JP1700006S - - Google Patents

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Publication number
JP1700006S
JP1700006S JPD2021-4172F JP2021004172F JP1700006S JP 1700006 S JP1700006 S JP 1700006S JP 2021004172 F JP2021004172 F JP 2021004172F JP 1700006 S JP1700006 S JP 1700006S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2021-4172F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Application granted granted Critical
Publication of JP1700006S publication Critical patent/JP1700006S/ja
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Anticipated expiration legal-status Critical

Links

JPD2021-4172F 2021-02-23 2021-02-26 Active JP1700006S (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20210008923 2021-02-23

Publications (1)

Publication Number Publication Date
JP1700006S true JP1700006S (enExample) 2021-11-22

Family

ID=78604409

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2021-4172F Active JP1700006S (enExample) 2021-02-23 2021-02-26

Country Status (2)

Country Link
US (1) USD973030S1 (enExample)
JP (1) JP1700006S (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1712327S (ja) * 2021-06-18 2022-04-12 半導体素子

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD523403S1 (en) * 2004-09-09 2006-06-20 Kabushiki Kaisha Toshiba Substrate for a semiconductor device
JP2008066655A (ja) * 2006-09-11 2008-03-21 Matsushita Electric Ind Co Ltd 半導体装置、半導体装置の製造方法、及び電気機器システム
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD710319S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD710318S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD710317S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Inc. Semiconductor device
USD704670S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD704671S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
JP1578686S (enExample) * 2016-10-31 2017-06-12
JP6827776B2 (ja) * 2016-11-15 2021-02-10 ローム株式会社 半導体デバイス
CN113737128A (zh) * 2017-01-31 2021-12-03 堺显示器制品株式会社 蒸镀掩模、蒸镀掩模及有机半导体元件的制造方法
US10605828B2 (en) * 2017-03-30 2020-03-31 Advanced Semiconductor Engineering, Inc. Device for attaching a semiconductor device to a circuit board
USD851612S1 (en) * 2017-06-30 2019-06-18 Microduino Inc. Electrical module
US10418255B2 (en) * 2017-12-01 2019-09-17 Micron Technology, Inc. Semiconductor device packages and related methods
JP7113221B2 (ja) * 2018-02-08 2022-08-05 パナソニックＩｐマネジメント株式会社 炭化珪素半導体装置
USD933618S1 (en) * 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
JP1669329S (enExample) * 2020-03-13 2020-10-05
USD916039S1 (en) * 2020-03-20 2021-04-13 Sansha Electric Manufacturing Co., Ltd. Semiconductor device
JP1684023S (enExample) * 2020-04-01 2021-04-26
JP1712327S (ja) * 2021-06-18 2022-04-12 半導体素子

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Publication number Publication date
USD973030S1 (en) 2022-12-20

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