JP1762250S - Gripping machine for semiconductor wafer storage cassettes - Google Patents

Gripping machine for semiconductor wafer storage cassettes

Info

Publication number
JP1762250S
JP1762250S JP2023012779F JP2023012779F JP1762250S JP 1762250 S JP1762250 S JP 1762250S JP 2023012779 F JP2023012779 F JP 2023012779F JP 2023012779 F JP2023012779 F JP 2023012779F JP 1762250 S JP1762250 S JP 1762250S
Authority
JP
Japan
Prior art keywords
semiconductor wafer
wafer storage
storage cassettes
gripping machine
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023012779F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2023012779F priority Critical patent/JP1762250S/en
Priority to US29/918,288 priority patent/USD1036399S1/en
Application granted granted Critical
Publication of JP1762250S publication Critical patent/JP1762250S/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

本物品は、半導体ウエハ収納カセットを把持するために、ロボットアームの先端に取付けられて使用される半導体ウエハ収納カセット用把持機である。本物品は、対向配置された一対の第１アーム部および第２アーム部によって半導体ウエハ収納カセットを保持することにより、半導体ウエハ収納カセットを把持することができる。第２アーム部の第１アーム部に対向する領域には、距離計測機が固定されている。This article is a gripping machine for semiconductor wafer storage cassettes that is attached to the tip of a robot arm and used to grip semiconductor wafer storage cassettes. This article can grip the semiconductor wafer storage cassette by holding the semiconductor wafer storage cassette with a pair of first arm portions and second arm portions arranged opposite to each other. A distance measuring device is fixed to a region of the second arm portion facing the first arm portion.

JP2023012779F 2023-06-22 2023-06-22 Gripping machine for semiconductor wafer storage cassettes Active JP1762250S (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023012779F JP1762250S (en) 2023-06-22 2023-06-22 Gripping machine for semiconductor wafer storage cassettes
US29/918,288 USD1036399S1 (en) 2023-06-22 2023-11-27 Gripper for wafer cassette

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2023012779F JP1762250S (en) 2023-06-22 2023-06-22 Gripping machine for semiconductor wafer storage cassettes

Publications (1)

Publication Number Publication Date
JP1762250S true JP1762250S (en) 2024-01-25

Family

ID=89616384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023012779F Active JP1762250S (en) 2023-06-22 2023-06-22 Gripping machine for semiconductor wafer storage cassettes

Country Status (2)

Country Link
US (1) USD1036399S1 (en)
JP (1) JP1762250S (en)

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4770590A (en) * 1986-05-16 1988-09-13 Silicon Valley Group, Inc. Method and apparatus for transferring wafers between cassettes and a boat
US4892455A (en) * 1987-05-21 1990-01-09 Hine Derek L Wafer alignment and transport mechanism
US5102291A (en) * 1987-05-21 1992-04-07 Hine Design Inc. Method for transporting silicon wafers
KR0152324B1 (en) * 1994-12-06 1998-12-01 양승택 Semiconductor wafer carrier apparatus
JP3549141B2 (en) * 1997-04-21 2004-08-04 大日本スクリーン製造株式会社 Substrate processing device and substrate holding device
USD444157S1 (en) * 1998-07-14 2001-06-26 Bayer Corporation Gripper finger
US6256555B1 (en) * 1998-12-02 2001-07-03 Newport Corporation Robot arm with specimen edge gripping end effector
US6986636B2 (en) * 2000-06-09 2006-01-17 Brooks Automation, Inc. Device for positioning disk-shaped objects
US6468022B1 (en) * 2000-07-05 2002-10-22 Integrated Dynamics Engineering, Inc. Edge-gripping pre-aligner
FR2835337B1 (en) * 2002-01-29 2004-08-20 Recif Sa METHOD AND DEVICE FOR IDENTIFYING CHARACTERS REGISTERED ON A SEMICONDUCTOR PLATE HAVING AT LEAST ONE GUIDANCE MARK
US6769861B2 (en) * 2002-10-08 2004-08-03 Brooks Automation Inc. Apparatus for alignment and orientation of a wafer for processing
USD589912S1 (en) * 2007-06-06 2009-04-07 Tokyo Electron Limited Wafer holding member
USD589474S1 (en) * 2007-06-06 2009-03-31 Tokyo Electron Limited Wafer holding member
USD594424S1 (en) * 2007-07-12 2009-06-16 Hiwin Mikrosystem Corp. Wafer carrier
JP5823742B2 (en) * 2010-07-02 2015-11-25 芝浦メカトロニクス株式会社 Gripping device, transport device, processing device, and electronic device manufacturing method
USD674366S1 (en) * 2011-01-20 2013-01-15 Tokyo Electron Limited Wafer holding member
USD674761S1 (en) * 2011-10-20 2013-01-22 Tokyo Electron Limited Wafer holding member
JP6088243B2 (en) * 2012-12-28 2017-03-01 川崎重工業株式会社 End effector
US10249524B2 (en) * 2017-08-09 2019-04-02 Asm Ip Holding B.V. Cassette holder assembly for a substrate cassette and holding member for use in such assembly
USD911986S1 (en) * 2019-05-03 2021-03-02 Raytheon Company Handheld semiconductor wafer handling tool

Also Published As

Publication number Publication date
USD1036399S1 (en) 2024-07-23

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