandwiched and held by the positioning claw, the chip is prevented from dropping from the tip of the suction nozzle.

In the above two aspects, it is preferable that the tip of the suction nozzle is formed of a soft resin. In this case, since the frictional force applied to the chip from the tip of the suction nozzle is reduced by the elastic deformation of the soft resin, the chip can be more reliably prevented from being damaged when the chip slides to the tip of the suction nozzle.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a semiconductor chip transfer device according to the present invention will be described with reference to the drawings. FIG. 1 is an explanatory configuration diagram of the semiconductor chip transfer device of the present embodiment as viewed from the front, and FIG. 2 is an explanatory configuration diagram of a main part of the semiconductor chip transfer device of the present embodiment as viewed from the side. FIG. 3 is an explanatory view of the operation of the semiconductor chip transfer device of the present embodiment, FIG. 4 is an explanatory view of the positioning of the chip of the first embodiment, and FIG. 5 is a chip of the second embodiment. It is explanatory drawing about position regulation of (1).

The configuration of the semiconductor chip transfer device of the present embodiment will be described with reference to FIGS. As shown in FIG. 1, the semiconductor chip transfer device is provided with a substantially cylindrical suction nozzle 1 as shown in FIG.
Consists of an outer cylinder 2 and an inner cylinder 3 projecting up and down from the inside of the outer cylinder 2. The upper end of the inner cylinder 3 is connected to a suction means (not shown) capable of changing the suction force. A substantially cylindrical rubber member (soft member) 4 is provided at the lower end of the inner cylinder 3 (the end of the suction nozzle 1). Note that, instead of the rubber member 4, the tip portion of the suction nozzle 1 may be formed of another soft member such as a synthetic resin that does not easily damage the chip.

The suction nozzle 1 is axially slidably inserted into a fixed cylinder 5 externally inserted into the suction nozzle 1, and the fixed cylinder 5 is provided with a U-shaped member 7 through a bearing 6.
It is supported by. The upper end of the outer cylinder 2 is supported by an elevating member 9 via a bearing 8, and the elevating member 9 is a ball screw 1
0, and the ball screw 10 is rotatably provided on the U-shaped member 7 via a bearing. Ball screw 10
Is rotated by a motor (not shown) connected to a belt 12 via a belt 12 wound on a pulley 11,
Thus, the suction nozzle 1 is moved up and down together with the elevating member 9. The U-shaped member 7 is swingably provided so that the suction nozzle 1 can move with respect to the arm tip 13 moved by operation of a controller (not shown). The suction nozzle 1 and the fixed cylinder 5 are integrally rotated by a rotating means (not shown).

A peripheral portion 14 is provided on the middle part of the fixed cylinder 5 so as to protrude in the radial direction. A substantially cylindrical first slide member 1 slidable with respect to the fixed cylinder 5 below the peripheral edge portion 14
5 is provided, and a substantially cylindrical second slide member 16 is provided so as to be slidable with respect to the first slide member 15.
An inner portion is provided between the peripheral portion 14 of the fixed cylinder 5 and a step portion provided by increasing the diameter of the upper inner peripheral wall of the first slide member 15, and between the peripheral portion 14 and an upper end portion of the second slide member 16. A first spring 17 and a second spring 18 are interposed in this order.

Below the first slide member 15, a pair of positioning pawls 19a, 19b are provided so as to be swingable with reference to supporting shafts 20a, 20b provided at the lower end of the fixed cylinder 4. The pair of positioning nails 19a and 19b are
When the a and 21b are in contact with the outer peripheral side wall of the outer cylinder 2, the claw portions 22a and 22b are separated from each other against the urging force of the first spring 17 via the first slide member 15, so that a C-shape is formed. It is spread and held. Further, as will be described later, when the convex portions 21a and 21b fit into the reduced diameter portion 23 formed by gradually reducing the diameter at the lower end portion of the outer cylinder 2, a pair of positioning claw 19a,
19b are the claw portions 22a, 22b by the urging force of the first spring 17.
b closes.

As shown in FIG. 2, the second slide member 16
A pair of position setting claws 19c, 19d are provided below the support shafts 20c, 20d provided at the lower end of the fixed cylinder 5 as a reference.
The pair of positioning pawls 19a and 19b are provided so as to be swingable in a straight line. When the projections 21c and 21d are in contact with the outer peripheral side wall of the outer cylinder 2, the pair of positioning claw 19c and 19d resist the urging force of the second spring 18 via the second slide member 16. The portions 22c and 22d are separated from each other and are spread and held in a C shape. When the convex portions 21c and 21d fit into the reduced diameter portion 23 as described later, the pair of position setting claws 19c and 19d close the claw portions 22c and 22d by the urging force of the second spring 18.

The operation of the semiconductor chip transfer device having the above configuration will be described with reference to FIG. First, the arm tip 13 is moved by operating a controller (not shown), the U-shaped member 7 is swung, and the suction nozzle 1 is moved to match the position of the chip 24. Subsequently, the lifting member 9 is lowered by rotating the ball screw 10, the suction nozzle 1 is lowered, and the tip thereof is brought into contact with the chip 24. Then, the suction means (not shown) is operated to suck the chip 24 at the tip of the suction nozzle 1, and the ball screw 10 is rotated in the reverse direction to raise the suction nozzle 1 and pick up the chip 24 (FIG. 3).
(A)).

When the suction nozzle 1 is further raised, the projections 21a and 21b of the pair of positioning claw 19a and 19b are
Is fitted into the reduced diameter portion 23 while slidingly contacting the outer peripheral side wall. A pair of position setting claws 19a, 19 is urged by the first spring 17.
b are substantially parallel, and the claw portions 22a and 22b
4 is pinched (FIG. 3B). At this time, although not shown, the pair of position setting claws 19c and 19d are also substantially parallel similarly, and the chip 24 is also held by the claw portions 22c and 22d.

The tip portion 13 sucked by the suction nozzle 1 is moved by moving the arm tip portion 13 and swinging the U-shaped member 7.
Is moved onto the lead frame 25. Further, by rotating the fixed cylinder 5 integrally with the suction nozzle 1 by a rotating means (not shown) with respect to the U-shaped member 7, the chip 24 sandwiched between the four positioning claws 19 a to 19 d is attached to the lead frame 25. And rotate it. Thereafter, when the suction nozzle 1 is lowered, the convex portions 21a and 21b of the pair of position determining claws 19a and 19b are disengaged from the reduced diameter portion 23 of the outer cylinder 2, and the urging force of the first spring 17 is applied. It expands into a character shape. At this time, the pair of position determining claws 19c and 19d also spread in a C shape, and the tip 24 is opened. Then, the operation of the suction means is stopped, and the chip 24 is separated from the tip of the suction nozzle 1 and placed on the lead frame 25 (FIG. 3C).

With the semiconductor chip transfer device having the above configuration,
The manner in which the position of the chip 24 sucked by the suction nozzle 1 is regulated will be described. There are two embodiments described below for positioning the chip 24, each of which will be described with reference to FIGS. In the drawing, white arrows indicate the suction force of the suction nozzle 1, and a change in the length indicates a change in the strength of the suction force.

In the position adjustment of the chip 24 of the first embodiment, it is assumed that the holding position of the chip 24 by the suction nozzle 1 is shifted from the regular position shown by the dotted line in the drawing toward the position setting claw 19b (FIG. 4 ( a)). At this time, the suction force of the suction nozzle 1 is sufficiently strong to surely prevent the chip 24 from dropping. Subsequently, when the suction nozzle 1 is raised, as described above, the pair of positioning claw 19a, 19b is closed in the diagonal arrow direction, and one of the positioning claw 19b first contacts the chip 24 (FIG. 4 (b)). )). At this time, the suction force of the suction nozzle 1 is reduced, and the tip 24 gradually slides with respect to the tip of the suction nozzle while sliding in the black arrow direction (FIG. 4C). When the position of the tip 24 is set, the tip 24 is held between the pair of position setting claws 19a and 19b.
4 so that it can be reliably prevented from falling (FIG. 4
(D)). Although not shown, a pair of positioning claw 19a, 1
In parallel with the positioning of the chip 24 by 9b, the positioning of the chip 24 by the pair of positioning nails 19c and 19d is performed in the same manner.

By regulating the position as described above, the chip 24 can be accurately transferred to a predetermined position. Also,
When the chip 24 moves with respect to the suction nozzle 1, the suction force is reduced, and the chip 24 and the suction nozzle 1 due to the suction force are reduced.
And the frictional force between them is reduced. Therefore, it is possible to prevent the chip 24 from sliding and being damaged with respect to the suction nozzle 1 against a large frictional force due to a strong suction force. It should be noted that the chip 24 has a suction force enough to suck the chip 24 when the suction force is reduced, thereby preventing the chip 24 from dropping from the tip of the suction nozzle 1.

With respect to the positioning of the chip 24 in the second embodiment, the holding position of the chip 24 by the suction nozzle 1 is changed from the regular position shown by the dotted line in the drawing to the positioning claw 19 in the same manner as above.
It is assumed that it is shifted to the b side (FIG. 5A). At this time, the suction force of the suction nozzle 1 is sufficiently strong to surely prevent the chip 24 from dropping. Subsequently, when the suction nozzle 1 is lifted, the pair of positioning claw 19a, 19b is closed in the diagonal arrow direction, and the tip 24 is held and held (FIG. 5).
(B)). At this time, the tip 24 is sucked by the suction nozzle 1 with a suction force that can be stopped, and the positioning claw 19 a
Suction nozzle 1 even if it is pushed in the diagonal arrow direction
Remains stationary against the tip of the. And chip 2
Suction of the suction nozzle 1 is stopped after 4 is sandwiched between the positioning nails 19a to 19d. Thereby, the frictional force between the tip 1 and the tip of the suction nozzle 24 is erased, and the tip 24 slides in the direction of the black arrow with respect to the tip of the suction nozzle 1 (FIG. 5).
(C)). Then, the position of the chip 24 is regulated, and the suction force of the suction nozzle 1 is increased so as to reliably prevent the chip 24 from dropping (FIG. 5D). Although not shown, 1
In parallel with the positioning of the chip 24 by the pair of positioning nails 19a, 19b, the positioning of the chip 24 by the pair of positioning nails 19c, 19d is performed in the same manner.

By regulating the position as described above, the chip 24 can be accurately transferred to a predetermined position. Also,
The position of the chip 24 is adjusted in a state where the suction is stopped and the frictional force between the chip 24 and the suction nozzle 1 due to the suction force is eliminated. Therefore, it is possible to prevent the chip 24 from sliding and being damaged with respect to the suction nozzle 1 against a large frictional force due to a strong suction force. Since the suction of the suction nozzle 1 is stopped after the chip 24 is sandwiched and held by the positioning claws 19a to 19d, the chip 24 is prevented from dropping from the tip of the suction nozzle 1.

[Brief description of the drawings]

FIG. 1 is an explanatory configuration diagram of a semiconductor chip transfer device according to an embodiment viewed from the front;

FIG. 2 is an explanatory configuration diagram of a main part of the semiconductor chip transfer device according to the present embodiment viewed from a side;

FIG. 3 is an explanatory diagram of an operation of the semiconductor chip transfer device according to the embodiment;

FIG. 4 is an explanatory diagram of position adjustment of the chip according to the first embodiment;

FIG. 5 is an explanatory diagram of positioning of a chip according to a second embodiment.

[Explanation of symbols]

1 ‥ suction nozzle, 4 ‥ rubber member (soft member), 19a ~
19d positioning claw, 24 semiconductor chip

Claims (3)

[Claims] 1. A suction nozzle for adsorbing a semiconductor chip with a variable suction force at a tip thereof, and two pairs of position adjusting claws for adjusting the position of the semiconductor chip by interposing the semiconductor chip adsorbed by the suction nozzle from an orthogonal direction. The suction nozzle holds the semiconductor chip by suction, and reduces the suction force when the two pairs of positioning claw sandwich the semiconductor chip to suck the semiconductor chip. A semiconductor chip transfer device, wherein the position is regulated by sliding the suction nozzle with respect to the suction nozzle. 2. A suction nozzle which variably sucks a semiconductor chip at a tip thereof, and two pairs of position setting claws which pinch the semiconductor chip sucked by the suction nozzle from a direction perpendicular to the semiconductor chip and adjust the position of the semiconductor chip. A semiconductor chip transfer device comprising: a suction nozzle that suction-holds a semiconductor chip, and the semiconductor chip can be stopped with respect to the suction nozzle until the two pairs of position determining claws sandwich the semiconductor chip; A semiconductor chip transfer device, wherein the semiconductor chip is sucked by an attraction force, and after the two pairs of position adjusting claws sandwich the semiconductor chip, the suction of the semiconductor chip is stopped to adjust the position. 3. The semiconductor chip transfer device according to claim 1, wherein a tip portion of said suction nozzle is formed of a soft resin.