JP2000005713A - Treatment of work and apparatus therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To decrease a required amt. of washing liquid and to shorten the replacement time of the washing liquid by supplying a first washing liquid to a washing tank, washing works, supplying a second washing liquid into the washing tank to replace the washing liquid and discharging the residual liquid of a first supply piping and drain pipe, then washing the works by the second washing liquid. SOLUTION: A first washing liquid is supplied into a washing tank 1 and a semiconductor wafer carrying in and out device is actuated to carry semiconductor wafers 16 into a housing space. While the first washing liquid is supplied to the washing tank 1 and is made to flow over therefrom, the semiconductor wafers 16 are washed. Next, a second washing liquid is supplied to the washing tank 1 to allow the first washing liquid to flow over therefrom, by which the replacement of the washing liquid in the washing tank 1 is executed. A residual liquid on the upstream side of a juncture of a second supply piping 11 on the downstream side of a first supply piping 5 is discharged to a waste liquid tank 14 and the waste liquid of the drain pipe 13 is discharged to the waste liquid tank 15. The semiconductor wafers 16 are washed upon completion of the discharge while the second washing liquid is supplied to the washing tank 1 and is made to flow over therefrom.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for treating an object to be treated, and more particularly, to a method for sequentially supplying a plurality of types of treatment liquids while accommodating the object to be treated in one treatment tank. The present invention relates to a method and an apparatus for processing an object.

[0002]

2. Description of the Related Art Conventionally, there has been proposed a semiconductor wafer cleaning apparatus for sequentially supplying a plurality of types of cleaning liquids in a state where semiconductor wafers are accommodated in one cleaning tank to clean the semiconductor wafers (Japanese Patent Laid-Open Publication No. Hei 6 (1994)). -208984).

In this semiconductor wafer cleaning apparatus, a plurality of cleaning liquids are sequentially supplied to a cleaning tank having a cleaning liquid supply member and a rectifying member at a lower portion and a semiconductor wafer accommodating space at an upper portion through a pipe having a valve interposed therebetween. The cleaning liquid in the cleaning tank is discharged through a drain pipe having a valve interposed therebetween.

Accordingly, a semiconductor wafer is cleaned by supplying one cleaning liquid (eg, a cleaning agent) into the cleaning tank, and then another cleaning liquid (eg, pure water) is supplied into the cleaning tank. Then, the first cleaning liquid is replaced with the other cleaning liquid, and thereafter, the semiconductor wafer can be cleaned with the other cleaning liquid.

[0005]

When the semiconductor wafer cleaning apparatus having the above structure is adopted, when one cleaning liquid is replaced with another cleaning liquid, the cleaning liquid in a portion of the drain pipe upstream of the valve is removed. Is not smoothly replaced, and as a result, the first cleaning liquid remains to some extent in the portion of the drain pipe. Further, since the pipe for supplying one cleaning liquid to the cleaning tank and the pipe for supplying another cleaning liquid to the cleaning tank have a common part and a non-common part, the cleaning liquid is exchanged in the non-common part. Is not performed smoothly, and as a result, the first cleaning liquid remains in the non-shared portion to some extent.

If the semiconductor wafer is cleaned with the other cleaning liquid while the first cleaning liquid remains to some extent, the first cleaning liquid is mixed into the other cleaning liquid. Therefore, in order to prevent the occurrence of such an inconvenience, the residual amount of the cleaning liquid in the above item 1 is reduced to 0.
The replacement of the cleaning liquid must be performed until the required amount of the other cleaning liquid is significantly increased, and the required replacement time of the cleaning liquid is significantly increased. It becomes extremely long.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and can reduce a required amount of a processing solution.
An object of the present invention is to provide a method and an apparatus for treating an object, which can reduce the time required for replacing the processing solution and, consequently, the time required for processing the object.

[0008]

According to a first aspect of the present invention, there is provided a method for processing an object to be processed, wherein a first valve is interposed in a middle of a first supply pipe for supplying a first processing solution into a processing tank. The supply pipe is connected to the first discharge pipe with the second valve interposed, the drain pipe opening provided at a predetermined position in the processing tank is connected to the third valve, and another processing liquid is supplied into the processing tank. Supply pipe with a fourth valve interposed therebetween is connected to a predetermined position on the downstream side of the first supply pipe, and the first processing liquid is supplied to the processing tank to process the object to be processed. In performing the processing of the object to be processed by replacing the processing liquid with the other processing liquid, the first valve is closed and the fourth valve is opened, and the other processing liquid is used for the downstream side of the first supply pipe. After filling the downstream side from the connection position of the second supply pipe, the first valve is operated to operate the downstream side of the first supply pipe. Of the first supply pipe is connected to the first discharge pipe at the upstream side of the second supply pipe connection position, the second valve is opened, and the downstream side of the first supply pipe is located upstream of the second supply pipe connection position. The remaining liquid of the first processing liquid is removed by the other processing liquid, and after completely discharging the remaining liquid, the second valve is closed, and the second supply pipe is located on the downstream side of the first supply pipe from the second supply pipe connection position. After the other processing liquid flowing into the processing tank via the downstream side accumulates above the opening of the drain pipe, the third valve is opened to discharge the remaining liquid of the first processing liquid in the drain pipe. This is a method in which, after completely draining and closing the third valve, the other processing liquid is continuously supplied into the processing tank to process the object to be processed.

According to a second aspect of the present invention, there is provided an apparatus for processing an object to be processed, wherein a first valve is interposed in the middle of a first supply pipe for supplying a first processing liquid into a processing tank, and the second supply pipe is connected to a second supply pipe. A drain pipe opening provided at a predetermined position in the processing tank connected to a first discharge pipe with a valve interposed is connected to a third valve to supply another processing liquid into the processing tank. A second supply pipe with a fourth valve interposed is connected to a predetermined position on the downstream side of the first supply pipe, and the first processing liquid is supplied to the processing tank to perform processing on the object to be processed. In performing the processing of the object to be processed by replacing the processing liquid with the other processing liquid, the first processing liquid is used.
The valve is closed and the fourth valve is opened to fill the downstream side of the first supply pipe with the other processing liquid downstream of the second supply pipe connection position, and then the first valve is operated to operate the first supply pipe. In the downstream side of the supply pipe, the upstream side of the second supply pipe connection position is communicated with the first discharge pipe, the second valve is opened, and the second supply pipe connection position of the downstream side of the first supply pipe is opened. A first valve control means for closing the second valve after completely removing the remaining liquid of the first processing liquid existing on the upstream side with the other processing liquid and discharging the remaining liquid; and a downstream of the first supply pipe. After the other processing liquid flowing into the processing tank through the downstream side of the second supply pipe connection position on the side of the second processing pipe accumulates above the drain pipe opening, the third valve is opened to open the first processing liquid in the drain pipe. Is discharged, and after the remaining liquid is completely drained and after the third bath. Close Bed, in which the other processing liquid was continuously fed into the processing tank and a second valve control means for processing the object to be processed.

[0010]

According to the object processing method of the first aspect, a plurality of types of processing liquids are sequentially supplied in a state where the object is accommodated in one processing tank to process the object. (1) connecting a first supply pipe to a first discharge pipe via a second valve via a first valve at an intermediate portion of a first supply pipe for supplying the processing liquid into the processing tank; The drain pipe opening provided at a predetermined position is connected to a third valve, and a second supply pipe interposed with a fourth valve for supplying another processing liquid into the processing tank is downstream of the first supply pipe. After being connected to a predetermined position, the first processing liquid is supplied to the processing tank to process the object, and then the first processing liquid is replaced with the other processing liquid to perform the processing of the object. At the same time, the first valve is closed and the fourth valve is opened, and the other processing liquid is used to seal the downstream side of the first supply pipe. After filling the downstream side of the second supply pipe connected position, the upstream side of the second supply pipe connecting position of the downstream side of the first supply pipe by operating the first valve first
While communicating with the discharge pipe, the second valve is opened, and the remaining liquid of the first processing liquid existing upstream of the second supply pipe connection position on the downstream side of the first supply pipe is replaced with the other processing liquid. After the remaining liquid is completely discharged, the second valve is closed after the remaining liquid is completely discharged, and another processing liquid flowing into the processing tank via the downstream side of the first supply pipe from the position where the second supply pipe is connected is located. After accumulating above the drain pipe opening, the third valve is opened to discharge the residual liquid of the first processing liquid in the drain pipe, and after the residual liquid is completely discharged and the third valve is closed, Since the processing of the object is performed by continuously supplying the other processing liquid into the processing tank, the first processing liquid is converted to the other processing liquid by performing the valve operation as described above. The process for completely replacing can be smoothed, and the other processes It is possible to reduce the required amount, it is possible to shorten the time required for replacement, it is possible to shorten the processing time required for the entire turn.

In the object processing apparatus according to claim 2, 1
A first supply pipe for supplying a first processing liquid into the processing tanks in order to sequentially supply a plurality of types of processing liquids in a state where the processing objects are accommodated in one processing tank and to process the processing objects. The first supply pipe is connected to the first discharge pipe via the second valve with the first valve interposed therebetween, and the drain pipe opening provided at a predetermined position in the processing tank is connected to the third valve. A second supply pipe, which is connected and has a fourth valve for supplying another treatment liquid into the treatment tank, is connected to a predetermined position downstream of the first supply pipe.

Then, after the first processing liquid is supplied to the processing tank to process the object, the first processing liquid is replaced with the other processing liquid and the processing of the object is performed. , First
The valve control means closes the first valve and opens the fourth valve to fill the downstream side of the first supply pipe with the other processing liquid downstream of the second supply pipe connection position. By operating the valve, the upstream side of the second supply pipe connection position on the downstream side of the first supply pipe and the first discharge pipe are communicated, and the second valve is opened to open the second supply pipe on the downstream side of the first supply pipe. Removing the remaining liquid of the first processing liquid existing upstream from the second supply pipe connection position with the other processing liquid;
After completely draining this residual liquid, the second valve is closed and the second valve is closed.
After the other processing liquid flowing into the processing tank through the downstream side of the first supply pipe and downstream of the second supply pipe connection position by the valve control means accumulates above the drain pipe opening, the third valve To drain the residual liquid of the first processing liquid in the drain pipe, and after completely draining the residual liquid, and
The object can be processed by closing the valve and continuously supplying the other processing liquid into the processing tank.

Therefore, by performing the valve operation as described above, the processing for completely replacing the first processing liquid with the other processing liquid can be smoothed,
The required amount of the other processing liquid can be reduced, and the time required for replacement can be reduced, and thus the processing time required as a whole can be reduced.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a method and an apparatus for treating an object according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a schematic view showing a semiconductor wafer cleaning apparatus according to an embodiment of the object processing apparatus of the present invention.

In this semiconductor wafer cleaning apparatus, a cleaning liquid supply member 2 is provided at a predetermined position at the bottom of a cleaning tank 1 having a tapered bottom wall, and a rectifying member 3 is provided at a predetermined position above the cleaning liquid supply member 2. To form a semiconductor wafer accommodation space. Then, a first supply pipe 5 for supplying the first cleaning liquid from the first cleaning liquid tank 4 to the cleaning liquid supply member 2.
A three-way valve (first valve) 6 is provided at a predetermined position, and a first valve 6 having a second valve 7 interposed with respect to the three-way valve 6.
The discharge pipe 8 is connected. Further, a second supply pipe 11 having a fourth valve 10 interposed between a second cleaning liquid tank 9 containing the second cleaning liquid and a predetermined position downstream of the three-way valve 6 of the first supply pipe 5 is provided. Connected. further,
A drain pipe (second pipe) with a third valve 12 interposed between the drain pipe opening formed at the lowest point of the bottom wall of the cleaning tank 1.
(Discharge pipe) 13.

The first discharge pipe 8 and the drain pipe 13 are
They are connected to waste liquid tanks 14 and 15, respectively. In addition, a pipe or the like (not shown) for collecting the cleaning liquid overflowing from the cleaning tank 1 is provided. Arrows indicate the flow of the cleaning liquid.

FIG. 2 is a flow chart for explaining the main part of the processing of the semiconductor wafer cleaning apparatus of FIG. 1 (including the processing of the first valve control means and the second valve control means).

In step SP1, the three-way valve 6 is operated to enable the first cleaning liquid to be supplied from the first cleaning liquid tank 4 to the cleaning liquid supply member 2. Further, the second valve 7, the third valve 12, and the fourth valve 10 Is closed, the first cleaning liquid is supplied to the cleaning tank 1, and in step SP2, a semiconductor wafer loading / unloading device (not shown) is operated to load the semiconductor wafer 16 into the semiconductor wafer accommodating space.
In step SP3, the semiconductor wafer 16 is washed while overflowing from above the washing tank 1 while supplying the first washing liquid to the washing tank 1 (perform overflow washing).

Next, in step SP4, the three-way valve 6 is operated to connect the downstream side of the first supply pipe 5 with the first discharge pipe 8, and the fourth valve 10 is opened to wash the second cleaning liquid. The first cleaning liquid is supplied to the tank 1 and the first cleaning liquid is pushed out of the cleaning tank 1 (overflow), thereby replacing the cleaning liquid in the cleaning tank 1. In step SP5, the second valve 7 and the third valve 12 are replaced.
To discharge the residual liquid upstream of the connection of the second supply pipe 11 to the waste liquid tank 14 and to discharge the residual liquid in the drain pipe 13 to the waste liquid tank 15 on the downstream side of the first supply pipe 5. After the discharge of the remaining liquid is completed, the second valve 7 and the third valve 12 are closed in step SP6, and the second cleaning liquid is supplied to the cleaning tank 1 while supplying the second cleaning liquid to the cleaning tank 1 in step SP7. The semiconductor wafer 16 is cleaned while overflowing from above (performs overflow cleaning), and a series of processing is terminated as it is.

By performing the above series of processes, after replacing the cleaning liquid in the cleaning tank 1 or simultaneously,
Since the remaining liquid is discharged by opening the second valve 7 and the third valve 12, it is possible to achieve a complete replacement of the cleaning liquid in a short time, and to reduce the required amount of the second cleaning liquid. As a result, the time required for cleaning the semiconductor wafer 16 can be reduced.

FIG. 3 is a schematic view showing a semiconductor wafer cleaning apparatus according to another embodiment of the object processing apparatus of the present invention.

This semiconductor wafer cleaning apparatus is different from the semiconductor wafer cleaning apparatus shown in FIG. 1 in that a drain pipe opening is formed at the lowermost end of the side wall of the cleaning tank 1, and a third valve 12 is provided for the drain pipe opening. Only at the point where the drain pipe 13 is connected.

Therefore, even when this embodiment is adopted, the same operation as that of the above embodiment can be achieved.

FIG. 4 is a schematic view showing a semiconductor wafer cleaning apparatus according to still another embodiment of the object processing apparatus of the present invention.

This semiconductor wafer cleaning apparatus is different from the semiconductor wafer cleaning apparatus of FIG. 1 in that a drain pipe opening is formed at the lowermost end of the side wall of the cleaning tank 1, and a third pipe is formed directly on the drain pipe opening. It is only the point where the valve 12 is connected.

Therefore, even when this embodiment is adopted, since the residual liquid is generated at the drain pipe opening and the third valve 12, the same operation as the above-mentioned embodiment can be achieved.

Although only the semiconductor wafer cleaning method and its apparatus have been described above, the present invention can be applied to an object to be cleaned other than a semiconductor wafer, and a plurality of types of processing liquids are sequentially supplied to a processing tank. It is also possible to perform processing on the object to be processed, and it is also possible to make various design changes within a range that does not change the gist of the present invention.

[0029]

According to the first aspect of the present invention, the processing for completely replacing the first processing liquid with the other processing liquid can be performed smoothly, and the required amount of the other processing liquid can be reduced. As a result, it is possible to reduce the time required for the replacement, and thereby to shorten the time required for the processing as a whole.

According to the second aspect of the present invention, the process for completely replacing the first processing solution with the other processing solution can be smoothly performed, and the required amount of the other processing solution can be reduced. In addition, it is possible to shorten the time required for the replacement, and thus to shorten the time required for the processing as a whole.

[Brief description of the drawings]

FIG. 1 is a schematic view showing a semiconductor wafer cleaning apparatus according to one embodiment of an object processing apparatus of the present invention.

FIG. 2 is a flowchart illustrating a main part of a process of the semiconductor wafer cleaning apparatus of FIG. 1;

FIG. 3 is a schematic diagram showing a semiconductor wafer cleaning apparatus according to another embodiment of the object processing apparatus of the present invention.

FIG. 4 is a schematic view showing a semiconductor wafer cleaning apparatus according to still another embodiment of the object processing apparatus of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Cleaning tank 5 1st supply pipe 6 3 way valve 7 2nd valve 8 1st discharge pipe 10 4th valve 11 2nd supply pipe 12 3rd valve 16 Semiconductor wafer

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Ki Kanan 1304, Kanaokacho, Sakai City, Osaka Prefecture Daikin Industries, Ltd.Kanaoka Plant (72) Inventor Masao Ono 1304, Kanaokacho, Sakai City, Osaka Daikin Industries Kanaoka Co., Ltd. F-term in the factory (reference) 3B201 AA03 BB03 BB22 BB95

Claims (2)

[Claims] 1. An object to be processed (1) is placed in one processing tank (1).
6) A method for processing a target object (16) by sequentially supplying a plurality of types of processing liquids in a state in which the first processing liquid is stored in the processing tank (1). The first supply pipe (5) is connected to the first discharge pipe (8) via the second valve (7) via a first valve (6) in the middle of the first supply pipe (5). The drain pipe opening provided at a predetermined position in the processing tank (1) is
A second supply pipe (11) connected to a valve (12) and interposing a fourth valve (10) for supplying another treatment liquid into the treatment tank (1) is connected to the first supply pipe (5). A first processing liquid is connected to a predetermined position on the downstream side, and the first processing liquid is supplied to the processing tank (1) to be processed (16).
After performing the process (1), the first valve (6) is closed and the fourth valve (10) is replaced in replacing the first processing solution with the other processing solution and processing the object (16). And filling the downstream side of the first supply pipe (5) from the connection position of the second supply pipe (11) with the other processing liquid, and then operating the first valve (6). In the downstream side of the first supply pipe (5), the first discharge pipe (8) communicates with the upstream side of the connection position of the second supply pipe (11), and the second valve (7) is opened. Of the downstream side of the supply pipe (5), the remaining liquid of the first processing liquid existing upstream of the connection position of the second supply pipe (11) is eliminated by the other processing liquid, and the remaining liquid is completely discharged. After that, the second valve (7) is closed, and the second supply pipe (1) on the downstream side of the first supply pipe (5) is closed.
1) After other processing liquid flowing into the processing tank (1) via the downstream side from the connection position accumulates above the drain pipe opening,
The third valve (12) is opened to discharge the residual liquid of the first processing liquid in the drain pipe (13), and after the residual liquid is completely discharged and the third valve (12) is closed, the processing is continued. A method for treating an object to be processed, characterized in that the object to be processed (16) is processed by continuously supplying the other processing liquid into the tank (1). 2. An object to be processed (1) is placed in one processing tank (1).
An object processing apparatus for processing an object to be processed by sequentially supplying a plurality of types of processing liquids in a state in which the first processing liquid is supplied into the processing tank. The first supply pipe (5) is connected to the first discharge pipe (8) via the second valve (7) via a first valve (6) in the middle of the first supply pipe (5). The drain pipe opening provided at a predetermined position of the processing tank (1) is
The second supply pipe (11) connected to the valve (12) and interposing a fourth valve (10) for supplying another processing liquid into the processing tank (1) is connected to the first supply pipe (5). ), Is connected to a predetermined position on the downstream side, and supplies the first processing liquid to the processing tank (1) to supply the first processing liquid to the processing object (16).
After performing the process (1), the first valve (6) is closed and the fourth valve (10) is replaced when the first processing solution is replaced with the other processing solution and the object (16) is processed. And filling the downstream side of the first supply pipe (5) with the other processing liquid downstream of the connection position of the second supply pipe (11), and then operating the first valve (6). In the downstream side of the first supply pipe (5), the first discharge pipe (8) communicates with the upstream side of the second supply pipe (11) connection position, and the second valve (7) is opened to open the first supply pipe. Of the downstream side of the supply pipe (5), the remaining liquid of the first processing liquid existing upstream of the connection position of the second supply pipe (11) is eliminated by the other processing liquid, and the remaining liquid is completely discharged. A first valve control means for closing the second valve (7) after the operation, and a second supply pipe on the downstream side of the first supply pipe (5). (1
1) After other processing liquid flowing into the processing tank (1) via the downstream side from the connection position accumulates above the drain pipe opening,
The third valve (12) is opened to discharge the residual liquid of the first processing liquid in the drain pipe (13), and after the residual liquid is completely discharged and the third valve (12) is closed, the processing tank (1) is closed. And a second valve control unit for continuously supplying the other processing liquid into the processing unit to process the processing target.