JP1719744S - Adhesive tape material for manufacturing semiconductor devices - Google Patents
Adhesive tape material for manufacturing semiconductor devicesInfo
- Publication number
- JP1719744S JP1719744S JP2021022818F JP2021022818F JP1719744S JP 1719744 S JP1719744 S JP 1719744S JP 2021022818 F JP2021022818 F JP 2021022818F JP 2021022818 F JP2021022818 F JP 2021022818F JP 1719744 S JP1719744 S JP 1719744S
- Authority
- JP
- Japan
- Prior art keywords
- main body
- layer portion
- adhesive layer
- daf
- article
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000463 material Substances 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 239000002390 adhesive tape Substances 0.000 title abstract 2
- 239000012790 adhesive layer Substances 0.000 abstract 4
- 239000010410 layer Substances 0.000 abstract 4
- 238000010586 diagram Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Abstract
本物品は、半導体装置製造用粘着テープ材であり、ＰＥＴセパレータ部から本体部を取り外して用いるものである。本物品の本体部は、ＰＥＴセパレータ部から取り外すと、基材部及び粘着層部の撓みがなくなり、「本体部の底面図」に示すように、基材部及び粘着層部がまっすぐに伸びる。本物品の本体部は、「参考図」に示すように、半導体装置の製造に使用される支持片部を形成するために用いられるものであり、当該支持片部は、本体部の接着剤層部を「使用状態を示す参考図」に示すように切断して個片化したものである。本物品の接着剤層部は、ボトムＤＡＦ層部をトップＤＡＦ層部よりも厚く形成しているため、ボトムＤＡＦ層部にクッション性が生まれる。これにより、表面に段差のある基板に、支持片部を貼り付けた際、ボトムＤＡＦ層部が段差を埋めることができるため、安定感が得られる。This product is an adhesive tape material for manufacturing semiconductor devices, and is used by removing the main body from the PET separator. When the main body of the article is removed from the PET separator, the base material and the adhesive layer are no longer bent, and the base material and the adhesive layer extend straight as shown in the "bottom view of the main body". The main body of the article, as shown in the "reference drawing", is used to form a support piece used in the manufacture of a semiconductor device, and the support piece is an adhesive layer of the main body. The part is cut into individual pieces as shown in the "reference diagram showing the state of use". In the adhesive layer portion of the article, the bottom DAF layer portion is thicker than the top DAF layer portion, so that the bottom DAF layer portion has cushioning properties. As a result, when the support piece portion is attached to a substrate having a stepped surface, the bottom DAF layer portion can fill in the stepped portion, thereby providing a sense of stability.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021022818F JP1719744S (en) | 2021-10-20 | 2021-10-20 | Adhesive tape material for manufacturing semiconductor devices |
| TW111301764F TWD222970S (en) | 2021-10-20 | 2022-04-14 | Adhesive tape for manufacturing semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021022818F JP1719744S (en) | 2021-10-20 | 2021-10-20 | Adhesive tape material for manufacturing semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1719744S true JP1719744S (en) | 2022-07-14 |
Family
ID=82362132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021022818F Active JP1719744S (en) | 2021-10-20 | 2021-10-20 | Adhesive tape material for manufacturing semiconductor devices |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1719744S (en) |
| TW (1) | TWD222970S (en) |
-
2021
- 2021-10-20 JP JP2021022818F patent/JP1719744S/en active Active
-
2022
- 2022-04-14 TW TW111301764F patent/TWD222970S/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TWD222970S (en) | 2023-01-01 |
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