JP1762672S - 半導体パッケージ - Google Patents

半導体パッケージ

Info

Publication number
JP1762672S
JP1762672S JP2023002248F JP2023002248F JP1762672S JP 1762672 S JP1762672 S JP 1762672S JP 2023002248 F JP2023002248 F JP 2023002248F JP 2023002248 F JP2023002248 F JP 2023002248F JP 1762672 S JP1762672 S JP 1762672S
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JP
Japan
Prior art keywords
semiconductor package
package
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023002248F
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English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Application granted granted Critical
Publication of JP1762672S publication Critical patent/JP1762672S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2023002248F 2022-08-24 2023-02-08 半導体パッケージ Active JP1762672S (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US202229866001 2022-08-24

Publications (1)

Publication Number Publication Date
JP1762672S true JP1762672S (ja) 2024-01-31

Family

ID=89704413

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2023002248F Active JP1762672S (ja) 2022-08-24 2023-02-08 半導体パッケージ
JP2023022179F Active JP1766482S (ja) 2022-08-24 2023-02-08 半導体パッケージ
JP2023022178F Active JP1766481S (ja) 2022-08-24 2023-02-08 半導体パッケージ

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2023022179F Active JP1766482S (ja) 2022-08-24 2023-02-08 半導体パッケージ
JP2023022178F Active JP1766481S (ja) 2022-08-24 2023-02-08 半導体パッケージ

Country Status (1)

Country Link
JP (3) JP1762672S (ja)

Also Published As

Publication number Publication date
JP1766481S (ja) 2024-03-26
JP1766482S (ja) 2024-03-26

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